CN214647952U - Imaging device and movable vehicle - Google Patents

Abstract

The utility model provides an imaging device and a movable vehicle, wherein the movable vehicle is provided with a light transmission component, the imaging device is arranged in the movable vehicle, and the imaging device comprises an imaging module, a surrounding structure and a heat radiation structure; the imaging module can face the preset area of the light-transmitting component and is used for sensing the ambient light passing through the light-transmitting component so as to acquire the environmental information of the environment where the movable vehicle is located; the surrounding structure is arranged between the imaging module and the light-transmitting component and comprises a bottom wall and other walls connected with the bottom wall, the bottom wall and the other walls surround a preset area of the light-transmitting component, and the surrounding structure is used for reducing stray light in the movable vehicle from being emitted into the imaging module; the heat radiation structure, on diapire and other walls were located to the heat radiation structure for surface formation heat radiation source at the surrounding structure heats the region of predetermineeing, thereby carries out defogging or deicing to the printing opacity subassembly of portable vehicle, guarantees that the imaging module normally works.

Description

Imaging device and movable vehicle

Technical Field

The utility model relates to a movable platform technical field especially relates to an imaging device and movable vehicle.

Background

Along with social development, traffic is more convenient, traffic modes are more diverse and popular, and development of vehicles makes substantial progress. Meanwhile, the performance and experience requirements of the vehicle are obviously improved, the image acquisition equipment is gradually popularized on the vehicle, and more functions and application scenes are provided. However, the existing vehicles often have problems of fogging, icing, etc. on the glass, which may affect the normal operation of the image capturing device.

SUMMERY OF THE UTILITY MODEL

The utility model provides an imaging device and portable vehicle aims at realizing carrying out defogging or deicing to the printing opacity subassembly of portable vehicle, guarantees that the imaging module normally works.

The utility model provides an image device for portable vehicle, portable vehicle is equipped with printing opacity subassembly, image device set up in inside the portable vehicle, image device includes:

the imaging module can face to a preset area of the light transmission component and is used for sensing ambient light passing through the light transmission component so as to acquire environmental information of the environment where the movable vehicle is located;

the surrounding structure is arranged between the imaging module and the light-transmitting component and comprises a bottom wall and other walls connected with the bottom wall, the bottom wall and the other walls surround the preset area of the light-transmitting component, and the surrounding structure is used for reducing stray light in the movable vehicle from entering the imaging module;

and the heat radiation structure is arranged on the bottom wall and other walls and used for forming a heat radiation source on the surface of the surrounding structure so as to heat the preset area.

In the imaging device of the present invention, the other walls include a side wall connected to the bottom wall, and a part of the heat radiation structure is provided on the bottom wall, and another part is provided on the side wall; and/or the presence of a gas in the gas,

the other walls further include a side wall connected to the bottom wall, and a top wall connected to the side wall and opposite to the bottom wall, and the heat radiation structure is further provided on the top wall.

In the imaging device of the present invention, the unit heat radiation powers of different unit sections of the heat radiation structure are substantially the same; and/or the presence of a gas in the gas,

the unit heat radiation power of different unit sections of the heat radiation structure is different; and/or the presence of a gas in the gas,

under the action of the heat radiation structure, the preset area of the light-transmitting component can receive substantially uniform heat radiation power per unit area.

In the imaging device of the present invention, the conductor density and the conductor thickness of different unit sections of the heat radiation structure are substantially the same.

In the imaging device of the present invention, the heat radiation structure is at least partially embedded in the bottom wall and/or the other walls; and/or the presence of a gas in the gas,

the bottom wall is substantially trapezoidal in shape.

In the imaging device of the present invention, the heat radiation structure includes:

at least one heating unit, each heating unit is wholly or partially embedded in the bottom wall and/or other walls.

In the imaging device of the present invention, the heating unit includes a resistance wire.

In the imaging device of the present invention, the other walls include a first side wall and a second side wall connected to the bottom wall, and the first side wall and the second side wall extend from the first end of the surrounding structure to the second end of the surrounding structure in such a manner that the distance between the first side wall and the second side wall is gradually reduced.

The utility model discloses an among the image device, thermal radiation structure is fixed in through at least one of laser engraving, chemical plating, electroplating, spraying plating, physical vapor deposition, in-mold decoration forming means, inserts forming means surround structurally.

In the imaging device of the present invention, the heat radiation structure is electrically connected to the imaging module through a conductive connector, and the conductive connector is at least partially disposed in the surrounding structure; and/or the presence of a gas in the gas,

the distance between the light-transmitting component and the bottom wall extends in a gradually increasing manner from the first end towards the second end of the enclosing structure.

The utility model discloses an among the imaging device, the formation of image module includes first imaging element and second imaging element, the surrounding structure includes:

a first enclosure for reducing stray light from inside the movable vehicle from entering the first imaging unit;

and the second enclosing part is connected with the first enclosing part and is used for reducing stray light in the interior of the movable vehicle from entering the second imaging unit.

The utility model discloses an among the imaging device, heat radiation structure as an organic whole, heat radiation structure includes:

an extension extending over the bottom wall and the other walls;

and the first electric connection part and the second electric connection part are respectively connected to two ends of the extension part.

In the imaging device of the present invention, the heat radiation structure includes:

and the resistance wires are arranged from the first end to the second end of the surrounding structure and can be provided with currents of different sizes, so that the preset area of the light-transmitting component can receive basically uniform heat radiation power per unit area.

The utility model also provides a movable vehicle, include:

a platform body;

the imaging device of any one of the above claims, disposed inside the platform body, is configured to obtain environmental information of an environment in which the movable vehicle is located.

The utility model provides an imaging device and portable vehicle can carry out defogging or deicing to the printing opacity subassembly of portable vehicle, guarantees that the imaging module normally works.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure of embodiments of the invention.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without any creative effort.

Fig. 1 is a schematic structural diagram of a movable platform according to an embodiment of the present invention;

fig. 2 is a schematic partial structural diagram of a movable platform according to an embodiment of the present invention;

fig. 3 is a schematic view of a part of the structure of an image forming apparatus according to an embodiment of the present invention, in which a surrounding structure and a heat radiation structure are shown;

fig. 4 is a schematic partial structural diagram of a movable platform according to an embodiment of the present invention;

fig. 5 is a schematic partial structural diagram of a movable platform according to an embodiment of the present invention;

fig. 6 is a schematic partial structural diagram of a movable platform according to an embodiment of the present invention;

fig. 7 is a schematic partial structural diagram of a movable platform according to an embodiment of the present invention;

fig. 8 is a schematic partial structural diagram of a movable platform according to an embodiment of the present invention;

FIG. 9 is an enlarged partial schematic view of FIG. 4 at A;

fig. 10 is a schematic partial structural view of a movable platform according to an embodiment of the present invention;

fig. 11 is a schematic structural diagram of a fixing member according to an embodiment of the present invention.

Description of reference numerals:

1000. a movable platform;

100. an imaging device;

10. an imaging module; 11. a first imaging unit; 12. a second imaging unit; 13. a carrier; 14. an imaging assembly;

20. an enclosing structure; 201. a first end; 202. a second end; 203. enclosing a space; 21. a bottom wall; 22. other walls; 221. a side wall; 2211. a first side wall; 2212. a second side wall; 222. a top wall; 23. a first enclosure; 24. a second enclosure;

30. a heat radiation structure; 31. a heat radiation film; 321. a first heat radiation member; 322. a second heat radiation member; 33. an extension portion; 331. a first extending sub-portion; 3311. a first extension section; 3312. a second extension section; 332. a second extending sub-portion; 333. an extension connection portion; 34. a first electrical connection portion; 35. a second electrical connection portion;

40. a conductive connector; 50. a fixing member; 51. a first side; 511. a first region; 512. a second region;

200. a platform body; 2001. a light transmissive component; 2002. a preset area.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, of the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be further understood that the term "and/or" as used in the specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.

