CN214674831U - Double-stator cylindrical linear motor based on heat dissipation of semiconductor refrigeration piece - Google Patents
Double-stator cylindrical linear motor based on heat dissipation of semiconductor refrigeration piece Download PDFInfo
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- CN214674831U CN214674831U CN202120950329.XU CN202120950329U CN214674831U CN 214674831 U CN214674831 U CN 214674831U CN 202120950329 U CN202120950329 U CN 202120950329U CN 214674831 U CN214674831 U CN 214674831U
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Abstract
The utility model discloses a double-stator cylindrical linear motor based on heat dissipation of a semiconductor refrigerating piece, which comprises a motor shell, an inner stator and a semiconductor refrigerating piece, wherein the inner stator is fixedly arranged in the motor shell; semiconductor refrigeration piece includes semiconductor refrigeration piece cold junction and semiconductor refrigeration piece hot end, wherein: the cold end of the semiconductor refrigeration piece is in contact with one end of the inner stator, and the hot end of the semiconductor refrigeration piece is exposed out of the motor shell. The utility model discloses a semiconductor refrigeration piece, will outside the inside heat of motor shifts the motor casing, strengthened the motor heat dissipation, because semiconductor refrigeration piece noiselessness, do not have the vibration, do not need refrigerant, small, light in weight, the cooling system who has solved motor among the prior art has that the structure is complicated, with high costs, and can increase the technical problem of motor volume and noise, has realized that the motor radiating effect is good, and motor volume, weight, noise are not influenced, and economic environmental protection's beneficial effect.
Description
Technical Field
The utility model belongs to the technical field of permanent magnet linear electric motor, especially, relate to a two stator cylinder type linear electric motor based on semiconductor refrigeration piece is radiating.
Background
The double-stator cylindrical linear motor is a novel motor with compact structure and improved space utilization rate and power density, and is commonly used in scenes of important renewable energy sources which are tidal and wave energy and are characterized by reciprocating motion.
Due to the limitation of low-thermal-conductivity materials such as insulating paint and air inside the motor, heat generated by key heating parts inside the motor, particularly windings, cannot be quickly transferred to a cooling motor shell, so that a large amount of heat is accumulated on the key parts of the motor to form a local high-temperature area. The heat generated in the motor operation process is quickly transferred to the outside by adopting the efficient and reliable heat dissipation system, so that the heat is prevented from accumulating on key parts of the motor, the motor is ensured to work at a proper temperature all the time, and the heat dissipation system has important significance on the service life, the efficiency and the operation safety of the motor.
The heat dissipation is enhanced by providing the motor with a heat dissipation system, such as an air-cooled heat dissipation system, a liquid-cooled heat dissipation system, and an evaporative cooling system.
The air-cooled heat dissipation system can be divided into natural air cooling and forced air cooling according to whether an additional device for enhancing air flow is adopted, the natural air cooling does not need an additional power device, heat exchange is carried out only through natural convection of the motor shell and surrounding air, and the heat dissipation efficiency is low. Forced air cooling generally utilizes fan system to strengthen the heat exchange of motor and outside air, and extra fan system compares in nature forced air cooling and has improved the radiating efficiency of motor greatly, but has also increased the power consumption and the noise of motor system to a certain extent, has also increased the volume of motor simultaneously.
The liquid cooling heat dissipation system requires additional circulating fluid paths and sealing systems, increasing the cost and complexity of the motor system. Common liquid cooling heat dissipation system divide into water cooling heat dissipation system and oil cooling heat dissipation system, and water cooling heat dissipation system produces incrustation scale and corrodes motor casing easily in long-term circulation process, consequently still need add additives such as anticorrosive and anti foam in practical application, and oil cooling system then needs strict filtration system to filter the oil medium to avoid impurity in the oil to cause destruction to the inside insulating layer of motor, and oil cooling heat dissipation system's cost is expensive.
