CN215069977U - LED display module and LED display screen - Google Patents

LED display module and LED display screen Download PDF

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Publication number
CN215069977U
CN215069977U CN202121448228.9U CN202121448228U CN215069977U CN 215069977 U CN215069977 U CN 215069977U CN 202121448228 U CN202121448228 U CN 202121448228U CN 215069977 U CN215069977 U CN 215069977U
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led display
chip
display module
light
circuit
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CN202121448228.9U
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Chinese (zh)
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刘传标
杨春燕
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Jiangxi Zhaochi Photoelectric Co ltd
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Jiangxi Zhaochi Photoelectric Co ltd
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Abstract

The utility model relates to a LED display module assembly and LED display screen, LED display module assembly includes the PCB base plate, the fixed positive circuit that is provided with in front of PCB base plate, the fixed back circuit that is provided with in back of PCB base plate, positive circuit and back circuit electric connection, PCB base plate internal fixation is provided with driver chip, driver chip respectively with front circuit and back circuit electric connection, the fixed luminous chipset that is provided with on the PCB base plate, luminous chipset and front circuit electric connection, still be provided with the encapsulation of the luminous chipset of encapsulation and positive circuit on the PCB base plate and glue. Compared with the prior art, the utility model discloses optimize LED display module assembly's overall arrangement, accelerate the heat dissipation, reduce cost.

