CN214810755U - Photocuring device with specific gas atmosphere protection - Google Patents

Photocuring device with specific gas atmosphere protection Download PDF

Info

Publication number
CN214810755U
CN214810755U CN202023188567.6U CN202023188567U CN214810755U CN 214810755 U CN214810755 U CN 214810755U CN 202023188567 U CN202023188567 U CN 202023188567U CN 214810755 U CN214810755 U CN 214810755U
Authority
CN
China
Prior art keywords
box body
transparent box
specific gas
photo
control chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202023188567.6U
Other languages
Chinese (zh)
Inventor
刘泉
李文杰
王蓓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Jiyang Photoelectric Technology Co ltd
Original Assignee
Kunshan Jiyang Photoelectric Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Jiyang Photoelectric Technology Co ltd filed Critical Kunshan Jiyang Photoelectric Technology Co ltd
Priority to CN202023188567.6U priority Critical patent/CN214810755U/en
Application granted granted Critical
Publication of CN214810755U publication Critical patent/CN214810755U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)

Abstract

The utility model provides a photocuring device with specific gas atmosphere protection, it includes: the transparent box body is used for placing a sample to be solidified and is provided with a closed cavity door, the transparent box body is provided with a vent hole and an exhaust hole, and the vent hole is used for being communicated with a specific gas source through a pipeline provided with an electronic valve; the oxygen sensor is arranged in the transparent box body and used for detecting the oxygen content in the transparent box body; the light curing equipment is used for irradiating a sample to be cured in the transparent box body and comprises a control chip, the control chip is in communication connection with the oxygen sensor to receive the oxygen content detected by the oxygen sensor, and the control chip is also in communication connection with the electronic valve to control the on-off of the electronic valve. The utility model discloses a photocuring device is through automatic detection oxygen content or oxygen concentration and through letting in of controlling specific gas for treat that the solidification sample can carry out photocuring under the specific gas atmosphere protection that satisfies the condition.