Some embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

Referring to fig. 1, an embodiment of the present invention provides a structural schematic diagram of a movable platform 1000. As shown in fig. 1, the movable platform 1000 includes: at least one of a movable vehicle, a movable vessel, a movable robot, an aircraft, and the like.

For example, the movable platform 1000 may be a movable vehicle, which may be a vehicle with or without an autopilot system.

The following explanation will be given by taking the movable platform 1000 as a movable vehicle.

Referring to fig. 1 and 2, the movable stage 1000 includes an imaging device 100 and a stage body 200. The platform body 200 includes a light transmissive component 2001. The imaging device 100 is disposed inside the movable platform 1000. Specifically, the imaging device 100 is disposed in the platform main body 200, and is configured to acquire environmental information of an environment in which the movable platform 1000 is located.

For example, the environment information of the environment in which the movable platform 1000 is located may include information of a parking space, information of an obstacle, position information of a vehicle, and the like.

Illustratively, the environment information includes environment image information or environment video information, and the like.

In some embodiments, the platform body 200 may also present environmental information in real time, and the driver may drive according to the environmental information. In other embodiments, the platform main body 200 may also be automatically driven according to the environmental information.

Referring to fig. 2, a light transmission assembly 2001 includes glass or is made of non-glass material to form a light transmission structure, such as a windshield or a window glass.

In some embodiments, the platform body 200 may further include at least one of a headliner, an instrument desk, an a-pillar, a B-pillar, a C-pillar, a D-pillar, and the like.

It is understood that, under certain ambient temperature and air humidity, when the temperature of the inner surface of the light-transmitting component 2001 is lower than the dew-point temperature of the air in the movable platform 1000, a phenomenon of fogging or icing may occur on the inner surface of the light-transmitting component 2001, and when the phenomenon of fogging or icing occurs on the light-transmitting component 2001, the imaging device 100 may be easily affected adversely, so that it is difficult to accurately obtain the environmental information of the environment where the movable platform 1000 is located. Therefore, it is necessary to prevent fog or ice from being generated on the light-transmitting member 2001, and the fog or ice should be removed as soon as possible when the fog or ice is generated, so as to ensure that the imaging device 100 can work normally. When the temperature of the surface of the light-transmitting component 2001 is not lower than the dew point temperature of the air in the movable platform 1000, the phenomenon of fogging or icing on the light-transmitting component 2001 can be avoided. Therefore, in order to defog or de-ice the light transmissive member 2001, the light transmissive member 2001 needs to be heated.

Referring to fig. 2 and 3, in some embodiments, the imaging device 100 includes an imaging module 10, a surrounding structure 20, and a heat radiation structure 30. The imaging module 10 can face the predetermined region 2002 of the light transmission member 2001. The imaging module 10 is used for sensing the ambient light passing through the light-transmitting assembly 2001 to obtain the environmental information of the environment where the movable platform 1000 is located. The surrounding structure 20 is disposed between the imaging module 10 and the light-transmitting assembly 2001. The surrounding structure 20 encloses a predetermined area 2002 of the light transmissive component 2001. The surrounding structure 20 is used to reduce the stray light inside the movable platform 1000 from entering the imaging module 10. The heat radiation structure 30 is provided on the surrounding structure 20 to form a heat radiation source on the surface of the surrounding structure 20 to heat the predetermined area 2002.

In the imaging apparatus 100 of the above embodiment, the heat radiation structure 30 forms the heat radiation source on the surface of the surrounding structure 20, so as to heat the preset region 2002 of the light-transmitting component 2001, adjust the temperature of the preset region 2002, and prevent the preset region 2002 from being fogged or frozen, thereby ensuring the normal use of the imaging module 10, saving energy, and reducing cost.

Illustratively, the predetermined area 2002 of the light transmissive member 2001 is capable of receiving substantially uniform thermal radiation power per unit area under the action of the heat radiation structure 30, thus having less adverse effect on the light transmissive member 2001 or other components of the platform body 200 and enabling better defogging or deicing effects.

Referring to fig. 2 and 3, the enclosing structure 20 includes a bottom wall 21 and other walls 22 connected to the bottom wall 21. The bottom wall 21 and the other walls 22 enclose a predetermined area 2002 of the light transmissive member 2001. The heat radiation structure 30 is provided on the bottom wall 21 and the other walls 22.

The heat radiation structure 30 is disposed not only on the bottom wall 21 but also on the other wall 22 connected to the bottom wall 21. The heat radiation structure 30 on the bottom wall 21 and the heat radiation structure 30 on the other wall 22 can form heat radiation sources at different surfaces of the enclosure structure 20. The thermal radiation source that the thermal radiation structure 30 that is located on the diapire 21 formed on the surface of diapire 21, and, the thermal radiation source that the thermal radiation structure 30 that is located on other walls 22 formed on the surface of other walls 22, thereby can be towards the different regional transmission of predetermineeing region 2002, and then heat predetermineeing the different regional heating of region 2002, realize all-round multi-angle ground heating, it is more even to make predetermineeing region 2002 be heated, it is more nimble to use, prevent that the corner of predetermineeing region 2002 can't be heated and hazed or freeze, or prevent that the different regions of predetermineeing region 2002 can't be heated and hazed or freeze uniformly, the harmful effects to other parts of printing opacity subassembly 2001 or platform main body 200 are little, and can make the effect of defogging or deicing better, and then provide reliable guarantee for the normal use of imaging module 10.

It will be appreciated that by arranging the heat radiating structure 30 on the bottom wall 21 and the other walls 22, it is possible to receive a substantially uniform unit area of heat radiation power throughout the predetermined area 2002 as much as possible. Even if the shortest distances from the light transmission member 2001 are different from each other at two points on the heat radiation structure 30, or even if the distances between the bottom wall 21 and the light transmission member 2001 are not equidistant, since the heat radiation structure 30 on the bottom wall 21 and the heat radiation structure 30 on the other wall 22 can simultaneously generate heat, the thermal radiation power per unit area received by each area of the predetermined area 2002 can be approximated or substantially equal, thereby enabling the predetermined area 2002 to be uniformly heated.

Illustratively, the imaging module 10 may include a camera capable of sensing visible and/or infrared light.

The specific geometric structure or geometric arrangement relationship of the heat radiation structure 30 with respect to the light transmission member 2001 or the predetermined region 2002 can be designed according to actual requirements. Referring to fig. 2 and 3, at least two points on the bottom wall 21 are spaced from the light-transmitting member 2001 at different distances, or the bottom wall 21 and the light-transmitting member 2001 are spaced at different distances. In some embodiments, the distance between the light transmissive member 2001 and the bottom wall 21 extends in a gradually increasing manner from the first end 201 towards the second end 202 of the enclosing structure 20.

Illustratively, the shortest distances of two points on the heat radiating structure 30 from the preset region 2002 are different from each other. At this time, it is possible to form the heat radiation structure 30 on the bottom wall 21 and the other walls 22; and/or, by designing a specific arrangement and/or thickness of the heat radiation structure 30, uniform heating of the predetermined region 2002 is achieved.