The evaporative cooling heat dissipation system utilizes the phase change circulation of a low-boiling point cooling medium to realize high-efficiency cooling of the motor. When a cooling medium with a low boiling point and a high insulation coefficient is in contact with a heating component in the motor, the cooling medium absorbs a large amount of heat and is vaporized, the gaseous cooling medium is converted into liquid when meeting cold in the condenser, and the efficient heat dissipation of the motor is realized by utilizing the gas-liquid phase change circulation of the cooling medium, but the structure is complex, and the volume and the noise of the motor can be increased.
Therefore, the above prior art has at least the following technical problems: the heat dissipation system of the motor in the prior art has a complex structure and high cost, and can increase the volume and the noise of the motor.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a double-stator cylindrical linear motor based on heat dissipation of semiconductor refrigeration pieces, and solves the technical problems that a heat dissipation system of a motor in the prior art is complex in structure, high in cost and capable of increasing the volume and noise of the motor.
The embodiment of the application provides a double-stator cylindrical linear motor based on semiconductor refrigeration piece heat dissipation, the motor includes:
a motor housing;
the inner stator is fixedly arranged in the motor shell;
semiconductor refrigeration piece, including semiconductor refrigeration piece cold junction, semiconductor refrigeration piece hot junction, just semiconductor refrigeration piece cold junction with semiconductor refrigeration piece hot junction passes through semiconductor refrigeration piece P, N and connects, wherein: the cold end of the semiconductor refrigeration piece is in contact with one end of the inner stator, and the hot end of the semiconductor refrigeration piece is exposed out of the motor shell.
Furthermore, the inner stator is hollow to form a cavity, and the cavity is filled with a heat dissipation core.
Furthermore, the cold end of the semiconductor refrigeration sheet is in contact with one end of the heat dissipation core.
Further, the length of the heat dissipation core is the same as that of the inner stator, that is, the heat dissipation core extends from one end of the inner stator to the other end of the inner stator.
Furthermore, the cavity is cylindrical and coaxially arranged on the inner stator, the heat dissipation core is cylindrical, and the outer surface of the heat dissipation core is in close contact with the inner surface of the cavity.
Further, the heat dissipation core is a metal rod.
Further, the heat dissipation core is an aluminum rod or a copper rod.
Furthermore, the cold end of the semiconductor refrigeration piece is fixed to one end of the heat dissipation core, and the area of the cold end of the semiconductor refrigeration piece is the same as the area of the end face of the end, contacted with the heat dissipation core, of the heat dissipation core.
Furthermore, the area of the hot end of the semiconductor refrigerating sheet is larger than that of the cold end of the semiconductor refrigerating sheet.
Furthermore, the hot end of the semiconductor chilling plate is fixed on the outer end face of the motor shell, and the projections of the hot end of the semiconductor chilling plate on the outer end face of the motor shell are located inside the outer end face of the motor shell.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
(1) this application embodiment through set up the semiconductor refrigeration piece on the motor, will the semiconductor refrigeration piece cold junction with the contact of inner stator one end, will semiconductor refrigeration piece hot junction expose in motor casing, thereby will outside the inside heat transfer of motor casing, strengthened the motor heat dissipation, because the semiconductor refrigeration piece noiselessness, do not have the vibration, do not need the refrigerant, small, light in weight, the cooling system who has solved motor among the prior art has the structure complicacy, with high costs, and can increase the technical problem of motor volume and noise, has realized that the motor radiating effect is good, and motor volume, weight, noise are not influenced, and economic environmental protection's beneficial effect.
(2) This application embodiment is through will the radiator core is hollowed and filled in the middle of the inner stator, because radiator core heat-conducting capacity is better, thereby can strengthen the heat-conducting capacity in the inner stator, with the outer heating power conduction of inner stator extremely semiconductor refrigeration piece department heat dissipation has strengthened the radiating effect.
