CN214706234U - 5G antenna oscillator and 5G antenna based on integrated into one piece and printed copper technology - Google Patents
5G antenna oscillator and 5G antenna based on integrated into one piece and printed copper technology Download PDFInfo
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- CN214706234U CN214706234U CN202120467128.4U CN202120467128U CN214706234U CN 214706234 U CN214706234 U CN 214706234U CN 202120467128 U CN202120467128 U CN 202120467128U CN 214706234 U CN214706234 U CN 214706234U
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Abstract
The application relates to the technical field of communication, and provides a 5G antenna oscillator and a 5G antenna based on integrated molding and copper printing processes, wherein the 5G antenna oscillator comprises an oscillator unit, a dielectric substrate and a feed network; the dielectric substrate is formed by in-mold injection molding or extrusion molding, and copper foil in a preset shape is printed on the dielectric substrate to form a feed network; the number of the oscillator units is 3, the oscillator units are all arranged on the dielectric substrate and are connected with the feed network through the feed probes. In practical application, the dielectric substrate is formed by in-mold injection molding or extrusion molding, so that the flatness is greatly improved, the surface roughness is reduced, bubbles are reduced, the contractibility is enhanced, a copper-clad process is realized by adopting a copper-printing technology on the dielectric substrate, and the feed network is formed by printing a copper foil in a preset shape; compared with the traditional laminating manufacturing mode of the high-frequency PCB, the manufacturing method has the advantages that the production process is simplified, the reliability of the antenna is better, and the cost is reduced by more than 30% compared with the traditional antenna scheme.
Description
Technical Field
The application relates to the technical field of communication, in particular to a 5G antenna oscillator and a 5G antenna based on integrated molding and copper printing processes.
Background
With the rapid development of mobile communication technology, a new infrastructure policy introduced by the country includes the large-scale laying of the next generation of 5G communication network, wherein the fusion of the base station master device and the front-end large-scale array antenna in the 5G network will become the mainstream trend, and therefore, higher requirements will be placed on the design of the 5G antenna element with low cost, miniaturization and convenient assembly.
The MIMO antenna array that 5G antenna element design scheme of present mainstream is trinity subarray and constitutes, obtains different broadcast wave beam and business wave beam through inciting oneself to different trinity subarrays for the antenna tends to high-efficient and intelligent, and under along with the continuous perfect of 5G antenna element design technique, the design form of trinity subarray mainly has following scheme: the method comprises a scheme of welding a die-cast oscillator on a high-frequency PCB (Printed Circuit Board), a scheme of welding a PCB oscillator on a high-frequency PCB, a scheme of laser etching and plating an integrated bracket and a scheme of selective electroplating of the integrated bracket.
The scheme of welding the oscillator by the high-frequency board has the advantages that the weight of the die-casting oscillator is relatively large, the traditional high-frequency board adopts a lamination technology to obtain medium substrates with different thicknesses, the lamination technology tends to be mature after continuous development, but the risk of poor batch performance still exists, the PIM (Passive inter-Modulation) problem of the board is particularly prominent, the antenna consistency is poor, the processing period of the high-frequency PCB is long, and the cost is relatively expensive; the integrated support laser etching plating scheme and the integrated support selective electroplating scheme have the defects that the manufacturing procedures are complex, the processing difficulty is high, and the manufacturing cost is difficult to effectively reduce due to the laser etching plating or the selective electroplating.
SUMMERY OF THE UTILITY MODEL
In order to provide a trinity oscillator antenna that the production process is more simplified, the processing technology degree of difficulty is lower, this application provides a 5G antenna oscillator and 5G antenna based on integrated into one piece and printing copper technology.
The first aspect of the embodiments of the present application provides a 5G antenna oscillator based on integrated molding and copper printing process, including an oscillator unit, a dielectric substrate and a feed network;
the dielectric substrate is formed by in-mold injection molding or extrusion molding, and copper foil in a preset shape is printed on the dielectric substrate to form the feed network;
the number of the oscillator units is 3, the oscillator units are all arranged on the dielectric substrate and welded on the feed network through feed probes.