Referring to fig. 3, it can be understood that the other walls 22 of the surrounding structure 20 and the bottom wall 21 cooperate to form a surrounding space 203 (see fig. 6) for limiting the field of view of the imaging module 10.

Referring to fig. 3 and 5, in some embodiments, the other wall 22 includes a side wall 221 connected to the bottom wall 21. A part of the heat radiation structure 30 is provided on the bottom wall 21 of the envelope structure 20. Another portion of the heat radiation structure 30 is provided on the sidewall 221 of the surrounding structure 20. The heat radiation structure 30 located on the bottom wall 21 and the heat radiation structure 30 located on the side wall 221 can form a heat radiation source from different positions or directions of the enclosure structure 20. The thermal radiation source that thermal radiation structure 30 that is located on diapire 21 formed on the surface of diapire 21 to and, the thermal radiation source that thermal radiation structure 30 that is located on lateral wall 221 formed on the surface of lateral wall 221, thereby can be towards the different regional transmission of predetermineeing regional 2002, and then to predetermineeing regional 2002's different regional heating, realize all-round multi-angle ground heating, it is more even to make predetermineeing regional 2002 be heated, and the application is more nimble.

Referring to fig. 3, the bottom wall 21 may be designed according to actual requirements. For example, the bottom wall 21 is substantially trapezoidal in shape, i.e., the bottom wall 21 is trapezoidal or approximately trapezoidal.

Illustratively, a portion of the bottom wall 21 close to the first end 201 of the surrounding structure 20 extends along the predetermined direction with a larger dimension than a portion of the bottom wall 21 far from the first end 201 of the surrounding structure 20 extends along the predetermined direction.

Illustratively, the extension in the preset direction refers to an extension of the component in the preset direction.

Illustratively, the preset direction is the X direction in fig. 3.

Illustratively, the predetermined direction is parallel to or coincides with the arrangement direction between the first and second side walls 2211 and 2212 of the enclosing structure 20.

Referring to fig. 3, the other walls 22 of the enclosure 20 illustratively include a first side wall 2211 and a second side wall 2212. The first and second side walls 2211 and 2212 are both connected to the bottom wall 21.

The bottom wall and the side wall can be integrally formed and connected. The bottom wall and the side wall can also be arranged in a split mode, and the bottom wall and the side wall are fixedly connected in a gluing mode and the like.

Referring to fig. 3, the included angle between the bottom wall 21 and the side wall 221 may be an acute angle, a right angle, or an obtuse angle. Illustratively, the included angle between the bottom wall 21 and the first side wall 2211 may be an acute angle, a right angle, or an obtuse angle. The angle between the bottom wall 21 and the second side wall 2212 can be acute, right, or obtuse.

Referring to fig. 3, the first and second side walls 2211 and 2212 are illustratively disposed opposite to each other.

Illustratively, the included angle between the first and second side walls 2211 and 2212 may be 0 degrees, an acute angle, a right angle, or an obtuse angle. For example, the first side wall 2211 is parallel to the second side wall 2212. For another example, the included angle between the first side wall 2211 and the second side wall 2212 is an acute angle, so as to limit the visible range of the imaging module 10.

Referring to fig. 3, for example, a minimum distance between the first end 201 of the first side wall 2211 close to the surrounding structure 20 and the first end 201 of the second side wall 2212 close to the surrounding structure 20 is greater than a minimum distance between the first end 201 of the first side wall 2211 far from the surrounding structure 20 and the first end 201 of the second side wall 2212 far from the surrounding structure 20, so as to limit the visible range of the imaging module 10.

Referring to fig. 3, for example, the first side wall 2211 and the second side wall 2212 extend from the first end 201 of the surrounding structure 20 to the second end 202 of the surrounding structure 20 in a manner that the distance between the first side wall 2211 and the second side wall 2212 gradually decreases, so as to effectively limit the visible range of the imaging module 10.

Referring to fig. 3 and 5, in some embodiments, the other wall 22 further includes a top wall 222 connected to the side wall 221 and opposite the bottom wall 21. The heat radiation structure 30 is also provided on the top wall 222. The heat radiation structure 30 located on the bottom wall 21, the heat radiation structure 30 located on the side wall 221, and the heat radiation structure 30 located on the top wall 222 can generate heat radiation from different positions or directions.

The thermal radiation source that the surface of the thermal radiation structure 30 that is located the diapire 21 formed at the diapire 21, the thermal radiation source that the surface of the thermal radiation structure 30 that is located the lateral wall 221 formed at the surface of lateral wall 221, and the thermal radiation source that the surface of the thermal radiation structure 30 that is located the roof 222 formed at the surface of roof 222, thereby can face the different regional emission of predetermineeing region 2002, and then to predetermineeing different regional heating of region 2002, realize all-round multi-angle heating, make predetermineeing region 2002 and be heated more evenly, the application is more nimble.

It is to be understood that, in the imaging apparatus 100 of the above embodiment, even if the shortest distances between two points on the heat radiation structure 30 and the light transmitting component 2001 are different from each other, or even if the distances between the bottom wall 21 and the light transmitting component 2001 are not equidistant, since the heat radiation structure 30 on the bottom wall 21, the heat radiation structure 30 on the side wall 221, and the heat radiation structure 30 on the top wall 222 can simultaneously generate heat, the preset region 2002 can be heated in all directions and at multiple angles, and the unit area heat radiation powers received by the regions of the preset region 2002 can be approximately equal or substantially equal, so that the preset region 2002 can be uniformly heated.

In other embodiments, the heat radiation structure 30 may be provided on only one of the bottom wall 21 and the other wall 22. For example, the heat radiation structure 30 includes the heat radiation film 31 (see fig. 7), and the heat radiation film 31 may be provided only on the bottom wall 21 so that the heat radiation structure 30 is disposed on the surrounding structure 20. Of course, the heat radiation film 31 may be disposed on both the bottom wall 21 and the other wall 22, which is not limited herein.

Illustratively, the plane of the top wall 221 may be parallel to or intersect the plane of the bottom wall 21, and is not limited herein. The top wall 221 and/or the bottom wall 21 may be flat or curved, etc.

Illustratively, the first side wall 2211, the bottom wall 21, the second side wall 2212 and the top wall 222 of the enclosing structure 20 are connected end to end and form an enclosed space 203 (see fig. 6).

Referring to fig. 2 to 4, in some embodiments, the imaging module 10 includes a first imaging unit 11. The enclosure structure 20 comprises a first enclosure 23. The first enclosing member 23 is disposed between the first imaging unit 11 and the light-transmitting component 2001, and is used for reducing the incidence of stray light inside the movable platform 1000 into the first imaging unit 11.

In some embodiments, the imaging module 10 is a binocular imaging module 10, such as including a binocular camera.

In other embodiments, the imaging module 10 is a monocular imaging module 10, such as comprising a monocular camera.

Referring to fig. 2 to 4, in some embodiments, the imaging module 10 further includes a second imaging unit 12. The enclosure 20 includes a second enclosure 24. The second enclosure 24 is connected to the first enclosure 23. The second enclosing member 24 is disposed between the second imaging unit 12 and the light transmitting assembly 2001, and is used for reducing stray light inside the movable platform 1000 from entering the second imaging unit 12.

Referring to fig. 3, the first enclosure 23 is illustratively juxtaposed with the second enclosure 24.