(3) This application embodiment through inciting somebody to action the one end of radiator core is direct with semiconductor refrigeration piece cold junction contacts, because the radiator core has better heat conduction effect, can conduct more heats to semiconductor refrigeration piece cold end on, has further improved the radiating effect.
(4) This application embodiment through with the length of radiator core set to with the length of inner stator is the same, has strengthened the whole heat conduction of inner stator along length direction, the radiator core can will keep away from more conduction of the heat of semiconductor refrigeration piece cold junction one end extremely semiconductor refrigeration piece cold is served, further improvement the radiating effect.
(5) This application embodiment through with the surface of radiator core with the internal surface of cavity closely sets up, has strengthened the heat conduction to the radiating effect has been improved.
(6) This application embodiment is through with the radiating core sets to the metal pole, because the metal pole has better heat-conduction ability, thereby has strengthened the radiating effect of motor.
(7) This application embodiment through with the area of semiconductor refrigeration piece cold junction set to with the terminal surface area that the radiator core contacted one end is the same, increased the semiconductor refrigeration piece cold junction with heat conduction area between the radiator core has improved the radiating effect.
(8) The area of the hot end of the semiconductor refrigerating sheet is enlarged, so that the heat dissipation area is increased, and the heat dissipation effect is improved.
(9) According to the embodiment of the application, the hot end of the semiconductor chilling plate is arranged in the outer end face of the motor shell, so that the hot end of the semiconductor chilling plate is protected.
Drawings
Fig. 1 is a schematic structural diagram of a double-stator cylindrical linear motor based on heat dissipation of semiconductor cooling fins according to an embodiment of the present application;
fig. 2 is a schematic diagram of a semiconductor refrigeration system in the prior art.
Detailed Description
The embodiment of the application provides a double-stator cylindrical linear motor based on heat dissipation of semiconductor refrigeration pieces, and solves the technical problems that a heat dissipation system of a motor in the prior art is complex in structure, high in cost and capable of increasing the volume and noise of the motor.
In order to solve the above problems, the technical solution in the embodiment of the present application has the following general idea:
the semiconductor refrigeration piece is arranged on the motor, the cold end of the semiconductor refrigeration piece is contacted with one end of the inner stator, and the hot end of the semiconductor refrigeration piece is exposed out of the motor shell, so that the heat in the motor is transferred out of the motor shell, and the heat dissipation of the motor is enhanced;
the heat conduction capacity in the inner stator can be enhanced by hollowing the middle of the inner stator and filling the heat dissipation core with better heat conduction capacity, so that the heat of the outer layer of the inner stator is conducted to the semiconductor refrigeration sheet for heat dissipation, and the heat dissipation effect is enhanced;
one end of the heat dissipation core is directly contacted with the cold end of the semiconductor refrigeration piece, and the heat dissipation core has a good heat conduction effect, so that more heat can be conducted to the cold end of the semiconductor refrigeration piece, and the heat dissipation effect is further improved;
the length of the heat dissipation core is set to be the same as that of the inner stator, namely the heat dissipation core extends from one end of the inner stator to the other end of the inner stator, so that the integral heat conduction of the inner stator along the length direction is enhanced, the heat dissipation core can conduct more heat far away from one end of the cold end of the semiconductor refrigeration piece to the cold end of the semiconductor refrigeration piece, and the heat dissipation effect is further improved.
In order to better understand the technical solution, the technical solution will be described in detail with reference to the drawings and the specific embodiments.
Fig. 1 is a cylindrical linear motor with double stators for dissipating heat based on semiconductor cooling fins according to an embodiment of the present application, as shown in fig. 1, the motor includes a motor housing 42, an inner stator 12 and semiconductor cooling fins.
As shown in fig. 1, an inner stator 12, an outer stator 11, an inner winding 22 on the inner stator 12, an outer winding 21 on the outer stator 11, a rotatable rotor 50 between the inner stator 12 and the outer stator 11, an inner permanent magnet 32 and an outer permanent magnet 31 between the inner stator 12 and the outer stator 11 are disposed in the motor housing 42, wherein the inner stator 12 is fixedly disposed on a central axis of the motor housing 42, and the motor housing 42 is further provided with a mechanical support structure 41.
