CN214627533U - SMT chip mounter for PCB board - Google Patents
SMT chip mounter for PCB board Download PDFInfo
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- CN214627533U CN214627533U CN202120640508.3U CN202120640508U CN214627533U CN 214627533 U CN214627533 U CN 214627533U CN 202120640508 U CN202120640508 U CN 202120640508U CN 214627533 U CN214627533 U CN 214627533U
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- fixedly connected
- chip mounter
- paster
- head
- smt chip
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Abstract
The utility model discloses a SMT chip mounter for PCB board, including the main part, the front of main part is provided with the recovery layer, the top fixedly connected with of main part pastes the dress device, the inside of pasting the dress device is provided with holds the platform, the one end fixedly connected with backward flow welded plate of holding the platform, the bottom fixedly connected with connecting plate of backward flow welded plate, the one end fixedly connected with conveyer of connecting plate, the top fixedly connected with printing mechanism of dress device, the top fixedly mounted of holding the platform has silk screen printing head, the head of dispensing, drive arrangement, welding set and optical detection device, sucking disc and subsides hole, the setting of guiding axle and extrusion piece can guarantee that drive arrangement can not appear the skew when the paster, the precision of paster is improved, silk screen printing head and dispensing head are to dripping solder paste and glue, improve the firm degree of paster, backward flow welded plate separately welds the dress hole alone, the welding quality of paster is guaranteed, the overall effect of the patch is improved.
Description
Technical Field
The utility model belongs to the technical field of SMT paster equipment, concretely relates to SMT chip mounter is used to PCB board.
Background
SMT paster refers to the abbreviation of a series of process flows that are processed on a PCB basis. The PCB is a printed circuit board.
SMT is a surface assembly technique, the most popular technique and process in the electronic assembly industry. Electronic circuit surface assembly techniques, known as surface mount or surface mount techniques. The surface-mounted component without pins or short leads is mounted on the surface of a printed circuit board or other substrates and is welded and assembled by methods such as reflow soldering or dip soldering.
In general, electronic products are designed by adding various capacitors, resistors and other electronic components to a PCB according to a designed circuit diagram, so that various electrical appliances need different SMT patch processing techniques.
The existing SMT technology has the following problems: the existing chip mounter is low in chip mounting precision, especially poor in chip mounting effect due to uneven stress of a chip mounting mechanism, and a plurality of chips are easily welded together in the reflow soldering process, so that the precision is low.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a SMT chip mounter is used to PCB board to the paster precision of the current chip mounter that proposes in solving above-mentioned background art is lower, and especially the drive atress of paster mechanism is uneven and lead to the paster effect not good, welds a plurality of pasters together easily in the reflow soldering in-process, thereby has leaded to the lower problem of precision.
In order to achieve the above object, the utility model provides a following technical scheme: an SMT chip mounter for a PCB comprises a main body, wherein a recycling layer is arranged on the front side of the main body, a machine thickening shell is fixedly connected to the top end of the main body, a mounting device is fixedly connected to one side of the machine thickening shell, a holding table is arranged inside the mounting device, a reflow soldering plate is fixedly connected to one end of the holding table, a connecting plate is fixedly connected to the bottom end of the reflow soldering plate, a conveying device is fixedly connected to one end of the connecting plate, a printing mechanism is fixedly connected to the top end of the mounting device, a controller is arranged on the front side of the printing mechanism, a screen printing head is fixedly mounted at the top end of the holding table, a dispensing head is fixedly mounted on the right side of the screen printing head, a driving device is fixedly mounted on one side of the dispensing head far away from the screen printing head, a telescopic rod is fixedly connected to the bottom end of the driving device, and a sucker is fixedly connected to the bottom end of the telescopic rod, the welding device is fixedly arranged on the right side of the driving device, a welding head is fixedly connected to the bottom end of the welding device, and an optical detection device is fixedly connected to the right side of the welding device.
Preferably, the bottom end of the main body is fixedly connected with a supporting column, and the bottom end of the supporting column is fixedly connected with a fixed foot ring.
Preferably, the top end of the main body is fixedly connected with a warning lamp, and a display is fixedly mounted on one side of the warning lamp.
Preferably, hold the inside dress hole that is provided with of platform, the both sides of holding the platform all are provided with the limiting plate, one side fixedly connected with guiding axle of limiting plate, one side fixedly connected with extrusion piece that the limiting plate was kept away from to the guiding axle.
Preferably, the reflow soldering plate is arranged at the top end of the containing table, and the soldering head is arranged right above the reflow soldering plate.
Preferably, the top end of the screen printing head is arranged in the printing mechanism, and the dispensing head is arranged in the printing mechanism.
Preferably, the number of the suckers is multiple, and the suckers are arranged right above the mounting holes.
