CN214956229U

CN214956229U - High-power precise chip resistor

Info

Publication number: CN214956229U
Application number: CN202121303239.8U
Authority: CN
Inventors: 宋丹
Original assignee: Shenzhen Huaxun Jiye Technology Co ltd
Current assignee: Shenzhen Huaxun Jiye Technology Co ltd
Priority date: 2021-06-10
Filing date: 2021-06-10
Publication date: 2021-11-30
Anticipated expiration: 2031-06-10

Abstract

The utility model discloses an accurate type chip resistor of high power relates to chip resistor technical field. The ceramic resistor comprises a ceramic substrate and a three-layer electrode assembly, wherein a resistor body is arranged at the top of the ceramic substrate, a first protective layer is sleeved outside the resistor body, the three-layer electrode assembly is arranged on each of two sides of the ceramic substrate and comprises an inner side electrode, one end of the inner side electrode extends to the bottom of the resistor body, the resistor body is electrically connected with the inner side electrode, an outer protective cover is arranged outside the three-layer electrode assembly, and a conductive convex block electrically connected with the inner side electrode is arranged at the bottom of the outer protective cover. By arranging the ceramic substrate and the three-layer electrode assembly, insulation corrosion-resistant protection is performed on the resistor body through the first protective layer and the second protective layer, and the outer protective cover is matched, so that the three-layer electrode assembly has excellent corrosion resistance, the condition that the three-layer electrode assembly is oxidized is avoided, and the service life of the three-layer electrode assembly is ensured.

Description

High-power precise chip resistor

Technical Field

The utility model relates to a chip resistor technical field specifically is a precision type chip resistor of high power.

Background

The chip resistor is also called a chip fixed resistor, and is one of metal glass glaze resistors. The resistor is made by mixing metal powder and glass glaze powder and printing the mixture on a substrate by a screen printing method, is resistant to humidity and high temperature, has small temperature coefficient, can greatly save the space cost of a circuit and enables the design to be more refined.

Although the conventional chip resistor is provided with the multilayer electrodes, the electrodes are exposed outside, so that the conventional chip resistor is very easily affected by the external environment to cause the problem of oxidation corrosion, and the service life of the chip resistor is seriously shortened.

SUMMERY OF THE UTILITY MODEL

The utility model provides a high power's accurate type chip resistor possesses and has avoided the electrode to expose and receive the condition of corruption outward and appear, has guaranteed the life's of resistance advantage to solve the electrode and expose outside, the problem that oxidation corrosion appears in the influence that receives external environment very easily.

For the condition of having avoided the electrode to expose outside to receive the corruption to appear, guaranteed the life's of resistance purpose, the utility model provides a following technical scheme: the utility model provides a precision type chip resistor of high power, includes ceramic substrate and three-layer electrode subassembly, its characterized in that: a resistor body is arranged at the top of the ceramic substrate, and a first protective layer is sleeved outside the resistor body;

the ceramic substrate is characterized in that three electrode assemblies are arranged on two sides of the ceramic substrate, each electrode assembly comprises an inner side electrode with one end extending to the bottom of the resistor body, the resistor body is electrically connected with the inner side electrode, an outer layer protective cover is arranged outside each electrode assembly, conductive lugs electrically connected with the inner layer electrodes are arranged at the bottom of the outer layer protective cover, and at least one grabbing groove is formed in the bottoms of the conductive lugs.

As an optimal technical scheme of the utility model, the outside of inoxidizing coating one is provided with inoxidizing coating two, inoxidizing coating one is low melting glass, inoxidizing coating two is electron fluoride layer.

As an optimized technical scheme of the utility model, the outside of inlayer electrode is provided with the middle level electrode, the outside of middle level electrode is provided with outer electrode, the inlayer electrode is silver palladium alloy, the middle level electrode is nickel plating alloy, outer electrode is the tin lead alloy.

As an optimized technical scheme of the utility model, conductive convex block's top is provided with the top and runs through outer electrode and middle level electrode in proper order and with inner electrode welded electrically conductive protruding.

As an optimal technical scheme of the utility model, three-layer electrode subassembly and outer protection casing all are the U-shaped setting, outer protection casing is the ceramic protection casing.

As a preferred technical scheme of the utility model, the atress groove that a quantity is no less than one is seted up to the inside in grabbing power groove.

Compared with the prior art, the utility model provides a precision type chip resistor of high power possesses following beneficial effect:

1. according to the high-power precise chip resistor, the ceramic substrate and the three-layer electrode assembly are arranged, insulation corrosion-resistant protection is performed on the resistor body through the first protective layer and the second protective layer, and the outer protective cover is matched, so that the three-layer electrode assembly has excellent corrosion-resistant performance, the condition that the three-layer electrode assembly is oxidized is avoided, and the service life of the three-layer electrode assembly is ensured.

2. This high power's accurate type chip resistor through setting up ceramic substrate and three-layer electrode subassembly, the atress groove cooperation is grabbed the power groove, has guaranteed the adhesion stress of conductive convex block with the tin cream, has guaranteed the stability after the tin cream shaping, and the outstanding outer protection casing of conductive convex block also can use the mode of spot welding to weld simultaneously, has guaranteed the suitability of this resistance.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a sectional view of the structure of the present invention;

fig. 3 is an enlarged view of a structure at a in fig. 2.

