CN215020271U

CN215020271U - Brain heat sink with adjustable

Info

Publication number: CN215020271U
Application number: CN202121044332.1U
Authority: CN
Inventors: 项杭静; 朱丽娟
Original assignee: Wenzhou Central Hospital
Current assignee: Wenzhou Central Hospital
Priority date: 2021-05-17
Filing date: 2021-05-17
Publication date: 2021-12-07
Anticipated expiration: 2031-05-17

Abstract

The utility model relates to a heat sink technical field specifically is a brain heat sink with adjustable, including the refrigeration case, the position that refrigeration incasement and lower part were located is equipped with the baffle, and the top of baffle is equipped with a plurality of semiconductor refrigeration pieces that are the matrix and arrange, and the right side of refrigeration case and the position that is close to the top are equipped with the air conditioning output tube, and the outer end of air conditioning output tube is connected with the air duct, and the one end that the air conditioning output tube was kept away from to the air duct is connected with the cooling cap, and the top of refrigeration case and the position that is close to the lower right corner are equipped with the temperature controller. This adjustable brain heat sink produces air conditioning through a plurality of semiconductor refrigeration pieces to carry the cold air stream to cold gas layer through the air duct, thereby handle the head of patient's cooling, can the intraformational temperature of real-time detection air conditioning through temperature sensor and temperature controller, and can set for the temperature as required, thereby adapt to different high fever patients, this brain heat sink can cool down for a long time because of adopting the refrigeration of semiconductor refrigeration piece.

Description

Brain heat sink with adjustable

Technical Field

The utility model relates to a heat sink technical field specifically is a brain heat sink with adjustable.

Background

Fever diseases are common in emergency departments, high fever diseases can be formed in severe cases, high fever often easily causes air draft of some patients, repeated or long-time air draft can cause brain tissue pathological changes, sequelae with different degrees are generated, patients infected with high fever are noninfectious and weak, medicines, alcohol and warm water are clinically used for wiping and bathing, but the cooling effect is not good, head ice bags are mostly needed for cooling, the effect of directly cooling by adopting alcohol or the ice bags is not ideal, and alcohol and ice blocks cannot be cooled for a long time and cannot be controlled, and the brain cooling device is inconvenient to use.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a brain heat sink with adjustable to it adopts alcohol or the direct effect of cooling down of ice bag to propose the patient to high fever disease in solving above-mentioned background art and is not ideal, and alcohol and ice-cube can not cool down for a long time, also can not control the temperature, when using, very inconvenient problem.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides an adjustable brain heat sink, includes the refrigeration case, the front side of refrigeration case and the position that is close to the lower right corner are equipped with the air inlet window, the left side of refrigeration case and the position that is close to the bottom are equipped with the heat dissipation window, the right side of refrigeration incasement wall and the position that is located bottom edge middle part are equipped with radiator fan, the position that just is located well lower part in the refrigeration incasement is equipped with the baffle, the top of baffle is equipped with a plurality of semiconductor refrigeration pieces that are the matrix and arrange, just the upper surface of semiconductor refrigeration piece is the refrigeration face, the bottom of baffle is equipped with the heat dissipation copper, the right side of refrigeration case and the position that is close to the top are equipped with the air conditioning output tube, the outer end of air conditioning output tube is connected with the air duct, the one end that the air conditioning output tube was kept away from to the air duct is connected with the cooling cap, the inner wall of cooling cap is equipped with the silica gel inside lining, the pointed end of silica gel inside lining outer wall is equipped with temperature sensor, be equipped with the cold gas layer between the pointed end of silica gel inside lining outer wall and the pointed end of cooling cap inner wall, the air duct communicates with each other with the cold gas layer, a plurality of gas pockets that are the ring array and arrange are seted up to the inner wall of silica gel inside lining, the rear side of refrigeration case and the position that is close to the top are equipped with the air conditioning back flow, the one end and the cold gas layer intercommunication of refrigeration case are kept away from to the air conditioning back flow, the top of refrigeration case and the position that is close to the lower right corner are equipped with the temperature controller, the controller of semiconductor refrigeration piece with temperature sensor respectively through the wire with temperature controller electric connection.

Preferably, a handle is arranged at the top of the refrigeration box.

Preferably, insect-proof nets are arranged in the air inlet window and the heat dissipation window.

Preferably, the bottom of the heat dissipation copper plate is vertically provided with a plurality of heat dissipation copper sheets which are arranged at equal intervals, and two ends of each heat dissipation copper sheet respectively face the heat dissipation window and the heat dissipation fan.

Preferably, a fan is arranged in the cold air output pipe.

Preferably, the air duct and the cold air return pipe are hoses, and the outer walls of the hoses are wrapped by heat-insulating layers.

Preferably, a light screen is arranged at the brim of the cooling cap, a cylindrical fixing block is arranged on the outer side of the light screen, an adjusting screw is in threaded connection with the end of the cylindrical fixing block, the bottom end of the adjusting screw penetrates through the cylindrical fixing block and the light screen in sequence and is connected with an arc plate in a rotating mode, and a rubber pad matched with the arc plate is arranged at the bottom of the arc plate.

