CN214800420U - Heat radiation module - Google Patents

Abstract

The utility model provides a heat radiation module for solve the not good problem of current temperature-uniforming plate radiating efficiency. The method comprises the following steps: the shell is provided with a circulating chamber which surrounds the outside of the accommodating space and is divided into an upper chamber part and a lower chamber part; a working liquid filled in the lower cavity part; and a heat radiation fin group located in the containing space.

Description

Heat radiation module

Technical Field

The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module for an electronic device.

Background

In order to avoid local overheating of an electronic device, in the current heat dissipation mode of the electronic device, a temperature-uniforming plate is mainly arranged in the electronic device and can be attached to a heating area of the electronic device; therefore, heat energy generated by the heating area can be diffused to the temperature equalizing plate, so that the heat energy is effectively prevented from being gathered in the heating area, and the heat dissipation effect can be achieved.

In the conventional temperature equalizing plate, even if the heating area can heat the working liquid and vaporize the working liquid, the gaseous working liquid is evaporated to one side far away from the heating area to release heat and then is condensed and carries away the heat of the heating area; however, since the temperature equalization plate only dissipates heat through the gas-liquid phase change of the working liquid, the heat dissipation effect of the temperature equalization plate on the heating area is limited, resulting in poor heat dissipation efficiency.

In view of the above, there is still a need for improvement of the conventional vapor chamber.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problems, the present invention provides a heat dissipation module with good heat dissipation efficiency.

The utility model discloses a next purpose provides a heat dissipation module, has the equipment convenience.

It is still another object of the present invention to provide a heat dissipation module with convenience in use.

It is still another object of the present invention to provide a heat dissipation module, which can reduce the manufacturing cost.

In the present invention, the directions or the similar terms thereof, such as "front", "back", "left", "right", "top", "bottom", "inner", "outer", "side", etc., refer to the directions of the drawings, and the directions or the similar terms thereof are only used to assist the explanation and understanding of the embodiments of the present invention, but not to limit the present invention.

The components and members described throughout the present invention use the wording "one" or "one" only for convenience of use and to provide a general meaning of the scope of the present invention; in the present invention, it is to be understood that one or at least one is included, and a single concept also includes a plurality unless it is obvious that other meanings are included.

The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a method for manufacturing a semiconductor device, which can be used for manufacturing a semiconductor device, and a semiconductor device manufactured by the method.

The utility model discloses a heat dissipation module, include: the shell is provided with a circulating chamber which surrounds the outside of the accommodating space and is divided into an upper chamber part and a lower chamber part; a working liquid filled in the lower cavity part; and a heat radiation fin group located in the containing space.

Therefore, the heat dissipation module of the present invention utilizes the circulation chamber to surround the accommodating space, and the working fluid is filled in the lower chamber; when the heat dissipation module operates, the heat energy of the heating source can be absorbed by the working liquid in the lower cavity, the working liquid in the lower cavity can absorb the heat energy from a liquid state and is evaporated into a gaseous state, the working liquid forming the gaseous state can upwards or upwards enter the upper cavity, the working liquid upwards or upwards entering the upper cavity can be rapidly condensed into the liquid state by the gaseous state and then returns to the lower cavity, so that the working liquid can fully absorb the heat energy of the heating source, and through the arrangement of the heat dissipation fin group, the heat energy in the circulation cavity and the heat dissipation fin group can have more contact area, and the heat dissipation module has the effect of improving good heat dissipation efficiency.

The housing may have an outer shell portion surrounding at least one inner shell portion, and the circulation chamber may be located between the outer shell portion and the inner shell portion. Therefore, the structure is simple and convenient to manufacture, and the effect of reducing the manufacturing cost is achieved.

Wherein, this inner shell portion can have a drain surface and adjoin this upper chamber portion, and this drain surface can be the slope and form an contained angle with a horizontal plane. Therefore, when the working liquid in the upper cavity is condensed from gas state to liquid state, the working liquid can easily flow from the high position to the two low positions so as to return to the lower cavity, and the effect of smooth flow guiding is achieved.

