CN214813957U - Stress relief die for television back panel - Google Patents

Stress relief die for television back panel Download PDF

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Publication number
CN214813957U
CN214813957U CN202121029084.3U CN202121029084U CN214813957U CN 214813957 U CN214813957 U CN 214813957U CN 202121029084 U CN202121029084 U CN 202121029084U CN 214813957 U CN214813957 U CN 214813957U
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mould
needle
towards
buffer
mold
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CN202121029084.3U
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Chinese (zh)
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肖波
高军
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Dongguan Xinghai Sheng Precision Technology Co ltd
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Dongguan Xinghai Sheng Precision Technology Co ltd
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Abstract

The utility model discloses a stress relief mould for TV set backplate includes mould and lower mould, it is equipped with first towards needle and second towards the needle respectively to go up mould and lower mould, and first towards needle and second towards the needle and be connected with the cylinder respectively, goes up mould and lower mould and is equipped with respectively and dashes needle and first location portion and the second location portion that dashes needle matched with the second, it is equipped with buffer to go up mould and lower mould. In the concrete implementation, go up mould and lower mould compound die for the first time, the buffer board at first offsets with the backplate, until the guide bar stretches into the constant head tank completely, then first towards needle and second towards the corresponding type hole of backplate shaping, then go up the mould under buffer's rebound effect, go up the die holder part jacking, and the buffer board makes the buffer board offset with the backplate all the time under the effect of first spring, make the effort of backplate exert with the buffer board on, then drive arrangement continues to drive the upper die base and pushes down and act on the buffer board, make backplate secondary atress, effectively improved the product percent of pass.