Description

LED display module and LED display screen
Technical Field
The utility model relates to a LED technical field, particularly, in particular to LED display module assembly and LED display screen.
Background
In the LED display module in the prior art, generally, an LED light emitting chip is mounted on one side of a PCB substrate, a driving chip and a connector are mounted on the other side of the PCB substrate, and one driving chip controls a plurality of groups of LED light emitting chips. However, even if one driving chip can control a plurality of groups of LED light emitting chips, the LED light emitting chips are more and more compact in arrangement, especially for a small-pitch LED display screen; the driving chip has a large size and is required to have good heat dissipation performance, so the arrangement space of the driving chip is very limited.
The specification of utility model patent CN202010343182.8 discloses a preparation method of COB integrated board and lamp plate, display module group that obtain thereof. The utility model discloses a although can solve short circuit, the problem of dead lamp to a certain extent, still can't solve the limited problem of drive IC overall arrangement.
In addition, the specification of utility model CN202010175148.4 discloses a LED display screen module and a manufacturing method thereof, and the specification of utility model CN202010124562.2 discloses a method for manufacturing mini LED mainboard, which solves some technical problems existing in the prior art to a certain extent, but does not relate to the solution of limited layout of the driving chip.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the above-mentioned technical problem among the prior art to a certain extent at least. Therefore, an object of the utility model is to provide an optimize overall arrangement, accelerate the heat dissipation, reduce cost's LED display module assembly and LED display screen.
The utility model provides an above-mentioned technical problem's technical scheme as follows: the utility model provides a LED display module assembly, includes the PCB base plate, the fixed front circuit that is provided with in front of PCB base plate, the fixed back circuit that is provided with in back of PCB base plate, front circuit with back circuit electric connection, PCB base plate internal fixation is provided with driver chip, driver chip respectively with front circuit and back circuit electric connection, the fixed luminous chipset that is provided with on the PCB base plate, luminous chipset with front circuit electric connection, still be provided with the encapsulation of the luminous chipset of encapsulation and front circuit on the PCB base plate and glue.
The utility model has the advantages that: the driving chip is arranged in the PCB substrate, so that the layout space of the driving chip is increased, and the overall layout of the LED display module is facilitated; the driving chip is arranged below the light-emitting chip group, so that the heat generated by the driving chip and the light-emitting chip group is dispersed, the heat concentration is reduced, the driving chip is protected from being damaged, and the manufacturing cost is reduced.
On the basis of the technical scheme, the utility model discloses can also do following improvement.
Furthermore, the upper end of the PCB substrate is provided with a groove, and the light-emitting chip group is positioned in the groove.
The beneficial effect of adopting the further scheme is that: the whole thickness of the PCB substrate can be reduced by arranging the light emitting chip groups in the grooves; the luminous chip groups are arranged in the grooves, light crosstalk among the plurality of groups of luminous chip groups can be prevented, and the luminous intensity of the luminous chip groups and the display quality of the LED display screen are improved.
Furthermore, the upper end of the PCB substrate is filled with insulating materials corresponding to the circumference of the light-emitting chip group, and a groove is formed at the position of the light-emitting chip group.
The beneficial effect of adopting the further scheme is that: the groove is formed by filling the insulating material, so that the process can be simplified, waste materials generated in the groove construction process are avoided, and the cost of the PCB substrate is reduced.
Furthermore, the plurality of groups of light emitting chip groups are electrically connected with the driving chip; the multiple groups of the light emitting chip groups and the front surface circuit are all positioned in the grooves.
Further, the light emitting chip groups are provided with 4 groups or 8 groups.
Furthermore, the moisture-proof layers are sprayed on the light-emitting chip group and the front surface line.
The beneficial effect of adopting the further scheme is that: the dampproof layer is used for preventing moisture of the luminous chip set, so that the short circuit of the luminous chip set is avoided, and the oxidation of the luminous chip set can be delayed.
Further, the light emitting chip group is electrically connected with the front surface circuit through a bonding wire, or the light emitting chip group is inversely installed on the front surface circuit.
Further, the front surface circuit comprises a die bonding area and a wire bonding area which are fixedly arranged on the PCB substrate, and the die bonding area and the wire bonding area are arranged at intervals; the light emitting chip group is fixedly arranged on the die bonding area and electrically connected with the welding line area through a bonding line.
Further, the light emitting chip group comprises a red light chip, a green light chip and a blue light chip, the red light chip, the green light chip and the blue light chip are all fixed on the solid crystal area, and the red light chip, the green light chip and the blue light chip are all electrically connected with the front circuit.
The beneficial effect of adopting the further scheme is that: the red light chip, the green light chip and the blue light chip can adjust the current and voltage of the red light chip, the green light chip and the blue light chip through the driving chip, and the light emitting intensity of the red light chip, the green light chip and the blue light chip is controlled to finally present different colors.
For solving the technical problem, the utility model also provides a LED display screen, including LED display module assembly, power, box and controller, LED display module assembly fixes on the box, power and controller are all fixed to be arranged in the box, the power respectively with controller and LED display module assembly electric connection, the controller with LED display module assembly connects, the controller is regulated and control LED display module assembly shows.
The utility model has the advantages that: through LED display module assembly optimization overall arrangement, it is concentrated to reduce the heat, reduces the cost of manufacture to reduce the volume of LED display screen, make LED display screen complete machine frivolous, increase of service life.
Drawings
Fig. 1 is a schematic top view of an LED display module according to a first embodiment of the present invention;
fig. 2 is a schematic front view of the LED display module according to the first embodiment of the present invention;
fig. 3 is a schematic front view of an LED display module according to a second embodiment of the present invention;
fig. 4 is a schematic front view of the LED display module according to the second embodiment of the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. a PCB substrate 1.1, a groove;
2. a front circuit, 2.1, a die bonding area, 2.2 and a bonding wire area;
3. a back side circuit;
4. a driving chip;