Optionally, the vibrator unit is further provided with a plurality of loading branches.
Optionally, the middle of the vibrator unit is provided with a mutually crossed radiation slit, the length of the radiation slit is less than or equal to λ/4, and λ is the wavelength of the radiation wave of the vibrator unit.
Optionally, the antenna further includes a ground layer printed on the dielectric substrate by a copper printing process, and the ground layer and the feed network are respectively located on two opposite surfaces of the dielectric substrate.
Optionally, the vibrator unit is a metal plate stamping vibrator.
Optionally, two sides of the dielectric substrate are provided with isolation walls.
Optionally, the dielectric substrate is made of plastic.
The second aspect of the embodiment of the present application provides a 5G antenna based on an integrated molding and copper printing process, where the 5G antenna is an array antenna composed of 5G antenna elements based on an integrated molding and copper printing process provided in the first aspect of the embodiment of the present application.
According to the technical scheme, the 5G antenna oscillator and the 5G antenna based on the integrated forming and copper printing process comprise an oscillator unit, a dielectric substrate and a feed network; the dielectric substrate is formed by in-mold injection molding or extrusion molding, and copper foil in a preset shape is printed on the dielectric substrate to form the feed network; the number of the oscillator units is two, the oscillator units are arranged on the dielectric substrate and connected with the feed network through feed probes.
In the practical application process, the dielectric substrate is molded by in-mold injection molding or extrusion molding, so that the flatness of the dielectric substrate is greatly improved, the surface roughness of the dielectric substrate is reduced, bubbles in the dielectric substrate are reduced, the contractibility of the dielectric substrate is enhanced, a copper-clad process is realized by adopting a copper printing technology on the dielectric substrate, and the feed network is formed by printing a copper foil with a preset shape; compared with the traditional laminating manufacturing mode of the high-frequency PCB, the manufacturing method has the advantages that the production process is simplified, the processing technology is lower, the reliability of the antenna is better, and the cost is reduced by more than 30% compared with the traditional antenna scheme.
Drawings
In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic view of an overall structure of a 5G antenna oscillator based on an integrated molding and copper printing process according to an embodiment of the present application;
fig. 2 is an exploded schematic view of a dielectric substrate structure provided in an embodiment of the present application;
fig. 3 is a schematic structural diagram of a vibrator unit according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of a feed network provided in an embodiment of the present application;
FIG. 5 is a schematic diagram of the measured standing-wave ratio of the three-in-one array antenna using the injection molding process scheme provided in the application example;
fig. 6 is a schematic view of actually measured antenna isolation of a three-in-one array antenna according to the injection molding process scheme provided in the application example.
Wherein: the antenna comprises a 1-vibrator unit, 101-feed probes, 102-loading branches, 103-radiation slits, 2-dielectric substrates, 3-feed networks, 301-first input ports, 302-second input ports, 4-ground layers and 5-isolation walls.
Detailed Description
Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following examples do not represent all embodiments consistent with the present application. But merely as exemplifications of embodiments consistent with certain aspects of the application, as detailed in the claims.
In order to provide a trinity oscillator antenna with a simplified production process and a lower processing difficulty, refer to fig. 1, which is a schematic diagram of an overall structure of a 5G antenna oscillator based on an integrated forming and copper printing process provided in an embodiment of the present application, a 5G antenna oscillator based on an integrated forming and copper printing process provided in a first aspect of an embodiment of the present application includes an oscillator unit 1, a dielectric substrate 2 and a feed network 3.
