CN215008168U - Semiconductor chip tray - Google Patents
Semiconductor chip tray Download PDFInfo
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- CN215008168U CN215008168U CN202121228108.8U CN202121228108U CN215008168U CN 215008168 U CN215008168 U CN 215008168U CN 202121228108 U CN202121228108 U CN 202121228108U CN 215008168 U CN215008168 U CN 215008168U
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- semiconductor chip
- baffle
- mainboard
- clamping
- chip tray
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Abstract
The utility model relates to the field of semiconductor technology, and a semiconductor chip tray is disclosed, including the mainboard, the middle part of mainboard is provided with the through-hole, the inside of baffle is provided with the clamping structure, the upper and lower both ends of clamping structure are provided with lug and baffle respectively, and the lug is located the upper end of baffle, both ends are provided with connection structure about the mainboard, the outside of mainboard is provided with mounting structure. This semiconductor chip tray, the setting of clamping structure, make the easy operation convenience of assembling and dismantling between clamping structure and the semiconductor chip, the operation of being convenient for, and can fix between device and the semiconductor chip, improve both's cooperation nature, so that semiconductor chip later stage processing, improve the use impression of device, connection structure's setting, stability between improvement device and the device, convenient stack, and whether stack process and device install semiconductor chip and do not have the influence, the setting of mounting structure, in order to make things convenient for make up between the device.
Description
Technical Field
The utility model relates to the field of semiconductor technology, specifically a semiconductor chip tray.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and has applications in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device made of the semiconductor, and the importance of the semiconductor is very great from the viewpoint of science and technology or economic development. Most electronic products, such as computers, mobile phones or digital audio recorders, have a core unit closely related to a semiconductor.
In the process of mounting the semiconductor chip, the traditional semiconductor chip tray only places the semiconductor chip in the groove of the semiconductor chip tray, so that the limitation on the semiconductor chip is small, and the use feeling of the device is poor.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor chip tray to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the present invention provides the following technical solutions: the utility model provides a semiconductor chip tray, includes the mainboard, and the middle part of mainboard is provided with the through-hole, and the upper end of through-hole is provided with the baffle, the inside of baffle is provided with clamping structure, clamping structure's upper and lower both ends are provided with lug and baffle respectively, and the lug is located the upper end of baffle, both ends are provided with connection structure about the mainboard, the outside of mainboard is provided with mounting structure.
Preferably, the centre gripping structure is provided with interior spliced pole including installing at the middle part of baffle, and the middle part of spliced pole is provided with the sideboard, the upper end of sideboard is provided with the fixture block, the lower extreme of sideboard is provided with the bottom plate, improves the device to semiconductor chip's restrictive nature.
Preferably, the connection structure comprises a groove formed in the lower end of the main board, a limiting rod is arranged at the upper end of the main board, movable pieces are arranged at the left end and the right end of the limiting rod, and the matching performance between the device and the device is improved.
Preferably, the mounting structure comprises clamping grooves arranged on the front side and the left side of the main board, clamping plates are arranged on the rear side and the right side of the main board, and the connectivity between the devices is improved.
Preferably, the diameter of the outer surface of the baffle plate is larger than that of the outer surface of the bump, and the center line of the baffle plate and the center line of the bump are vertically symmetrical about the plane of the horizontal center line of the bottom plate, so that the bottom plate can only protrude upwards.
Preferably, the inner surface structure of the groove is matched with the outer surface structures of the limiting rod and the movable sheet, the limiting rod and the movable sheet form a detachable structure through the groove, and the device can be conveniently engaged through the elasticity of the movable sheet.
Preferably, the clamping plate and the main board form an integrated structure, the clamping plate forms a slidable structure through the clamping groove, horizontal combination of the devices is facilitated, and the gap is small after combination.
