CN214958773U - High-frequency power supply charging module - Google Patents

High-frequency power supply charging module Download PDF

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Publication number
CN214958773U
CN214958773U CN202120860486.1U CN202120860486U CN214958773U CN 214958773 U CN214958773 U CN 214958773U CN 202120860486 U CN202120860486 U CN 202120860486U CN 214958773 U CN214958773 U CN 214958773U
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frequency power
power supply
cover
supply body
connecting box
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CN202120860486.1U
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Chinese (zh)
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尹朝亮
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Wuxi Shangyuan Electric Co ltd
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Wuxi Shangyuan Electric Co ltd
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Abstract

The utility model discloses a high frequency power supply charging module, including high frequency power supply body, charging mechanism and heat dissipation mechanism, the lower extreme of high frequency power supply body is provided with the mount pad, charging mechanism sets up and lies in one side of high frequency power supply body on the up end of mount pad, charging mechanism comprises first fixing base, connecting box, spread groove, socket, wire, a plurality of closing plate, a plurality of spring, mounting bracket, installation pole, coil spring and rubber seal plug, be provided with first fixing base on one side of high frequency power supply body on the up end of mount pad, be provided with the connecting box on the up end of first fixing base; the utility model discloses simple structure, reasonable in design, the connection of power cord is more reliable and more stable, can both protect charging connection position at operating condition and non-operating condition, prevents that dust and water stain splash into, can continuously carry cold wind simultaneously, prevents that the inside high temperature of high frequency power is too high, improves the result of use.