The number of the inner shell parts can be multiple, and the multiple inner shell parts are arranged at intervals up and down. Therefore, the structure is simple and convenient to manufacture, and the effect of reducing the manufacturing cost is achieved.

Wherein, a middle cavity part of the circulation cavity can be formed between two adjacent inner shells, and the middle cavity part can be positioned between the upper cavity part and the lower cavity part. Therefore, when the working liquid in the lower cavity part is converted into the gaseous state and moves upwards, part of the working liquid can be condensed back to the liquid state in the middle cavity part and then returns to the lower cavity part, and the rest part of the working liquid can be continuously positioned in the middle cavity part until enough energy is accumulated and vaporized to enter the upper cavity part, and is condensed into the liquid state again from the gaseous state and then returns to the lower cavity part, so that the working liquid can fully absorb the heat energy of the heating source, and the heat dissipation effect is good.

Wherein, this shell can enclose by single flat pipe and form the C shape, and two tip of this flat pipe can meet by a communicating part, or two tip welding of this flat pipe combine together. Therefore, the structure is simple and convenient to assemble, and has the effect of convenient assembly.

Wherein, this shell can enclose jointly by a plurality of flat pipes and form the ring-type, and two adjacent tip of these a plurality of flat pipes can meet by a communicating member, or two adjacent tip welding of this flat pipe combine together. Therefore, the structure is simple and convenient to assemble, and has the effect of convenient assembly.

Wherein, this shell can have a heat absorption district to lieing in this cavity portion down, and this heat absorption district can combine in an assembly board, and this assembly board can be used for a thermal connection source that generates heat. Therefore, the structure is simple and convenient to manufacture, and the effect of reducing the manufacturing cost is achieved.

Wherein, this equipment board can have a recess, and a shell portion of this shell can have a through-hole, and this through-hole can communicate this recess and this lower cavity portion. Therefore, the working liquid can be filled in the space from the groove to the lower cavity part, more working liquid can be filled, the heat energy of the heating source can be quickly absorbed, and the heat dissipation effect is better.

The assembling plate can be provided with an upper plate and a lower plate, the upper plate can be provided with a through hole, the through hole and the lower plate can jointly form the groove, and the lower plate can be used for being thermally connected with a heating source. Therefore, the structure is simple and convenient to assemble, and has the effect of convenient assembly.

Wherein, the lower plate can be made of metal material with high heat conductivity such as copper or aluminum. Therefore, the heat conduction structure has the effect of better heat conduction.

The assembly plate can be provided with a groove, a plurality of shell sleeves are arranged on the assembly plate side by side, and the heat absorption area of each shell sleeve can be positioned in the groove of the assembly plate. Therefore, the structure is simple and convenient to assemble, and has the effect of convenient assembly.

The assembling plate can be provided with a plurality of assembling holes, and the assembling plate is locked and combined at a preset position through the assembling holes. Therefore, the assembling plate can be easily connected with the heat source in a heat mode, and the effect of convenience in use is achieved.

The heat dissipation module of the present invention may further include an auxiliary heat dissipation member, and the auxiliary heat dissipation member may be connected to an outer shell portion of the shell. Therefore, the auxiliary heat radiating piece can take away the heat energy in the circulating chamber, so that the gaseous working liquid can be more easily cooled and condensed to be changed into a liquid state in the upper cavity part, and the effect of further cooling the heating source is achieved.

Wherein, an outer shell part of the shell can be provided with a heat absorption area, an assembly cover can be arranged outside the shell, and the heat absorption area is exposed to be thermally connected with a heating source. Therefore, the structure is simple and convenient to assemble, and has the effect of convenient assembly.

The assembling cover can be provided with a plurality of assembling holes, and the assembling cover is locked and combined at a preset position through the assembling holes. Therefore, the shell can be easily combined at the preset position through the assembling cover, and the shell has the effect of convenience in use.

Wherein, this shell can have an outer shell portion and encircle outside an inner shell portion, and this outer shell portion and this inner shell portion can form the confined cyclic annular respectively, and two closing caps can combine in the both sides of this shell respectively, and each closing cap can be by this outer shell portion of a jam portion butt and this inner shell portion. Therefore, the structure is simple and convenient to manufacture, and the effect of reducing the manufacturing cost is achieved.