Referring to fig. 3 and 4, the first enclosing member 23 and the second enclosing member 24 are exemplarily arranged along the arrangement direction of the first imaging unit 11 and the second imaging unit 12.

Referring to fig. 3 and 4, for example, the first enclosing member 23 and the second enclosing member 24 are symmetrically arranged, so that the structure is simple and the processing is convenient.

Referring to fig. 4, in some embodiments, at least one heat radiating structure 30 is provided on each enclosure. Specifically, at least one heat radiation structure 30 is provided on each of the first enclosure 23 and the second enclosure 24.

In other embodiments, a part of the same heat radiation structure 30 is provided on the first enclosure 23, and another part of the same heat radiation structure 30 is provided on the second enclosure 24.

For example, the number of enclosures may be designed according to actual requirements, such as one, two, three or more. For example, the number of enclosures is adapted to the number of imaging units.

Referring to fig. 3 and 4, in some embodiments, the heat radiating structure 30 and/or the surrounding structure 20 are symmetrically disposed about a predetermined plane, which is perpendicular to the bottom wall 21 and intersects the first end 201 and the second end 202 of the surrounding structure 20.

Illustratively, the predetermined plane is the ω -plane in fig. 3.

Referring to fig. 3 and 4, the first and second enclosing members 23 and 24 are exemplarily and symmetrically disposed about the predetermined plane.

Referring to fig. 3 and 4, the heat radiation structure 30 of the first enclosure 23 and the heat radiation structure 30 of the second enclosure 24 are exemplarily and symmetrically disposed about the predetermined plane.

In some embodiments, the unit heat radiation power of different unit sections of the heat radiation structure 30 is substantially the same, so that the design and manufacture of the heat radiation structure 30 are simple, the reliability of the heat radiation structure 30 is high, the practicability is strong, and the cost is further reduced.

It is to be understood that the unit section may be a unit area section or a unit length section, and is not limited herein.

Referring to fig. 3 and 5, for example, since the heat radiation structure 30 is disposed on the bottom wall 21 and the other walls 22 of the surrounding structure 20, the heat radiation power can be controlled according to the radiation position and/or the radiation direction of the heat radiation structure 30 and can be adapted to the heat requirement of the predetermined area 2002.

In some embodiments, the conductor density and the conductor thickness of different unit sections of the heat radiation structure 30 are substantially the same, the requirements on the arrangement and the conductor thickness of the heat radiation structure 30 are low, and the design and the manufacture are simple. Illustratively, the unit heat radiation powers of the different unit sections of the heat radiation structure 30 are substantially the same, which is achieved based on the conductor densities and the conductor thicknesses of the different unit sections of the heat radiation structure 30 being substantially the same.

In some embodiments, the unit heat radiation power of different unit sections of the heat radiation structure 30 is different. That is, the unit heat radiation power of the heat radiating structure 30 has regional differences. The thermal radiation power can be controlled according to the emission location and/or the emission direction and can be adapted to the thermal requirements of the predefined area 2002.

Exemplarily, the heat radiating structure 30 may include a plurality of unit sections. The unit heat radiation powers of at least two of the plurality of unit sections are different.

In some embodiments, the conductor density and/or conductor thickness of different unit sections of the heat radiation structure 30 are different. The unit heat radiation power of the heat radiation structure 30 has a regional difference, which is achieved based on the difference in conductor density and/or conductor thickness of different unit sections of the heat radiation structure 30.

For example, the heat radiation structure 30 has different conductor densities in two different unit sections, so that the amount of heat generated is proportional to the conductor density in the case of power supply uniformity. As another example, the conductor thickness may also be different at different locations. Of course, it is also possible to generate heat of different degrees by supplying power regionally to the heat radiating structure 30 so that different regions of the heat radiating structure 30 reach different temperatures.

Referring to fig. 3 and 4, in some embodiments, the heat radiating structure 30 is at least partially embedded in the bottom wall 21 and/or other walls 22 of the enclosure 20. Thus, the entire occupied space of the heat radiation structure 30 and the surrounding structure 20 can be reduced, which is advantageous for the miniaturization design.

It will be appreciated that the heat radiating structure 30 is at least partially embedded within the bottom wall 21 and/or other walls 22 of the enclosure 20, including: a) the heat radiation structure 30 is at least partially embedded in the bottom wall 21 of the surrounding structure 20; b) the heat radiating structure 30 is at least partially embedded in the other wall 22 of the surrounding structure 20; c) one part of the heat radiation structure 30 is embedded in the bottom wall 21 of the surrounding structure 20, and the other part of the heat radiation structure 30 is embedded in the other wall 22 of the surrounding structure 20.

Exemplarily, the heat generating unit includes a resistance wire.

Illustratively, the heat generating unit is embedded in the bottom wall and/or other walls in at least one of a dot shape, a linear shape, a planar shape, and the like. For example, the heat generating element is embedded in the bottom wall in at least one of a dot shape, a linear shape, a planar shape, and the like. For example, the heat generating element is embedded in the side wall in at least one of a dot shape, a linear shape, a planar shape, and the like. For example, the heat generating element is embedded in at least one of the bottom wall and the side wall in a dot shape, a linear shape, a planar shape, and the like.

In some embodiments, the heat radiating structure 30 includes at least one heat generating unit. Each heat generating unit is wholly or partially embedded in the bottom wall 21 and/or the other walls 22 to reduce the overall space occupied by both the heat radiating structure 30 and the enclosing structure 20 as much as possible, facilitating a compact design.

In some embodiments, a portion of each heat-generating unit is embedded in the bottom wall 21 and another portion of each heat-generating unit is embedded in the other wall 22.

For example, a portion of each heat generating unit is embedded in the bottom wall 21, and another portion of each heat generating unit is embedded in the first side wall 2211.

As another example, a portion of each heat generating unit is embedded in the bottom wall 21, and another portion of each heat generating unit is embedded in the second side wall 2212.

For another example, a portion of each heat generating unit is embedded in the bottom wall 21, another portion of each heat generating unit is embedded in the first side wall 2211, and another portion of each heat generating unit is embedded in the second side wall 2212.

In some embodiments, the heat radiating structure 30 includes a plurality of heat generating units. At least one of the plurality of heat generating units is embedded in the bottom wall 21, and at least another one of the plurality of heat generating units is embedded in the other wall 22.

Referring to fig. 3 and 4, for example, the heat radiation structure 30 on the bottom wall 21 is at least partially embedded in the bottom wall 21 of the surrounding structure 20. The heat radiation structure 30 located on the side wall 221 is at least partially embedded on the side wall 221 of the surrounding structure 20.

In some embodiments, the heat radiation structure 30 and the surrounding structure 20 form an integrated structure, so as to reduce the processing difficulty of the heat radiation structure 30, reduce the number of parts, reduce the number of assembly processes, and improve the processing efficiency.

In some embodiments, the heat radiating structure 30 is fixed to the surrounding structure 20 by at least one of laser engraving, electroless plating, electroplating, sputtering, physical vapor deposition, In-Mold Decoration (IMD), insert molding, and the like. Can make into a part with thermal radiation structure 30 and at least partial envelope structure 20 through this shaping mode, reduce imaging device 100's part quantity, reduce the assembly process, greatly reduced thermal radiation structure 30's inefficacy risk to can avoid thermal radiation structure 30 to be heated the problem that the back drops, make and the processing cost is low.

In addition, the molding method has low requirements on the connected surface of the surrounding structure 20 for connecting with the heat radiation structure, and has wide applicability. The surface to be connected of the surrounding structure 20 may be at least one of a plane, a curved surface, a circular arc surface, a cylindrical surface, an uneven surface, an abrupt surface, another regular surface or an irregular surface, and the like.