Description

Photocuring device with specific gas atmosphere protection
Technical Field
The utility model relates to a light-curing equipment field especially relates to a light-curing device with specific gas atmosphere protection.
Background
UV light curing has important significance in the industries of cosmetics, nano imprinting, coating preparation and the like. Some UV light curing processes cannot be performed under air and need to be performed under a specific gas atmosphere. The prior art lacks a light curing device protected by a specific gas atmosphere, and therefore a light curing device capable of providing protection by a specific gas atmosphere is needed.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model discloses a photocuring device with protection of specific gas atmosphere, it includes: the transparent box body is used for placing a sample to be cured and is provided with a closed cavity door, the transparent box body is provided with a vent hole and an exhaust hole, and the vent hole is communicated with a specific gas source through a pipeline provided with an electronic valve; the oxygen sensor is arranged in the transparent box body and used for detecting the oxygen content in the transparent box body; and the light curing equipment is used for irradiating the sample to be cured in the transparent box body and comprises a control chip, the control chip is in communication connection with the oxygen sensor so as to receive the oxygen content detected by the oxygen sensor, and the control chip is also in communication connection with the electronic valve so as to control the on-off of the electronic valve.
Furthermore, the transparent box body is of a two-layer cavity structure, wherein the upper layer cavity is used for placing the light curing equipment, and the lower layer cavity is used for placing a sample to be cured.
Further, one of the vent hole and the exhaust hole is disposed at an upper position of the lower cavity, and the other is disposed at a lower position of the lower cavity.
Further, the number of the vent holes is at least two, wherein at least one vent hole is arranged at the upper position of the lower cavity, at least one vent hole is arranged at the lower position of the lower cavity, and the number of the exhaust holes is at least two, wherein at least one exhaust hole is arranged at the upper position of the lower cavity, at least one exhaust hole is arranged at the lower position of the lower cavity, and at least two of the exhaust holes are provided with switch valves.
Further, the number of the oxygen sensors is at least two, wherein at least one oxygen sensor is arranged at an upper position of the lower cavity, and at least one oxygen sensor is arranged at a lower position of the lower cavity.
Furthermore, an air inlet hole for introducing air is further formed in the lower-layer cavity, and a switch valve is arranged at the air inlet hole.
Furthermore, the number of the air inlets is at least two, wherein at least one air inlet is arranged at the upper part of the lower layer cavity, and at least one air inlet is arranged at the lower part of the lower layer cavity.
Furthermore, the switch valves arranged at the exhaust hole and the air inlet hole are electronic valves in communication connection with the control chip.
Further, the light curing equipment also comprises a heat dissipation assembly and a light source, wherein the light source is a linear light source or a surface light source.
Further, the light curing equipment is light curing equipment under any wave band.
The utility model discloses a photocuring device is through automatic detection oxygen content or oxygen concentration and through letting in of controlling specific gas for treat that the solidification sample can carry out photocuring under the specific gas atmosphere protection that satisfies the condition.
Drawings
Fig. 1 is a schematic view of the entire structure of the light curing device of the present invention;
fig. 2 is an exploded schematic view of the light curing device of the present invention.
Detailed Description
The technical solution of the present invention will be further described with reference to the following specific examples, but the present invention is not limited to these examples.
Referring to fig. 1 and 2, the present invention provides a light curing apparatus with a specific gas atmosphere protection, which includes: the curing device comprises a transparent box body 1, a gas source, a gas outlet and a gas inlet, wherein the transparent box body 1 is used for placing a sample to be cured and is provided with a closed cavity door 15, the transparent box body 1 is provided with a vent hole 10 and a vent hole 11, the vent hole 10 is communicated with a specific gas source (for example, a specific gas concentration bottle) through a pipeline (for example, a valve hose) provided with an electronic valve, so that the specific gas source can be introduced into the transparent box body 1 through the vent hole 10, and the transparent box body is in a specific gas atmosphere; the oxygen sensor 2 is arranged in the transparent box body 1 and used for detecting the oxygen content in the transparent box body 1; and the light curing device 3 is used for irradiating the sample to be cured in the transparent box body 1, the light curing device 3 comprises a control chip, the control chip is in communication connection with the oxygen sensor 2 to receive the oxygen content detected by the oxygen sensor 2, and the control chip is also in communication connection with the electronic valve to control the on-off of the electronic valve.
In the technical scheme of the utility model, firstly, the sample to be solidified is placed in the transparent box body by opening the airtight cavity door, and the cavity door is closed; then, detecting the oxygen concentration in the transparent box body through an oxygen sensor, comparing the detected oxygen concentration with a preset value through a control chip, controlling an electronic valve to be opened through the control chip to introduce specific gas (for example, nitrogen) into the transparent box body when the oxygen concentration is higher than the preset value, simultaneously opening an exhaust hole to exhaust air, starting the program to expose the light curing equipment and controlling the exposure time when the oxygen concentration detected by the oxygen sensor is reduced to the preset value, and continuously introducing the specific gas during the exposure period until the exposure is finished; finally, the chamber door is opened to take out the sample. Thereby, a photo-curing process under protection of a specific gas atmosphere is achieved.
The utility model discloses a photocuring device is through automatic detection oxygen content or oxygen concentration and through letting in of controlling specific gas for treat that the solidification sample can carry out photocuring under the specific gas atmosphere protection that satisfies the condition.