Description

High-frequency power supply charging module
Technical Field
The utility model relates to a high frequency power supply equipment technical field specifically is high frequency power supply charging module.
Background
The high-frequency power supply is also called as an electronic tube frequency conversion device and is key equipment of a high-frequency induction furnace, the high-frequency power supply and an induction heating technology have the advantages of highest heating efficiency, fastest speed, low energy consumption and environmental protection on metal materials, the high-frequency power supply and the induction heating technology are widely applied to the processes of hot processing, heat treatment, hot assembly, welding, smelting and the like of the metal materials in various industries, and the high-frequency power supply can not only heat the whole workpiece, but also heat the local part of the workpiece in a targeted manner; the deep heat penetration of the workpiece can be realized, and the surface layer of the workpiece can be heated in a concentrated manner; not only can directly heat the metal material, but also can indirectly heat the non-metal material.
The defects of the prior art are as follows:
1. the power interface of the high-frequency power supply is usually directly exposed in the air, and a corresponding protection mechanism is not arranged, so that dust is easy to permeate under the condition that a plug is not connected, and meanwhile, water stain is easy to splash into the plug, so that the normal use of the high-frequency power supply is influenced;
2. the high-frequency power supply is easy to generate high temperature in the working process, and although the high-frequency power supply is provided with the corresponding heat dissipation port, the heat dissipation effect is poor, and the internal air circulation effect is poor.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high frequency power module of charging to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a high-frequency power supply charging module comprises a high-frequency power supply body, a charging mechanism and a heat dissipation mechanism, wherein the lower end of the high-frequency power supply body is provided with a mounting seat, the charging mechanism is arranged on the upper end face of the mounting seat and is positioned on one side of the high-frequency power supply body, the charging mechanism consists of a first fixing seat, a connecting box, a connecting groove, a socket, a lead, a plurality of sealing plates, a plurality of springs, a mounting frame, a mounting rod, a coil spring and a rubber sealing plug, the first fixing seat is arranged on one side of the high-frequency power supply body on the upper end face of the mounting seat, the connecting box is arranged on the upper end face of the first fixing seat, the connecting box is arranged at the upper end of the connecting box, the socket is arranged at the bottom of the connecting groove of the connecting box, the lead is arranged on the socket, the other end of the lead is arranged at the input end of the high-frequency power supply body, and the sealing plates are movably arranged on two sides of the upper end of the connecting box, the sealing plate is characterized in that a spring is arranged on the lower end face of the sealing plate, the other end of the spring is arranged on the inner side wall of the connecting box, a mounting frame is arranged on the inner side wall of the connecting box, mounting rods are movably arranged on the mounting frame, coil springs are arranged on the mounting frame on two sides of each mounting rod, the other ends of the coil springs are arranged on the mounting rods, and the heat dissipation mechanism is arranged on the upper end face of the mounting seat.
Preferably, heat dissipation mechanism comprises second fixing base, fan, first toper cover, connecting cover, a plurality of semiconductor refrigeration piece and second toper cover, one side of keeping away from first fixing base at the high frequency power body on the up end of mount pad is provided with the second fixing base, be provided with the fan on the up end of second fixing base, the air-out end of fan is provided with first toper cover, the opposite side of first toper cover is provided with the connecting cover, be provided with a plurality of semiconductor refrigeration piece on the connecting cover, the other end of connecting cover is provided with second toper cover, the other end setting of second toper cover is on the thermovent of high frequency power body.
Preferably, be provided with the bracing piece on the up end of mount pad, the upper end of bracing piece is provided with solid fixed ring, gu fixed ring sets up on the connecting cover.
Preferably, the side surfaces of the adjacent sides of the sealing plates are provided with semicircular holes.
Preferably, the sealing plate is provided with sealing strips inside the semicircular hole and at the upper end of the connecting box.
Preferably, the inner side wall of the connecting cover is provided with a plurality of connecting rods, and the other ends of the connecting rods are provided with conical air deflectors.
Preferably, the semiconductor refrigeration piece is provided with a plurality of heat dissipation columns outside the connecting cover.
Compared with the prior art, the beneficial effects of the utility model are that:
1. this high frequency power module of charging through being provided with charging mechanism, charging mechanism comprises first fixing base, connecting box, spread groove, socket, wire, a plurality of closing plate, a plurality of spring, mounting bracket, installation pole, coil spring and rubber sealing plug, and through charging mechanism's effect, the connection of power cord is reliable and more stable, can both protect charging connection position at operating condition and non-operating condition, prevents that dust and water stain from splashing into.
2. This high frequency power module of charging through being provided with heat dissipation mechanism, and heat dissipation mechanism comprises second fixing base, fan, first toper cover, connecting cover, a plurality of semiconductor refrigeration piece and second toper cover, through heat dissipation mechanism's effect, can carry cold wind continuously, prevents that the inside high temperature of high frequency power from being too high, improves the result of use.
Drawings
FIG. 1 is an overall front view of the present invention;
FIG. 2 is a partial cross-sectional view of the junction box of the present invention;
FIG. 3 is a longitudinal cross-sectional view of the connecting cover of the present invention;
fig. 4 is a top view of the connection box of the present invention.