(III) advantageous effects
Compared with the prior art, the utility model provides a semiconductor chip tray possesses following beneficial effect:
1. the semiconductor chip tray is characterized in that the semiconductor chip is vertically pressed downwards through the arrangement of the clamping structure, the semiconductor chip is contacted with the clamping blocks at the two ends of the side plate in the pressing process and continuously pressed downwards until the lower end surface of the semiconductor chip is attached to the upper end surface of the bottom plate, when the semiconductor chip needs to be taken out, the clamping blocks at the two sides of the bottom plate are respectively pushed towards the two ends, the side plate deflects by taking the horizontal central line of the connecting column as the center of a circle, the bottom plate is extruded, the middle part of the side plate protrudes upwards under the limitation of the bump and the baffle plate, and the semiconductor chip is pushed out through the protruding middle part, the structure mainly has the main function that the assembly and disassembly operations between the clamping structure and the semiconductor chip are simple and convenient through the mutual matching between the internal parts of the clamping structure, the operation is convenient, the device and the semiconductor chip can be fixed, and the matching performance of the device and the semiconductor chip is improved, so as to facilitate the later processing of the semiconductor chip and improve the use feeling of the device;
2. the semiconductor chip tray has the advantages that through the arrangement of the connecting structure, the inner surface structure of the through hole at the lower end of the device is matched with the protrusion at the upper end of the middle part of the device, so that two groups of devices can be vertically placed, meanwhile, the limiting rod and the movable sheet are arranged at the upper end of the device and are matched with the groove at the lower end, the structure has the main effects that through the mutual matching of the internal parts of the connecting structure, the special arrangement of the outer surface structure of the structure is convenient to match with the device, the stability between the device and the device is improved, the stacking is convenient, and the stacking process has no influence on whether the semiconductor chip is mounted on the device or not;
3. this semiconductor chip tray, through mounting structure's setting, mainboard front side and left draw-in groove, the rear side and the right side of mainboard are provided with the cardboard, and the cardboard constitutes the integral structure with the mainboard, and the cardboard passes through the draw-in groove and constitutes slidable structure, and this structure main action lies in, through mutually supporting between the mounting structure internals to make things convenient for to make up between the device.
Drawings
FIG. 1 is a schematic view of the main view of the full-section structure of the present invention;
FIG. 2 is a schematic view of the structure of the present invention;
FIG. 3 is a schematic view of the clamping structure of the present invention;
fig. 4 is a schematic view of the structure of the limiting rod of the present invention.
In the figure: 1. a main board; 2. a through hole; 3. a partition plate; 4. a clamping structure; 5. a bump; 6. a baffle plate; 7. a connecting structure; 8. a mounting structure; 9. connecting columns; 10. a side plate; 11. a clamping block; 12. a base plate; 13. a groove; 14. a restraining bar; 15. a movable plate; 16. a card slot; 17. and (4) clamping the board.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, a semiconductor chip tray comprises a main board 1, a through hole 2 is disposed in the middle of the main board 1, a partition 3 is disposed at the upper end of the through hole 2, a clamping structure 4 is disposed inside the partition 3, a bump 5 and a baffle 6 are disposed at the upper and lower ends of the clamping structure 4, respectively, the bump 5 is located at the upper end of the baffle 6, a connecting structure 7 is disposed at the left and right ends of the main board 1, a mounting structure 8 is disposed at the outer side of the main board 1, the clamping structure 4 comprises an inner connecting column 9 disposed in the middle of the partition 3, a side board 10 is disposed in the middle of the connecting column 9, a clamping block 11 is disposed at the upper end of the side board 10, a bottom board 12 is disposed at the lower end of the side board 10, the outer surface diameter of the baffle 6 is larger than the outer surface diameter of the bump 5, and the center line 6 of the baffle and the center