As shown in fig. 1 and fig. 2, the transparent box 1 may have a two-layer cavity structure, wherein the upper layer cavity 13 may be used for placing the light curing device 3, and the lower layer cavity 14 may be used for placing a sample to be cured. In this case, the oxygen sensor, the vent hole and the exhaust hole are also disposed in the lower chamber 14 accordingly. It is understood that the structure of the transparent casing 1 is not limited thereto, and the transparent casing 1 may also be a single-layer cavity structure.
In practical applications, different light curing processes may need to be performed under different specific gas atmosphere protection, for example, nitrogen gas, helium gas atmosphere, etc. Since it is necessary to introduce a specific gas through the vent hole 10 and to discharge air through the discharge hole 11, in order to improve the ventilation and discharge efficiency, the arrangement positions of the vent hole 10 and the discharge hole 11 are preferably determined depending on the density ratio of the specific gas to the air. If the density of the specific gas is greater than that of air, it is preferable that the vent hole 10 is provided at a lower position of the lower chamber 14 and the exhaust hole 11 is provided at an upper position of the lower chamber 14, and if the density of the specific gas is less than that of air, it is preferable that the vent hole 10 is provided at an upper position of the lower chamber 14 and the exhaust hole 11 is provided at a lower position of the lower chamber 14.
In a further embodiment, in order to make the same photo-curing device applicable to photo-curing under different specific atmospheres, as shown in fig. 1, at least two vent holes 10 and at least two vent holes 11 may be provided on the transparent case 1 (specifically, the lower cavity 14), and at least one vent hole 10 is provided at an upper position of the lower cavity 14, at least one vent hole 10 is provided at a lower position of the lower cavity 14, similarly, at least one vent hole 11 is provided at an upper position of the lower cavity 14, at least one vent hole 11 is provided at a lower position of the lower cavity 14, and at least two vent holes may be provided with a switch valve.
In the above further embodiments, different vent holes 10 and vent holes 11 may be selected for use according to the needs of a particular gas atmosphere to improve venting and exhaustion efficiency. For example, when the density of the required specific gas is higher than that of air, it is selected to use the vent hole 10 at the lower position of the lower chamber 14 and the exhaust hole 11 at the upper position of the lower chamber 14; and vice versa.
In addition, it will be appreciated that, in order to ensure accurate detection of the oxygen content in the transparent enclosure, the specific location of the oxygen sensor 2 will also depend on the density contrast of the particular gas to air. In view of this, in a preferred embodiment, at least two oxygen sensors may be arranged in the transparent case 1 (specifically, the lower chamber 14), wherein at least one oxygen sensor 2 is disposed at an upper position of the lower chamber 14 and at least one oxygen sensor 2 is disposed at a lower position of the lower chamber 14. In this case, the exposure is performed only when the oxygen content or the oxygen concentration detected by the two oxygen sensors 2 simultaneously satisfies below the set value.
In practice, after the photo-curing of a certain sample to be cured is completed, the chamber door is opened to take out the sample, and the lower chamber 14 is returned to the air atmosphere during the process of opening the chamber door, so that the next sample to be cured can be put in, and the photo-curing control process as described above is repeated.
However, in some cases, it may be necessary to successively carry out photocuring under different specific gas atmospheres on the same sample to be cured. After photo-curing is performed under a specific gas atmosphere, the interior of the box body needs to be restored to an air atmosphere first, so that the concentration of other specific atmospheres can be controlled by detecting the oxygen content. In order to eliminate the action of opening the chamber door, in a preferred embodiment, an air inlet hole for introducing air can be further arranged on the lower chamber 14, and a switch valve is arranged at the air inlet hole. So that air can be introduced into the lower chamber 14 by opening the respective on-off valve.
In addition, it is understood that, in order to provide the ventilation and exhaust efficiency, the number of the air intake holes may be at least two, wherein at least one air intake hole is provided at an upper position of the lower chamber and at least one air intake hole is provided at a lower position of the lower chamber. So that the corresponding air inlet and outlet holes can be selectively opened according to the comparison of the density of the specific gas and the air in the box body.
Further, in order to reduce the manual intervention process and achieve automatic control of the light curing process, the switch valve may be an electronic valve in communication connection with the control chip, so that the on-off of the air inlet and the air outlet is automatically controlled by the control chip.
Further, the light curing device 3 further comprises a heat dissipation assembly and a light source, and the light source can be a linear light source or a surface light source. When a linear light source is adopted, the light curing device can perform scanning curing.
Further, the light curing equipment is light curing equipment under any wave band, working time and working power can be set, when the oxygen content sensor detects that the oxygen content in the sample cavity is lower than a preset value, the control chip controls the light curing equipment to be started, and the light curing equipment is closed after the working time.
In addition, as for the transparent case 1, it may be made of transparent material such as acryl, glass, etc.
The utility model has the advantages that:
1. the light curing equipment is combined with the specific gas atmosphere generating equipment, so that the requirement that the oxygen content in the atmosphere needs to be controlled under most light curing conditions is met.
2. The oxygen content sensor is arranged, the on-off of specific gas is intelligently controlled, the oxygen content in the atmosphere can be accurately limited, manual control is not needed, the operation is simple, the gas cost is saved, and the environment is not damaged.
3. The light curing equipment is provided with an intelligent control chip, the opening and closing conditions of the intelligent control chip are communicated with the oxygen content sensor, when the oxygen content sensor detects that the oxygen content is lower than a preset value, the light curing equipment is opened, the light curing equipment is automatically closed after working for preset time, then specific gas is cut off and introduced, and the condition that the oxygen content meets the curing requirement all the time during curing can be guaranteed, so that the curing effect is optimal.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, many modifications and improvements can be made without departing from the inventive concept, and all of them belong to the protection scope of the present invention.

