CN214591103U

CN214591103U - Power module

Info

Publication number: CN214591103U
Application number: CN202120379284.5U
Authority: CN
Inventors: 黄彭发; 黄鑫; 李平磊
Original assignee: Sungrow Power Supply Co Ltd
Current assignee: Sungrow Power Supply Co Ltd
Priority date: 2021-02-19
Filing date: 2021-02-19
Publication date: 2021-11-02
Anticipated expiration: 2031-02-19

Abstract

The utility model discloses a power module, which comprises two groups of capacitor components and a module frame, wherein the two groups of capacitor components are arranged in two layers; the capacitor assembly is installed on the module frame, the outer side walls of the two capacitor assemblies and the side wall of the module frame form a heat dissipation air channel for cooling the capacitor assembly, and the module frame is provided with an air inlet and an air outlet which are connected with the heat dissipation air channel. In the power module that this application provided, set up to two sets ofly through the capacitor assembly, and through forming the heat dissipation wind channel that is used for cooling off the capacitor assembly between capacitor assembly and the module frame, realize dispelling the heat to the capacitor assembly through the forced air cooling, for the radiating condition of water-cooling, the effectual capacitor assembly heat dissipation cost that has reduced.

Description

Power module

Technical Field

The utility model relates to an electric heat dissipation technical field, in particular to power module.

Background

With the increase of the power of the heating device in the power module, for example, the wind turbine generator with high power grade is continuously emerging, the requirement on the power density of the wind power conversion equipment, namely the wind power converter, is higher and higher. The power module with the IGBT as the core device is the core part of the wind power converter, and the improvement of the unit power density is the inevitable requirement.

The traditional power module has low power density and loose structure, so that the equipment volume is large; the core heating element of power module is the IGBT, through installing the IGBT on the water-cooling board, relies on rivers to take away the heat, but direct current filter capacitor's heat also can not neglect, and adopts the water-cooling mode to the capacitor assembly cooling, leads to capacitor assembly's heat dissipation cost to improve.

Therefore, how to reduce the heat dissipation cost of the capacitor assembly is a technical problem to be solved urgently by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a power module to reduce capacitor assembly's heat dissipation cost.

In order to achieve the above object, the utility model provides a power module, include:

the capacitor assemblies are divided into two groups, and the two groups of capacitor assemblies are arranged in two layers;

the module frame, the capacitor assembly is installed on the module frame, two the lateral wall of capacitor assembly with the lateral wall of module frame forms and is used for cooling capacitor assembly's heat dissipation wind channel, be equipped with on the module frame with air intake and air outlet that the heat dissipation wind channel is connected.

Preferably, the air inlet and the air outlet are located at the bottom end and the top end respectively.

Preferably, the capacitor assembly comprises a capacitor tray, a laminated busbar and a direct current capacitor arranged between the capacitor tray and the laminated busbar, and the capacitor tray is an outer side wall of the capacitor assembly.

Preferably, two of the capacitor assemblies are symmetrically distributed along the module frame central mirror.

Preferably, a notch is formed between the positive pin and the negative pin of the laminated busbar.

Preferably, the laminated busbar comprises a positive busbar, a negative busbar and an intermediate insulating layer arranged between the negative busbar and the negative busbar.

Preferably, the number of the direct current capacitors is multiple, and the multiple direct current capacitors are arranged in an array along the airflow direction in the heat dissipation air duct.

Preferably, the bottom plate of the module frame is a non-magnetic plate.

Preferably, the module frame is provided with a handle.

Preferably, the handle sets up on the bottom plate of module frame, the module frame both sides that set up dorsad all are equipped with the handle.

Preferably, the module frame is provided with lifting holes.

Preferably, the module frame is provided at a side thereof with a guide hole.

Preferably, an IGBT assembly is included, which is mounted on the module frame.

Preferably, the IGBT component includes water-cooling board and sets up IGBT on the water-cooling board, the both sides that the water-cooling board set up dorsad all are equipped with IGBT, two capacitor assembly the stromatolite female arranging be located the both sides that the water-cooling board set up dorsad, and with the water-cooling board homonymy the IGBT is connected.

Preferably, the module frame comprises a wind shield, a bottom plate, a front plate and a surrounding plate which is connected with the front plate and the bottom plate and is far away from one end of the front plate, the surrounding plate, the bottom plate and the front plate form the heat dissipation air duct and an IGBT cavity which is used for accommodating the IGBT assembly, and the IGBT cavity and the heat dissipation air duct are isolated by the wind shield.

