CN214665487U - Multistage semiconductor refrigeration equipment - Google Patents
Multistage semiconductor refrigeration equipment Download PDFInfo
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- CN214665487U CN214665487U CN202022803495.5U CN202022803495U CN214665487U CN 214665487 U CN214665487 U CN 214665487U CN 202022803495 U CN202022803495 U CN 202022803495U CN 214665487 U CN214665487 U CN 214665487U
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Abstract
The utility model discloses a multistage semiconductor refrigeration plant, relate to semiconductor refrigeration technical field, including semiconductor refrigeration piece and radiator, the semiconductor refrigeration piece is provided with a plurality of pieces, a plurality of semiconductor refrigeration pieces from top to bottom evenly distributed, it has a plurality of heat conduction strips to bond between two adjacent semiconductor refrigeration pieces from top to bottom, turn right evenly distributed from a left side for a plurality of heat conduction strips, the right side of semiconductor refrigeration piece is provided with the transfer line, the left side of semiconductor refrigeration piece is provided with the back flow, the radiator bonds at the upper surface of top semiconductor refrigeration piece, the heat dissipation chamber has been seted up to the inside of radiator upper end, the left and right sides of heat dissipation intracavity portion all is rabbeted and is had the heat dissipation fan, the positive center of heat dissipation fan bottom is provided with first transmission shaft, the bottom welding of first transmission shaft has the driving gear. Through the cooperation setting of semiconductor refrigeration piece with heat conduction strip, radiator, the radiating effect of semiconductor refrigeration piece can effectual improvement improves, improves the refrigeration effect of semiconductor refrigeration piece.
Description
Technical Field
The utility model relates to a semiconductor refrigeration technology field especially relates to a multistage semiconductor refrigeration plant.
Background
The semiconductor refrigerating plate, also called thermoelectric refrigerating plate, is a heat pump. Its advantages are no slide part, limited space, high reliability and no pollution of refrigerant. By utilizing the Peltier effect of the semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, and the aim of refrigeration can be fulfilled. The refrigerating technology which generates negative thermal resistance is characterized by no moving parts and higher reliability.
At present, a plurality of semiconductor refrigerating pieces are stacked together to form a semiconductor refrigerating assembly so as to improve the refrigerating performance of the semiconductor refrigerating device. However, after the semiconductor refrigerating sheets are stacked, heat on the heating surfaces of the semiconductor refrigerating sheets is not easy to dissipate, so that the refrigerating effect of the semiconductor refrigerating sheets is affected, and therefore a multistage semiconductor refrigerating device is provided to solve the technical problems.
SUMMERY OF THE UTILITY MODEL
The utility model provides a multistage semiconductor refrigeration plant is difficult for giving off with the heat of solving the semiconductor refrigeration piece heating surface that above-mentioned background art provided to influence the problem of the refrigeration effect of semiconductor refrigeration piece.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a multistage semiconductor refrigeration device comprises semiconductor refrigeration pieces and a radiator, wherein the semiconductor refrigeration pieces are provided with a plurality of pieces which are uniformly distributed from top to bottom, a plurality of heat conducting strips are bonded between the two vertically adjacent semiconductor refrigeration pieces and uniformly distributed from left to right, a liquid conveying pipe is arranged on the right side of each semiconductor refrigeration piece, a backflow pipe is arranged on the left side of each semiconductor refrigeration piece, the radiator is bonded on the uppermost end of the upper surface of each semiconductor refrigeration piece, a heat dissipation cavity is formed in the upper end of the radiator, heat dissipation fans are embedded in the left side and the right side of the inner part of the heat dissipation cavity, a first transmission shaft is arranged in the center of the bottom of each heat dissipation fan, a driving gear is welded at the bottom of the first transmission shaft, and a driving cavity, a liquid inlet cavity and a liquid outlet cavity are formed at the lower end of the inner part of the radiator, the feed liquor chamber is located the place ahead in drive chamber, the inlet has been seted up to the central authorities of feed liquor intracavity portion rear surface, it is located the rear in drive chamber to go out the sap cavity, the liquid outlet has been seted up to the central authorities of the inside front surface in play sap cavity, the left and right sides of drive intracavity portion all rotates and is connected with the infusion gear, the left and right sides the central authorities of infusion gear upper surface all weld the second transmission shaft, the top of second transmission shaft runs through into the inside in heat dissipation chamber and welds driven gear.