The number of the shell sleeves and the number of the radiating fin groups can be multiple, and the multiple shell sleeves are arranged along the ventilation direction or arranged along a wind shielding direction orthogonal to the ventilation direction. Therefore, the heat dissipation module can be matched with various installation occasions and has the effect of convenient installation.

Wherein, these shells are arranged along this ventilation direction, and these shells are connected to a plurality of intercommunication piece staggered arrangement each other. Therefore, the length of the plurality of shells arranged in a row can be reduced, so that the overall volume of the heat dissipation module can be reduced, and the heat dissipation module has the effect of space utilization.

Wherein the circulation chamber may be filled with at least one working liquid. Therefore, the circulation speed of the gas-liquid phase of the working liquid can be increased through the different boiling points of the at least one working liquid, and the heat dissipation effect is achieved.

Wherein the working fluid may be a non-conductive fluid. Therefore, even if the working liquid leaks, the short circuit of the system circuit can not be generated.

Drawings

FIG. 1: the utility model discloses a partial exploded perspective view of the first embodiment;

FIG. 2: the utility model discloses an exploded perspective view of a shell sleeve, a radiating fin group and a connecting piece in the first embodiment;

FIG. 3: the utility model discloses the combined section view of the first embodiment;

FIG. 4: the second embodiment of the present invention does not include an exploded perspective view of the assembly plate;

FIG. 5: the utility model discloses the combined section view of the second embodiment;

FIG. 6: a combined cross-sectional view of a third embodiment of the present invention;

FIG. 7: a combined perspective view of a fourth embodiment of the present invention;

FIG. 8: an exploded perspective view of another form of the fourth embodiment of the present invention;

FIG. 9: an exploded perspective view of a fifth embodiment of the present invention;

FIG. 10: a perspective view of a sixth embodiment of the present invention;

FIG. 11: a perspective view of another form of the sixth embodiment of the present invention;

FIG. 12: a cross-sectional view taken along line A-A of FIG. 10;

FIG. 13: a cross-sectional view of another form taken along line a-a of fig. 10;

FIG. 14: an exploded perspective view of a seventh embodiment of the present invention;

FIG. 15: a combined cross-sectional view of a seventh embodiment of the present invention;

FIG. 16: the utility model discloses the combined section view of the eighth embodiment;

FIG. 17: an exploded perspective view of a ninth embodiment of the present invention;

FIG. 18: the utility model discloses the combination section view of ninth embodiment.

Description of the reference numerals

[ utility model ] to solve the problems

1: shell cover

1a casing part

1b inner shell

11 opening of the container

12 liquid guiding surface

13, through hole

2 working fluid

3: heat radiation fin group

4: communicating member

5, assembling plate

5a upper plate

5b lower plate

51 groove

52 assembly hole

53, a through hole

6 auxiliary heat dissipation member

7: assembling cover

71 assembling hole

8: sealing cover

81 plug part

C, circulating chamber

C1 Upper Chamber

C2 lower cavity part

C3 middle chamber part

D1 Ventilation Direction

D2 wind shielding direction

H heating source

P is horizontal plane

S is a containing space

T-flat tube

T1 end

Z is endothermic region

And theta is the included angle.

Detailed Description

In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail as follows:

please refer to fig. 1 and fig. 3, which show a first embodiment of the heat dissipation module of the present invention, including a casing 1, a working fluid 2 and a heat dissipation fin set 3, wherein the working fluid 2 is filled in the casing 1, and the heat dissipation fin set 3 is located in an accommodation space S of the casing 1.

Referring to fig. 2 and 3, the housing 1 encloses to form the accommodating space S, two ends of the accommodating space S in a ventilation direction D1 respectively have an opening 11, and the housing 1 has a circulation chamber C surrounding the accommodating space S. In detail, the housing 1 may have an outer shell portion 1a and at least one inner shell portion 1b, the outer shell portion 1a may surround the at least one inner shell portion 1b, and the outer shell portion 1a and the inner shell portion 1b may jointly form the circulation chamber C, so that the circulation chamber C may be located between the outer shell portion 1a and the inner shell portion 1 b.