In the above technical solution, the power module provided by the present invention includes two sets of capacitor assemblies and a module frame, wherein the two sets of capacitor assemblies are arranged in two layers; the capacitor assembly is installed on the module frame, the outer side walls of the two capacitor assemblies and the side wall of the module frame form a heat dissipation air channel for cooling the capacitor assembly, and the module frame is provided with an air inlet and an air outlet which are connected with the heat dissipation air channel.

According to the power module, the capacitor assemblies are arranged into two groups, the heat dissipation air channels used for cooling the capacitor assemblies are formed between the capacitor assemblies and the module frame, heat dissipation of the capacitor assemblies through air cooling is achieved, and the heat dissipation cost of the capacitor assemblies is effectively reduced compared with the condition of water cooling.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

Fig. 1 is a three-dimensional structure diagram of a power module according to an embodiment of the present invention;

fig. 2 is a three-dimensional structure diagram of another viewing angle power module according to an embodiment of the present invention;

fig. 3 is a three-dimensional structure diagram of a capacitor module according to an embodiment of the present invention;

fig. 4 is a three-dimensional structure diagram of a module frame according to an embodiment of the present invention;

fig. 5 is a three-dimensional structure diagram of the laminated busbar according to the embodiment of the present invention.

Wherein in FIGS. 1-5:

1-module frame, 11-coaming, 111-guide hole, 12-front plate, 121-lifting hole, 13-bottom plate, 131-handle and 14-wind shield;

2-IGBT component, 21-water cooling plate, 22-IGBT, 23-drive plate and 24-alternating current copper bar;

3-capacitor assembly, 31-capacitor tray, 32-direct current capacitor, 33-laminated busbar and 34-busbar fixing column.

Detailed Description

The core of the utility model is to provide a power module to reduce capacitor assembly's heat dissipation cost.

In order to make those skilled in the art better understand the technical solution of the present invention, the present invention will be further described in detail with reference to the accompanying drawings and embodiments.

Please refer to fig. 1 to 5.

In a specific implementation manner, the power module provided by the embodiment of the present invention includes two sets of capacitor assemblies 3 and a module frame 1, where the two sets of capacitor assemblies 3 are arranged in two layers; capacitor assembly 3 installs on module frame 1, and the lateral wall of two capacitor assembly 3 and the lateral wall of module frame 1 form the heat dissipation wind channel that is used for cooling capacitor assembly 3, are equipped with air intake and the air outlet of being connected with the heat dissipation wind channel on the module frame. Specifically, the module frame 1 may be composed of a plurality of shell plates, and preferably, the shell plates are detachably connected. Specifically, the heat dissipation air duct may be formed by the module frame 1 alone, and preferably, the air inlet and the air outlet of the heat dissipation air duct are located at two opposite ends of the module frame 1.

It can be known from the above description that, in the power module provided in this application embodiment, set up to two sets through capacitor assembly 3, and form the heat dissipation wind channel that is used for cooling capacitor assembly 3 through capacitor assembly 3 and module frame 1 between, realize through the forced air cooling to capacitor assembly 3 heat dissipation, for the radiating condition of water-cooling, the effectual heat dissipation cost that reduces capacitor assembly 3.

In a specific embodiment, one of the air inlet and the air outlet of the heat dissipation air duct is located at the bottom end of the module frame 1, and the other is located at the top end of the module frame 1, so as to facilitate the discharge of hot air, preferably, the air inlet of the heat dissipation air duct is located at the bottom end of the module frame 1, and the air outlet of the heat dissipation air duct is located at the top end of the module frame 1. The ventilation openings are arranged on the upper part and the lower part of the module frame 1 to form a heat dissipation air duct which penetrates through the module frame from top to bottom, and the direct current capacitors 32 of the capacitor assembly 3 are all positioned in the heat dissipation air duct. When the power module works, the airflow passes through the heat dissipation air duct to dissipate heat of the dc capacitor 32 in the heat dissipation air duct.