Further, control adjacent two the welding has the connecting pipe between the heat conduction strip, the rightmost side the right flank welding of heat conduction strip has the feed liquor pipe, and the leftmost side the left flank welding of heat conduction strip has the drain pipe.
Furthermore, the interior of the heat conducting strip is of a hollow structure, and the connecting pipe, the liquid inlet pipe and the liquid outlet pipe are communicated with the interior of the heat conducting strip.
Furthermore, the right end of the liquid inlet pipe is connected and communicated with the liquid conveying pipe, and the left end of the liquid outlet pipe is connected and communicated with the return pipe.
Furthermore, the heat dissipation cavity is located above the driving cavity, the liquid inlet cavity and the liquid outlet cavity, the liquid inlet is communicated with the front end inside the driving cavity, and the liquid outlet is communicated with the rear end inside the driving cavity.
Furthermore, the upper surfaces of the driving cavity, the liquid inlet cavity and the liquid outlet cavity are all embedded with radiating fins, the upper ends of the radiating fins penetrate through the lower end of the inner part of the radiating cavity, and the radiating fan is positioned right above the radiating fins.
Furthermore, the top of the return pipe penetrates through the front end of the interior of the liquid inlet cavity and is communicated with the front end of the interior of the liquid inlet cavity, and the top of the infusion pipe penetrates through the rear end of the interior of the liquid inlet cavity and is communicated with the rear end of the interior of the liquid outlet cavity.
Furthermore, the top of first transmission shaft meets with the main shaft of heat dissipation fan, driven gear and driving gear are left and right to be leveled.
Furthermore, the infusion gears on the left side and the right side are respectively positioned under the heat dissipation fans on the left side and the right side, the driven gear on the left side is meshed with the driving gear on the left side, and the driven gear on the right side is meshed with the driving gear on the right side.
Compared with the prior art, the utility model discloses the beneficial effect who realizes:
through semiconductor refrigeration piece and heat conduction strip, the cooperation setting of radiator, the coolant liquid is equipped with in the inside of radiator, and simultaneously, the inside coolant liquid that can promote inside of two inside meshing of radiator flows through transfer line and feed liquor pipe, when the coolant liquid flows into the inside of heat conduction strip, can carry out the heat absorption refrigeration to the heat conduction strip, with this heat conduction strip can cool down the heat dissipation to the face that generates heat of semiconductor refrigeration piece, and can rethread back flow reflux entering radiator's inside behind the coolant liquid heat absorption, then radiator and radiator fan can endothermic coolant liquid cool down, make the coolant liquid can recycle and last to cool down the semiconductor refrigeration piece, then through this kind of mode, can effectual improvement semiconductor refrigeration piece's radiating effect, improve semiconductor refrigeration piece's refrigeration effect.
Drawings
Fig. 1 is a schematic view of the overall internal structure of the present invention.
Fig. 2 is a partially enlarged schematic view of a portion a of fig. 1 according to the present invention.
Fig. 3 is a schematic view of the top view internal structure of the heat sink of the present invention.
Fig. 4 is a schematic view of the top view external structure of the heat sink of the present invention.
In FIGS. 1-4: 1-semiconductor refrigerating sheet, 2-radiator, 201-radiating cavity, 202-driving cavity, 203-liquid inlet cavity, 204-liquid inlet, 205-liquid outlet cavity, 206-liquid outlet, 3-heat conducting strip, 4-connecting pipe, 5-liquid inlet pipe, 6-liquid outlet pipe, 7-liquid conveying pipe, 8-return pipe, 9-radiating fan, 901-first transmission shaft, 902-driving gear, 10-liquid conveying gear, 1001-second transmission shaft, 1002-driven gear and 11-radiating fin.
Detailed Description
The following description is provided for illustrative purposes, and other advantages and features of the present invention will become apparent to those skilled in the art from the following detailed description.