In addition, the circulation chamber C may be divided into an upper chamber part C1 and a lower chamber part C2, and the upper chamber part C1 and the lower chamber part C2 may communicate. Wherein, this shell 1's mode of formation, the utility model discloses not restrict, in this embodiment, this shell 1 can enclose by single flat pipe T and form the C shape, and this flat pipe T can be for example made for the material of thermal conductivity such as copper, titanium, stainless steel or aluminium, and two tip T1 of this flat pipe T are in order to be connected in order to form this circulation cavity C as the principle, two tip T1's of this flat pipe T connected mode, the utility model discloses not restrict, also not use the open schema of this embodiment as the limit. In the present embodiment, the two ends T1 of the flat tube T may be connected by a communication member 4, so that the upper chamber portion C1 may communicate with the lower chamber portion C2.

Referring to fig. 3, the housing 1 may have a heat absorbing region Z located on the outer shell portion 1a, and the heat absorbing region Z may be located on the lower cavity portion C2, the heat absorbing region Z may be combined with an assembly board 5, and the assembly board 5 may be used to thermally connect a heat generating source H, which may be, for example, a central processing unit of a server, a computer or other electrical products, or an electronic component such as a chip on a circuit board that generates heat due to operation.

The assembling plate 5 can be made of a metal material with high thermal conductivity such as copper or aluminum, and the assembling plate 5 can be connected to the heat generating source H by heating after being combined with a heat conducting medium (such as a heat conducting pad, a heat conducting paste or a heat conducting adhesive). In detail, the assembly plate 5 may have a groove 51, the housing 1 may be disposed in the groove 51 of the assembly plate 5, and the heat absorption region Z of the housing 1 is located in the groove 51 of the assembly plate 5, so as to improve the assembly convenience. The assembling plate 5 may further have a plurality of assembling holes 52, and the assembling plate 5 may be locked and combined at a predetermined position through the plurality of assembling holes 52, so that the assembling plate 5 may be easily thermally connected to the heat generating source H.

The working fluid 2 fills the lower cavity C2 of the circulating chamber C, and the working fluid 2 in the lower cavity C2 can be used for absorbing the heat energy of the heat generating source H by the working fluid 2 in the lower cavity C2. The working liquid 2 can be water, alcohol or other liquid with low boiling point; preferably, the working liquid 2 may be a non-conductive liquid, so that even if the working liquid 2 leaks, the short circuit of the system circuit is not generated, the working liquid 2 can absorb heat energy from a liquid state and evaporate into a gaseous state, and further, the heat energy transfer is realized by using a change mechanism of a gas-liquid phase of the working liquid 2; and through being the enclosed state in this circulation cavity C, can avoid losing after this working fluid 2 forms the gaseous state to and avoid inside because the air occupies, compress to the space behind this working fluid 2 formation gaseous state, and then influence the radiating efficiency.

In particular, the working fluid 2 may be at least one of, for example: the lower chamber section C2 may be filled with one, two, or three or more kinds of working liquids 2; therefore, the circulation speed of the gas-liquid phase of the working liquid 2 can be increased through the difference of the boiling points of the at least one working liquid 2, and a better heat dissipation effect can be provided. In addition, the working fluid 2 in the lower cavity C2 can be filled with working fluids 2 with different boiling points according to the requirement of the heat generating source H; therefore, when the heat dissipation requirement is not high, the working liquid 2 with a relatively flat price can be selected, and the effect of saving the cost can be achieved.

Referring to fig. 1 and 3, the heat dissipating fin set 3 is located in the accommodating space S, the heat dissipating fin set 3 may be formed by bending a single-sheet fin or by fastening a plurality of stacked fins, but the present invention is not limited thereto, and the heat dissipating fin set 3 may be made of a metal material with a high thermal conductivity to improve the thermal conductivity.

