CN214800024U

CN214800024U - Circuit board with high-efficient heat dissipation function

Info

Publication number: CN214800024U
Application number: CN202120933916.8U
Authority: CN
Inventors: 王兆武
Original assignee: Kunshan Fuhsin Hardware Electronics Co ltd
Current assignee: Kunshan Fuhsin Hardware Electronics Co ltd
Priority date: 2021-05-01
Filing date: 2021-05-01
Publication date: 2021-11-19
Anticipated expiration: 2031-05-01

Abstract

The utility model discloses a circuit board with high-efficient heat dissipation function, including bottom plate and circuit board, the upper surface of bottom plate is provided with the radiating block, the one end of bottom plate lower surface is provided with a plurality of fin groups, the other end slant of bottom plate lower surface is provided with the holding tank, the holding tank is provided with a plurality ofly, and a plurality of the holding tank is evenly arranged on the bottom plate at intervals, and each holding tank is provided with the heat conduction block, one side of bottom plate is provided with the first fin that extends outward, the interval is provided with a plurality of erection columns on the bottom plate, still be provided with the couple on the bottom plate; the utility model discloses a be provided with a plurality of heat conduction pieces for the heat is outside effluvium to the bottom plate, and make the even heat to radiating block, first fin and the diffusion of second fin, can strengthen the radiating effect of circuit board.

Description

Circuit board with high-efficient heat dissipation function

Technical Field

The utility model relates to a circuit board technical field, concretely relates to circuit board with high-efficient heat dissipation function.

Background

Along with the continuous powerful of circuit board function, the circuit board design is also more and more complicated, and the integrated level is higher and higher, and the interval between each components and parts on the face is littleer and more. Some high-power electronic components can release certain operating temperature in the course of the work, if the heat dissipation is improper, not only influence self life-span, also probably influence the life-span of other electronic components of its next door simultaneously, and then influence the stability of circuit board. Especially, some circuit boards used in high precision fields have very strict requirements on the temperature of the circuit board, and once the problem of non-ideal heat dissipation occurs, the circuit board may have serious negative effects on the work. In view of the above drawbacks, it is necessary to design a circuit board with high heat dissipation efficiency.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a circuit board with high-efficient heat dissipation function to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a circuit board with high-efficient heat dissipation function, includes bottom plate and circuit board, the upper surface of bottom plate is provided with the radiating block, the one end of bottom plate lower surface is provided with a plurality of fin groups, the other end slant of bottom plate lower surface is provided with the holding tank, the holding tank is provided with a plurality ofly, and is a plurality of the even interval arrangement of holding tank is on the bottom plate, every all be provided with the heat conduction piece in the holding tank, one side of bottom plate is provided with the first fin of outside extension, the interval is provided with a plurality of erection columns on the bottom plate, still be provided with the couple on the bottom plate.

Preferably, the heat conduction block sequentially comprises a protection film layer, a foaming buffer layer, a metal wave absorption layer, a heat conduction graphite layer, a heat conduction pressure-sensitive adhesive layer and a release film layer from bottom to top, the protection film layer is a PET (polyethylene terephthalate) insulating film with single-side back adhesive, the metal wave absorption layer is a copper foil, an aluminum foil, a silver foil, a nickel foil or a metal alloy, and air guide channels communicated with one another are arranged among the foaming buffer layer, the metal wave absorption layer, the heat conduction graphite layer and the heat conduction pressure-sensitive adhesive layer.

Preferably, a first bonding layer is arranged between the heat conduction graphite layer and the metal wave absorption layer, and a second bonding layer is arranged between the metal wave absorption layer and the foaming buffer layer.

Preferably, the heat dissipation blocks are arranged in plurality and are uniformly arranged on the bottom plate at intervals.

Preferably, a plurality of the fin groups are uniformly arranged at intervals along the length direction of the bottom plate, and each of the fin groups comprises a plurality of second fins which are uniformly arranged at intervals.

Preferably, the first radiating fins are provided in plurality, and the radiating fins are in a shape of a right-angle wavy line.

Preferably, the column body of the mounting column is a stepped shaft with a stud at the front end and a boss at the rear end, the bottom plate is provided with a mounting hole, the mounting column is sleeved with a pressure spring, the pressure spring is located between the boss at the rear end of the mounting column and the end face of the mounting hole, and the stud at the front end of the mounting column is sleeved with a cushion pressing ring.

Compared with the prior art, the circuit board with the efficient heat dissipation function of the utility model utilizes the metal wave-absorbing layer to have high heat conduction and electromagnetic shielding performance, not only can enhance the heat conduction and heat dissipation effects of the heat conduction block on the circuit board, but also effectively reduces the clutter interference between circuit board components in a way of absorbing clutter by the wave-absorbing material; the air duct is utilized, so that the utility model is not foamed when being pasted on the circuit board, the surface of the heat conducting block after being pasted is ensured to be smooth and flat, and meanwhile, the air duct can also enhance the heat conducting and radiating effect; moreover, the utility model realizes the rapid heat conduction and radiation in the horizontal direction by the heat conduction graphite layer and the rapid heat conduction and radiation in the vertical direction by the metal wave-absorbing layer through the heat conduction block formed by multilayer compounding, thereby having good uniform high heat conduction and radiation performance in the horizontal and vertical directions and greatly improving the heat conduction and radiation effect; the utility model has the advantages that the foam buffer layer is arranged, on one hand, the overall buffer performance of the heat conducting block is increased, the metal wave absorbing layer and the heat conducting graphite layer are effectively protected, and the probability of compression damage is reduced; on the other hand, the integral strength of the heat conducting block is increased, and the toughness and the bending performance of the heat conducting block are improved; when the heat conduction pressure-sensitive adhesive arranged in the utility model is pasted on the circuit board, the seamless connection with the circuit board is facilitated, the heat diffusion is also facilitated, the local overheating of the heat conduction and heat conduction block is avoided, and the performance and the service life of the heat conduction block are improved; the protective film layer arranged in the utility model has excellent functions of dust prevention, scraping prevention and oxidation prevention; the utility model is provided with a plurality of mounting posts at intervals on the bottom plate, which is convenient for the mounting and dismounting of the bottom plate and the circuit board; the utility model discloses a be provided with a plurality of heat conduction pieces for the heat is outside effluvium to the bottom plate, and make the even heat to radiating block, first fin and the diffusion of second fin, can strengthen the radiating effect of circuit board.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description, do not constitute a limitation of the invention, in which:

fig. 1 is a schematic structural diagram of a circuit board with a high-efficiency heat dissipation function according to the present invention;

fig. 2 is a bottom view of the circuit board with high-efficiency heat dissipation function of the present invention;

fig. 3 is a schematic structural view of a heat conduction block in a circuit board with a high-efficiency heat dissipation function according to the present invention;

fig. 4 is a side view of the circuit board with high-efficient heat dissipation function of the present invention.

In the drawings:

1. a base plate; 2. a heat dissipating block; 3. accommodating grooves; 4. a heat conducting block; 5. a first heat sink; 6. mounting a column; 7. hooking; 8. a second heat sink; 9. a protective film layer; 10. a foamed buffer layer; 11. a metal wave-absorbing layer; 12. a heat conductive graphite layer; 13. a thermally conductive pressure sensitive adhesive layer; 14. a release film layer; 15. an air duct; 16. a first adhesive layer; 17. a second adhesive layer; 18. a stud; 19. a boss; 20. mounting holes; 21. a pressure spring; 22. a cushion pressing ring; 23. a bolt; 24. a circuit board; 25. and a screw hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a circuit board with high-efficient heat dissipation function, includes bottom plate 1 and circuit board 24, the upper surface of bottom plate 1 is provided with radiating block 2, the one end of 1 lower surface of bottom plate is provided with a plurality of fin groups, the other end slant of 1 lower surface of bottom plate is provided with holding tank 3, holding tank 3 is provided with a plurality ofly, and is a plurality of 3 evenly spaced arrangement of holding tank are on bottom plate 1, every all be provided with heat conduction block 4 in the holding tank 3, one side of bottom plate 1 is provided with outside extension's first fin 5, the interval is provided with a plurality of erection columns 6 on the bottom plate 1, still be provided with couple 7 on the bottom plate 1, the installation of bottom plate 1 of being convenient for.

In this embodiment, the plurality of heat dissipation blocks 2 are provided, and the plurality of heat dissipation blocks 2 are uniformly arranged on the bottom plate 1 at intervals.

In this embodiment, the plurality of fin groups are uniformly arranged at intervals along the length direction of the bottom plate 1, and each fin group includes a plurality of second fins 8 which are uniformly arranged at intervals.

The heat conducting block 4 in this embodiment sequentially comprises a protective film layer 9, a foam buffer layer 10, a metal wave absorbing layer 11, a heat conducting graphite layer 12, a heat conducting pressure sensitive adhesive layer 13 and a release film layer 14 from bottom to top, the protective film layer 9, the foam buffer layer 10, the metal wave absorbing layer 11, the heat conducting graphite layer 12, the heat conducting pressure sensitive adhesive layer 13 and the release film layer 14 are pressed and molded through a hot pressing process, wherein the protective film layer 9 is a PET insulating film with single-side back glue, the foaming buffer layer 10 is formed by foaming polyurethane resin, the metal wave-absorbing layer 11 is copper foil, aluminum foil, silver foil, nickel foil or metal alloy, and air guide channels 15 which are mutually communicated are arranged among the foaming buffer layer 10, the metal wave-absorbing layer 11, the heat-conducting graphite layer 12 and the heat-conducting pressure-sensitive adhesive layer 13, only the release film layer 14 needs to be torn off, and the bottom plate 1 is directly pasted on the circuit board 24, so that the use is convenient and quick.