The semiconductor refrigeration piece comprises a semiconductor refrigeration piece cold end 70 and a semiconductor refrigeration piece hot end 90, and the semiconductor refrigeration piece cold end 70 is connected with the semiconductor refrigeration piece hot end 90 through semiconductor refrigeration piece P, N junctions 80 and 90; wherein, the cold end 70 of the semiconductor chilling plate is in close contact with the end face of one end of the inner stator 12 to improve the heat conduction effect, and the hot end 90 of the semiconductor chilling plate is exposed out of the motor housing 42.
Further, the cold end 70 of the semiconductor chilling plate is directly fixed (e.g., bonded) to the end face of one end of the inner stator 12.
Semiconductor refrigeration, i.e. thermoelectric refrigeration, also called thermoelectric refrigeration, is called semiconductor refrigeration because the materials adopted by the thermoelectric refrigeration are basically semiconductor materials at present. The semiconductor refrigerating sheet has the characteristics of no noise, no vibration, no need of refrigerant, small volume, light weight and the like, and has the advantages of reliable work, simple and convenient operation and easy cold quantity regulation.
The semiconductor material has the characteristic of thermoelectric energy conversion, and when direct current is applied, heat passes from one end of the material to the other end of the material to generate a refrigeration effect. Semiconductor refrigeration is a novel refrigeration technology based on five thermoelectric effects of Fourier effect, Joule effect, Seebeck effect, Thomson effect and Peltier effect.
Fig. 2 is a schematic diagram of a semiconductor refrigeration in the prior art, as shown in fig. 2, two different semiconductor materials are connected in series to form a couple, which forms P, N junction b, when direct current passes through, due to the temperature difference effect, two ends of the couple suck and release heat, and electric energy is converted into heat energy. The current direction of the cold end is N → P, and the heat absorption and refrigeration are carried out; the direction of the hot-end current is P → N, and the heat is released and increased. When direct current passes through the junction b of the semiconductor P, N, a thermoelectric effect will be generated at the junction interface. Semiconductor refrigeration is mainly applied to the Peltier effect, and the heat Q generated by the Peltier effectpComprises the following steps:
Qp＝(αp-αn)TI
in the formula, alphap、αnThe thermoelectric electromotive force rates of the P-type junction and the N-type junction are respectively; t is the absolute temperature at the junction; and I is the current intensity generated by the direct current in the loop.
In addition to the peltier effect, the thermoelectric effect also presents two irreversible effects, namely the fourier effect and the joule effect, among which: heat Q generated by fourier effectF：
In the formula, λIs the thermal conductivity of the conductor; s is the effective cross-sectional area of the conductor; l is the effective length of the conductor; t ishIs the hot end a absolute temperature; t iscIs the cold end c absolute temperature; k is the total thermal conductance of the conductor; and delta T is the temperature difference of the cold end and the hot end.
Heat Q generated by joule effectJ：
Wherein R is the total resistance of the conductor; ρ is the resistivity of the conductor.
In the refrigeration P, N couple, P, N junction b has one end as cold end a and the other end as hot end c, so there is temperature difference between the two ends of P, N junction b, because of the temperature difference, and because joule heat is generated when current passes through the couple arm, the local temperature rises, and the heat will be transmitted from hot end c to cold end a. If equilibrium is reached at junction b at P, N, the heat Q conducted by hot side c to the cold junctionHeat generationCan be represented by a one-dimensional fourier equation:
the semiconductor cooling efficiency is affected by the heat dissipation effect of the hot end c. When the semiconductor refrigerating device is in actual use, the cold end a is attached to an object to be cooled to absorb heat, and the heat is transmitted to the hot end c and must be timely dissipated to maintain the normal operation of the semiconductor refrigerating device. When the system works, the heat dissipation density of the cold end a and the hot end c can reach 104W/m2Therefore, the effective operation of the system strongly depends on the heat transfer performance of the cold end and the hot end.