Referring to fig. 2 and 3, when the heat dissipation module operates, the heat absorption region Z of the casing 1 can be thermally connected to the heat source H, and the working fluid 2 in the lower cavity C2 can absorb heat energy from a liquid state and evaporate into a gaseous state, so that the working fluid 2 in the lower cavity C2 can absorb heat energy from the heat source H; then, the working fluid 2 forming the gas state can enter the upper chamber C1 upwards or upwards, and the working fluid 2 entering the upper chamber C1 upwards or upwards can be rapidly condensed from the gas state into the liquid state and then returns to the lower chamber C2, so that the working fluid 2 can fully absorb the heat energy of the heat source H, and the effect of providing good heat dissipation efficiency can be achieved; through the arrangement of the heat radiating fin group 3, the heat energy in the circulating chamber C and the heat radiating fin group 3 can have more contact areas, and the heat radiating effect can be improved.

Referring to fig. 4 and 5, which are second embodiments of the heat dissipation module of the present invention, the housing 1 may be formed in a ring shape by a plurality of flat tubes T, and two adjacent ends T1 of the flat tubes T may be connected by a connecting member 4; in the present embodiment, the number of the flat tubes T is two, and two adjacent end portions T1 of the two flat tubes T may be connected by two communicating members 4. In addition, the inner housing 1b may have a liquid guiding surface 12, the liquid guiding surface 12 is adjacent to the upper cavity C1 of the circulation chamber C, the liquid guiding surface 12 is preferably inclined, such that the inner housing 1b adjacent to the upper cavity C1 may be formed to be higher at the middle than at the two sides, or one side is higher at the other side, in this embodiment, the inner housing 1b adjacent to the upper cavity C1 is illustrated as being higher at the middle than at the two sides, and the liquid guiding surface 12 may form an included angle θ with a horizontal plane P; thus, when the working fluid 2 in the upper chamber C1 is condensed from a gas state to a liquid state, the working fluid 2 can easily flow from a high level to two low levels to return to the lower chamber C2.

Referring to fig. 6, which is a third embodiment of the heat dissipation module of the present invention, the number of the inner shells 1b may be multiple, the multiple inner shells 1b may be arranged at intervals up and down, a middle cavity portion C3 may be formed between two adjacent inner shells 1b, and the middle cavity portion C3 may be located between the upper cavity portion C1 and the lower cavity portion C2; thus, when the working fluid 2 in the lower chamber portion C2 is converted into a gas state and moves upward, a part of the working fluid may condense back into a liquid state in the middle chamber portion C3 and move downward to the lower chamber portion C2, and the rest of the working fluid may continue to be located in the middle chamber portion C3 until sufficient energy is accumulated and vaporized into the upper chamber portion C1, and the working fluid 2 located in the upper chamber portion C1 may condense from the gas state into the liquid state and then move back to the lower chamber portion C2, so that the working fluid 2 may fully absorb the heat energy of the heat source H, and a good heat dissipation effect may be achieved.

Furthermore, in this embodiment, the utility model discloses heat dissipation module can also include an auxiliary heat dissipation piece 6 in addition, this auxiliary heat dissipation piece 6 can be connected in the outer shell portion 1a of this shell 1, this auxiliary heat dissipation piece 6 can extend towards the direction of keeping away from this shell 1, this auxiliary heat dissipation piece 6 can adopt the metal material that coefficient of heat conductivity is high to make, through the setting of this auxiliary heat dissipation piece 6, this auxiliary heat dissipation piece 6 can take away the heat energy in this circulation cavity C, make gaseous working fluid 2 can change the cooling condensation and become liquid in this upper cavity C1 more easily, can further realize making the effect of this heat source H cooling.

Please refer to fig. 7, which shows a fourth embodiment of the heat dissipation module of the present invention, the number of the shell 1 and the heat dissipation fin set 3 is plural, the lower cavity portions C2 of the shell 1 are respectively filled with respective working liquids 2, the working liquids 2 in the lower cavity portions C2 are not communicated with each other, the shell 1 can be arranged in the groove 51 of the assembly plate 5 side by side, and the arrangement mode can be adjusted according to actual requirements, for example: may be arranged along the ventilation direction D1 as shown in fig. 7 so that the plurality of openings 11 may be formed in opposite directions; alternatively, as shown in fig. 8, the heat dissipation module may be arranged along a wind shielding direction D2 perpendicular to the ventilation direction D1, so that the plurality of openings 11 may be exposed, thereby the heat dissipation module may be adapted to various installation situations. Wherein, when these shells 1 are arranged along this ventilation direction D1, these connecting pieces 4 preferably can be staggered with each other, can reduce the length that these shells 1 were arranged to can reduce this heat dissipation module's whole volume, can have the effect of space utilization.