Preferably, the controller is arranged at the bottom end of the display, the controller is electrically connected with the display, and the warning lamp is electrically connected with the controller.
Compared with the prior art, the utility model provides a SMT chip mounter is used to PCB board possesses following beneficial effect:
the utility model discloses a hold platform and drive arrangement's setting, the paster is adsorbed on the sucking disc, because be provided with the subsides dress hole under the sucking disc, material on the sucking disc just can carry out the paster to the PCB board, the telescopic link can the repetitive motion, carry out the paster again after adsorbing the material through the sucking disc, the skew can not appear in drive arrangement when the paster in setting up of guiding axle and extrusion piece, the precision of paster has been improved, silk screen printing head and glue head drip dress hole and soldering paste to the dress hole, can improve the firm degree of paster, set up under the soldered connection through the backward flow welded plate, the backward flow welded plate has separated a plurality of dress holes, every soldered connection welding solitary paster, can not influence near paster, the welding quality of paster has been guaranteed, can not be in the same place a plurality of paster welding, the whole effect of paster has been improved.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description, do not constitute a limitation of the invention, in which:
fig. 1 is a schematic structural view of an SMT chip mounter according to the present invention;
fig. 2 is a cross-sectional view of the mounting device according to the present invention;
fig. 3 is a top view of the placing table of the present invention;
in the figure: 1. a warning light; 2. thickening the shell by the machine; 3. a containing table; 4. a main body; 5. a support pillar; 6. fixing the foot ring; 7. a conveying device; 8. a recovery layer; 9. a connecting plate; 10. reflow soldering the board; 11. a controller; 12. a display; 13. a mounting device; 14. a printing mechanism; 15. dispensing a glue head; 16. a telescopic rod; 17. a drive device; 18. a suction cup; 19. a welding device; 20. welding a head; 21. an optical detection device; 22. printing a head by a screen; 23. a guide shaft; 24. extruding the block; 25. mounting holes; 26. and a limiting plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the utility model provides a technical solution of SMT chip mounter for PCB: an SMT chip mounter for PCBs comprises a main body 4, a supporting column 5 is fixedly connected to the bottom end of the main body 4, a fixing foot ring 6 is fixedly connected to the bottom end of the supporting column 5, a recycling layer 8 is arranged on the front face of the main body 4, a machine thickening shell 2 is fixedly connected to the top end of the main body 4, a mounting device 13 is fixedly connected to one side of the machine thickening shell 2, a containing table 3 is arranged inside the mounting device 13, a mounting hole 25 is formed inside the containing table 3, limiting plates 26 are arranged on two sides of the containing table 3, a guide shaft 23 is fixedly connected to one side of each limiting plate 26, an extrusion block 24 is fixedly connected to one side, away from each limiting plate 26, of each guide shaft 23, a reflow soldering plate 10 is fixedly connected to one end of each containing table 3, a connecting plate 9 is fixedly connected to the bottom end of each reflow soldering plate 10, a conveying device 7 is fixedly connected to one end of each connecting plate 9, and a printing mechanism 14 is fixedly connected to the top end of each mounting device 13, the front side of the printing mechanism 14 is provided with a controller 11, the top end of the main body 4 is fixedly connected with a warning lamp 1, one side of the warning lamp 1 is fixedly provided with a display 12, the controller 11 is arranged at the bottom end of the display 12, the controller 11 is electrically connected with the display 12, and the warning lamp 1 is electrically connected with the controller 11;
a screen printing head 22 is fixedly installed at the top end of the containing table 3, a dispensing head 15 is fixedly installed on the right side of the screen printing head 22, the top end of the screen printing head 22 is arranged inside the printing mechanism 14, the dispensing head 15 is arranged inside the printing mechanism 14, a driving device 17 is fixedly installed on one side, away from the screen printing head 22, of the dispensing head 15, an expansion rod 16 is fixedly connected to the bottom end of the driving device 17, suction cups 18 are fixedly connected to the bottom end of the expansion rod 16, the suction cups 18 are multiple in number, the suction cups 18 are arranged right above the mounting holes 25, a welding device 19 is fixedly installed on the right side of the driving device 17, a welding head 20 is fixedly connected to the bottom end of the welding device 19, the reflow soldering plate 10 is arranged at the top end of the containing table 3, the welding head 20 is arranged right above the reflow soldering plate 10, and an optical detection device 21 is fixedly connected to the right side of the welding device 19;
the sucking disc 18 carries out the paster again after adsorbing the material, and the skew can not appear in drive arrangement 17 when the paster in setting up of guiding axle 23 and extrusion piece 24, and the firm degree of paster can be improved to pasting dress hole 25 drippage soldering paste and glue to silk screen printing head 22 and some rubber heads 15, and reflow soldering board 10 has separated a plurality of dress holes 25, and the solitary paster of every soldered connection 20 welding.