5. the LED chip comprises a light emitting chip group, 5.1 red light chips, 5.2 green light chips, 5.3 blue light chips;
6. packaging glue;
7. an insulating material;
8. and bonding wires.
Detailed Description
The principles and features of the present invention are described below in conjunction with the following drawings, the examples given are only intended to illustrate the present invention and are not intended to limit the scope of the present invention.
Example 1:
as shown in fig. 1 and fig. 2, the LED display module according to the present invention is a schematic structural diagram of the first embodiment. The utility model provides a LED display module assembly, including PCB base plate 1, PCB base plate 1's fixed front is provided with positive circuit 2, PCB base plate 1's the fixed back circuit 3 that is provided with in the back, positive circuit 2 with 3 electric connection of back circuit, PCB base plate 1 internal fixation is provided with driver chip 4, driver chip 4 respectively with positive circuit 2 and 3 electric connection of back circuit, the fixed luminous chipset 5 that is provided with on PCB base plate 1, luminous chipset 5 with 2 electric connection of positive circuit, still be provided with the encapsulation of encapsulation luminous chipset 5 and positive circuit 2 on PCB base plate 1 and glue 6.
In the practical application process, a driving chip 4 is correspondingly arranged below each group of light-emitting chip groups 5, and one driving chip 4 correspondingly drives one group of light-emitting chip groups 5, so that single-lamp single control is realized, the accuracy of controlling the light-emitting chip groups 5 is high, and the light-emitting intensity of the light-emitting chip groups 5 is ensured; in addition, a driving chip 4 can be correspondingly arranged below the plurality of groups of light emitting chip groups 5, one driving chip 4 correspondingly drives the plurality of groups of light emitting chip groups 5, and specifically, 4 groups or 8 groups of light emitting chip groups 5 are arranged.
The driver chip 4 is fixed in the PCB substrate 1 by soldering or eutectic bonding.
In the embodiment, the driving chip 4 is arranged in the PCB substrate 1, so that the layout space of the driving chip 4 is increased, which is beneficial to the overall layout of the LED display module; the driving chip 4 is arranged below the light emitting chip group 5, so that heat generated by the driving chip 4 and the light emitting chip group 5 is dispersed, heat concentration is reduced, the driving chip 4 is protected from being damaged, and manufacturing cost is reduced.
In the above embodiment, the upper end of the PCB substrate 1 is provided with the groove 1.1, and the light emitting chip set 5 is located in the groove 1.1.
In the practical application process, a plurality of grooves 1.1 are arranged on a PCB substrate 1, each group of light-emitting chip sets 5 are arranged in one groove 1.1, a front circuit 2 is arranged on the PCB substrate 1 and positioned at two sides of the groove 1.1, the light-emitting chip sets 5 are electrically connected with the front circuit 2 through bonding wires 8, and packaging glue 6 is used for packaging the front circuit 2, the grooves 1.1 and the light-emitting chip sets 5 in the grooves 1.1;
in the present embodiment, by disposing the light emitting chip group 5 in the groove 1.1, the overall thickness of the PCB substrate 1 can be reduced; the luminous chip groups 5 are positioned in the grooves 1.1, light crosstalk among the groups of luminous chip groups 5 can be prevented, and the luminous intensity of the luminous chip groups 5 and the display quality of the LED display screen are improved.
Further, the upper end of the PCB substrate 1 is filled with an insulating material 7 in a circumferential direction corresponding to the light emitting chip set 5, and a groove 1.1 is formed at the light emitting chip set 5, specifically, the insulating material 7 is insulating resin.
The groove 1.1 is formed in the position of the luminous chip group 5 by filling the insulating material 7 on the PCB substrate 1, so that the process can be simplified, waste materials generated in the process of constructing the groove 1.1 are avoided, and the cost of the PCB substrate 1 is reduced.
In the above embodiment, the moisture-proof layers are sprayed on the light emitting chip sets 5.
In this embodiment, luminous chipset 5 to in recess 1.1 carries out the spraying and has the dampproof course, utilizes the dampproof course to carry out dampproofing to luminous chipset 5, avoids luminous chipset 5's circuit short circuit, can also delay luminous chipset 5 oxidation.
In the above embodiment, the front surface circuit 2 includes a die attach region 2.1 and a bonding wire region 2.2 fixedly disposed on the PCB substrate 1, and the die attach region 2.1 and the bonding wire region 2.2 are arranged at intervals; the light emitting chip group 5 is fixedly arranged on the die bonding area 2.1, and the light emitting chip group 5 is electrically connected with the bonding wire area 2.2 through a bonding wire 8; wherein, the solid crystal region 2.1 and the welding line region 2.2 are arranged at intervals through an insulation isolation region.
Further, the light emitting chip group 5 includes a red light chip 5.1, a green light chip 5.2 and a blue light chip 5.3, the red light chip 5.1, the green light chip 5.2 and the blue light chip 5.3 are all fixed on the die attach area 2.1, and the red light chip 5.1, the green light chip 5.2 and the blue light chip 5.3 are all electrically connected with the front surface circuit 2.
The red chip 5.1, the green chip 5.2 and the blue chip 5.3 can adjust the current and voltage of the chips through the driving chip 4, and control the luminous intensity of the chips to finally present different colors.
For matcing above-mentioned LED display module assembly, the utility model also provides a LED display screen, including LED display module assembly, power, box and controller, LED display module assembly fixes on the box, power and controller are all fixed to be arranged in the box, the power respectively with controller and LED display module assembly electric connection, the controller with LED display module assembly connects, the controller is regulated and control LED display module assembly shows.
In the embodiment, the LED display module is optimized in layout, heat concentration is reduced, the manufacturing cost is reduced, the size of the LED display screen can be reduced, the whole LED display screen is light and thin, and the service life is prolonged.
Example 2:
as shown in fig. 3 and fig. 4, the LED display module according to the second embodiment of the present invention is schematically shown. The difference between the embodiment and embodiment 1 is that a plurality of groups of light emitting chip sets 5 are arranged in each groove 1.1, the plurality of groups of light emitting chip sets 5 are all flip-chip mounted on the front surface circuit 2, and two adjacent light emitting chip sets 5 are arranged at intervals; the light emitting chip group 5 and the front surface circuit 2 are both arranged in the groove 1.1. Specifically, the light emitting chip groups 5 are fixed on the front surface circuit 2 by soldering or eutectic welding, and the plurality of groups of light emitting chip groups 5 in each groove 1.1 are electrically connected with a driving chip 4 through the front surface circuit 2.
Further, the light emitting chip group 5 comprises a red light chip 5.1, a green light chip 5.2 and a blue light chip 5.3, the red light chip 5.1, the green light chip 5.2 and the blue light chip 5.3 are all fixed on the die attach area 2.1, and the red light chip 5.1, the green light chip 5.2 and the blue light chip 5.3 are all fixed on the front surface circuit 2 through soldering or eutectic welding.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims (10)