In the figure: 1. a ceramic substrate; 11. a resistor body; 12. a first protective layer; 13. a second protective layer; 2. a three-layer electrode assembly; 21. an outer protective cover; 22. a conductive bump; 23. a conductive bump; 24. a grip groove; 25. a stress groove; 26. an inner layer electrode; 27. a middle layer electrode; 28. and an outer electrode.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention discloses a high power precision chip resistor, which includes a ceramic substrate 1 and a three-layer electrode assembly 2, wherein a resistor 11 is disposed on the top of the ceramic substrate 1, and a protective layer 12 is disposed outside the resistor 11.

The ceramic substrate comprises a ceramic substrate 1 and is characterized in that three electrode assemblies 2 are arranged on two sides of the ceramic substrate 1, each three electrode assembly 2 comprises an inner side electrode with one end extending to the bottom of a resistor body 11, electric connection between the resistor body 11 and the inner side electrode is achieved, an outer layer protective cover 21 is arranged outside each three electrode assembly 2, a conductive bump 22 electrically connected with an inner layer electrode 26 is arranged at the bottom of the outer layer protective cover 21, and at least one grabbing groove 24 is formed in the bottom of the conductive bump 22.

Specifically, a second protective layer 13 is arranged outside the first protective layer 12, the first protective layer 12 is made of low-melting-point glass, the second protective layer 13 is made of an electronic fluoride layer, the first protective layer 12 and the second protective layer 13 protect the resistor body 11, a mechanical protection effect is achieved on the resistor body 11, the surface of the resistor body 11 can be insulated, and the electronic fluoride layer has good corrosion resistance.

Specifically, a middle electrode 27 is arranged outside the inner electrode 26, an outer electrode 28 is arranged outside the middle electrode 27, the inner electrode 26 is made of silver-palladium alloy, the middle electrode 27 is made of nickel-plated alloy, the outer electrode 28 is made of tin-lead alloy, and the middle electrode 27 is arranged, so that the heat resistance of the chip resistor is improved, thermal shock during welding is buffered, and the arrangement of the outer electrode 28 enables the chip resistor to have excellent conductivity and the service life to be prolonged.

Specifically, the top of the conductive bump 22 is provided with a conductive protrusion 23, the top end of which sequentially penetrates through the outer electrode 28 and the middle electrode 27 and is welded with the inner electrode 26, and the conductive protrusion 23 is arranged, so that the conductive bump 22 is directly connected with the inner electrode 26, the problem that the middle electrode 27 and the outer electrode 28 cannot be conducted when damaged is avoided, and the use performance of the conductive bump is ensured.

Specifically, three-layer electrode subassembly 2 and outer protection casing 21 all are the U-shaped setting, outer protection casing 21 is the ceramic protection casing, the setting of outer protection casing 21 for three-layer electrode subassembly 2 has good corrosion resisting property, has avoided three-layer electrode subassembly 2 the condition of oxidation to appear, has guaranteed three-layer electrode subassembly 2's life.

Specifically, the gripping force groove 24 is internally provided with at least one force-bearing groove 25, and the force-bearing groove 25 is matched with the gripping force groove 24, so that the bonding force between the conductive bump 22 and the solder paste is ensured, and the stability of the solder paste after molding is ensured.

In summary, according to the high-power precision chip resistor, the ceramic substrate 1 and the three-layer electrode assembly 2 are arranged, the resistor body 11 is subjected to insulation corrosion-resistant protection through the first protective layer 12 and the second protective layer 13, and the outer-layer protective cover 21 is matched, so that the three-layer electrode assembly 2 has excellent corrosion-resistant performance, the three-layer electrode assembly 2 is prevented from being oxidized, and the service life of the three-layer electrode assembly 2 is ensured.

It should be noted that, in this document, terms such as "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a precision type chip resistor of high power, includes ceramic substrate (1) and three-layer electrode subassembly (2), its characterized in that: a resistor body (11) is arranged at the top of the ceramic substrate (1), and a first protective layer (12) is sleeved outside the resistor body (11);

the ceramic substrate is characterized in that three electrode assemblies (2) are arranged on two sides of the ceramic substrate (1), each three electrode assembly (2) comprises an inner side electrode with one end extending to the bottom of the resistor body (11), the resistor body (11) is electrically connected with the inner side electrode, an outer layer protective cover (21) is arranged outside each three electrode assembly (2), a conductive convex block (22) electrically connected with an inner layer electrode (26) is arranged at the bottom of each outer layer protective cover (21), and at least one grabbing groove (24) is formed in the bottom of each conductive convex block (22).

2. The high-power precise chip resistor as claimed in claim 1, wherein: the outer part of the first protective layer (12) is provided with a second protective layer (13), the first protective layer (12) is made of low-melting-point glass, and the second protective layer (13) is an electronic fluoride layer.

3. The high-power precise chip resistor as claimed in claim 1, wherein: the outer electrode structure is characterized in that a middle layer electrode (27) is arranged outside the inner layer electrode (26), an outer layer electrode (28) is arranged outside the middle layer electrode (27), the inner layer electrode (26) is made of silver-palladium alloy, the middle layer electrode (27) is made of nickel-plated alloy, and the outer layer electrode (28) is made of tin-lead alloy.

4. The high-power precise chip resistor as claimed in claim 1, wherein: the top of the conductive bump (22) is provided with a conductive bump (23) the top end of which sequentially penetrates through the outer layer electrode (28) and the middle layer electrode (27) and is welded with the inner layer electrode (26).

5. The high-power precise chip resistor as claimed in claim 1, wherein: the three-layer electrode assembly (2) and the outer protective cover (21) are both arranged in a U shape, and the outer protective cover (21) is a ceramic protective cover.

6. The high-power precise chip resistor as claimed in claim 1, wherein: at least one force bearing groove (25) is formed in the grabbing groove (24).