Description

Stress relief die for television back panel
Technical Field
The utility model relates to a TV backplate processing equipment technical field, in particular to a stress relief mould for TV set backplate.
Background
Roughly classified into 5 subclasses from the use effect and the appearance: flat panel television (plasma, liquid crystal and a part of ultra thin wall DLP rear projector), CRT kinescope television (flat CRT, ultra thin CRT, etc.), rear projection television (CRT rear projector, DLP rear projector, LCOS rear projector, liquid crystal rear projector), projection television, 3D television
Most televisions still can be defined as flat panel televisions in appearance, and the main characteristic is that the thickness is thinner, so that the home environment is more harmonious and the carrying is more convenient. The glass display screen mainly comprises a shell, a main board and a glass display screen, wherein the glass display screen is generally arranged on a back plate, and the back plate plays a role in placing the glass display screen to leak light and fix the glass display screen.
In the course of working, generally use the punching machine with planar plate body, through the corresponding shape of punching machine at the plate body punching press to the corresponding recess of shaping or lug or mounting hole, but current mould is after processing is accomplished, the discovery, when going up mould and lower mould drawing of patterns, the backplate can produce meeting stress in the plate body because the power of holding of mould stamping force, can cause the deformation of plate body part when going up the mould drawing of patterns, influences the qualification rate of product.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a stress relief mould for TV set backplate aims at reducing the plate body stress deformation that the mould drawing of patterns caused, improves the product percent of pass.
In order to achieve the above object, the utility model provides a stress relief mould for TV set backplate, including last mould and lower mould, it is equipped with first towards needle and second towards the needle respectively to go up mould and lower mould, first towards needle and second towards the needle and be connected with the cylinder, it is equipped with respectively and dashes needle and first location portion and the second location portion towards needle matched with the second to go up mould and lower mould, it is equipped with buffer to go up mould and lower mould, go up the mould and move the back on buffer's elasticity, with the lower mould compound die once more under drive arrangement's drive.
Preferably, the upper die comprises an upper die base and a buffer plate slidably mounted on the upper die base, the upper die base is provided with a guide rod, the buffer plate is slidably mounted on the guide rod, and the buffer plate is provided with a guide hole matched with the guide rod.
Preferably, the lower die is provided with a limiting groove matched with the guide rod.
Preferably, the buffer plate is provided with a sliding hole for the first punch pin to pass through.
Preferably, the guide rod sleeve is provided with a first spring, and the first spring is arranged between the upper die base and the buffer plate.
Preferably, buffer includes locating lever and the constant head tank of locating between mould and the lower mould respectively, the locating lever can stretch into the constant head tank.
Preferably, the positioning groove is provided with a second spring, and when the positioning rod extends into the positioning groove, the lower end of the positioning rod is abutted against the second spring.
Preferably, the inner wall of the positioning groove is further provided with a damping layer.
Preferably, the outer wall of the guide bar is provided with a plurality of elastic protrusions.
Preferably, the lower end surface of the wire rod and the lower end surface of the positioning rod are in a wedge shape.
In the technical scheme of the utility model, in the process of opening the mould, the upper mould moves upwards by 2mm-4mm under the elastic action of the buffer device, and then the driving device applies the pressing pressure to the upper mould again to fix the backboard again, thereby effectively releasing part of stress; in the concrete implementation, go up mould and lower mould compound die for the first time, the buffer board at first offsets with the backplate, until the guide bar stretches into the constant head tank completely, then first towards needle and second towards the corresponding type hole of backplate shaping, then go up the mould under buffer's rebound effect, go up the die holder part jacking, and the buffer board makes the buffer board offset with the backplate all the time under the effect of first spring, make the effort of backplate exert with the buffer board on, then drive arrangement continues to drive the upper die base and pushes down and act on the buffer board, make backplate secondary atress, effectively improved the product percent of pass.
Drawings
FIG. 1 is a schematic view of the mold opening state of the present invention;
FIG. 2 is a schematic view of the mold closing state of the present invention;
FIG. 3 is a schematic view of the mold opening state (side cut);
fig. 4 is a schematic view (side cut) of the mold closing state of the present invention.
In the drawing, 1 is an upper die, 11 is an upper die base, 12 is a buffer plate, 2 is a lower die, 31 is a first punch pin, 32 is a second punch pin, 41 is a first positioning portion, 42 is a second positioning portion, 51 is a stopper groove, 52 is a guide hole, 61 is a first spring, 62 is a second spring, 7 is an elastic projection, 81 is a positioning rod, 82 is a positioning groove, and 9 is a guide rod.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indicators (such as … …, upper, lower, left, right, front, back, top, bottom, inner, outer, vertical, horizontal, longitudinal, counterclockwise, clockwise, circumferential, radial, axial) are involved in the embodiments of the present invention, the directional indicators are only used to explain the relative position, motion, etc. of the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicators are changed accordingly.
In addition, if there is a description relating to "first" or "second", etc. in the embodiments of the present invention, the description of "first" or "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
As shown in fig. 1 to 4, a stress relief mold for a tv back plate includes an upper mold 1 and a lower mold 2, where the upper mold 1 and the lower mold 2 are respectively provided with a first punch pin 31 and a second punch pin 32, the first punch pin 31 and the second punch pin 32 are connected to a cylinder, the upper mold 1 and the lower mold 2 are respectively provided with a first positioning portion 41 and a second positioning portion 42 that are matched with the second punch pin 32 and the first punch pin 31, the upper mold 1 and the lower mold 2 are provided with a buffer device, and after moving up by an elastic force of the buffer device, the upper mold 1 is matched with the lower mold 2 again by a driving device.
In the process of opening the die, the upper die 1 moves upwards by 2mm-4mm under the elastic force of the buffer device, and then the driving device applies downward pressure to the upper die 1 again to fix the back plate again, so that part of stress is released effectively; in the specific implementation, the upper die base 11 and the lower die 2 are closed for the first time, the buffer plate 12 firstly abuts against the back plate until the guide rod 9 completely extends into the limiting groove 51, then the first punching pin 31 and the second punching pin 32 form corresponding holes on the back plate, then the upper die base 11 partially jacks the upper die base 11 under the rebound action of the buffer device, the buffer plate 12 always abuts against the back plate under the action of the first spring 61, the acting force of the back plate is applied to the buffer plate 12, then the driving device continuously drives the upper die base 11 to press downwards and act on the buffer plate 12, the back plate is stressed for the second time, and the product qualification rate is effectively improved.
The embodiment of the utility model provides an in, go up mould 1 and include upper die base 11 and slidable mounting in the buffer board 12 of upper die base 11, upper die base 11 is equipped with guide bar 9, buffer board 12 slidable mounting is on guide bar 9, buffer board 12 is equipped with the guiding hole 52 with guide bar 9 matched with, and buffer board 12 cover passes through guiding hole 52 slidable mounting in guide bar 9 promptly.
In the embodiment of the present invention, the lower mold 2 is provided with a limiting groove 51 matched with the guiding rod 9, i.e. the guiding rod 9 can extend into the limiting groove 51, so that the upper mold base directly applies pressure to the sliding plate, thereby positioning the back plate.
In the embodiment of the present invention, the buffer plate 12 is provided with a sliding hole for the first punching pin 31 to pass through, and then punch a corresponding hole.
In the embodiment of the present invention, the guide rod 9 is sleeved with a first spring 61, the first spring 61 is disposed between the upper die base 11 and the buffer board 12, so that the buffer board 12 can move down.
In the embodiment of the present invention, the buffering device includes a positioning rod 81 and a positioning groove 82 respectively disposed between the upper mold 1 and the lower mold 2, the positioning rod 81 can extend into the positioning groove 82 to perform the positioning and buffering functions.
The embodiment of the utility model provides an in, the constant head tank 82 is equipped with second spring 62, and when the constant head tank 82 was stretched into to the positioning rod 81, the lower extreme of positioning rod 81 offsets with second spring 62, slows down the vibrations when going up mould 1 and pushing down promptly to reduce the error of punching press, and can exert ascending elasticity to last mould 1.
The embodiment of the utility model provides an in, the inner wall of constant head tank 82 still is equipped with the damping layer, improves the friction between locating lever 81 and the constant head tank 82, reduces the vibrations of going up mould 1 when pushing down.
In the embodiment of the present invention, the outer wall of the guiding rod 9 is provided with a plurality of elastic bumps 7, so that the buffering plate 12 is clamped at the corresponding position.
The above only be the preferred embodiment of the utility model discloses a not consequently restriction the utility model discloses a patent range, all are in the utility model discloses a conceive, utilize the equivalent structure transform of what the content was done in the description and the attached drawing, or direct/indirect application all is included in other relevant technical field the utility model discloses a patent protection within range.