Compared with the prior art, the beneficial effects of the utility model are that:

this brain heat sink with adjustable produces air conditioning through a plurality of semiconductor refrigeration pieces to carry the air conditioning stream to the air conditioning layer through fan and air duct, discharge from the gas pocket at last, thereby handle cooling to patient's head, can real-time detection air conditioning intraformational temperature through temperature sensor and temperature controller, and can set for the temperature as required, thereby adapt to different high fever patients, this brain heat sink is because adopt the semiconductor refrigeration piece refrigeration, can cool down for a long time, make things convenient for medical personnel to use.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is an enlarged schematic view of the structure at A in FIG. 1 according to the present invention;

FIG. 3 is one of the partial structural schematic diagrams of the present invention;

fig. 4 is a second partial schematic structural view of the present invention;

FIG. 5 is a schematic view of the assembly structure of the cool air output pipe and the fan according to the present invention;

fig. 6 is a third partial schematic structural diagram of the present invention.

In the figure: the cooling device comprises a refrigeration box 1, a lifting handle 10, an air inlet window 11, a heat dissipation window 12, a partition plate 13, a cold air output pipe 14, a fan 140, a cold air return pipe 15, a semiconductor refrigeration sheet 2, a heat dissipation copper plate 3, a heat dissipation copper sheet 30, a heat dissipation fan 4, a temperature controller 5, an air guide pipe 6, a cooling cap 7, a silica gel lining 70, an air hole 700, a shading plate 71, a cylindrical fixing block 710, a cold air layer 72, an adjusting screw 8, an arc-shaped plate 80, a rubber pad 800 and a temperature sensor 9.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1-6, the present invention provides a technical solution:

an adjustable brain cooling device, comprising a refrigeration box 1, wherein an air inlet window 11 is arranged at the front side of the refrigeration box 1 and at a position close to the lower right corner, so that outside air enters the refrigeration box 1, a heat radiation window 12 is arranged at the left side of the refrigeration box 1 and at a position close to the bottom, and is used for discharging heat generated by a semiconductor refrigeration sheet 2 from the refrigeration box 1, a heat radiation fan 4 is arranged at the right side of the inner wall of the refrigeration box 1 and at the middle part of the edge of the bottom, so as to accelerate the discharge of the heat, a partition plate 13 is arranged at the position in the refrigeration box 1 and at the middle lower part, a plurality of semiconductor refrigeration sheets 2 arranged in a matrix form are arranged at the top of the partition plate 13, the upper surfaces of the semiconductor refrigeration sheets 2 are refrigeration surfaces, a heat radiation copper plate 3 is arranged at the bottom of the partition plate 13, the lower surfaces of the semiconductor refrigeration sheets 2 are attached to the tops of the heat radiation copper plate 3, and a cold air output pipe 14 is arranged at the right side of the refrigeration box 1 and at a position close to the top, the outer end of the cold air output pipe 14 is connected with an air duct 6, one end of the air duct 6, which is far away from the cold air output pipe 14, is connected with a cooling cap 7, the inner wall of the cooling cap 7 is provided with a silica gel lining 70, the comfort of the head of a patient is improved, the tip of the outer wall of the silica gel lining 70 is provided with a temperature sensor 9 for detecting the temperature in the cold air layer 72, the cold air layer 72 is arranged between the tip of the outer wall of the silica gel lining 70 and the tip of the inner wall of the cooling cap 7, the air duct 6 is communicated with the cold air layer 72, the inner wall of the silica gel lining 70 is provided with a plurality of air holes 700 which are arranged in an annular array, so that the cold air flow in the cold air layer 72 is output, the head of the patient is cooled, a cold air return pipe 15 is arranged at the position, which is close to the rear side of the refrigeration box 1, one end of the cold air return pipe 15 is communicated with the cold air layer 72, so that the cold air flow can be partially circulated, a temperature controller 5 is arranged at the position, which is close to the lower right corner, at the top of the refrigeration box 1, the controller of the semiconductor refrigerating plate 2 and the temperature sensor 9 are respectively electrically connected with the temperature controller 5 through leads, and the temperature in the cold air layer 72 is controlled through the temperature controller 5, so that the semiconductor refrigerating plate is suitable for different high-heat patients.

In this embodiment, the top of the refrigeration box 1 is provided with a handle 10, which is convenient for a user to move the refrigeration box 1.

Specifically, the air inlet window 11 and the heat dissipation window 12 are both provided with insect-proof nets to prevent external small animals from entering the refrigeration box 1.

Further, the bottom of the heat dissipation copper plate 3 is vertically provided with a plurality of heat dissipation copper sheets 30 which are arranged at equal intervals, and two ends of each heat dissipation copper sheet 30 face the heat dissipation window 12 and the heat dissipation fan 4 respectively, so that heat dissipation is accelerated, and the refrigeration efficiency of the semiconductor refrigeration sheet 2 is ensured.