Please refer to fig. 1 to 4:
the utility model provides a multistage semiconductor refrigeration plant, including semiconductor refrigeration piece 1 and radiator 2, following each part detailed description to a multistage semiconductor refrigeration plant:
the semiconductor refrigerating sheet 1 is provided with a plurality of semiconductor refrigerating sheets 1, the plurality of semiconductor refrigerating sheets 1 are uniformly distributed from top to bottom, a plurality of heat conducting strips 3 are bonded between two vertically adjacent semiconductor refrigerating sheets 1, the plurality of heat conducting strips 3 are uniformly distributed from left to right, a liquid conveying pipe 7 is arranged on the right side of the semiconductor refrigerating sheet 1, a return pipe 8 is arranged on the left side of the semiconductor refrigerating sheet 1, a radiator 2 is bonded on the upper surface of the uppermost semiconductor refrigerating sheet 1, a heat dissipation cavity 201 is formed in the upper end of the radiator 2, heat dissipation fans 9 are embedded on the left side and the right side of the interior of the heat dissipation cavity 201, a first transmission shaft 901 is arranged at the midpoint of the bottom of the heat dissipation fans 9, a driving gear 902 is welded at the bottom of the first transmission shaft 901, a driving cavity 202, a liquid inlet cavity 203 and a liquid outlet cavity 205 are formed at the lower end of the interior of the radiator 2, the liquid inlet cavity 203 is positioned in front of the driving cavity 202, and a liquid inlet 204 is formed in the center of the rear surface of the interior of the liquid inlet cavity 203, the liquid outlet cavity 205 is positioned behind the driving cavity 202, a liquid outlet 206 is formed in the center of the front surface inside the liquid outlet cavity 205, the infusion gears 10 are rotatably connected to the left side and the right side inside the driving cavity 202, second transmission shafts 1001 are welded to the centers of the upper surfaces of the infusion gears 10 on the left side and the right side, and the tops of the second transmission shafts 1001 penetrate through the inside of the heat dissipation cavity 201 and are welded with driven gears 1002;
specifically, a connecting pipe 4 is welded between two adjacent left and right heat conducting strips 3, a liquid inlet pipe 5 is welded on the right side surface of the rightmost heat conducting strip 3, a liquid outlet pipe 6 is welded on the left side surface of the leftmost heat conducting strip 3, the interior of the heat conducting strip 3 is of a hollow structure, the connecting pipe 4, the liquid inlet pipe 5 and the liquid outlet pipe 6 are communicated with the interior of the heat conducting strip 3, the right end of the liquid inlet pipe 5 is connected and communicated with a liquid conveying pipe 7, the left end of the liquid outlet pipe 6 is connected and communicated with a return pipe 8, a heat dissipation cavity 201 is positioned above a driving cavity 202, a liquid inlet cavity 203 and a liquid outlet cavity 205, a liquid inlet 204 is communicated with the front end of the interior of the driving cavity 202, a liquid outlet 206 is communicated with the rear end of the interior of the driving cavity 202, the upper surfaces of the liquid inlet cavity 203 and the liquid outlet cavity 205 are respectively embedded with heat dissipation fins 11, the upper ends of the heat dissipation fins 11 penetrate through the lower end of the interior of the heat dissipation cavity 201, and a heat dissipation fan 9 is positioned right above the heat dissipation fins 11, the top of the return pipe 8 penetrates through the front end inside the liquid inlet cavity 203 and is communicated with the front end inside the liquid inlet cavity 203, the top of the liquid conveying pipe 7 penetrates through the rear end inside the liquid inlet cavity 205 and is communicated with the rear end inside the liquid outlet cavity 205, the top of the first transmission shaft 901 is connected with a main shaft of the heat dissipation fan 9, the driven gear 1002 is flush with the driving gear 902 in the left-right direction, the driven gear 1002 is meshed with the driving gear 902, the liquid conveying gears 10 in the left side and the right side are respectively located under the heat dissipation fan 9 in the left-right direction, the driven gear 1002 in the left side is meshed with the driving gear 902 in the left side, and the driven gear 1002 in the right side is meshed with the driving gear 902 in the right side.