Exemplary molding manners of the heat radiation structure 30 and the surrounding structure 20 include Laser Direct Structuring (LDS), Laser Applications (LAP), Laser Reconstruction Printing (LRP), Laser engraving and electroplating after electroless plating, and the like.

Illustratively, by using a laser direct structuring technique, a computer is used to control the movement of the laser on the surrounding structure 20 according to the trace of the conductive pattern, the laser is projected onto the surrounding structure 20 to activate the circuit pattern, and the circuit pattern becomes an electrical conductor after electroplating or electroless plating, and the electrical conductor constitutes the heat radiation structure 30. The heating effect is achieved by energizing the electrical conductor to generate heat.

Illustratively, by laser forming technique, a computer is used to control the movement of laser light on the surrounding structure 20 according to the trace of the conductive pattern, the laser light is projected onto the surrounding structure 20 to activate the circuit pattern, and the circuit pattern becomes an electrical conductor after electroplating or electroless plating, and the electrical conductor constitutes the heat radiation structure 30. The heating effect is achieved by energizing the electrical conductor to generate heat.

Illustratively, a conductive silver paste is precisely applied to the surface of the surrounding structure 20 at a high speed by a laser reconstruction printing technique to form a circuit pattern, and then trimmed by a three-dimensionally controlled laser to form a high-precision circuit structure, i.e., constituting the heat radiation structure 30. The circuit structure is electrified to generate heat, so that the heating effect is achieved.

Illustratively, the surrounding structure 20 is first chemically plated, then laser-engraved to form a plated area and a non-plated area, and then selectively plated to form an area requiring electrical conductivity, by a chemical plating followed by laser engraving and then electroplating, and the heat radiation structure 30 is formed by the conductive area formed after the plating. The conductive area generates heat by electrifying the conductive area, so that the heating effect is achieved.

In some embodiments, the film with the conductive pattern is formed onto the enclosure 20 by an in-mold decoration technique, in which the film is printed to print the conductive pattern onto the film and then injection molded into a mold. The conductive pattern and the thin film form the heat radiating structure 30. The conductive pattern is electrified to generate heat, so that the heating effect is achieved.

In some embodiments, the heat radiation structure 30 and the surrounding structure 20 are formed as a unitary structure by insert molding.

Illustratively, the conductive material part (the molding process of which may be, but is not limited to, die casting, stamping, machining, extrusion molding, etc.) is used as an insert by an insert molding process technique, and is placed as an insert in a mold for injection molding before the surrounding structure 20 is injection molded, so that the two are connected together to form an integral structure. Wherein the conductive material part constitutes the heat radiation structure 30. The conductive material part is electrified to generate heat, so that the heating effect is achieved.

It is understood that the shape of the heat radiation structure 30 may be designed according to actual requirements, such as a strip shape, an array shape, a planar shape, or the like.

Referring to fig. 6, in some embodiments, the heat radiating structure 30 is electrically connected to the imaging module 10 through the conductive connector 40. In other embodiments, the heat radiating structure 30 may also be connected to other electrical components of the movable platform 1000 through the conductive connecting body 40, such as a controller or a power supply.

Illustratively, the conductive connection 40 includes at least one of a flexible flat cable, a flexible wiring board, a flex cable, and the like.

Referring to fig. 6, in some embodiments, the conductive connector 40 is at least partially disposed within the surrounding structure 20. Illustratively, the electrical connection interface in the heat radiating structure 30 is provided in the enclosing structure 20, and the electrical connection interface can be electrically connected with the conductive connecting body 40 and electrically connected to the imaging module 10 or other electrical components of the movable platform 1000 through the conductive connecting body 40.

Referring to fig. 7, in some embodiments, the heat radiation structure 30 includes a heat radiation film 31. Illustratively, the heat radiation film 31 and the surrounding structure 20 are separately processed, and then assembled and fixed after the processing of the two is completed.

In some embodiments, the heat radiating structure 30 is connected to the surrounding structure 20 in at least one of the following ways; adhesive bonding, lamination, spraying, etc. The heat radiating film 31 is, for example, adhesively bonded to the surrounding structure 20.

The surrounding structure 20 and the heat radiating structure 30 may be in point contact, line contact, or surface contact, without limitation.

Referring to fig. 8, the heat radiation structure 30 includes a first heat radiation member 321 and a second heat radiation member 322. The first heat radiation member 321 is provided on the bottom wall 21. The second heat radiating member 322 is provided on the other wall 22, and the second heat radiating member 322 is separately provided from the first heat radiating member 321 with a space. In this embodiment, the first and second heat radiating members 321 and 322 are spaced apart from each other and are not connected to each other. In a practical application scenario, the first and second heat radiating members 321 and 322 may be supplied with different currents or the same current according to a scene heating requirement.

Exemplarily, the second heat radiating member 322 may be provided on at least one of the first side wall 2211, the second side wall 2212, and the top wall 222 of the surrounding structure 20.

Exemplarily, at least one of the first and second heat radiating members 321 and 322 includes the heat radiating film 31.

Illustratively, at least one of the first and second heat radiating members 321 and 322 is fixed to the envelope 20 by at least one of laser engraving, electroless plating, electroplating, spraying, physical vapor deposition, in-mold decoration molding, insert molding, and the like.

Exemplarily, at least one of the first and second heat radiating members 321 and 322 includes a resistance wire.

In other embodiments, the first heat radiating member 321 may be connected with the second heat radiating member 322. Such as the first heat radiating member 321 and the second heat radiating member 322 as an integrated structure.

Referring to fig. 8 and 9, the heat radiating structure 30 includes one or more resistance wires. For example, referring to fig. 8, the heat radiation structure 30 includes two resistance wires, which are respectively disposed on the second side wall 2212 and the bottom wall 21. For another example, referring to fig. 9, the heat radiation structure 30 includes a resistance wire, a portion of which is disposed on the bottom wall 21, and another portion of which is disposed on the second side wall 2212.

Referring to fig. 10, in some embodiments, the heat radiating structure 30 includes a plurality of resistance wires. A plurality of resistance wires are positioned along the first end 201 of the enclosure 20 in regions toward the second end 202 and can be supplied with different amounts of current such that the predetermined area 2002 of the transparent component 2001 can receive substantially uniform thermal radiation power per unit area. So, can lead to the electric current of equidimension not to many resistance wires according to actual demand, realize predetermineeing regional 2002's even heating, it is little to the harmful effects of other parts of printing opacity subassembly 2001 or platform main part 200 to can make the effect of defogging or deicing better.

Referring to fig. 10, with reference to fig. 3, a distance between a portion of the bottom wall 21 close to the first end 201 and the light-transmitting assembly 2001 is smaller than a distance between a portion of the bottom wall 21 far from the first end 201 and the light-transmitting assembly 2001. The resistance wire near the first end 201 of the surrounding structure 20 passes less current than the resistance wire away from the first end 201 of the surrounding structure 20.

Referring to fig. 10, the heat radiation structure 30 includes a resistance wire 30a and a resistance wire 30b, the resistance wire 30a is disposed on the bottom wall 21 and/or the side wall 221, and the resistance wire 30b is disposed on the bottom wall 21 and/or the side wall 221. The resistance wires 30a and 30b are arranged along the first end 201 of the surrounding structure 20 to the second end 202 in regions, i.e., at intervals along the Y direction in fig. 10. I.e., the resistance wire 30a is disposed proximate the first end 201 of the surrounding structure 20 and the resistance wire 30b is disposed distal the first end 201 of the surrounding structure 20.