As shown in fig. 2, for an exploded schematic view of a dielectric substrate structure provided in an embodiment of the present application, the dielectric substrate 2 is manufactured by an integral molding process, which may be in-mold injection molding or extrusion molding. The dielectric substrate 2 is different from the traditional laminating manufacturing mode of the high-frequency PCB, is obtained by in-mold injection molding or extrusion molding in a mode of accurately controlling in-mold temperature, particle fluidity and molding time, and has relatively stable and reliable performance, and because the dielectric substrate 2 is subjected to injection molding, the flatness of the dielectric substrate 2 is greatly improved, the surface roughness of the dielectric substrate 2 is reduced, air bubbles in the dielectric substrate 2 are reduced, the contractibility of the dielectric substrate 2 is enhanced, and more importantly, the production cost is greatly reduced relative to the high-frequency PCB.
The feed network 3 is printed on the dielectric substrate 2 through a copper printing process, specifically, a copper foil with a preset shape is printed on the dielectric substrate 2 to form the feed network 3. The copper foil with the preset shape can be directly printed with a printing plate with a certain shape; it is also possible to print a finished shape, for example a rectangle, and then etch the rectangle into a predetermined shape, which is the planar shape of the feeding network 3, by an etching technique.
The dielectric substrate 2 is formed through injection molding or extrusion molding, the surface flatness of the dielectric substrate is high, a copper printing process can be achieved, the feed network 3 is formed through printed copper foil, compared with laser etching plating or selective electroplating, the copper printing process is simple in processing process, the feed network 3 formed through the printing process is high in flatness, accordingly, in a large-scale antenna array, consistency among a plurality of 5G antenna oscillators is guaranteed, reliability of the large-scale antenna array is improved, and production cost is low in a large-scale production process.
According to the technical scheme, the 5G antenna oscillator and the 5G antenna based on the integrated forming and copper printing process comprise an oscillator unit 1, a dielectric substrate 2 and a feed network 3; the dielectric substrate 2 is formed by in-mold injection molding or extrusion molding, and a copper foil in a preset shape is printed on the dielectric substrate 2 to form the feed network 3; the number of the oscillator units 1 is 3, the oscillator units are all arranged on the dielectric substrate 2, and the oscillator units are connected with the feed network through feed probes 101.
In the practical application process, the dielectric substrate 2 is molded by in-mold injection molding or extrusion molding, so that the flatness of the dielectric substrate 2 is greatly improved, the surface roughness of the dielectric substrate 2 is reduced, bubbles in the dielectric substrate 2 are reduced, the contractibility of the dielectric substrate 2 is enhanced, a copper-clad process is realized by adopting a copper-printing technology on the dielectric substrate 2, and the feed network 3 is formed by printing a copper foil in a preset shape; compared with the traditional laminating manufacturing mode of the high-frequency PCB, the manufacturing method has the advantages that the production process is simplified, the complexity of the processing technology is lower, the reliability of the antenna is better, and the cost is reduced by more than 30% compared with the traditional antenna scheme.
Further, as shown in fig. 2, for an explosion schematic diagram of a dielectric substrate structure provided in an embodiment of the present application, in some embodiments of the present application, a ground layer 4 is further disposed on the dielectric substrate 2, the ground layer 4 is printed on the dielectric substrate 2 through a copper printing process, and is located on two opposite sides of the dielectric substrate 2 with respect to the feeding network 3, in a specific application process, copper foils with preset shapes are printed on upper and lower surfaces of the injection-molded dielectric substrate 2 to form surface copper-clad layers, and finally an injection-molded PCB board with double-sided copper-clad layers is formed, where a copper layer on one side is the feeding network 3, and a copper layer on the other side is the ground layer 4, so as to form a microstrip feeding network.
Further, as shown in fig. 3, a structural schematic diagram of the oscillator unit provided in the embodiment of the present application is provided, in some embodiments of the present application, the oscillator unit 1 is a dual-polarized sheet metal oscillator, and is further provided with a plurality of loading branches 102, for example, the number of the feed probes 101 arranged on the oscillator unit 1 is four, and correspondingly, the number of the loading branches 102 is also four, and as shown in fig. 2, the loading branches 102 are arranged at four corners of the radiation surface of the oscillator unit 1, so that the bandwidth of the oscillator unit 1 is extended.