line of the bump 5 are vertically symmetrical with respect to the plane where the horizontal center line of the bottom board 12 is located, the arrangement of the clamping structure 4, the semiconductor chip is pressed down vertically, the semiconductor chip contacts the clamping blocks 11 at the two ends of the side plate 10 in the pressing down process, the pressing down is continued until the lower end surface of the semiconductor chip is attached to the upper end surface of the bottom plate 12, when the semiconductor chip needs to be taken out, the clamping blocks 11 at the two sides of the bottom plate 12 are respectively pushed towards the two ends, the side plate 10 deflects by taking the horizontal central line of the connecting column 9 as the center of a circle, the bottom plate 12 is extruded, the middle part protrudes upwards under the limitation of the bump 5 and the baffle 6, and the semiconductor chip is pushed out by the protruding middle part, the structure mainly has the advantages that the assembly and disassembly operations between the clamping structure 4 and the semiconductor chip are simple and convenient through the mutual matching between the internal parts of the clamping structure 4, the operation is convenient, the device and the semiconductor chip can be fixed, and the matching between the device and the semiconductor chip is improved, so as to facilitate the later processing of the semiconductor chip and improve the use feeling of the device;
the connecting structure 7 comprises a groove 13 arranged at the lower end of the main board 1, a limiting rod 14 is arranged at the upper end of the main board 1, movable pieces 15 are arranged at the left end and the right end of the limiting rod 14, the inner surface structure of the groove 13 is matched with the outer surface structures of the limiting rod 14 and the movable pieces 15, the limiting rod 14 and the movable pieces 15 form a detachable structure through the groove 13, the connecting structure 7 is arranged, the inner surface structure of a through hole 2 at the lower end of the device is matched with the protrusion at the upper end of the middle part of the device, so that two groups of devices can be vertically placed, meanwhile, the limiting rod 14 and the movable pieces 15 are arranged at the upper end of the device and are matched with the groove 13 at the lower end, the structure mainly has the advantages that through mutual matching of internal parts of the connecting structure 7, the special arrangement of the outer surface structure of the structure is convenient to match with the device and the device, and the stability between the device is improved, the stacking is convenient, and the stacking process has no influence on whether the semiconductor chip is mounted on the device or not;
The electrical components presented in the document are all electrically connected with an external master controller and 220V mains, and the master controller can be a conventional known device controlled by a computer or the like.
Before the device is used, a semiconductor chip to be mounted is mounted, the lower end surface of the semiconductor chip is parallel to the flash surface of a bottom plate 12 in the device, then the semiconductor chip is vertically pressed downwards, the semiconductor chip is contacted with clamping blocks 11 at two ends of an edge plate 10 in the pressing process and continuously pressed downwards until the lower end surface of the semiconductor chip is attached to the upper end surface of the bottom plate 12, when the semiconductor chip needs to be taken out, the clamping blocks 11 at two sides of the bottom plate 12 are respectively pushed towards two ends, the edge plate 10 deflects by taking a horizontal central line of a connecting column 9 as a circle center, the bottom plate 12 is extruded, the middle part of the bottom plate protrudes upwards under the limitation of a bump 5 and a baffle 6, the semiconductor chip is pushed out at the protruding middle part, the semiconductor chip can be taken out, the inner surface structure of a through hole 2 at the lower end of the device is matched with the protrusion at the upper end of the middle part of the device, realize that two sets of devices can put perpendicularly, the upper end of device is provided with restriction lever 14 simultaneously and movable piece 15 is identical with recess 13 of lower extreme, and 1 front side of mainboard and left draw-in groove 16 simultaneously, the rear side and the right side of mainboard 1 are provided with cardboard 17, and cardboard 17 constitutes the integral structure with mainboard 1, and cardboard 17 passes through draw-in groove 16 and constitutes slidable structure to make things convenient for to make up between the device.