Referring to fig. 9, which is a fifth embodiment of the heat dissipation module of the present invention, the heat dissipation module may further include an assembly cover 7, the assembly cover 7 may be disposed outside the casing 1, the assembly cover 7 may be substantially formed into an Ω shape, the assembly cover 7 may be covered on the casing 1 by a side adjacent to the upper cavity C1 (as shown in fig. 3), and the heat absorption region Z may be exposed to thermally connect to the heat source H (as shown in fig. 3). Wherein the assembly cover 7 may have a plurality of assembly holes 71; thus, the assembling cover 7 can facilitate the housing 1 to be coupled to the predetermined position, thereby providing convenience in use.

Referring to fig. 10, which shows a sixth embodiment of the heat dissipation module of the present invention, two adjacent ends T1 of the two U-shaped flat tubes T may be connected to each other, and the connection may be formed by clamping, fastening or bonding. In the present embodiment, the two adjacent ends T1 of the two flat tubes T may be selected to be welded (e.g., reflow or laser welded) to form a connected arrangement. For example, as shown in fig. 12 and 13, the inner diameter width of the end T1 of one flat tube T is greater than or equal to the outer diameter width of the end T1 of the other flat tube T, and then the two adjacent ends T1 of the two flat tubes T are welded together, so that the upper cavity C1 can communicate with the lower cavity C2. In other embodiments, a single flat tube T may be looped around to form a C-shape as shown in fig. 11, and the two ends T1 of the flat tube T may be joined by welding as described above.

Referring to fig. 14 and 15, which illustrate a seventh embodiment of the heat dissipation module of the present invention, the outer shell 1a of the housing 1 may have a through hole 13, the through hole 13 is adjacent to the lower cavity C2, the through hole 13 may communicate with the groove 51 of the assembly plate 5 and the lower cavity C2, so that the working fluid 2 may be filled in the space between the groove 51 and the lower cavity C2, and thus, more working fluid 2 may be filled, and the heat energy of the heat source H may be rapidly absorbed, thereby providing a better heat dissipation effect.

Referring to fig. 16, which is an eighth embodiment of the heat dissipation module of the present invention, the assembly plate 5 may have an upper plate 5a and a lower plate 5b, the upper plate 5a is combined with the lower plate 5b, the upper plate 5a may be located between the shell 1 and the lower plate 5b, the upper plate 5a may have a through hole 53, the through hole 53 and the lower plate 5b may form the groove 51 together, and the lower plate 5b may be thermally connected to the heat source H; thus, the lower plate 5b can be made of a metal material having high thermal conductivity such as copper or aluminum, which can reduce the manufacturing cost.

Referring to fig. 17 and 18, which are ninth embodiments of the heat dissipation module of the present invention, in this embodiment, the shell 1 may be formed by fitting plate bodies with different calibers, and is different from the shell 1 that is formed by enclosing the flat tubes T. In detail, the heat dissipation module may further include two covers 8, and the two covers 8 may have a plug portion 81; the outer shell 1a and the inner shell 1b may form a closed ring respectively, the outer shell 1a surrounds the inner shell 1b, the circulation chamber C is formed between the outer shell 1a and the inner shell 1b, and is respectively combined to two sides of the housing 1 through the two sealing caps 8, and the plug 81 of each sealing cap 8 abuts against the outer shell 1a and the inner shell 1b to close the circulation chamber C; thus, another way of making the shell 1 is provided.