The four feeding probes 101 are divided into two groups, the feeding probes 101 in the same group are located on different sides of the oscillator unit 1, for example, the feeding probe 101 in the first group includes a first probe and a second probe, the feeding probe 101 in the second group includes a third probe and a fourth probe, the first probe and the second probe are distributed along one diagonal line on the radiation surface of the oscillator unit 1, the third probe and the fourth probe are distributed along another diagonal line on the radiation surface of the oscillator unit 1, and the first diagonal line and the second diagonal line are orthogonal to each other. Corresponding to the number of the four feeding probes 101, the feeding network 3 is provided with feeding points connected with the four feeding probes 101, so that signals fed from the two feeding points are mutually overlapped to form two vector-overlapped signals, a dual-polarized oscillator unit is formed, and two mutually orthogonal polarizations are generated, namely a dual-polarized antenna is formed.
Further, as shown in fig. 3, in some embodiments of the present application, a mutually intersecting radiation slit 103 is disposed in the middle of the vibrator unit 1, the length of the radiation slit 103 is less than or equal to λ/4, and λ is the wavelength of the radiation wave of the vibrator unit 1. Set up intercrossing's radiation seam 103 in the middle of the oscillator, form the cross seam, make the cross seam with the radiating surface of oscillator unit 1 is outward radiant energy jointly, if the length of radiation seam exceeds lambda/4, lambda is the radiation wave wavelength, then can make the current distribution of oscillator unit 1 radiating surface no longer along the diagonal evenly distributed of radiating surface, but concentrate the distribution in the radiation seam is peripheral, forms the radiating mode of class symmetry oscillator, in this application embodiment, the length of radiation seam 103 is less than or equal to lambda/4, makes the current of oscillator unit 1 radiating surface mainly distributes in the radiating surface edge, forms the patch antenna radiation mode.
Further, as shown in fig. 1, partition walls 5 are disposed on two sides of the dielectric substrate 2. By arranging the separation wall 5, in a large-scale antenna array, different antenna elements have better isolation.
Further, the material of the dielectric substrate 2 is plastic, but is not limited to plastic, and may also be other injection molding materials, for example, thermoplastic resin materials.
As shown in fig. 4, for the schematic view of the feed network structure provided in the embodiment of the present application, the feed network 3 includes two input ports of a polarization feed network, which are a first input port 301 and a second input port 302, respectively, so as to form a dual-polarization three-in-one array antenna through a differential feed network, thereby better improving the isolation between different polarizations.
Further, as shown in fig. 5, a schematic diagram of the measured standing wave ratio of the three-in-one array antenna adopting the injection molding process scheme provided for the application example is shown, in fig. 5, a dashed line portion is the standing wave ratio of the first input port 301, a solid line portion is the standing wave ratio of the second input port 302, and in an n78(3.3-3.8GHz) frequency band, the standing wave ratio (VSWR) is less than 1.5.
Further, as shown in fig. 6, an antenna isolation schematic diagram actually measured for the three-in-one array antenna of the injection molding process scheme provided in the embodiment of the present application is shown, wherein an ordinate represents an isolation between the first input port 301 and the second input port 302, and it can be seen from the diagram that an isolation S (2,1) between the first input port 301 and the second input port 302 is less than-22 dB.
Through the isolation test between the first Input port 301 and the second Input port 302 and the test on the standing-wave ratios of the first Input port 301 and the second Input port 302, the 5G antenna based on the integrated forming and the copper printing process provided by the embodiment of the present application can be obtained, and the use requirements of a 5G MIMO (Multiple Input Multiple Output) antenna can be better satisfied.
The second aspect of the embodiment of the present application provides a 5G antenna based on an integrated molding and copper printing process, where the 5G antenna is an array antenna composed of 5G antenna elements based on an integrated molding and copper printing process provided in the first aspect of the embodiment of the present application. A large-scale array antenna is formed by combining a certain number of 5G antenna elements of the first aspect of the embodiment of the application.