Further, a fan 140 is arranged in the cold air output pipe 14 to accelerate the output of the cold air flow in the refrigeration box 1.

Further, air duct 6 and air conditioning back flow 15 are the hose, the removal of the cap of being convenient for cool down 7, and the outer wall all wraps up there is the heat preservation, reduces the influence of ambient temperature to the air conditioning stream.

Further, brim of a hat department of cooling cap 7 is equipped with light screen 71, the outside of light screen 71 is equipped with the solid piece 710 of cylindricality, the tip threaded connection of the solid piece 710 of cylindricality has adjusting screw 8, adjusting screw 8's bottom passes the solid piece 710 of cylindricality and light screen 71 in proper order and rotates and be connected with arc 80, it removes to drive arc 80 through adjusting screw 8, fix a position patient's forehead, prevent patient's head removal, ensure the cooling effect, arc 80's bottom is equipped with rather than the rubber pad 800 of looks adaptation, can prevent arc 80 direct and patient's forehead department contact through rubber pad 800, prevent the scotch condition from appearing.

Brain heat sink with adjustable this embodiment is when using, medical personnel establish the head at the patient with cooling cap 7 cover, then rotate adjusting screw 8, make arc 80 fix patient's head, then set for required temperature through temperature controller 5, semiconductor refrigeration piece 2 begins work, under fan 140's effect, the air conditioning in refrigeration case 1 passes through in air duct 6 inputs cooling cap 7's refrigeration layer 72, and export from gas pocket 700, thereby cool down the processing to patient's head, under temperature sensor 9 and temperature controller 5's effect, can cool down the processing for a long time under the temperature of settlement, thereby make things convenient for medical personnel to use.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. An adjustable brain cooling device, its characterized in that: including refrigeration case (1), the front side of refrigeration case (1) and the position that is close to the lower right corner are equipped with air inlet window (11), the left side of refrigeration case (1) and the position that is close to the bottom are equipped with radiator window (12), the right side of refrigeration case (1) inner wall and the position that is located bottom edge middle part are equipped with radiator fan (4), the position that just is located well lower part in refrigeration case (1) is equipped with baffle (13), the top of baffle (13) is equipped with a plurality of semiconductor refrigeration pieces (2) that are the matrix and arrange, just the upper surface of semiconductor refrigeration piece (2) is the refrigeration face, the bottom of baffle (13) is equipped with heat dissipation copper (3), the right side of refrigeration case (1) and the position that is close to the top are equipped with air conditioning output tube (14), the outer end of air conditioning output tube (14) is connected with air duct (6), the one end that air duct (6) kept away from air conditioning output tube (14) is connected with cooling cap (7), the inner wall of the cooling cap (7) is provided with a silica gel lining (70), the tip of the outer wall of the silica gel lining (70) is provided with a temperature sensor (9), a cold air layer (72) is arranged between the tip of the outer wall of the silica gel lining (70) and the tip of the inner wall of the cooling cap (7), the air duct (6) is communicated with the cold air layer (72), the inner wall of the silica gel lining (70) is provided with a plurality of air holes (700) which are distributed in an annular array, a cold air return pipe (15) is arranged at the rear side of the refrigeration box (1) and close to the top, one end of the cold air return pipe (15) far away from the refrigerating box (1) is communicated with a cold air layer (72), a temperature controller (5) is arranged at the top of the refrigeration box (1) and near the lower right corner, the controller of the semiconductor refrigerating sheet (2) and the temperature sensor (9) are respectively electrically connected with the temperature controller (5) through leads.

2. The adjustable brain cooling device of claim 1, wherein: the top of the refrigeration box (1) is provided with a handle (10).

3. The adjustable brain cooling device of claim 1, wherein: insect-proof nets are arranged in the air inlet window (11) and the heat dissipation window (12).

4. The adjustable brain cooling device of claim 1, wherein: the bottom of the heat dissipation copper plate (3) is vertically provided with a plurality of heat dissipation copper sheets (30) which are distributed at equal intervals, and two ends of each heat dissipation copper sheet (30) face the heat dissipation window (12) and the heat dissipation fan (4) respectively.

5. The adjustable brain cooling device of claim 1, wherein: a fan (140) is arranged in the cold air output pipe (14).

6. The adjustable brain cooling device of claim 1, wherein: the air duct (6) and the cold air return pipe (15) are hoses, and the outer walls of the hoses are wrapped with heat-insulating layers.

7. The adjustable brain cooling device of claim 1, wherein: the cooling cap is characterized in that a light shielding plate (71) is arranged at the brim of the cooling cap (7), a cylindrical fixing block (710) is arranged on the outer side of the light shielding plate (71), an adjusting screw rod (8) is connected to the end part of the cylindrical fixing block (710) in a threaded manner, the bottom end of the adjusting screw rod (8) sequentially penetrates through the cylindrical fixing block (710) and the light shielding plate (71) and is rotatably connected with an arc-shaped plate (80), and a rubber pad (800) matched with the arc-shaped plate (80) is arranged at the bottom of the arc-shaped plate (80).