To sum up, the heat dissipation module of the present invention utilizes the circulation chamber to surround the accommodating space, and the working fluid is filled in the lower chamber portion; when the heat dissipation module operates, the heat energy of the heating source can be absorbed by the working liquid in the lower cavity, the working liquid in the lower cavity can absorb the heat energy from a liquid state and is evaporated into a gaseous state, the working liquid forming the gaseous state can upwards or upwards enter the upper cavity, the working liquid upwards or upwards entering the upper cavity can be rapidly condensed into the liquid state by the gaseous state and then returns to the lower cavity, so that the working liquid can fully absorb the heat energy of the heating source, and through the arrangement of the heat dissipation fin group, the heat energy in the circulation cavity and the heat dissipation fin group can have more contact area, and the heat dissipation module has the effect of improving good heat dissipation efficiency.

Claims (21)

1. A heat dissipation module, comprising:

the shell is provided with a circulating chamber which surrounds the outside of the accommodating space and is divided into an upper chamber part and a lower chamber part;

a working liquid filled in the lower cavity part; and

a heat radiation fin group located in the containing space.

2. The thermal module of claim 1, wherein the housing has an outer shell portion surrounding at least one inner shell portion, the circulation chamber being located between the outer shell portion and the inner shell portion.

3. The thermal module of claim 2, wherein the inner housing portion has a liquid guiding surface adjacent the upper chamber portion, the liquid guiding surface being inclined and forming an angle with a horizontal plane.

4. The heat dissipating module of claim 2, wherein the number of the inner shells is plural, and the plural inner shells are spaced up and down.

5. The heat dissipating module of claim 4, wherein a middle chamber portion of the circulating chamber is formed between two adjacent inner shells, and the middle chamber portion is located between the upper chamber portion and the lower chamber portion.

6. The heat dissipating module of claim 1, wherein the housing is formed in a C-shape by a single flat tube, and the two ends of the flat tube are connected by a connecting member, or the two ends of the flat tube are welded together.

7. The heat dissipating module of claim 1, wherein the housing is formed in a ring shape by a plurality of flat tubes commonly surrounded, and two adjacent ends of the plurality of flat tubes are connected by a communication member or two adjacent ends of the flat tubes are welded together.

8. The heat dissipating module of claim 1, wherein the housing has a heat absorbing region opposite to the lower cavity, the heat absorbing region being combined with an assembling plate for thermally connecting to a heat generating source.

9. The heat dissipating module of claim 8, wherein the assembling plate has a groove, and an outer shell of the housing has a through hole communicating the groove and the lower cavity.

10. The heat dissipating module of claim 9, wherein the assembling plate has an upper plate and a lower plate, the upper plate has a through opening, the through opening and the lower plate together form the recess, and the lower plate is used for thermal connection with a heat generating source.

11. The heat dissipating module of claim 10, wherein the lower plate is made of metal.

12. The heat dissipating module of claim 8, wherein the assembly plate has a recess, a plurality of housings are disposed side by side in the assembly plate, and the heat absorbing region of each housing is located in the recess of the assembly plate.

13. The heat dissipating module of claim 8, wherein the assembling plate has a plurality of assembling holes, and the assembling plate is locked to a predetermined position through the assembling holes.

14. The heat dissipation module of claim 1, further comprising an auxiliary heat sink attached to an outer shell portion of the housing.

15. The heat dissipating module of claim 1, wherein an outer shell of the casing has a heat sink, an assembly cover is disposed outside the casing, and the heat sink is exposed for thermal connection to a heat source.

16. The heat dissipating module of claim 15, wherein the assembling cover has a plurality of assembling holes, and the assembling cover is locked to a predetermined position through the assembling holes.

17. The heat dissipating module of claim 1, wherein the housing has an outer shell surrounding an inner shell, the outer shell and the inner shell forming a closed ring, two covers respectively coupled to two sides of the housing, and each cover is abutted to the outer shell and the inner shell by a plug.

18. The heat dissipating module of claim 1, wherein the number of the casings and the heat dissipating fin groups is plural, and the plural casings are arranged along the ventilation direction or arranged along a wind shielding direction orthogonal to the ventilation direction.

19. The heat dissipating module of claim 18, wherein a plurality of the housings are arranged along the ventilation direction, and a plurality of the communication members are connected to the plurality of housings in a staggered arrangement with each other.

20. The thermal module of claim 1, wherein the circulation chamber is filled with at least one working fluid.

21. The heat dissipation module of claim 1, wherein the working fluid is a non-conductive fluid.

Images