CN214585618U - Probe card silicon substrate with contact holes for fixing and arranging probes - Google Patents

Abstract

The utility model discloses a probe card silicon substrate with contact hole is with fixed and range probe, concretely relates to silicon substrate field of probe card, including a plurality of cut-apart pieces, the cut-apart piece evenly is provided with a plurality of arrangement portions along the department outward, the arrangement portion is including arranging lug and range groove, it is a plurality of to arrange the lug and arrange groove interval distribution the cut-apart piece all vertically runs through and has seted up a plurality of first contact holes and level and arrange, is provided with horizontal coupling device and elasticity portion between the adjacent cut-apart piece. The utility model discloses a cut apart the silicon substrate that is used for fixing and arranging the probe, arrange and hookup with it, can enlarge the size and do not be restricted by the size of measurand, need not produce the expensive equipment of the probe card that suits with it to the measurand of equidimension not, with a equipment alright production be used for the not probe card of measurand of equidimension to the part that makes the cutting apart keeps accurate arrangement state, thereby has the effect of the test result degree of accuracy of assurance measurand tested.

Description

Probe card silicon substrate with contact holes for fixing and arranging probes

Technical Field

The utility model relates to a silicon substrate technical field of probe card, more specifically say, the utility model relates to a probe card silicon substrate with contact hole is with fixed and range probe.

Background

In order to test semiconductor devices (e.g., semiconductor memories, displays) for defects during or after manufacturing, a probe card is generally used to electrically connect a wafer and a semiconductor device testing apparatus, and an electrical signal from the testing apparatus is transmitted to a chip under test formed on the wafer, and a signal returned from the chip is transmitted to the semiconductor device testing apparatus.

The conventional probe card is fabricated by using a deep silicon etching process in the MEMS, and thus has a problem of size limitation. In addition, the size of the conventional probe card and the area where the probe is located depend on the size of the object to be measured, and since the probe card cannot cope with the size change of the object to be measured because the size of the probe card is determined in the manufacturing process, there is a case where a manufacturing apparatus for manufacturing a wafer conforming to different sizes (e.g., inch wafer) of the object to be measured must be provided.

Disclosure of Invention

In order to overcome the above-mentioned defects of the prior art, embodiments of the present invention provide a silicon substrate for a probe card with contact holes to fix and arrange probes.

In order to achieve the above object, the utility model provides a following technical scheme: a silicon substrate of a probe card with contact holes for fixing and arranging probes comprises a plurality of dividing sheets, wherein a plurality of arrangement parts are uniformly arranged at the outer edges of the dividing sheets, each arrangement part comprises an arrangement lug and an arrangement groove, the arrangement lugs and the arrangement grooves are distributed at intervals to arrange the dividing sheets, a plurality of first contact holes are longitudinally arranged in a penetrating mode and horizontally arranged on each dividing sheet, a horizontal connecting device and an elastic part are arranged between every two adjacent dividing sheets, the horizontal connecting device is positioned at the mutually contacted parts between the dividing sheets to horizontally connect the dividing sheets, the elastic part is positioned at one or all opposite side surfaces between the dividing sheets connected by the horizontal connecting device, and a certain interval is kept between the dividing sheets by means of elasticity; the horizontal connecting device is used for connecting the dividing sheets to adjust the area of the probe, and meanwhile, the elastic force of the elastic part is used for aligning the dividing sheets.

In a preferred embodiment, the resilient part is made of a spring, which is integral with the dividing piece.

In a preferred embodiment, the horizontal coupling device comprises a hook located on the side of the dividing sheet and a pair of clamping sheets located on the side of the dividing sheet opposite to the hook, and the clamping sheets are fastened to the hook so as to be clamped on both sides of the hook.

In a preferred embodiment, the elastic parts are respectively positioned at two sides of the pair of clamping pieces, and the elastic parts are fixedly connected with the dividing pieces.

A probe card silicon substrate with contact holes for fixing and arranging probes comprises a plurality of laminated sheets, wherein a plurality of second contact holes are uniformly formed in two sides of each laminated sheet, and the laminated sheets are stacked in a vertically staggered mode and are horizontally arranged; positioning and coupling devices are arranged between the adjacent lamination sheets, so that the lamination sheets are fixed up and down to form a plurality of lamination sheets and are horizontally coupled at the same time, and the contact holes of the lamination sheets are aligned up and down; by utilizing the positioning and coupling device to stagger and couple the lamination up and down, the area of the probe can be adjusted, and the second contact holes are aligned up and down.

In a preferred embodiment, the positioning coupling means includes a plurality of positioning holes and positioning pins formed on each lamination for vertically inserting the positioning holes of the laminations stacked up and down in a staggered manner.

In a preferred embodiment, the positioning holes are formed in a directional shape with a vertical section thereof as a positioning reference, and the positioning pins keep the directions of the positioning holes arranged up and down in a uniform direction.

In a preferred embodiment, the vertical section of the positioning hole is in a line shape or a cross shape, and a plurality of positioning protrusions are formed on the positioning pin along the length direction of the outer surface, and the positioning protrusions include three types: the positioning protrusion is obliquely arranged, and when the positioning pin is inserted into the positioning hole, the positioning protrusion exerts bounce force on the inner wall of the positioning hole in the horizontal direction, so that the positioning pin has elasticity.