In a specific embodiment, the capacitor assembly 3 includes a capacitor tray 31, a laminated busbar 33 and a dc capacitor 32, specifically, the capacitor tray 31 may be an outer sidewall of the capacitor assembly 3, wherein the dc capacitor 32 is mounted on the capacitor tray 31, and the laminated busbar and the capacitor tray 31 are respectively located on two opposite sides of the dc capacitor 32. Specifically, the capacitor trays 31 of the two capacitor assemblies 3 may be fixedly connected to the module frame 1. Preferably, there are a plurality of dc capacitors 32, and the plurality of dc capacitors 32 are arranged in an array along the airflow direction in the heat dissipation air duct. Specifically, preferably, the dc capacitors in each capacitor assembly 3 are arranged on the capacitor tray 31 in a matrix, and the airflow entering the heat dissipation air duct directly blows to the dc capacitors 32.

In an embodiment, the two capacitor assemblies 3 are symmetrically distributed along the central mirror of the module frame 1, and specifically, the two capacitor assemblies 3 may be arranged along the thickness direction of the module frame 1.

Specifically, the capacitor assembly 3 further comprises a busbar fixing column 34, the length of the busbar fixing column 34 is determined according to actual needs, and the capacitor assembly is not specifically limited in the application.

In order to simplify the structure of the module frame 1, when the number of the heat dissipation air ducts is two, the two heat dissipation air ducts can be spaced by the capacitor tray 31, and the side wall of the capacitor tray 31 and the side wall of the module frame 1 are sealed, so that the air flow can flow through the direct current capacitor 32 of the capacitor assembly 3 and the surface of the laminated busbar 33 as much as possible.

In one embodiment, a notch is formed between the positive pin and the negative pin of the laminated busbar 33 to increase the creepage distance between the positive pin and the negative pin. Specifically, a notch is formed between each group of adjacent positive and negative pins.

In one embodiment, the laminated busbar 33 includes a positive busbar, a negative busbar, and an intermediate insulating layer disposed between the negative busbar and the positive busbar. Specifically, the positive busbar, the intermediate insulating layer and the negative busbar are sequentially superposed.

In one embodiment, the bottom plate 13 of the module frame 1 is a non-magnetic conductive plate. Specifically, the non-magnetic conductive plate body can be made of non-magnetic conductive materials such as an aluminum plate or a stainless steel plate, and the eddy current heating effect is avoided.

In order to easily carry, mount, or dismount the power module, it is preferable that the module frame 1 is provided with a handle 131. Specifically, handle 131 can be one or at least two, and for the transport, preferably, the both sides that module frame 1 set up dorsad all are equipped with handle 131, and for the convenience of many people's transport, module frame 1 is equipped with a plurality of handles 131 with one side, and is concrete, and handle 131 is the structure of fixed connection on module frame 1, and in order to reduce the part, handle 131 is the groove body structure of module frame 1 indent formation.

Specifically, the handle 131 is provided on the bottom plate 13 of the module frame 1. The handle 131 is arranged at the lower part of the module frame 1, so that the power module can be conveniently lifted through the handle 131.

In one embodiment, the module frame 1 is provided with lifting holes 121. Specifically, lifting eye 121 sets up on module frame 1 upper portion, through lifting eye 121, utilizes lifting device, can easily realize packing into or tearing down the converter with the power module.

In one embodiment, the module frame 1 is provided with one or at least two guiding holes 111 at the side thereof, and the guiding holes 111 facilitate positioning and fixing of the power module.

The power module that this application provided is rationally distributed, compact structure, maintains simple to operate, the extensive use widely of being convenient for.

The application provides a power module includes IGBT subassembly 2 and above-mentioned arbitrary power module, and IGBT subassembly 2 installs on module frame 1. The foregoing describes a specific structure of a power module, and the present application includes the above power module, which also has the above technical effects.

In a specific embodiment, the IGBT module 2 includes a plurality of water-cooling plates 21 and IGBTs 22 disposed on the water-cooling plates 21, the IGBTs 22 are provided, the two sides of the water-cooling plates 21 facing away from each other are provided with IGBTs 22, and the laminated busbars 33 of the two capacitor modules 3 are located on the two sides of the water-cooling plates 21 facing away from each other and connected to the IGBTs 22 on the same side of the water-cooling plates 21. The IGBT module 2 further includes a drive board 23 disposed above the IGBT22 and an ac copper bar 24 connected to one side of the IGBT 22. Specifically, the laminated busbars 33 are respectively arranged on two sides of the water cooling plate 21, one end of each laminated busbar is connected to the plurality of IGBTs 22, and the other end of each laminated busbar is connected to the plurality of direct current capacitors 32.