This application embodiment through set up the semiconductor refrigeration piece on the motor, will semiconductor refrigeration piece cold junction 70 with the contact of 12 one ends of inner stator will semiconductor refrigeration piece hot junction 90 expose in motor casing 42, thereby will outside the inside heat transfer of motor shifts the motor casing, has strengthened the motor heat dissipation, because the semiconductor refrigeration piece noiselessness, do not have the vibration, do not need the refrigerant, small, light in weight, solved the cooling system of motor among the prior art and have complicated, with high costs, and can increase the technical problem of motor volume and noise, realized that the motor radiating effect is good, motor volume, weight, noise are not influenced, and economic environmental protection's beneficial effect.
In an embodiment of the present application, the inner stator 12 is hollow to form a cavity, and the cavity is filled with the heat dissipation core 60, so that the heat conduction capability of the heat dissipation core 60 is good, the heat conduction capability in the inner stator 12 can be enhanced, and the heat of the outer layer of the inner stator 12 is conducted to the semiconductor cooling fins for heat dissipation.
In this application embodiment, the first end of radiator core 60 with semiconductor refrigeration piece cold junction 70 contacts, because radiator core 60 has better heat conduction effect, can conduct more heat to semiconductor refrigeration piece cold junction 70 on to improve the radiating effect.
In an embodiment of the present application, the length of the heat dissipation core 60 is the same as the length of the inner stator 12, that is, the heat dissipation core 60 extends from one end of the inner stator to the other end of the inner stator 12, so that the overall heat conduction of the inner stator 12 along the length direction is enhanced, the heat dissipation core 60 can conduct more heat away from one end of the semiconductor chilling plate cold end 70 to the semiconductor chilling plate cold end 70, and thus the heat dissipation effect is improved.
In summary, the middle of the inner stator 12 is hollowed and filled with the heat dissipation core 60, the length of the heat dissipation core 60 is the same as that of the inner stator 12, and one end of the heat dissipation core 60 is in contact with the cold end 70 of the semiconductor chilling plate, which is beneficial to conducting heat to the cold end 70 of the semiconductor chilling plate through the heat dissipation core 60, and finally transferring the heat to the outside of the motor housing 42 through the semiconductor heating end 90, thereby enhancing the heat dissipation effect inside the motor.
In an embodiment of the present invention, the cavity is a cylinder coaxially formed on the inner stator 12, the heat dissipation core 60 is a cylinder and coaxially disposed in the cavity, an axial length of the heat dissipation core 60 is the same as an axial length of the inner stator 12, and an outer surface of the heat dissipation core 60 is in close contact with an inner surface of the cavity, so as to enhance a heat conduction effect.
In an embodiment of the present application, the heat dissipation core 60 is a metal rod having a good heat conduction capability, so as to enhance the heat dissipation effect of the motor, specifically, the heat dissipation core 60 is an aluminum rod or a copper rod having a high heat conduction coefficient.
In an embodiment of the present application, the area of semiconductor refrigeration piece cold junction 70 with the terminal surface area that radiator core 60 contacted one end is the same to maximize semiconductor refrigeration piece cold junction 70 with heat conduction area between radiator core 60 improves the radiating effect.
In an embodiment of the present application, the area of the hot end 90 of the semiconductor refrigeration sheet is greater than the area of the cold end 70 of the semiconductor refrigeration sheet, because the hot end 90 of the semiconductor refrigeration sheet is located outside the motor housing 42 and is not limited by the internal structure of the motor, the heat dissipation area can be increased as much as possible, thereby improving the heat dissipation effect.