Claims (10)

1. A photo-curing device with specific gas atmosphere protection, comprising:
the transparent box body is used for placing a sample to be cured and is provided with a closed cavity door, the transparent box body is provided with a vent hole and an exhaust hole, and the vent hole is communicated with a specific gas source through a pipeline provided with an electronic valve;
the oxygen sensor is arranged in the transparent box body and used for detecting the oxygen content in the transparent box body;
and the light curing equipment is used for irradiating the sample to be cured in the transparent box body and comprises a control chip, the control chip is in communication connection with the oxygen sensor so as to receive the oxygen content detected by the oxygen sensor, and the control chip is also in communication connection with the electronic valve so as to control the on-off of the electronic valve.
2. The light curing device of claim 1, wherein the transparent box has a two-layer cavity structure, wherein the upper layer cavity is used for placing the light curing equipment, and the lower layer cavity is used for placing a sample to be cured.
3. The photo-curing device according to claim 2, wherein one of the vent hole and the exhaust hole is provided at an upper position of the lower cavity and the other is provided at a lower position of the lower cavity.
4. The photo-curing device of claim 2, wherein the number of the vent holes is at least two, wherein at least one vent hole is provided at an upper position of the lower chamber, at least one vent hole is provided at a lower position of the lower chamber, and a switching valve is provided at each of the at least two vent holes.
5. The photo-curing device of claim 4, wherein the number of the oxygen sensors is at least two, wherein at least one oxygen sensor is disposed at an upper position of the lower cavity and at least one oxygen sensor is disposed at a lower position of the lower cavity.
6. The photo-curing device of claim 5, wherein an air inlet hole is further formed on the lower chamber for introducing air, and a switch valve is disposed at the air inlet hole.
7. The photo-curing device of claim 6, wherein the number of the air inlet holes is at least two, wherein at least one air inlet hole is provided at an upper position of the lower chamber and at least one air inlet hole is provided at a lower position of the lower chamber.
8. The photo-curing device of claim 7, wherein the switch valves disposed at the air outlet and the air inlet are electronic valves communicatively connected to the control chip.
9. The photocuring device according to any one of claims 1 to 8, wherein the photocuring apparatus further comprises a heat dissipation component and a light source, and the light source is a linear light source or a surface light source.
10. The photocuring apparatus according to any one of claims 1 to 8, wherein the photocuring device is a photocuring device at an arbitrary wavelength band.
CN202023188567.6U 2020-12-26 2020-12-26 Photocuring device with specific gas atmosphere protection Active CN214810755U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202023188567.6U CN214810755U (en) 2020-12-26 2020-12-26 Photocuring device with specific gas atmosphere protection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202023188567.6U CN214810755U (en) 2020-12-26 2020-12-26 Photocuring device with specific gas atmosphere protection

Publications (1)

Publication Number Publication Date
CN214810755U true CN214810755U (en) 2021-11-23

Family

ID=78869609

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202023188567.6U Active CN214810755U (en) 2020-12-26 2020-12-26 Photocuring device with specific gas atmosphere protection

Country Status (1)

Country Link
CN (1) CN214810755U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114042613A (en) * 2021-11-29 2022-02-15 浙江科力厌氧胶有限公司 Colloid curing device and curing process thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114042613A (en) * 2021-11-29 2022-02-15 浙江科力厌氧胶有限公司 Colloid curing device and curing process thereof

Similar Documents

Publication Publication Date Title
CN214810755U (en) Photocuring device with specific gas atmosphere protection
CN207464492U (en) A kind of automatic adjustment absorption platform suitable for the processing of sizes laser light guide plate
US7878112B2 (en) Apparatus and methods for storing sensitive materials
TW200601482A (en) Load port
US10399237B2 (en) Controlling a vacuum system comprising a vacuum generator
JP2005504855A5 (en)
HK1091026A1 (en) Air de-humidifier for oil-insulated transformers, choke coils and step switches
TW200602243A (en) Stocker for semiconductor substrates, storage method therefor and fabrication method for semiconductor device using the stocker
US6339028B2 (en) Vacuum loadlock ultra violet bake for plasma etch
CN109622962B (en) Multichannel dual cycle atmosphere protection system
TW200610164A (en) Method and device for encapsulating electronic components with a conditioning gas
CN114669253A (en) Photocuring device with specific gas atmosphere protection
DE102006035423A1 (en) Valve device for exhaust-gas recirculation device, has valve provided with completely closed bypass in position, if valve is placed on hub, where position is defined with completely closed bypass between radiator inlet and outlet openings
KR100253102B1 (en) Water treatment facility having the photo-oxidationequipment, for manufacturing semiconductor device and water treating method
CA2727805A1 (en) Apparatus for impregnating fibrous material with a liquid
JP2008525566A5 (en)
KR20060114153A (en) Apparatus for imprinting the patern
CN209918886U (en) Multichannel dual cycle atmosphere protection system
ATE277342T1 (en) DEVICE FOR QUALIFYING PRODUCTS WITH HIGHLY VOLATILE COMPONENTS
US6843967B2 (en) Curing unit
US6622398B2 (en) Method of ozone conversion in semiconductor manufacturing
CN203956931U (en) A kind of Simple hand casing
CN216226065U (en) Laboratory ventilation hood
CN219552046U (en) UV curing device
JP3214097U (en) Storage device

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant