CN214751760U - Computer electronic component cooling device - Google Patents
Computer electronic component cooling device Download PDFInfo
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- CN214751760U CN214751760U CN202120394843.XU CN202120394843U CN214751760U CN 214751760 U CN214751760 U CN 214751760U CN 202120394843 U CN202120394843 U CN 202120394843U CN 214751760 U CN214751760 U CN 214751760U
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Abstract
A cooling device for electronic components of a computer, which is used in cooperation with a heat dissipation fan to dissipate heat of an electronic module, comprising: the shell comprises a top plate and two side plates which are oppositely arranged on two sides of the top plate, and the top plate and the two side plates enclose a cavity; the partition plate is clamped between the two side plates and positioned below the top plate, the cavity is divided into a first drainage cavity and a second drainage cavity, the first drainage cavity is provided with a first air inlet, the other end of the first drainage cavity is closed, the second drainage cavity is provided with a second air inlet, the other end of the second drainage cavity is provided with an air outlet, the shell is covered on the electronic module through the second drainage cavity, and the electronic module is provided with a plurality of memories which are arranged along the length direction of the side plates of the shell and are arranged at intervals; and the drainage mechanism is arranged on the position, close to the air outlet, of the isolating plate in a length direction perpendicular to the memory and is communicated with the first drainage cavity and the second drainage cavity.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to a cooling device, especially a computer electronic component cooling device.
[ background of the invention ]
At present, with the rapid development of science and technology, the number of memories of computer electronic modules is increased more and more, so that the arrangement of the memories is denser, the generated heat is also higher and higher, the heat is usually dissipated in an air cooling mode, air flow passes through the memories generating heat through a fan and other equipment, and a part of heat is taken away from the memories, however, the space between the memories is smaller and smaller, and the current cooling mode has the following problem that the temperature is continuously increased along with the fact that air takes away the heat generated by the operation of a part of the memories through the memories, and a higher air temperature is generated when the air reaches the rear end of the memories, so that the heat dissipation of rear-end memory components is difficult. To solve this problem, the current method is to increase the air flow through the memory by the fan, and because the memory space is reduced and the heat is increased, a high performance fan must be used, which causes the problems of increased cost, increased system power consumption and noise.
[ Utility model ] content
The utility model aims to solve the technical problem that a computer electronic component cooling device is provided, it is not increasing under the condition of the air flow volume of flowing through electronic module at the class, can improve the radiating effect of electronic module rear end greatly.
In order to solve the above technical problem, the utility model relates to a computer electronic component cooling device, its electronic module that is used for cooperating a radiator fan to produce heat energy when a function dispels the heat, and it includes:
the shell comprises a top plate and two side plates which are oppositely arranged on two sides of the top plate, and the top plate and the two side plates enclose a cavity;
the partition plate is clamped between the two side plates and positioned below the top plate, the cavity is divided into a first drainage cavity and a second drainage cavity, one end of the first drainage cavity, which is close to the heat dissipation fan, is provided with a first air inlet, the other end of the first drainage cavity is closed, one end of the second drainage cavity, which is close to the heat dissipation fan, is provided with a second air inlet, the other end of the second drainage cavity is provided with an air outlet, air flow generated by the heat dissipation fan is blown to the first drainage cavity and the second drainage cavity by the first air inlet and the second air inlet and flows out of the shell through the air outlet, the shell is covered on the electronic module through the second drainage cavity, and the electronic module is provided with a plurality of electronic components which are arranged along the length direction of the side plates of the shell at intervals; and
and the drainage mechanism is arranged at a position, close to the air outlet, on the isolating plate in a length direction perpendicular to the memory and is communicated with the first drainage cavity and the second drainage cavity, so that the air flow flowing into the first drainage cavity by the heat radiation fan can flow into the second drainage cavity through the drainage mechanism and is mixed with the air flow blown to the air outlet by the second air inlet and heated due to the flowing of part of electronic components, and the air flow with lower temperature is generated to radiate the other part of electronic components close to the air outlet.
Preferably, the drainage mechanism is composed of a plurality of hollow cylinders, and each hollow cylinder is provided with an air collecting cavity and a vertical air guiding cavity, wherein the air collecting cavity is formed by the partition board and is located on a first surface of the first drainage cavity, and the first surface of the partition board is gradually reduced towards the second drainage cavity, and the vertical air guiding cavity is communicated with the air collecting cavity and the second drainage cavity.
Preferably, the casing is further provided with an air deflector obliquely arranged towards the heat dissipation fan at one end of the top plate of the casing close to the heat dissipation fan, for guiding the air flow above the top plate into the casing.
Preferably, the electronic module is a memory module.
Preferably, the electronic component is a memory.
Compared with the prior art, the utility model divides the containing cavity of the shell into a first drainage cavity and a second drainage cavity through the separation plate, one end of the first drainage cavity is open, the other end is closed, and both ends of the second drainage cavity are open, the electronic module is arranged in the second drainage cavity, the air current generated by the heat radiation fan flows into the first drainage cavity and the second drainage cavity through the first air inlet and the second air inlet respectively, wherein, the second drainage cavity consists of a first heat radiation area close to the second air inlet, a second heat radiation area close to the air outlet and a mixing area between the first heat radiation area and the second heat radiation area, the temperature of the air current flowing into the second drainage cavity rises when the first heat radiation area takes away the heat flowing through the electronic module in the first heat radiation area, and the air current flowing through the first drainage cavity by the first air inlet does not contact with the electronic element generating heat in the flowing process, therefore, compared with the temperature of the air flow flowing through the first heat dissipation area, the temperature of the air flow is lower, because the other end of the first drainage cavity is closed, the air flow can intensively flow to the drainage mechanism, and the air flow flowing to the second drainage cavity from the drainage mechanism and flowing through the first heat dissipation area in the second drainage cavity and heated is mixed in the mixing area, so that the air flow heated by flowing through the first heat dissipation area is cooled and continuously flows towards the air outlet of the second drainage cavity to continuously dissipate the heat of the electronic component in the second heat dissipation area, and the temperature of the air flow mixed in the mixing area is lower than that of the air flow flowing through the first heat dissipation area, thereby really greatly improving the cooling effect of the electronic component of the electronic module close to the air outlet end
[ description of the drawings ]
Fig. 1 is an assembly diagram of the cooling device of electronic component of computer according to the present invention assembled on an electronic module.
Fig. 2 is a schematic perspective view of the cooling device for electronic components of a computer according to the present invention.
Fig. 3 is a schematic front view of the cooling device for electronic components of a computer according to the present invention.
Fig. 4 is a top view of the cooling device for computer electronic components according to the present invention with the top plate removed.
Fig. 5 is a schematic perspective sectional view of the cooling device for electronic components of a computer according to the present invention.
Fig. 6 is a plan sectional view showing the flow direction of the air stream.
[ detailed description ] embodiments
Referring to fig. 1-2, the present invention provides a cooling device for a computer electronic component, which is used to cooperate with a heat dissipation fan (not shown) to dissipate heat generated by an electronic module 2, such as a motherboard module, a power supply module, a memory module (in this embodiment, the memory module is taken as an example), and includes a housing 10, a partition 11, and a flow guiding mechanism 12.
The housing 10 includes a top plate 100 and two side plates 101 disposed at two opposite sides of the top plate 100, wherein the top plate 100 and the two side plates 101 enclose a cavity (not shown).
This division board 11, it presss from both sides and locates between these two curb plates 101 and be located the below of this roof 100, divide into a first drainage chamber and a second drainage chamber with this cavity, this first drainage chamber has a first air intake 1020 in the one end that is close to this radiator fan, this first drainage chamber is sealed in the opposite other end of this first air intake 1020, this second drainage chamber has a second air intake 1030 in the one end that is close to this radiator fan, this second drainage chamber has an air outlet 1031 in the other end that is relative this second air intake, the air current that this radiator fan produced is blown to this first drainage chamber and this second drainage chamber and flows out this casing 10 via this air outlet 1031 by this first air intake 1020 and this second air intake 1030. The housing 10 covers the electronic module 2 through the second drainage cavity, the electronic module 2 has a plurality of electronic components 20 disposed along the length direction of the side plate 101 of the housing 10 and arranged at intervals, and the electronic components 20 are, for example, a central processing unit, a graphics processing unit, a substrate management controller, a memory, or a combination of any two of them (hereinafter, the memory is taken as an example).
Referring to fig. 2 and 3, the flow guiding mechanism 12 is disposed on the isolation plate 11 in a direction perpendicular to the length direction of the memory 20 and near the air outlet 1031, and is communicated with the first flow guiding cavity and the second flow guiding cavity, so that the air flow flowing into the first flow guiding cavity by the heat dissipation fan can flow into the second flow guiding cavity 102 through the flow guiding mechanism 12 and mix with the air flow blown to the air outlet 10311 by the second air inlet 1030 and heated by flowing through a part of the electronic components 20 to generate an air flow with a lower temperature, so as to dissipate heat of the electronic components 20 of another part of the electronic modules 2 near the air outlet 1031. As shown in fig. 4 and 5, in the present embodiment, the drainage mechanism 12 is composed of a plurality of hollow cylinders 120, and each hollow cylinder 120 is provided with a wind collecting cavity 1200 formed by the partition plate 11 located on a first surface of the first drainage cavity and tapering toward the second drainage cavity, and a vertical wind guiding cavity 1201 communicating the wind collecting cavity 1200 and the second drainage cavity.
In one embodiment, as shown in fig. 1 and 6, in order to guide more air flow into the casing 10, the casing 10 further includes an air guiding plate 1000 disposed at an end of the top plate 100 of the casing 10 close to the heat dissipation fan and inclined toward the heat dissipation fan, for guiding the air flow above the top plate 100 into the casing 10.
As shown in fig. 6, when the heat dissipation fan is started, the air flow generated by the heat dissipation fan flows into the first and second flow guiding cavities through the first and second air inlets 1020 and 1030, respectively, wherein the second flow guiding cavity is composed of a first heat dissipation area near the second air inlet 1030, a second heat dissipation area near the air outlet 1031, and a mixing area between the first and second heat dissipation areas, the temperature of the air flow flowing into the second flow guiding cavity increases while the first heat dissipation area takes away the heat flowing through the electronic module 2 in the first heat dissipation area, and the air flow flowing through the first air inlet 1020 through the first flow guiding cavity has a lower temperature than the air flow flowing through the first heat dissipation area because the air flow flowing through the first flow guiding cavity does not contact with the electronic component generating heat during flowing, and the air flow flows into the flow guiding mechanism 12 intensively because the other end of the first flow guiding cavity is closed, and the air current which flows to the second drainage cavity and is heated by flowing through the first heat dissipation area in the second drainage cavity from the drainage mechanism 12 is mixed in the mixing area, so that the air current which is heated by flowing through the first heat dissipation area is cooled and then continuously flows towards the air outlet 1031 of the second drainage cavity to continuously dissipate the heat of the electronic component 20 of the second heat dissipation area, the temperature of the air current which is mixed in the mixing area is reduced compared with the temperature of the air current which flows through the first heat dissipation area, and the air current of the first drainage cavity is mixed, and the air current of the first drainage cavity is gradually concentrated in the tapered structure due to the impact of the air current on the tapered structure and then is accelerated to flow towards the second drainage cavity due to the adoption of the tapered structural design, thereby greatly improving the cooling effect of the electronic component 20 of the electronic module 2 which is close to the air outlet 1031 end.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (5)
1. A computer electronic component cooling device for cooperating with a heat dissipation fan to dissipate heat from an electronic module that generates heat energy during operation, comprising:
the shell comprises a top plate and two side plates which are oppositely arranged on two sides of the top plate, and the top plate and the two side plates enclose a cavity;
the partition plate is clamped between the two side plates and positioned below the top plate, the cavity is divided into a first drainage cavity and a second drainage cavity, one end of the first drainage cavity, which is close to the heat dissipation fan, is provided with a first air inlet, the other end of the first drainage cavity is closed, one end of the second drainage cavity, which is close to the heat dissipation fan, is provided with a second air inlet, the other end of the second drainage cavity is provided with an air outlet, air flow generated by the heat dissipation fan is blown to the first drainage cavity and the second drainage cavity by the first air inlet and the second air inlet and flows out of the shell through the air outlet, the shell is covered on the electronic module through the second drainage cavity, and the electronic module is provided with a plurality of electronic components which are arranged along the length direction of the side plates of the shell at intervals; and
and the drainage mechanism is arranged at a position, close to the air outlet, on the isolating plate in a length direction perpendicular to the memory and is communicated with the first drainage cavity and the second drainage cavity, so that the air flow flowing into the first drainage cavity by the heat radiation fan can flow into the second drainage cavity through the drainage mechanism and is mixed with the air flow blown to the air outlet by the second air inlet and heated due to the flowing of part of electronic components, and the air flow with lower temperature is generated to radiate the other part of electronic components close to the air outlet.
2. The cooling apparatus for electronic components of computers according to claim 1, wherein the flow guiding mechanism comprises a plurality of hollow cylinders, each of the hollow cylinders defines a wind collecting chamber formed by the partition plate and located on a first surface of the first flow guiding chamber, the wind collecting chamber tapering toward the second flow guiding chamber, and a vertical wind guiding chamber communicating the wind collecting chamber with the second flow guiding chamber.
3. The apparatus according to claim 1, wherein the housing further comprises a wind deflector disposed at an end of the top plate of the housing adjacent to the heat dissipation fan and inclined toward the heat dissipation fan for guiding the airflow above the top plate into the housing.
4. The apparatus according to claim 1, wherein the electronic module is a memory module.
5. The apparatus according to claim 4, wherein the electronic component is a memory.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120394843.XU CN214751760U (en) | 2021-02-22 | 2021-02-22 | Computer electronic component cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120394843.XU CN214751760U (en) | 2021-02-22 | 2021-02-22 | Computer electronic component cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214751760U true CN214751760U (en) | 2021-11-16 |
Family
ID=78589317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120394843.XU Active CN214751760U (en) | 2021-02-22 | 2021-02-22 | Computer electronic component cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214751760U (en) |
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2021
- 2021-02-22 CN CN202120394843.XU patent/CN214751760U/en active Active
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