When the distance between the portion of the bottom wall 21 close to the first end 201 and the light-transmitting component 2001 is smaller than the distance between the portion of the bottom wall 21 far from the first end 201 and the light-transmitting component 2001, a first current may be applied to the resistance wire 30a, and a second current may be applied to the resistance wire 30b, where the first current is smaller than the second current, so that the unit thermal radiation power generated by the resistance wire 30a is smaller than the unit thermal radiation power generated by the resistance wire 30b, and the predetermined region 2002 of the light-transmitting component 2001 can receive the substantially uniform unit area thermal radiation power.

Referring to fig. 10, in some embodiments, the heat radiating structure 30 includes a plurality of resistance wires. The imaging device 100 is used to determine whether the resistance wire is energized to the resistance wire according to the distance between the resistance wire and the light transmissive component 2001.

Referring to fig. 10, in conjunction with fig. 3, for example, the heat radiation structure 30 includes a resistance wire 30a and a resistance wire 30b, and a distance between the resistance wire 30a and the light transmission component 2001 is smaller than a distance between the resistance wire 30b and the light transmission component 2001. The resistance wire 30b is energized, while the resistance wire 30a is not energized.

Illustratively, the imaging device 100 is configured to determine to energize the resistance wire if the distance between the resistance wire and the light transmissive assembly 2001 is greater than or equal to a preset distance. If the distance between the resistance wire and the light transmission component 2001 is smaller than the preset distance, the resistance wire is determined not to be electrified. The preset distance may be designed according to actual requirements, and is not limited herein.

Exemplarily, the distance between the resistance wire and the light transmitting component 2001 refers to the minimum distance between the middle portion of the resistance wire and the light transmitting component 2001.

In some embodiments, the imaging device 100 is configured to obtain a temperature at a preset position, and determine whether to energize the heat radiation structure 30 according to the temperature at the preset position.

The temperature at the preset position may be acquired by providing a temperature sensor at or near the preset position.

Illustratively, the preset position is on or in front of the inner side of the light transmission assembly 2001. Specifically, the preset position may be located on or in front of the inside of the preset region 2002.

Illustratively, the preset position is located within the enclosure 20. For example, the predetermined position is located in the enclosed space 203 formed by the other wall 22 and the bottom wall 21. As another example, the predetermined position is located on an inner wall surface forming the enclosed space 203.

In some embodiments, the imaging device 100 is configured to determine to energize the heat radiating structure 30 if the temperature at the predetermined location is less than a predetermined threshold temperature. If the temperature at the predetermined position is greater than or equal to the predetermined threshold temperature, it is determined that the heat radiation structure 30 is not energized. The preset threshold temperature may be set according to actual requirements, and is not limited herein.

In some embodiments, the imaging device 100 is configured to determine whether to energize the heat radiating structure 30 based on the environmental information acquired by the imaging module 10. For example, if the environmental information obtained by the imaging module 10 is clear, it indicates that the ambient light can normally penetrate through the light-transmitting component 2001 or the preset area 2002, and the imaging module 10 can normally obtain the environmental information without powering the heat radiation structure 30 for defogging or deicing. If the environmental information acquired by the imaging module 10 is unclear, it indicates that the light-transmitting component 2001 or the preset region 2002 has a fogging phenomenon or an icing phenomenon, and the ambient light cannot normally penetrate through the light-transmitting component 2001 or the preset region 2002, so that the imaging module 10 cannot normally acquire the environmental information, and at this time, the heat radiation structure 30 needs to be powered on to perform defogging or deicing.

Illustratively, the imaging device 100 is configured to determine to energize the heat radiation structure 30 if the clarity of the environmental information is less than a preset clarity threshold. If the clarity of the environmental information is greater than or equal to the preset clarity threshold, it is determined that the heat radiation structure 30 is not powered on. The preset clear threshold may be designed according to actual requirements, and is not limited herein.

In some embodiments, the heat radiating structure 30 is a unitary structure. For example, the heat radiation structure 30 is a heat radiation film 31 or a resistance wire. Illustratively, a heat radiation film 31 or a resistance wire may be bent from the bottom wall 21 to extend to the side wall 221.

Referring to fig. 9, the heat radiation structure 30 includes an extension portion 33, a first electrical connection portion 34, and a second electrical connection portion 35. The extension 33 extends over the bottom wall 21 and the other wall 22. The first and second electrical connection portions 34 and 35 are connected to both ends of the extension portion 33, respectively. The first and second electrical connection portions 34 and 35 are used to electrically connect with the imaging module 10 or other electrical components.

The first and second electrical connection portions 34 and 35 can be designed at any suitable positions according to actual requirements. For example, the first electrical connection portion 34 and the second electrical connection portion 35 are disposed on the bottom wall 21 for routing.

The extension 33 is made of a conductive material. Illustratively, the extension 33 comprises a resistive wire.

Referring to fig. 9, for example, the first electrical connection portion 34 and the second electrical connection portion 35 are both located at the first end 201 of the surrounding structure 20, so that the first electrical connection portion 34 and the second electrical connection portion 35 are electrically connected to the conductive connection body 40, and the wiring is convenient.

Referring to fig. 9, the other walls 22 include opposing first and second side walls 2211 and 2212. The extension part 33 includes a first extension sub-part 331 and a second extension sub-part 332. The first extending sub-portion 331 is provided on the bottom wall 21 and the first side wall 2211. The first extending sub-portion 331 is connected to the first electrical connection portion 34. The second extending sub-portion 332 is disposed on the bottom wall 21 and the second side wall 2212, and the second extending sub-portion 332 is connected to the second electrical connection portion 35. The extension connecting part 333 is provided on the bottom wall 21. Both ends of the extension connection part 333 are connected to the first extension sub-part 331 and the second extension sub-part 332, respectively.

Referring to fig. 9, the first extending sub-portion 331 includes a plurality of first extending segments 3311 and a plurality of second extending segments 3312. A plurality of first extension portions 3311 are provided at intervals on the bottom wall 21. A plurality of second extension portions 3312 are provided at intervals on the first sidewall 2211. Except for the first extension 3311 located at the first end 201 of the surrounding structure 20, two ends of the other first extensions 3311 are respectively connected to two adjacent second extensions 3312. In this way, on the premise that the size of the enclosure structure 20 is fixed, the extension length of the first extension sub-portion 331 can be increased as much as possible, thereby improving the heating efficiency and defogging efficiency of the heat radiation structure 30.

Referring to fig. 9, a first extension 3311 at the first end 201 of the surrounding structure 20 illustratively connects the first electrical connection 34 and a second extension 3312.

Referring to fig. 9, a plurality of first extension segments 3311 are illustratively spaced along the first end 201 toward the second end 202 of the enclosure 20 on the bottom wall 21. A plurality of second extensions 3312 are spaced along the first end 201 toward the second end 202 of the enclosure 20 on the first sidewall 2211.

Referring to fig. 9, in some embodiments, the first extension 3311 near the first end 201 of the surrounding structure 20 extends a greater length than the first extension 3311 away from the first end 201 of the surrounding structure 20. Illustratively, the plurality of first extension segments 3311 are spaced apart from the first end 201 to the second end 202 of the surrounding structure 20 in such a manner that the extension length is gradually decreased.