The utility model discloses a technological effect and advantage:

the utility model discloses a cut apart the silicon substrate that is used for fixing and arranging the probe, arrange and hookup with it, can enlarge the size and do not be restricted by the size of measurand, need not produce the expensive equipment of the probe card that suits with it to the measurand of equidimension not, with a equipment alright production be used for the not probe card of measurand of equidimension to the part that makes the cutting apart keeps accurate arrangement state, thereby has the effect of the test result degree of accuracy of assurance measurand tested.

Drawings

Fig. 1 is a perspective view showing a silicon substrate of a probe card according to a first embodiment of the present invention in a separated state.

Fig. 2 is a plan view showing a connection state of a silicon substrate for a probe card according to a first embodiment of the present invention.

Fig. 3 is a perspective view of a silicon substrate for a probe card according to a second embodiment of the present invention in a separated state.

Fig. 4 is a cross-sectional view showing a connection state of a silicon substrate for a probe card according to a second embodiment of the present invention.

The reference signs are: 110 dividing piece, 111 first contact hole, 120 horizontal connecting device, 121 hook, 122 clamping piece, 130 elastic part, 140 arranging part, 141 arranging convex block, 142 arranging groove, 210 lamination, 211 second contact hole, 220 positioning connecting device, 221 positioning hole, 222 positioning pin, 222a linear positioning projection, 222b bending positioning projection, and 222c end positioning projection with bulge.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1:

the utility model provides a probe card silicon substrate with contact holes for fixing and arranging probes as shown in fig. 1-2, which comprises a plurality of dividing sheets 110, a plurality of arranging parts 140 are uniformly arranged at the outer edge of the dividing sheets 110, the arranging parts 140 comprise arranging lugs 141 and arranging grooves 142, the arranging lugs 141 and the arranging grooves 142 are distributed at intervals, a plurality of the dividing sheets 110 are longitudinally penetrated and provided with a plurality of first contact holes 111 and are horizontally arranged, a horizontal connecting device 120 and an elastic part 130 are arranged between the adjacent dividing sheets 110, the horizontal connecting device 120 is positioned at the mutual contact part between the dividing sheets 110 to horizontally connect the dividing sheets 110, the elastic part 130 is positioned at one or all opposite side surfaces between the dividing sheets 110 connected by the horizontal connecting device 120, the elastic part 130 is made of a spring, the elastic part 130 and the dividing sheets 110 form a whole, the horizontal coupling device 120 includes a hook 121 and a pair of clamping pieces 122, the clamping pieces 122 are located on the side of the dividing piece 110 opposite to the hook 121, the clamping pieces 122 are fastened to the hook 121, the elastic parts 130 are respectively located on two sides of the clamping pieces 122, and the elastic parts 130 are fixedly connected to the dividing piece 110.

The dividing sheet 110 is mostly made of silicon, and a plurality of first contact holes 111 vertically penetrating the dividing sheet 110 are formed for inserting positioning probes to form at least one contact hole array; the dividing sheet 110 may be formed in various shapes such as a rectangle, a polygon or a shape consisting of a curve and a straight line, which is horizontally arranged to form a continuous surface on which the probes are arranged, and the area on which the probes are mounted is adjusted according to the number of the probes arranged; horizontal coupling means 120 are provided at portions where the divided pieces 110 are in contact with each other to horizontally couple the divided pieces 110, and preferably, a plurality of horizontal coupling means 120 are provided along edges of the divided pieces 110 to stably couple the divided pieces 110 in various directions;

the clamping piece 122 is composed of two pieces, is disposed on the side of the other divided piece 110 opposite to the hook 121, and is used for hanging on the two sides of the hook 121, and can clamp the hook 121 in various forms, such as "ㄱ" form, "ㄷ" form, and has certain elasticity so that the hook 121 can go in and out;

the elastic parts 130 are located at opposite one or all sides between the horizontally arranged divided pieces 110 coupled by the horizontal coupling means 120; a plurality of elastic parts 130 formed at one side of the partition piece 110 to provide uniform elasticity; pushing the other divided piece 110 under its elastic action to maintain a certain interval between the divided pieces 110 across the horizontal coupling means 120; in order to generate elasticity, the elastic part 130 is provided at the side of the segment piece 110 as an integrated spring, and may take various forms such as a zigzag shape, an inclined straight or curved member or a cantilever type elastically supporting the protruding part of the side of the segment piece 110; the arrangement part 140 is composed of arrangement projections 141 and arrangement grooves 142, is in a U shape or a V shape, and is arranged on the side surface of the butted dividing sheet 110 to connect the dividing sheet 110;

when forming contact holes on the division sheet 110 by using a deep silicon etching process, forming the horizontal coupling device 120, the elastic part 130 and the arrangement part 140 at the edge of the division sheet 110; a plurality of divided pieces 110 horizontally arranged by a horizontal coupling means 120 are bonded to the support substrate;