Claims (10)

1. The utility model provides a stress relief mould for TV set backplate which characterized in that, includes mould and lower mould, it is equipped with first towards needle and second towards the needle to go up mould and lower mould respectively, first towards the needle and the second towards the needle is connected with the cylinder respectively, go up mould and lower mould and be equipped with respectively with second towards needle and first towards needle matched with first location portion and second location portion, go up mould and lower mould and be equipped with buffer, go up the mould and move up the back at buffer's elasticity, with the lower mould compound die again under drive arrangement's drive.
2. The mold for relieving stress of a back plate of a television set according to claim 1, wherein: the upper die comprises an upper die base and a buffer plate slidably mounted on the upper die base, the upper die base is provided with a guide rod, the buffer plate is slidably mounted on the guide rod, and the buffer plate is provided with a guide hole matched with the guide rod.
3. The mold for relieving stress of a back plate of a television set according to claim 1, wherein: the lower die is provided with a limiting groove matched with the guide rod.
4. The mold for relieving stress of a back plate of a television set according to claim 2, wherein: the buffer plate is provided with a sliding hole for the first punching needle to pass through.
5. The mold for relieving stress of a back plate of a television set according to claim 2, wherein: the guide rod sleeve is provided with a first spring, and the first spring is arranged between the upper die base and the buffer plate.
6. The mold for relieving stress of a back plate of a television set according to claim 2, wherein: the buffer device comprises a positioning rod and a positioning groove which are respectively arranged between the upper die and the lower die, and the positioning rod can extend into the positioning groove.
7. The mold for relieving stress of a back plate of a television set according to claim 6, wherein: the locating slot is provided with a second spring, and when the locating rod extends into the locating slot, the lower end of the locating rod is abutted against the second spring.
8. The mold for relieving stress of a back plate of a television set according to claim 6, wherein: the inner wall of the positioning groove is also provided with a damping layer.
9. The mold for relieving stress of a back plate of a television set according to claim 2, wherein: the outer wall of the guide rod is provided with a plurality of elastic lugs.
10. The mold for relieving stress of a back plate of a television set according to claim 6, wherein: the lower end surface of the guide rod and the lower end surface of the positioning rod are in a wedge shape.
CN202121029084.3U 2021-05-14 2021-05-14 Stress relief die for television back panel Active CN214813957U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121029084.3U CN214813957U (en) 2021-05-14 2021-05-14 Stress relief die for television back panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121029084.3U CN214813957U (en) 2021-05-14 2021-05-14 Stress relief die for television back panel

Publications (1)

Publication Number Publication Date
CN214813957U true CN214813957U (en) 2021-11-23

Family

ID=78774098

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121029084.3U Active CN214813957U (en) 2021-05-14 2021-05-14 Stress relief die for television back panel

Country Status (1)

Country Link
CN (1) CN214813957U (en)

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