According to the technical scheme, the 5G antenna oscillator and the 5G antenna based on the integrated forming and copper printing process comprise an oscillator unit 1, a dielectric substrate 2 and a feed network 3; the dielectric substrate 2 is formed by in-mold injection molding or extrusion molding, and a copper foil in a preset shape is printed on the dielectric substrate 2 to form the feed network 3; the number of the oscillator units 1 is 3, the oscillator units are all arranged on the dielectric substrate 2 and welded on the feed network 3 through feed probes 101.
In the practical application process, the dielectric substrate 2 is molded by in-mold injection molding or extrusion molding, so that the flatness of the dielectric substrate 2 is greatly improved, the surface roughness of the dielectric substrate 2 is reduced, bubbles in the dielectric substrate 2 are reduced, the contractibility of the dielectric substrate 2 is enhanced, a copper-clad process is realized by adopting a copper-printing technology on the dielectric substrate 2, and the feed network 3 is formed by printing a copper foil in a preset shape; compared with the traditional laminating manufacturing mode of the high-frequency PCB, the manufacturing method has the advantages that the production process is simplified, the processing technology is lower, the reliability of the antenna is better, and the cost is reduced by more than 30% compared with the traditional antenna scheme.
The embodiments provided in the present application are only for describing the embodiments and/or example examples under the general concept of the present application, and do not limit the protection scope of the present application. Various equivalent substitutions, modifications or improvements may be made to the embodiments and implementations of the disclosure by those skilled in the art without inventive faculty or departing from the spirit and scope of the disclosure, which fall within the scope of the disclosure. The protection scope of this application is subject to the appended claims.
Claims (8)
1. The 5G antenna oscillator based on the integrated forming and copper printing process is characterized by comprising an oscillator unit (1), a dielectric substrate (2) and a feed network (3);
the dielectric substrate (2) is formed by injection molding or extrusion molding in a die, and copper foil in a preset shape is printed on the dielectric substrate (2) to form the feed network (3);
the number of the oscillator units (1) is 3, the oscillator units are all arranged on the dielectric substrate (2), and the oscillator units are welded on the feed network (3) through feed probes (101).
2. The 5G antenna element based on the integrated molding and copper printing process as claimed in claim 1, wherein the element unit (1) is further provided with a plurality of loading branches (102).
3. The 5G antenna element based on the integrated molding and printed copper process as claimed in claim 1, wherein a radiation slit (103) is arranged in the middle of the element unit (1), the length of the radiation slit (103) is less than or equal to λ/4, and λ is the radiation wavelength of the element unit (1).
4. The 5G antenna element based on the integrated molding and printed copper process as claimed in claim 1, further comprising a ground layer (4), wherein the ground layer (4) is printed on the dielectric substrate (2) through the printed copper process, and the feeding network (3) is respectively arranged on two opposite sides of the dielectric substrate (2).
5. The 5G antenna oscillator based on integrated molding and copper printing process as claimed in claim 1, wherein the oscillator unit (1) is a sheet metal stamping oscillator.
6. The 5G antenna element based on the integrated molding and copper printing process as claimed in claim 1, wherein two sides of the dielectric substrate (2) are provided with isolation walls (5).
7. The 5G antenna element based on the integrated molding and printed copper process as claimed in claim 1, wherein the dielectric substrate (2) is made of plastic.
8. A5G antenna based on integrated molding and copper printing process, characterized in that the 5G antenna is an array antenna composed of 5G antenna elements based on integrated molding and copper printing process according to any one of claims 1-7.
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| CN202120467128.4U CN214706234U (en) | 2021-03-04 | 2021-03-04 | 5G antenna oscillator and 5G antenna based on integrated into one piece and printed copper technology |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114447579A (en) * | 2021-06-04 | 2022-05-06 | 中兴通讯股份有限公司 | Antenna element and antenna array |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114447579A (en) * | 2021-06-04 | 2022-05-06 | 中兴通讯股份有限公司 | Antenna element and antenna array |
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