In an embodiment of the present application, the semiconductor chilling plate hot end 90 is fixed on the outer end surface of the motor housing 42, and the projections of the semiconductor chilling plate hot end 90 on the outer end surface of the motor housing 42 are all located inside the outer end surface of the motor housing 42, that is, the outer edge of the semiconductor chilling plate hot end 90 does not exceed the outer edge of the outer end surface of the motor housing 42, so as to prevent the semiconductor chilling plate hot end 90 from being damaged.
Experimental verification
The motor is subjected to three-dimensional thermal analysis, and compared with a motor before optimization (hereinafter referred to as before optimization) without the semiconductor refrigerating sheet according to the embodiment and a motor (hereinafter referred to as after the semiconductor refrigerating sheet is added) provided with the semiconductor refrigerating sheet according to the embodiment, the highest temperature of each part in the motor is shown in table 1, the highest temperature of the inner stator before optimization is 179.033 ℃, the highest temperature of the inner stator of the motor is 105.272 ℃ after the semiconductor refrigerating sheet is added, the temperature is reduced by 69.355 ℃ compared with that before optimization, the temperature is reduced to 41.20%, the temperature reduction effect is very obvious, and the temperatures of other parts of the motor are also obviously reduced.
TABLE 1 maximum temperature of each component of the motor
Therefore, the motor has better heat dissipation capacity due to the arrangement of the semiconductor refrigerating sheet.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
(1) this application embodiment through set up the semiconductor refrigeration piece on the motor, will semiconductor refrigeration piece cold junction 70 with the contact of inner stator one end, will semiconductor refrigeration piece hot junction 90 expose in motor casing 42, thereby will outside the inside heat transfer of motor shifts the motor casing, has strengthened the motor heat dissipation, because the semiconductor refrigeration piece noiselessness, do not have the vibration, do not need the refrigerant, small, light in weight, solved the cooling system of motor among the prior art and have complicated, with high costs, and can increase the technical problem of motor volume and noise, realized that the motor radiating effect is good, motor volume, weight, noise are not influenced, and economic environmental protection's beneficial effect.
(2) In the embodiment of the application, the heat dissipation core 60 is hollowed and filled in the middle of the inner stator 12, and the heat conduction capability of the heat dissipation core 60 is better, so that the heat conduction capability in the inner stator 12 can be enhanced, the heat of the outer layer of the inner stator 12 is conducted to the semiconductor refrigeration sheet for heat dissipation, and the heat dissipation effect is enhanced.
(3) This application embodiment through inciting somebody to action the one end of radiator core 60 directly with semiconductor refrigeration piece cold junction 70 contacts, because radiator core 60 has better heat conduction effect, can conduct more heat to semiconductor refrigeration piece cold junction 70 on, further improved the radiating effect.
(4) This application embodiment through with the length of radiator core 60 set to with the length of inner stator 12 is the same, has strengthened the whole heat conduction of inner stator 12 along length direction, radiator core 60 can will keep away from more conduction of the heat of semiconductor refrigeration piece cold junction 70 one end extremely on semiconductor refrigeration piece cold junction 70, further improvement the radiating effect.
(5) The embodiment of the application strengthens heat conduction by tightly arranging the outer surface of the heat radiating core 60 and the inner surface of the cavity, thereby improving the heat radiating effect.
(6) In the embodiment of the present application, the heat dissipation core 60 is set to be a metal rod, and the metal rod has a good heat conduction capability, so that the heat dissipation effect of the motor is enhanced.
(7) This application embodiment through with semiconductor refrigeration piece cold junction 70 the area set to with the terminal surface area that radiating core 60 contacted one end is the same, increased semiconductor refrigeration piece cold junction 70 with heat conduction area between the radiating core 60 has improved the radiating effect.
(8) The area of the hot end 90 of the semiconductor refrigerating sheet is enlarged, so that the heat dissipation area is increased, and the heat dissipation effect is improved.
(9) In the embodiment of the present application, the hot end 90 of the semiconductor chilling plate is disposed inside the outer end surface of the motor housing 42, so as to protect the hot end 90 of the semiconductor chilling plate.