According to the above, the directions of the two heat dissipation fans 9 are opposite, the driving cavity 202, the liquid inlet cavity 203 and the liquid outlet cavity 205 inside the heat radiator 2 are filled with cooling liquid, the lower surface of the semiconductor chilling plate 1 is a chilling surface, the upper surface of the semiconductor chilling plate is a heating surface, the heat radiator 2 and the heat conduction strip 3 are made of metal copper, the heat conduction strip 3 is bonded between the two semiconductor chilling plates 1 adjacent to each other, so that the two semiconductor chilling plates 1 can be connected, meanwhile, the heat conduction strip 3 can absorb heat emitted from the heating surface of the semiconductor chilling plate 1 below, meanwhile, the heat conduction strip 3 can transfer low temperature generated by the semiconductor chilling plate 1 above to the semiconductor chilling plate 1 below, and thus, the heat conduction strip 3 and the semiconductor chilling plate 1 below can be cooled, and then, through the structure that the semiconductor chilling plates 1 below are stacked layer by layer, the semiconductor chilling plate 1 below can be always in a low-temperature chilling state, the upper surface of the semiconductor refrigeration piece 1 at the top can emit a large amount of heat, the radiator 2 is arranged on the upper surface of the semiconductor refrigeration piece 1 at the top, so that the heat emitted by the semiconductor refrigeration piece 1 at the top can be absorbed, the driving cavity 202, the liquid inlet cavity 203 and the liquid outlet cavity 205 in the radiator 2 are filled with cooling liquid to cool the radiator 2, meanwhile, the two cooling fans 9 in the radiator 2 can cool the radiator 2, and the two cooling fans 9 are turned differently, so that the two cooling fans 9 are matched, the cooling cavity 201 in the radiator 2 can form air convection, and the heat emission is accelerated;
when the two heat dissipation fans 9 rotate, the main shaft of the heat dissipation fan 9 drives the first transmission shaft 901 to rotate, the first transmission shaft 901 drives the second transmission shaft 1001 to rotate by meshing with the driven gear 1002 and the driving gear 902, so that the rotating second transmission shaft 1001 can drive the infusion gear 10 inside the driving cavity 202 to rotate, and since the two heat dissipation fans 9 are in different rotation directions, the two infusion gears 10 inside the driving cavity 202 also rotate oppositely and are meshed, so that the two meshed infusion gears 10 can draw the cooling liquid in the liquid inlet cavity 203 and discharge the cooling liquid into the liquid outlet cavity 205 by using pressure difference, and along with the increase of the hydraulic pressure of the liquid outlet cavity 205, the cooling liquid can be discharged into the heat conduction strip 3 through the infusion tube 7 and the liquid inlet tube 5, so that the cooling liquid inside the heat conduction strip 3 can absorb heat and cool the heat conduction strip 3, thereby the cooling effect of the semiconductor refrigeration sheet 1 can be well improved, the cooling liquid after absorbing heat will be discharged into the return pipe 8 through the drain pipe 6 afterwards, the return pipe 8 discharges the cooling liquid after absorbing heat into the inside of the liquid inlet cavity 203 again to this recycles the cooling liquid, and sets up heat radiation fins 11 at the upper surface of heat dissipation cavity 201, drive cavity 202 and liquid inlet cavity 203, can accelerate the inside thermal dissipation of cooling liquid, improves the cooling effect of cooling liquid.
Claims (9)
1. The utility model provides a multistage semiconductor refrigeration plant, includes semiconductor refrigeration piece (1) and radiator (2), its characterized in that:
the semiconductor refrigeration piece (1) is provided with a plurality of pieces, the plurality of pieces of semiconductor refrigeration pieces (1) are uniformly distributed from top to bottom, a plurality of heat conduction strips (3) are bonded between two vertically adjacent semiconductor refrigeration pieces (1), the plurality of heat conduction strips (3) are uniformly distributed from left to right, a liquid conveying pipe (7) is arranged on the right side of the semiconductor refrigeration piece (1), and a return pipe (8) is arranged on the left side of the semiconductor refrigeration piece (1);
the radiator (2) is bonded on the uppermost end of the upper surface of the semiconductor refrigeration sheet (1), a heat dissipation cavity (201) is formed in the upper end of the radiator (2), the left side and the right side of the interior of the heat dissipation cavity (201) are both embedded with a heat dissipation fan (9), a first transmission shaft (901) is arranged at the center of the bottom of the heat dissipation fan (9), a driving gear (902) is welded at the bottom of the first transmission shaft (901), a driving cavity (202), a liquid inlet cavity (203) and a liquid outlet cavity (205) are formed in the lower end of the interior of the radiator (2), the liquid inlet cavity (203) is located in front of the driving cavity (202), a liquid inlet (204) is formed in the center of the rear surface of the interior of the liquid inlet cavity (203), the liquid outlet cavity (205) is located behind the driving cavity (202), and a liquid outlet (206) is formed in the center of the front surface of the interior of the liquid outlet cavity (205), the left side and the right side of the interior of the driving cavity (202) are rotatably connected with infusion gears (10), the left side and the right side of the upper surface of each infusion gear (10) are welded with second transmission shafts (1001), and the tops of the second transmission shafts (1001) penetrate through the interior of the heat dissipation cavity (201) and are welded with driven gears (1002).