1. The utility model provides a LED display module assembly, includes the PCB base plate, the fixed front circuit that is provided with in front of PCB base plate, the fixed back circuit that is provided with in back of PCB base plate, front circuit with back circuit electric connection, its characterized in that: the PCB substrate internal fixation is provided with driver chip, driver chip respectively with front circuit and back circuit electric connection, the fixed luminous chipset that is provided with on the PCB substrate, luminous chipset with front circuit electric connection, still be provided with the encapsulation of encapsulation luminous chipset and front circuit on the PCB substrate and glue.
2. The LED display module of claim 1, wherein: the upper end of the PCB substrate is provided with a groove, and the light-emitting chip group is located in the groove.
3. The LED display module of claim 2, wherein: the upper end of the PCB substrate is filled with insulating materials corresponding to the circumference of the light-emitting chip group, and a groove is formed at the position of the light-emitting chip group.
4. The LED display module of claim 2 or 3, wherein: the plurality of groups of the light emitting chip groups are electrically connected with the driving chip; the multiple groups of the light emitting chip groups and the front surface circuit are all positioned in the grooves.
5. The LED display module of claim 4, wherein: the light emitting chip groups are provided with 4 groups or 8 groups.
6. The LED display module of claim 4, wherein: moisture-proof layers are sprayed on the light-emitting chip groups and the front surface lines.
7. The LED display module of claim 4, wherein: the light emitting chip group is electrically connected with the front surface circuit through a bonding wire, or the light emitting chip group is inversely arranged on the front surface circuit.
8. The LED display module of claim 7, wherein: the front circuit comprises a die bonding area and a welding line area which are fixedly arranged on the PCB substrate, and the die bonding area and the welding line area are arranged at intervals; the light emitting chip group is fixedly arranged on the die bonding area and electrically connected with the welding line area through a bonding line.
9. The LED display module of claim 8, wherein: the light-emitting chip group comprises a red light chip, a green light chip and a blue light chip, the red light chip, the green light chip and the blue light chip are all fixed on the solid crystal area, and the red light chip, the green light chip and the blue light chip are all electrically connected with the front surface circuit.
10. An LED display screen, its characterized in that: the LED display module comprises the LED display module, a power supply, a box body and a controller, wherein the LED display module is fixed on the box body, the power supply and the controller are both fixedly arranged in the box body, the power supply is respectively and electrically connected with the controller and the LED display module, the controller is connected with the LED display module, and the controller regulates and controls the LED display module to display.
CN202121448228.9U 2021-06-28 2021-06-28 LED display module and LED display screen Active CN215069977U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121448228.9U CN215069977U (en) 2021-06-28 2021-06-28 LED display module and LED display screen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121448228.9U CN215069977U (en) 2021-06-28 2021-06-28 LED display module and LED display screen

Publications (1)

Publication Number Publication Date
CN215069977U true CN215069977U (en) 2021-12-07

Family

ID=79230107

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121448228.9U Active CN215069977U (en) 2021-06-28 2021-06-28 LED display module and LED display screen

Country Status (1)

Country Link
CN (1) CN215069977U (en)

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