Referring to fig. 9 in conjunction with fig. 3, in some embodiments, the extension length of the second extension 3312 near the first end 201 of the surrounding structure 20 is less than the extension length of the second extension 3312 far from the first end 201 of the surrounding structure 20. Illustratively, the plurality of second extension segments 3312 are spaced apart from the first end 201 to the second end 202 of the surrounding structure 20 in such a manner that the extension length gradually increases.

The first extending sub-portion 331 and the second extending sub-portion 332 may have the same or different structures. Referring to fig. 9, the first extending sub-portion 331 and the second extending sub-portion 332 are disposed symmetrically.

It is understood that the imaging device 100 may be mounted at any suitable position of the platform body 200 according to actual requirements, such as on the inner side of the light transmission assembly 2001, or on other components of the movable platform 1000 close to the light transmission assembly 2001. The other component may include at least one of an interior roof, a dashboard, an a-pillar, a B-pillar, a C-pillar, a D-pillar, etc.

The surrounding structure 20 and/or the imaging module 10 may be fixed to the transparent member 2001 and/or other components of the platform body 200 by an assembly method such as gluing.

Referring to fig. 2, the image forming apparatus 100 further includes a fixing member 50. The fixing member 50 is connected to the light transmitting member 2001 and the surrounding structure 20. The fixture 50 can provide a fixing, supporting, or positioning function for the surrounding structure 20 and/or the imaging module 10.

It is understood that the predetermined area 2002 can be heated by direct heat radiation of the heat radiation structure 30 and heat conduction between the heat radiation structure 30 and the air and the fixing member 50.

In some embodiments, the heat radiation structure 30 is also used to heat the fixing member 50. Illustratively, the heat radiation structure 30 or another heater may heat the fixing member 50. After the portion of the fixing member 50 for connection with the light transmission member 2001 is heated, the predetermined region 2002 is heated by heat conduction inside the light transmission member 2001.

The structure and shape of the fixing member 50 can be designed according to practical requirements, and are not limited herein.

Referring to fig. 2 and 11, the fixing member 50 includes a first surface 51 and a second surface opposite to each other. First face 51 and printing opacity subassembly 2001 fixed connection, second face and surrounding structure 20 fixed connection to realize imaging module 10 and printing opacity subassembly 2001's fixed connection, fixed reliability is high and with low costs.

Illustratively, the fixture 50 is further formed with a visible window (not labeled) disposed corresponding to the predetermined area 2002. The ambient light can reach the imaging module 10 through the predetermined region 2002 of the light-transmitting component 2001 and the visible opening window of the fixing member 50, so that the imaging module 10 obtains the environmental information of the environment where the movable platform 1000 is located.

Illustratively, the visible window may be an opening structure, or a structure made of a transparent or translucent material, so as to ensure that the imaging module 10 can normally acquire the environmental information.

Referring to fig. 2 and 11, the first surface 51 includes a first region 511 and a second region 512. The first region 511 is fixedly connected to the light-transmitting member 2001, and the second region 512 is used for fixedly connecting to other components of the platform main body 200, thereby ensuring the connection reliability of the imaging device 100.

Illustratively, the second region 512 is for fixed connection with at least one of a headliner, an instrument desk, an a-pillar, a B-pillar, a C-pillar, a D-pillar, etc. of the platform body 200.

Illustratively, the first region 511 may be partially or entirely bonded to the light transmissive member 2001.

In other embodiments, the second region 512 may be omitted, and the first region 511 is fixedly connected to the light-transmitting component 2001, so that the imaging device 100 is fixedly connected to the light-transmitting component 2001.

In some embodiments, the first region 511 may be omitted and fixedly connected to at least one of a ceiling, an instrument desk, an a-pillar, a B-pillar, a C-pillar, a D-pillar, etc. of the platform main body 200 through the second region 512.

Referring to fig. 2 and 4, in some embodiments, the imaging module 10 includes a carriage 13 and an imaging assembly 14. The carrier 13 is connected to the envelope structure 20 and/or the fixing 50. The imaging assembly 14 is carried on the carriage 13. The enclosing structure 20 serves to reduce stray light inside the movable platform 1000 from entering the imaging assembly 14.

Illustratively, the enclosing structure 20 is disposed between the imaging component 14 and the light transmissive component 2001; and/or between the carrier 13 and the light transmission assembly 2001.

The carrier 13 may be of one piece construction with the enclosing structure 20 or may be of two parts separate from each other.

The imaging assembly 14 may comprise one, two, three, four, five or more imaging units, such as the first imaging unit 11 and the second imaging unit 12 described above.

Illustratively, when the imaging assembly 14 includes a plurality of imaging units, the plurality of imaging units may be carried on the same carriage 13.

For example, the plurality of image forming units may be respectively carried on a plurality of carriers 13 different from each other.

Illustratively, at least two of the plurality of imaging units are carried on the same carriage 13 and at least one other of the plurality of imaging units is carried on another, independent carriage 13.

Illustratively, the imaging unit includes a camera or the like.

Illustratively, the imaging assembly 14 may be oriented toward the preset area 2002. Of course, the imaging assembly 14 may be oriented in any other suitable direction depending on the actual functional needs.

In some embodiments, the imaging assembly 14 further integrates a night vision function, and the thermal radiation structure 30 heats the predetermined area 2002 to defog or de-ice the predetermined area 2002, so as to reduce the loss of the emergent enhanced night vision light (laser, infrared light, etc.) and the loss of the incident night vision light (laser, infrared light, etc.), so that the imaging assembly 14 obtains a clearer, stable and brighter image or environmental information.

Referring to fig. 2 and 3, an embodiment of the present invention further provides an image forming apparatus 100 for a movable platform 1000. The movable platform 1000 is provided with a light transmission assembly 2001. The imaging device 100 is disposed inside the movable platform 1000. The imaging apparatus 100 includes an imaging module 10, a surrounding structure 20, and a heat radiation structure 30. The imaging module 10 can face the predetermined region 2002 of the light transmission member 2001. The imaging module 10 is used for sensing the ambient light passing through the light-transmitting assembly 2001 to obtain the environmental information of the environment where the movable platform 1000 is located. The surrounding structure 20 is disposed between the imaging module 10 and the light-transmitting assembly 2001. The surrounding structure 20 encloses a predetermined area 2002 of the light transmissive component 2001. The surrounding structure 20 is used to reduce the stray light inside the movable platform 1000 from entering the imaging module 10. The heat radiation structure 30 is provided on the surrounding structure 20 to form a heat radiation source on the surface of the surrounding structure 20 to heat the predetermined area 2002. Wherein the unit heat radiation power of different unit sections of the heat radiation structure 30 is substantially the same.

In the imaging apparatus 100 of the above embodiment, the heat radiation structure 30 can heat the preset region 2002 of the light-transmitting component 2001, so as to adjust the temperature of the preset region 2002 of the light-transmitting component 2001, prevent the preset region 2002 from being fogged or frozen to affect the use of the imaging module 10, save energy, and reduce cost. In addition, since the unit heat radiation powers of different unit sections of the heat radiation structure 30 are substantially the same, the design and manufacture of the heat radiation structure 30 are simple, the reliability of the heat radiation structure 30 is high, the practicability is strong, and the cost is further reduced.

It is to be understood that the unit section may be a unit area section or a unit length section, and is not limited herein.

Exemplarily, the image forming apparatus 100 includes the image forming apparatus 100 of any of the above embodiments.

In some embodiments, the conductor density and the conductor thickness of different unit sections of the heat radiation structure 30 are substantially the same.