2. The multi-stage semiconductor refrigeration unit of claim 1, wherein: control adjacent two the welding has connecting pipe (4) between heat conduction strip (3), the rightmost side the right flank welding of heat conduction strip (3) has feed liquor pipe (5), the leftmost side the left flank welding of heat conduction strip (3) has drain pipe (6).
3. The multi-stage semiconductor refrigeration unit of claim 2, wherein: the interior of the heat conducting strip (3) is of a hollow structure, and the connecting pipe (4), the liquid inlet pipe (5) and the liquid outlet pipe (6) are communicated with the interior of the heat conducting strip (3).
4. The multi-stage semiconductor refrigeration unit of claim 2, wherein: the right end of the liquid inlet pipe (5) is connected and communicated with a liquid conveying pipe (7), and the left end of the liquid outlet pipe (6) is connected and communicated with a return pipe (8).
5. The multi-stage semiconductor refrigeration unit of claim 1, wherein: the heat dissipation cavity (201) is located above the driving cavity (202), the liquid inlet cavity (203) and the liquid outlet cavity (205), the liquid inlet (204) is communicated with the front end inside the driving cavity (202), and the liquid outlet (206) is communicated with the rear end inside the driving cavity (202).
6. The multi-stage semiconductor refrigeration unit of claim 5, wherein: the upper surfaces of the driving cavity (202), the liquid inlet cavity (203) and the liquid outlet cavity (205) are all embedded with heat dissipation fins (11), the upper ends of the heat dissipation fins (11) penetrate through the lower ends of the interior of the heat dissipation cavity (201), and the heat dissipation fan (9) is located right above the heat dissipation fins (11).
7. The multi-stage semiconductor refrigeration unit of claim 1, wherein: the top of the return pipe (8) penetrates through the front end inside the liquid inlet cavity (203) and is communicated with the front end inside the liquid inlet cavity, and the top of the infusion pipe (7) penetrates through the rear end inside the liquid inlet cavity and the rear end inside the liquid outlet cavity (205) and is communicated with the rear end.
8. The multi-stage semiconductor refrigeration unit of claim 1, wherein: the top of the first transmission shaft (901) is connected with a main shaft of the heat dissipation fan (9), and the driven gear (1002) is flush with the driving gear (902) from left to right.
9. The multi-stage semiconductor refrigeration unit of claim 8, wherein: the infusion gears (10) on the left side and the right side are respectively located right below the heat dissipation fans (9) on the left side and the right side, the driven gear (1002) on the left side is meshed with the driving gear (902) on the left side, and the driven gear (1002) on the right side is meshed with the driving gear (902) on the right side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022803495.5U CN214665487U (en) | 2020-11-28 | 2020-11-28 | Multistage semiconductor refrigeration equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022803495.5U CN214665487U (en) | 2020-11-28 | 2020-11-28 | Multistage semiconductor refrigeration equipment |
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| Publication Number | Publication Date |
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| CN214665487U true CN214665487U (en) | 2021-11-09 |
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| CN202022803495.5U Active CN214665487U (en) | 2020-11-28 | 2020-11-28 | Multistage semiconductor refrigeration equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114812005A (en) * | 2022-06-28 | 2022-07-29 | 合肥中科国腾生物科技有限公司 | Active rapid heat dissipation method and device of thermal cycler based on thermoelectric refrigeration piece |
-
2020
- 2020-11-28 CN CN202022803495.5U patent/CN214665487U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114812005A (en) * | 2022-06-28 | 2022-07-29 | 合肥中科国腾生物科技有限公司 | Active rapid heat dissipation method and device of thermal cycler based on thermoelectric refrigeration piece |
| CN114812005B (en) * | 2022-06-28 | 2022-10-11 | 合肥中科国腾生物科技有限公司 | Active rapid heat dissipation method and device of thermal cycler based on thermoelectric refrigeration piece |
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