Specifically, module frame 1 includes that bounding wall 11 of front bezel 14, bottom plate 13, front bezel 12 and the one end of connecting front bezel 12 and bottom plate 13 and keeping away from front bezel 12 forms the heat dissipation wind channel and is used for holding IGBT subassembly 2 between bounding wall 11, bottom plate 13 and the front bezel 12, keeps apart through wind shield 14 between IGBT cavity and the heat dissipation wind channel. In which the coaming 11, the base 13 and the front 12 are assembled to each other to form a closed frame. A wind screen 14 is arranged in the middle of the frame; the whole power module is divided into an IGBT assembly cavity and a capacitor assembly cavity.

The power module that this application provided, power density is high, easily expands. When the expansion is needed, the size of the power module in the height direction can be changed by increasing or reducing the quantity of the IGBTs 22 and the capacitor assemblies 3 (generally, the wind power converter is generally arranged in a tower of a wind turbine generator, and the size of the wind power converter in the height direction is not strictly limited).

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A power module, comprising:

the capacitor assemblies (3) are divided into two groups, and the two groups of capacitor assemblies (3) are arranged in two layers;

the module comprises a module frame (1), wherein the capacitor assembly (3) is installed on the module frame (1), the outer side wall of the capacitor assembly (3) and the side wall of the module frame (1) form a heat dissipation air duct for cooling the capacitor assembly (3), and the module frame is provided with an air inlet and an air outlet which are connected with the heat dissipation air duct.

2. The power module according to claim 1, wherein the air inlet and the air outlet are located one at the bottom end of the module frame (1) and the other at the top end of the module frame (1).

3. The power module according to claim 1, wherein the capacitor assembly (3) comprises a capacitor tray (31), a laminated busbar (33) and a dc capacitor (32) mounted between the capacitor tray (31) and the laminated busbar (33), and the capacitor tray (31) is an outer sidewall of the capacitor assembly (3).

4. A power module according to claim 3, characterized in that two of said capacitive components (3) are symmetrically distributed along the central mirror image of said module frame (1).

5. A power module according to claim 3, characterized in that a cut-out is provided between the positive and negative leads of the laminated busbar (33).

6. The power module according to claim 3, wherein the laminated busbar (33) comprises a positive busbar, a negative busbar, and an intermediate insulating layer disposed between the negative busbar and the negative busbar.

7. The power module according to claim 3, wherein the number of the dc capacitors (32) is plural, and the plural dc capacitors (32) are arranged in an array along the airflow direction in the heat dissipation air duct.

8. A power module according to claim 1, characterized in that the bottom plate (13) of the module frame (1) is a non-magnetically conductive plate body.

9. A power module according to claim 1, characterized in that the module frame (1) is provided with a handle (131).

10. A power module according to claim 9, characterized in that the handle (131) is arranged on the bottom plate (13) of the module frame (1), the handle (131) being arranged on both sides of the module frame (1) facing away.

11. A power module according to claim 1, characterized in that the module frame (1) is provided with lifting holes (121).

12. A power module according to claim 1, characterized in that the sides of the module frame (1) are provided with guide holes (111).

13. Power module according to any one of claims 1-12, characterized in that it further comprises an IGBT component (2), which IGBT component (2) is mounted on the module frame (1).

14. The power module according to claim 13, wherein the IGBT component (2) comprises a water-cooling plate (21) and IGBTs (22) arranged on the water-cooling plate (21), wherein IGBTs (22) are arranged on two sides of the water-cooling plate (21) facing away from each other, and laminated busbars (33) of the two capacitor components (3) are arranged on two sides of the water-cooling plate (21) facing away from each other and connected with the IGBTs (22) on the same side of the water-cooling plate (21).

15. The power module according to claim 14, wherein the module frame (1) comprises a wind deflector (14), a bottom plate (13), a front plate (12) and a shroud (11) connecting the front plate (12) and the bottom plate (13) at an end far away from the front plate (12), the shroud (11), the bottom plate (13) and the front plate (12) form the heat dissipation air duct and an IGBT cavity for accommodating the IGBT assembly (2), and the IGBT cavity and the heat dissipation air duct are isolated by the wind deflector (14).