The utility model discloses a theory of operation and use flow: the utility model discloses install the back, start display 12 and optical detection device 21 through controller 11, the paster is adsorbed on sucking disc 18, because be provided with subsides dress hole 25 under sucking disc 18, material on the sucking disc 18 just can carry out the paster to the PCB board, telescopic link 16 can the repetitive motion, carry out the paster again after adsorbing the material through sucking disc 18, the skew can not appear when the paster in drive arrangement 17 can be guaranteed in setting up of guiding axle 23 and extrusion piece 24, the precision of paster has been improved, the first 22 of silk screen printing and some adhesive tape head drip soldering paste and glue to subsides dress hole 25, can improve the firm degree of paster, set up under soldered joint 20 through reflow soldering board 10, reflow soldering board 10 has separated a plurality of subsides dress holes 25, every soldered joint 20 welds solitary paster, can not influence near paster, the whole effect of paster has been improved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a PCB board is with SMT chip mounter, includes main part (4), its characterized in that: the front of the main body (4) is provided with a recovery layer (8), the top end of the main body (4) is fixedly connected with a machine thickening shell (2), one side of the machine thickening shell (2) is fixedly connected with a surface mounting device (13), the inside of the surface mounting device (13) is provided with a containing table (3), one end of the containing table (3) is fixedly connected with a backflow welding plate (10), the bottom end of the backflow welding plate (10) is fixedly connected with a connecting plate (9), one end of the connecting plate (9) is fixedly connected with a conveying device (7), the top end of the surface mounting device (13) is fixedly connected with a printing mechanism (14), the front of the printing mechanism (14) is provided with a controller (11), the top end of the containing table (3) is fixedly provided with a silk screen printing head (22), and the right side of the silk screen printing head (22) is fixedly provided with a dispensing head (15), one side fixed mounting that the silk screen printing head (22) was kept away from in dispensing head (15) has drive arrangement (17), bottom fixedly connected with telescopic link (16) of drive arrangement (17), bottom fixedly connected with sucking disc (18) of telescopic link (16), the right side fixed mounting of drive arrangement (17) has welding set (19), the bottom fixedly connected with soldered connection (20) of welding set (19), the right side fixedly connected with optical detection device (21) of welding set (19).
2. An SMT chip mounter according to claim 1, wherein: the bottom fixedly connected with support column (5) of main part (4), the bottom fixedly connected with fixed foot ring (6) of support column (5).
3. An SMT chip mounter according to claim 1, wherein: the top fixedly connected with warning light (1) of main part (4), one side fixed mounting of warning light (1) has display (12).
4. An SMT chip mounter according to claim 1, wherein: hold platform (3) inside and be provided with dress hole (25), the both sides of holding platform (3) all are provided with limiting plate (26), one side fixedly connected with guiding axle (23) of limiting plate (26), one side fixedly connected with extrusion piece (24) of limiting plate (26) are kept away from in guiding axle (23).
5. An SMT chip mounter according to claim 1, wherein: the reflow soldering plate (10) is arranged at the top end of the containing table (3), and the soldering head (20) is arranged right above the reflow soldering plate (10).
6. An SMT chip mounter according to claim 1, wherein: the top of silk screen printing head (22) sets up in the inside of printing mechanism (14), just dispensing head (15) sets up in the inside of printing mechanism (14).
7. An SMT chip mounter according to claim 1, wherein: the number of the suckers (18) is multiple, and the suckers (18) are arranged right above the mounting holes (25).
8. An SMT chip mounter according to claim 3, wherein: the controller (11) is arranged at the bottom end of the display (12), the controller (11) is electrically connected with the display (12), and the warning lamp (1) is electrically connected with the controller (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120640508.3U CN214627533U (en) | 2021-03-30 | 2021-03-30 | SMT chip mounter for PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120640508.3U CN214627533U (en) | 2021-03-30 | 2021-03-30 | SMT chip mounter for PCB board |
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| Publication Number | Publication Date |
|---|---|
| CN214627533U true CN214627533U (en) | 2021-11-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN202120640508.3U Active CN214627533U (en) | 2021-03-30 | 2021-03-30 | SMT chip mounter for PCB board |
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| CN (1) | CN214627533U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117896910A (en) * | 2024-03-15 | 2024-04-16 | 珠海新立电子科技有限公司 | SMT device of FPC pad paster |
-
2021
- 2021-03-30 CN CN202120640508.3U patent/CN214627533U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117896910A (en) * | 2024-03-15 | 2024-04-16 | 珠海新立电子科技有限公司 | SMT device of FPC pad paster |
| CN117896910B (en) * | 2024-03-15 | 2024-05-14 | 珠海新立电子科技有限公司 | SMT device of FPC pad paster |
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