In summary, in the semiconductor chip tray, the clamping structure 4 is arranged such that the semiconductor chip is vertically pressed down, the semiconductor chip is contacted with the clamping blocks 11 at the two ends of the side plate 10 during the pressing down process, and is continuously pressed down until the lower end surface of the semiconductor chip is attached to the upper end surface of the bottom plate 12, when the semiconductor chip needs to be taken out, the clamping blocks 11 at the two sides of the bottom plate 12 are respectively pushed towards the two ends, the side plate 10 deflects by taking the horizontal center line of the connecting column 9 as the center of a circle, the bottom plate 12 is squeezed, the middle part protrudes upwards under the limitation of the bump 5 and the baffle 6, and the protruding middle part pushes out the semiconductor chip, the structure mainly has the advantages that the assembly and disassembly operations between the clamping structure 4 and the semiconductor chip are simple and convenient through the mutual matching between the internal parts of the clamping structure 4, the operation is convenient, and the device and the semiconductor chip can be fixed, the matching performance of the two is improved, so that the later processing of semiconductor chips is facilitated, the use feeling of the device is improved, the connecting structure 7 is arranged, the inner surface structure of the through hole 2 at the lower end of the device is matched with the protrusion at the upper end of the middle part of the device, the two groups of devices can be vertically placed, meanwhile, the limiting rod 14 and the movable sheet 15 are arranged at the upper end of the device and are matched with the groove 13 at the lower end, the structure mainly has the advantages that through the mutual matching of the internal parts of the connecting structure 7, the special arrangement of the outer surface structure of the structure facilitates the matching between the device and the device, the stability between the device and the device is improved, the superposition is convenient, whether the semiconductor chips are installed on the device or not in the superposition process is not influenced, the installing structure 8 is arranged, the clamping grooves 16 at the front side and the left side of the main board 1 are arranged, the clamping plates 17 are arranged at the rear side and the right side of the main board 1, and the clamping plates 17 and the main board 1 form an integrated structure, and the clamping plate 17 forms a slidable structure through the clamping groove 16, and the structure mainly has the main function of facilitating the combination of the devices through the mutual matching of the internal parts of the mounting structure 8.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A semiconductor chip tray comprising a main board (1), characterized in that: the middle part of mainboard (1) is provided with through-hole (2), and the upper end of through-hole (2) is provided with baffle (3), the inside of baffle (3) is provided with clamping structure (4), the upper and lower both ends of clamping structure (4) are provided with lug (5) and baffle (6) respectively, and lug (5) are located the upper end of baffle (6), both ends are provided with connection structure (7) about mainboard (1), the outside of mainboard (1) is provided with mounting structure (8).
2. The semiconductor chip tray of claim 1, wherein: centre gripping structure (4) are provided with interior spliced pole (9) including installing in the middle part of baffle (3), and the middle part of spliced pole (9) is provided with sideboard (10), the upper end of sideboard (10) is provided with fixture block (11), the lower extreme of sideboard (10) is provided with bottom plate (12).
3. The semiconductor chip tray of claim 1, wherein: the connecting structure (7) comprises a groove (13) arranged at the lower end of the main board (1), a limiting rod (14) is arranged at the upper end of the main board (1), and movable pieces (15) are arranged at the left end and the right end of the limiting rod (14).
4. The semiconductor chip tray of claim 1, wherein: mounting structure (8) are including setting up at mainboard (1) front side and left draw-in groove (16), the rear side and the right side of mainboard (1) are provided with cardboard (17).
5. The semiconductor chip tray of claim 1, wherein: the diameter of the outer surface of the baffle (6) is larger than that of the outer surface of the bump (5), and the center line of the baffle (6) and the center line of the bump (5) are vertically symmetrical about the plane of the horizontal center line of the bottom plate (12).
6. A semiconductor chip tray according to claim 3, wherein: the inner surface structure of the groove (13) is matched with the outer surface structures of the limiting rod (14) and the movable sheet (15), and the limiting rod (14) and the movable sheet (15) form a detachable structure through the groove (13).
7. The semiconductor chip tray of claim 4, wherein: the clamping plate (17) and the main plate (1) form an integrated structure, and the clamping plate (17) forms a slidable structure through the clamping groove (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121228108.8U CN215008168U (en) | 2021-06-03 | 2021-06-03 | Semiconductor chip tray |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121228108.8U CN215008168U (en) | 2021-06-03 | 2021-06-03 | Semiconductor chip tray |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215008168U true CN215008168U (en) | 2021-12-03 |
Family
ID=79085856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121228108.8U Active CN215008168U (en) | 2021-06-03 | 2021-06-03 | Semiconductor chip tray |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215008168U (en) |
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2021
- 2021-06-03 CN CN202121228108.8U patent/CN215008168U/en active Active
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