In the figure: 1. a high-frequency power supply body; 2. a charging mechanism; 21. a first fixed seat; 22. a connecting box; 23. connecting grooves; 24. a socket; 25. a wire; 26. a sealing plate; 261. a semicircular hole; 262. a sealing strip; 27. a spring; 28. a mounting frame; 29. mounting a rod; 201. a coil spring; 202. a rubber sealing plug; 3. a heat dissipation mechanism; 31. a second fixed seat; 32. a fan; 33. a first conical cover; 34. a connecting cover; 35. a semiconductor refrigeration sheet; 36. a second conical cover; 4. a mounting seat; 5. a support bar; 6. a fixing ring; 7. a connecting rod; 8. a tapered air deflector; 9. a heat-dissipating stud.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1-4, the present invention provides a technical solution: a high-frequency power supply charging module comprises a high-frequency power supply body 1, a charging mechanism 2 and a heat dissipation mechanism 3, wherein a mounting seat 4 is installed at the lower end of the high-frequency power supply body 1 through a bolt, the charging mechanism 2 is installed on the upper end face of the mounting seat 4 and is positioned at one side of the high-frequency power supply body 1, the charging mechanism 2 comprises a first fixing seat 21, a connecting box 22, a connecting groove 23, a socket 24, a lead 25, a plurality of sealing plates 26, a plurality of springs 27, a mounting frame 28, a mounting rod 29, a coil spring 201 and a rubber sealing plug 202, the first fixing seat 21 is installed on one side of the high-frequency power supply body 1 on the upper end face of the mounting seat 4 through a bolt, the connecting box 22 is installed on the upper end face of the first fixing seat 21 through a bolt, the connecting groove 23 is formed in the upper end of the connecting box 22, the socket 24 is installed on the bottom of the connecting groove 23 through a bolt, and the lead 25 is connected onto the socket 24, the other end of the wire 25 is connected to the input end of the high-frequency power supply body 1, sealing plates 26 are mounted on two sides of the upper end of the connecting box 22 through pin shafts, springs 27 are mounted on the lower end face of each sealing plate 26, the other end of each spring 27 is mounted on the inner side wall of the connecting box 22, a mounting frame 28 is mounted on the inner side wall of the connecting box 22 through bolts, a mounting rod 29 is mounted on each mounting frame 28 through a pin shaft, coil springs 201 are mounted on two sides of each mounting rod 29 on each mounting frame 28, the other ends of the coil springs 201 are mounted on the mounting rods 29, and the heat dissipation mechanisms 3 are mounted on the upper end face of the mounting seat 4;
through above-mentioned scheme, through being provided with charging mechanism 2, charging mechanism 2 comprises first fixing base 21, connecting box 22, spread groove 23, socket 24, wire 25, a plurality of sealing plate 26, a plurality of spring 27, mounting bracket 28, installation pole 29, coil spring 201 and rubber sealing plug 202, and the connection of power cord is reliable and more stable, can both protect charging connection position at operating condition and non-operating condition, prevents that dust and water stain from splashing into.
In this embodiment, preferably, the heat dissipation mechanism 3 is composed of a second fixing seat 31, a fan 32, a first conical cover 33, a connecting cover 34, a plurality of semiconductor cooling fins 35, and a second conical cover 36, the second fixing seat 31 is installed on one side, away from the first fixing seat 21, of the high-frequency power supply body 1 on the upper end surface of the mounting seat 4 through a bolt, the fan 32 is installed on the upper end surface of the second fixing seat 31 through a bolt, the first conical cover 33 is connected to an air outlet end of the fan 32, the connecting cover 34 is connected to the other side of the first conical cover 33, the plurality of semiconductor cooling fins 35 are installed on the connecting cover 34 through bolts, the other end of the connecting cover 34 is connected to the second conical cover 36, and the other end of the second conical cover 36 is connected to the heat dissipation port of the high-frequency power supply body 1;
through the above scheme, through being provided with heat dissipation mechanism 3, heat dissipation mechanism 3 comprises second fixing base 31, fan 32, first toper cover 33, connecting cover 34, a plurality of semiconductor refrigeration piece 35 and second toper cover 36, can carry cold wind continuously, prevents that the inside high temperature of high frequency power supply from improving the result of use.
In this embodiment, preferably, the upper end surface of the mounting seat 4 is provided with a support rod 5 through a bolt, the upper end of the support rod 5 is welded with a fixing ring 6, and the fixing ring 6 is sleeved on the connecting cover 34;
through the above scheme, through being provided with bracing piece 5, the upper end welding of bracing piece 5 has solid fixed ring 6, and through solid fixed ring 6's effect, can increase the stability of connecting cover 34 effectively, prevents that the wind that fan 32 produced from producing great impact force to connecting cover 34.
In this embodiment, preferably, the side surfaces of the adjacent sides of the sealing plate 26 are both provided with a semicircular hole 261;
through the scheme, the cable of the power line is conveniently inserted through the semicircular hole 261.
In this embodiment, it is preferable that the sealing plate 26 is connected to the sealing strip 262 inside the semicircular hole 261 and at the upper end of the connecting box 22 by soaking;
through the above scheme, the sealing effect can be increased by providing the sealing strip 262.
In this embodiment, preferably, a plurality of connecting rods 7 are welded on the inner side wall of the connecting cover 34, and a tapered air deflector 8 is welded at the other end of each connecting rod 7;
through the scheme, the conical air deflector 8 is arranged, so that the air generated by the fan 32 can be uniformly cooled through the semiconductor refrigerating sheet 35.
In this embodiment, preferably, the semiconductor cooling plate 35 is provided with a plurality of heat dissipation columns 9 on the outer side of the connecting cover 34;
through the scheme, the heat dissipation and emission of the heat dissipation end of the semiconductor refrigeration piece 35 can be increased by arranging the plurality of heat dissipation columns 9.
The working principle of the utility model is as follows:
when the high-frequency power supply charging module of the embodiment is used, the charging mechanism 2 is arranged, the charging mechanism 2 is composed of a first fixed seat 21, a connecting box 22, a connecting groove 23, a socket 24, a lead 25, a plurality of sealing plates 26, a plurality of springs 27, a mounting frame 28, a mounting rod 29, a coil spring 201 and a rubber sealing plug 202, the connection of a power line is more stable and reliable through the effects of the sealing plates 26, the springs 27, the mounting rod 29, the coil spring 201 and the rubber sealing plug 202, the charging connecting position can be protected in a working state and a non-working state, dust and water are prevented from splashing, the heat dissipation mechanism 3 is arranged at the same time, the heat dissipation mechanism 3 is composed of a second fixed seat 31, a fan 32, a first conical cover 33, a connecting cover 34, a plurality of semiconductor refrigeration sheets 35 and a second conical cover 36, gas which flows at high speed through the fan 32 is cooled through the semiconductor refrigeration sheets 35 and enters the inside of the high-frequency power supply body 1, can continuously convey cold air, prevent the inside high temperature of high frequency power supply, improve the result of use.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (7)