In some embodiments, the predetermined area 2002 of the light transmissive member 2001 is capable of receiving substantially uniform thermal radiation power per unit area under the influence of the heat radiating structure 30.

Referring to fig. 2 and 3, an embodiment of the present invention further provides an image forming apparatus 100 for a movable platform 1000. The movable platform 1000 is provided with a light transmission assembly 2001. The imaging device 100 is disposed inside the movable platform 1000. The imaging apparatus 100 includes an imaging module 10, a surrounding structure 20, and a heat radiation structure 30. The imaging module 10 can face the predetermined region 2002 of the light transmission member 2001. The imaging module 10 is used for sensing the ambient light passing through the light-transmitting assembly 2001 to obtain the environmental information of the environment where the movable platform 1000 is located. The surrounding structure 20 is disposed between the imaging module 10 and the light-transmitting assembly 2001. The surrounding structure 20 encloses a predetermined area 2002 of the light transmissive component 2001. The surrounding structure 20 is used to reduce the stray light inside the movable platform 1000 from entering the imaging module 10. The heat radiation structure 30 is provided on the surrounding structure 20 to form a heat radiation source on the surface of the surrounding structure 20 to heat the predetermined area 2002. Wherein the heat radiation structure 30 is formed as an integrated structure with the surrounding structure 20.

In the imaging apparatus 100 of the above embodiment, the heat radiation structure 30 can heat the preset region 2002 of the light-transmitting component 2001, so as to adjust the temperature of the preset region 2002 of the light-transmitting component 2001, prevent the preset region 2002 from being fogged or frozen to affect the use of the imaging module 10, save energy, and reduce cost. In addition, since the heat radiation structure 30 and the surrounding structure 20 form an integrated structure, the processing difficulty of the heat radiation structure 30 is reduced, the number of parts is reduced, the number of assembly processes is reduced, and the processing efficiency is improved.

Exemplarily, the image forming apparatus 100 includes the image forming apparatus 100 of any of the above embodiments.

In some embodiments, the heat radiating structure 30 is fixed to the surrounding structure 20 by at least one of laser engraving, electroless plating, electroplating, sputtering, physical vapor deposition, in-mold decoration molding, and insert molding.

In some embodiments, the heat radiating structure 30 is at least partially embedded within the bottom wall 21 and/or other walls 22 of the enclosure 20.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected. Either mechanically or electrically. Either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The above disclosure provides many different embodiments or examples for implementing different features of the invention. In order to simplify the disclosure of the present invention, the components and arrangements of the specific examples are described above. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or reference letters in the various examples, which have been repeated for purposes of simplicity and clarity and do not in themselves dictate a relationship between the various embodiments and/or arrangements discussed. In addition, the present disclosure provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular method step, feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular method steps, features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope of the present invention, and these modifications or replacements should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected. Either mechanically or electrically. Either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The above disclosure provides many different embodiments or examples for implementing different features of the invention. In order to simplify the disclosure of the present invention, the components and arrangements of the specific examples are described above. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or reference letters in the various examples, which have been repeated for purposes of simplicity and clarity and do not in themselves dictate a relationship between the various embodiments and/or arrangements discussed. In addition, the present disclosure provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular method step, feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular method steps, features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope of the present invention, and these modifications or replacements should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (14)

1. An imaging device for a movable vehicle provided with a light transmission component, characterized in that the imaging device is disposed inside the movable vehicle, the imaging device comprising:

the imaging module can face to a preset area of the light transmission component and is used for sensing ambient light passing through the light transmission component so as to acquire environmental information of the environment where the movable vehicle is located;

the surrounding structure is arranged between the imaging module and the light-transmitting component and comprises a bottom wall and other walls connected with the bottom wall, the bottom wall and the other walls surround the preset area of the light-transmitting component, and the surrounding structure is used for reducing stray light in the movable vehicle from entering the imaging module;

and the heat radiation structure is arranged on the bottom wall and other walls and used for forming a heat radiation source on the surface of the surrounding structure so as to heat the preset area.

2. The imaging apparatus according to claim 1, wherein the other walls include a side wall connected to the bottom wall, and a part of the heat radiation structure is provided on the bottom wall and another part is provided on the side wall; and/or the presence of a gas in the gas,

the other walls further include a side wall connected to the bottom wall, and a top wall connected to the side wall and opposite to the bottom wall, and the heat radiation structure is further provided on the top wall.

3. The imaging apparatus as set forth in claim 1, wherein the unit heat radiation powers of different unit sections of the heat radiation structure are substantially the same; and/or the presence of a gas in the gas,

the unit heat radiation power of different unit sections of the heat radiation structure is different; and/or the presence of a gas in the gas,

under the action of the heat radiation structure, the preset area of the light-transmitting component can receive substantially uniform heat radiation power per unit area.

4. The imaging apparatus as claimed in claim 3, wherein the conductor density and the conductor thickness of different unit sections of the heat radiation structure are substantially the same.

5. The imaging apparatus as claimed in claim 1, wherein the heat radiation structure is at least partially embedded in the bottom wall and/or other walls; and/or the presence of a gas in the gas,

the bottom wall is substantially trapezoidal in shape.

6. The imaging apparatus according to claim 5, wherein the heat radiation structure includes:

at least one heating unit, each heating unit is wholly or partially embedded in the bottom wall and/or other walls.

7. The imaging apparatus of claim 6, wherein the heat generating unit comprises a resistive wire.

8. The imaging apparatus of claim 1, wherein the other walls include a first sidewall and a second sidewall connected to the bottom wall, the first sidewall and the second sidewall extending from a first end of the enclosure to a second end of the enclosure in a manner that a distance between the first sidewall and the second sidewall gradually decreases.

9. The image forming apparatus as claimed in claim 1, wherein the heat radiation structure is fixed to the surrounding structure by at least one of laser engraving, electroless plating, electroplating, sputtering, physical vapor deposition, in-mold decoration molding, and insert molding.

10. An imaging device as in any one of claims 1-9, wherein said heat radiating structure is electrically connected to said imaging module by an electrically conductive connector, said electrically conductive connector being at least partially disposed within said enclosure; and/or the presence of a gas in the gas,

the distance between the light-transmitting component and the bottom wall extends in a gradually increasing manner from the first end towards the second end of the enclosing structure.

11. The imaging apparatus of any of claims 1-9, wherein the imaging module comprises a first imaging unit and a second imaging unit, the enclosing structure comprising:

a first enclosure for reducing stray light from inside the movable vehicle from entering the first imaging unit;

and the second enclosing part is connected with the first enclosing part and is used for reducing stray light in the interior of the movable vehicle from entering the second imaging unit.

12. The imaging apparatus as claimed in any one of claims 1 to 9, wherein the heat radiation structure is a unitary structure, the heat radiation structure comprising:

an extension extending over the bottom wall and the other walls;

and the first electric connection part and the second electric connection part are respectively connected to two ends of the extension part.

13. The imaging apparatus as set forth in any one of claims 1 to 9, wherein the heat radiation structure includes:

and the resistance wires are arranged from the first end to the second end of the surrounding structure and can be provided with currents of different sizes, so that the preset area of the light-transmitting component can receive basically uniform heat radiation power per unit area.

14. A movable vehicle, characterized by comprising:

a platform body;

the imaging device of any one of claims 1-13, disposed within the platform body, for obtaining environmental information of an environment in which the mobile vehicle is located.

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