It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element may be termed a second element, and, similarly, a second element may be termed a first element, without departing from the scope of example embodiments.
The terms of orientation of up, down, left, right, front, back, top, bottom, and the like referred to or may be referred to in this specification are defined relative to the configuration shown in the drawings, and are relative terms, and thus may be changed correspondingly according to the position and the use state of the device. Therefore, these and other directional terms should not be construed as limiting terms.
While the foregoing is directed to the preferred embodiment of the present application, and not to the limiting thereof in any way and any way, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. Those skilled in the art can make various changes, modifications and equivalent arrangements to those skilled in the art without departing from the spirit and scope of the present application; moreover, any equivalent alterations, modifications and variations of the above-described embodiments according to the spirit and techniques of this application are intended to be within the scope of the claims of this application.
Claims (10)
1. The utility model provides a double-stator cylindrical linear motor based on semiconductor refrigeration piece heat dissipation which characterized in that, the motor includes:
a motor housing;
the inner stator is fixedly arranged in the motor shell;
semiconductor refrigeration piece, including semiconductor refrigeration piece cold junction and semiconductor refrigeration piece hot junction, just semiconductor refrigeration piece cold junction with semiconductor refrigeration piece hot junction passes through semiconductor refrigeration piece P, N and connects, wherein: the cold end of the semiconductor refrigeration piece is in contact with one end of the inner stator, and the hot end of the semiconductor refrigeration piece is exposed out of the motor shell.
2. The double-stator cylindrical linear motor based on the heat dissipation of the semiconductor chilling plate as claimed in claim 1, wherein a cavity is formed in the inner stator in a hollow manner, and a heat dissipation core is filled in the cavity.
3. The double-stator cylindrical linear motor based on heat dissipation of the semiconductor chilling plate as claimed in claim 2, wherein the cold end of the semiconductor chilling plate is in contact with one end of the heat dissipation core.
4. The double-stator cylindrical linear motor based on heat dissipation of the semiconductor chilling plate as claimed in claim 3, wherein the length of the heat dissipation core is the same as that of the inner stator, i.e., the heat dissipation core extends from one end of the inner stator to the other end of the inner stator.
5. The double-stator cylindrical linear motor based on the heat dissipation of the semiconductor chilling plate as claimed in claim 2, wherein the cavity is cylindrical and coaxially formed on the inner stator, the heat dissipation core is cylindrical, and an outer surface of the heat dissipation core is in close contact with an inner surface of the cavity.
6. The double-stator cylindrical linear motor based on the semiconductor chilling plate heat dissipation of claim 2, wherein the heat dissipation core is a metal rod.
7. The double-stator cylindrical linear motor based on the semiconductor chilling plate heat dissipation of claim 6, wherein the heat dissipation core is an aluminum rod or a copper rod.
8. The double-stator cylindrical linear motor based on the semiconductor chilling plate for heat dissipation according to claim 3, wherein the cold end of the semiconductor chilling plate is fixed to one end of the heat dissipation core, and the area of the cold end of the semiconductor chilling plate is the same as the area of the end face of the heat dissipation core at the end in contact with the cold end of the semiconductor chilling plate.
9. The double-stator cylindrical linear motor based on heat dissipation of the semiconductor chilling plates as claimed in claim 1, wherein the area of the hot end of the semiconductor chilling plates is larger than the area of the cold end of the semiconductor chilling plates.
10. The double-stator cylindrical linear motor based on semiconductor chilling plate heat dissipation of claim 1, wherein the semiconductor chilling plate hot end is fixed on the outer end face of the motor housing, and the projections of the semiconductor chilling plate hot end on the outer end face of the motor housing are all located within the outer end face of the motor housing.
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| CN202120950329.XU CN214674831U (en) | 2021-05-06 | 2021-05-06 | Double-stator cylindrical linear motor based on heat dissipation of semiconductor refrigeration piece |
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