1. High frequency power module of charging, including high frequency power body (1), charging mechanism (2) and heat dissipation mechanism (3), its characterized in that: the low-frequency power supply comprises a high-frequency power supply body (1), and is characterized in that a mounting seat (4) is arranged at the lower end of the high-frequency power supply body (1), a charging mechanism (2) is arranged on the upper end face of the mounting seat (4) and is positioned on one side of the high-frequency power supply body (1), the charging mechanism (2) is composed of a first fixing seat (21), a connecting box (22), a connecting groove (23), a socket (24), a lead (25), a plurality of sealing plates (26), a plurality of springs (27), a mounting frame (28), a mounting rod (29), a coil spring (201) and a rubber sealing plug (202), the first fixing seat (21) is arranged on one side of the high-frequency power supply body (1) on the upper end face of the mounting seat (4), the connecting box (22) is arranged on the upper end face of the first fixing seat (21), the connecting groove (23) is arranged on the upper end of the connecting box (22), the socket (24) is arranged at the bottom of the connecting groove (23) of the connecting box (22), be provided with wire (25) on socket (24), the other end setting of wire (25) is at the input of high frequency power supply body (1), the both sides of connecting box (22) upper end are all movable and are provided with closing plate (26), be provided with spring (27) on the lower terminal surface of closing plate (26), the other end setting of spring (27) is on the inside wall of connecting box (22), be provided with mounting bracket (28) on the inside wall of connecting box (22), the activity is provided with installation pole (29) on mounting bracket (28), all be provided with coil spring (201) in the both sides of installation pole (29) on mounting bracket (28), the other end setting of coil spring (201) is on installation pole (29), heat dissipation mechanism (3) set up on the up end of mount pad (4).
2. The high-frequency power charging module according to claim 1, wherein: the heat dissipation mechanism (3) consists of a second fixed seat (31), a fan (32), a first conical cover (33), a connecting cover (34), a plurality of semiconductor refrigeration sheets (35) and a second conical cover (36), a second fixed seat (31) is arranged on the upper end surface of the mounting seat (4) at one side of the high-frequency power supply body (1) far away from the first fixed seat (21), a fan (32) is arranged on the upper end surface of the second fixed seat (31), a first conical cover (33) is arranged at the air outlet end of the fan (32), the other side of the first conical cover (33) is provided with a connecting cover (34), the connecting cover (34) is provided with a plurality of semiconductor refrigeration sheets (35), the other end of the connecting cover (34) is provided with a second conical cover (36), and the other end of the second conical cover (36) is arranged on a heat dissipation opening of the high-frequency power supply body (1).
3. The high-frequency power charging module according to claim 2, wherein: the support rod (5) is arranged on the upper end face of the mounting seat (4), the fixing ring (6) is arranged at the upper end of the support rod (5), and the fixing ring (6) is arranged on the connecting cover (34).
4. The high-frequency power charging module according to claim 1, wherein: and the side surfaces of the adjacent sides of the sealing plates (26) are provided with semicircular holes (261).
5. The high-frequency power charging module according to claim 4, wherein: and sealing strips (262) are arranged on the sealing plate (26) in the semicircular hole (261) and at the upper end of the connecting box (22).
6. The high-frequency power charging module according to claim 2, wherein: the connecting cover is characterized in that a plurality of connecting rods (7) are arranged on the inner side wall of the connecting cover (34), and conical air deflectors (8) are arranged at the other ends of the connecting rods (7).
7. The high-frequency power charging module according to claim 2, wherein: the semiconductor refrigeration piece (35) is provided with a plurality of heat dissipation columns (9) on the outer side of the connecting cover (34).
CN202120860486.1U 2021-04-25 2021-04-25 High-frequency power supply charging module Active CN214958773U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120860486.1U CN214958773U (en) 2021-04-25 2021-04-25 High-frequency power supply charging module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120860486.1U CN214958773U (en) 2021-04-25 2021-04-25 High-frequency power supply charging module

Publications (1)

Publication Number Publication Date
CN214958773U true CN214958773U (en) 2021-11-30

Family

ID=79066978

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120860486.1U Active CN214958773U (en) 2021-04-25 2021-04-25 High-frequency power supply charging module

Country Status (1)

Country Link
CN (1) CN214958773U (en)

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