In this embodiment be provided with first adhesive linkage 16 between heat conduction graphite layer 12 and the metal wave-absorbing layer 11, be provided with second adhesive linkage 17 between metal wave-absorbing layer 11 and the foaming buffer layer 10, first adhesive linkage 16 and second adhesive linkage 17 are at least one in organosilicon pressure sensitive adhesive layer, ya keli glue film and the acrylic acid glue film, set up the adhesive linkage and can effectively improve bonding effect, make the viscous force between rete and the rete better and be difficult for droing.

In this embodiment, the plurality of first heat dissipation fins 5 are provided, and the heat dissipation fins 5 are in a shape of a right-angled wavy line, so that the heat dissipation area is increased, and the heat dissipation speed is increased.

The column body of erection column 6 in this embodiment is the step shaft that the front end was equipped with double-screw bolt 18, the rear end is equipped with boss 19 be equipped with mounting hole 20 on bottom plate 1, the cover is equipped with pressure spring 21 on the erection column 6, and pressure spring 21 is located between the boss 19 of erection column 6 rear end and the terminal surface of mounting hole 20, and the cover is equipped with on the double-screw bolt 18 of erection column 6 front end has a pressure ring 22, and the double-screw bolt 18 of erection column 6 front end passes mounting hole 20 and the corresponding screw 25 spiro union on circuit board 24, fixes bottom plate 1 on circuit board 24.

In this embodiment, the hooks 7 are fixed on the bottom plate 1 through bolts 23, and the number of the hooks 7 is three, and the three hooks 7 are uniformly arranged at intervals.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a circuit board with high-efficient heat dissipation function which characterized in that: including bottom plate (1) and circuit board (24), the upper surface of bottom plate (1) is provided with radiating block (2), the one end of bottom plate (1) lower surface is provided with a plurality of fin groups, the other end slant of bottom plate (1) lower surface is provided with holding tank (3), holding tank (3) are provided with a plurality ofly, and are a plurality of holding tank (3) align to grid is arranged on bottom plate (1), every all be provided with heat conduction block (4) in holding tank (3), one side of bottom plate (1) is provided with outside extension first fin (5), the interval is provided with a plurality of erection columns (6) on bottom plate (1), still be provided with couple (7) on bottom plate (1).

2. The circuit board with high-efficiency heat dissipation function according to claim 1, wherein: the heat conduction block (4) comprises a protection film layer (9), a foaming buffer layer (10), a metal wave absorption layer (11), a heat conduction graphite layer (12), a heat conduction pressure-sensitive adhesive layer (13) and a release film layer (14) from bottom to top in sequence, the protection film layer (9) is a PET insulating film with single-side gum, the metal wave absorption layer (11) is a copper foil, an aluminum foil, a silver foil, a nickel foil or a metal alloy, the foaming buffer layer (10), the metal wave absorption layer (11), and air guide channels (15) which are communicated with one another are arranged between the heat conduction graphite layer (12) and the heat conduction pressure-sensitive adhesive layer (13).

3. The circuit board with high-efficiency heat dissipation function according to claim 2, wherein: a first bonding layer (16) is arranged between the heat-conducting graphite layer (12) and the metal wave-absorbing layer (11), and a second bonding layer (17) is arranged between the metal wave-absorbing layer (11) and the foaming buffer layer (10).

4. The circuit board with high-efficiency heat dissipation function according to claim 1, wherein: the heat dissipation blocks (2) are arranged in a plurality, and the heat dissipation blocks (2) are uniformly arranged on the bottom plate (1) at intervals.

5. The circuit board with high-efficiency heat dissipation function according to claim 1, wherein: the plurality of radiating fin groups are uniformly arranged at intervals along the length direction of the bottom plate (1), and each radiating fin group comprises a plurality of second radiating fins (8) which are uniformly arranged at intervals.

6. The circuit board with high-efficiency heat dissipation function according to claim 1, wherein: the first radiating fins (5) are arranged in a plurality of numbers, and the radiating fins (5) are in a shape of a right-angle wavy line.

7. The circuit board with high-efficiency heat dissipation function according to claim 1, wherein: the cylinder of erection column (6) is that the front end is equipped with stud (18), the rear end is equipped with the step shaft of boss (19) be equipped with mounting hole (20) on bottom plate (1), the cover is equipped with pressure spring (21) on erection column (6), and pressure spring (21) are located between boss (19) and the terminal surface of mounting hole (20) of erection column (6) rear end, and the cover is equipped with pad clamping ring (22) on stud (18) of erection column (6) front end.