the embodiment of the embodiment specifically comprises: horizontally arranging an appropriate number of the divided pieces 110 to have a probe mounting surface corresponding to the size of a test object (e.g., a wafer) and coupling them by a horizontal coupling means 120; when the divided pieces 110 are coupled, the divided pieces 110 are prearranged by coupling the arrangement projections 141 and the arrangement grooves 142, the hooks 121, the clamping pieces 122 and the elastic parts 130 are prevented from being damaged due to mutual dislocation, and the hooks 121 are clamped between the clamping pieces 122, thereby ensuring that the divided pieces 110 maintain the coupled state unless a certain force is applied;

when the horizontal coupling device 120 is used to couple the divided pieces 110, the elastic force of the elastic part 130 acts on the side surfaces of the opposite divided pieces 110 to eliminate the gap error caused by the combination of the hook 121 and the clamping piece 122, so that the probe and the divided pieces 110 are accurately positioned;

in order to reduce or enlarge the area formed by coupling the divided pieces 110, a certain force is applied to disengage the hook 121 from the clamping piece 122 to separate the divided pieces 110, and then the coupled divided pieces 110 are recombined as described above according to the desired shape, size or probe arrangement area.

Example 2:

the present invention provides a silicon substrate for a probe card having contact holes for fixing and arranging probes, as shown in fig. 3 to 4, comprising a plurality of stacked sheets 210, a plurality of second contact holes 211 are uniformly formed on both sides of the lamination sheets 210, a positioning coupling device is arranged between the adjacent lamination sheets 210, the positioning coupling means 220 includes a plurality of positioning holes 221 and positioning pins 222 formed on each lamination sheet 210, positioning holes 221 for vertically inserting the lamination sheets 210 stacked up and down with being staggered, the positioning holes 221 being formed with directional shapes, the positioning pins 222 keep the directions of the positioning holes 221, which are vertically arranged, to be the same with each other, using the vertical cross-section thereof as a positioning reference, the vertical cross-section of the positioning holes 221 is in a line shape or a cross shape, a plurality of positioning protrusions are formed on the positioning pins 222 along the length direction of the outer surface, and the positioning protrusions include three types: a linear positioning protrusion 222a, a curved positioning protrusion 222b, and a positioning protrusion 222c having a bulge at a distal end thereof, the positioning protrusions being obliquely arranged;

the laminate 210 is mostly made of silicon, forms a plurality of vertical second contact holes 211 for inserting the arrangement probes to form at least one second contact hole 211 array, and may be made in various shapes such as a rectangle, a polygon, or a shape consisting of curves and lines to improve input-output rate and workability;

the lamination sheets 210 are stacked up and down in a staggered manner and are horizontally arranged to form a continuous surface for arranging the probes, and the area for installing the probes is adjusted according to the arrangement number of the probes;

in the present embodiment, the number of stacked laminations 210 using the positioning coupling device 220 is two, but is not limited thereto, and the stacked laminations 210 may be stacked, and the direction of the horizontal arrangement or the staggered arrangement is not necessarily a single direction of the X axis or the Y axis, but may be two directions of the X axis and the Y axis; positioning the coupling means 220 to be fixed up and down between the lamination sheets 210 to form the horizontally coupled multi-layered lamination sheets 210 and to align the second contact holes 211 of the upper and lower lamination sheets 210 up and down; the positioning coupling means 220 includes a plurality of positioning holes 221 formed on each lamination sheet 210 and positioning pins 222 for inserting the upper and lower positioning holes 221; each lamination 210 is formed with a plurality of positioning holes 221, the cross section of which is in the shape of a straight line or a curve, a polygon and the like, and the positioning holes have directionality to be used as positioning reference; in the present embodiment, the cross section of the positioning hole 221 is cross-shaped;

preferably, the positioning holes 221 are formed together when the second contact holes 211 are formed on the stack by using a deep silicon etching process, and the number of the positioning holes 221 of the lamination stack 210 may be adjusted in order to improve the input-output rate and the workability; the positioning pins 222 are inserted into the positioning holes 221 between the stacked laminations 210 which are staggered up and down, so that the directions of the positioning holes 221 are kept consistent and the contact holes are aligned; to ensure the consistent direction of the upper and lower positioning holes 221, in the present embodiment, a plurality of positioning protrusions are distributed along the length direction of the outer side of the positioning pin 222, and are disposed inside the positioning holes 221 to prevent the positioning pin 222 from rotating after being inserted into the positioning holes 221; a plurality of positioning protrusions are distributed on both sides of the positioning pin 222 along the length direction to be disposed on at least two sides of the cross-shaped four sides of the positioning holes 221 (221);

the alignment pins 222 may be machined metal pins or made in the same manner as conventional probes;

the positioning pin 222 is formed with a positioning protrusion having elasticity and arranged obliquely at an angle with the vertical direction, preferably, the angle is between 30 degrees and 60 degrees, so as to exert a repulsive force in the horizontal direction (X-axis or Y-axis direction) in the positioning hole 221; therefore, when the positioning pin 222 is inserted into the positioning hole 221, the elastic force generated by the positioning protrusion causes the upper and lower positioning holes 221 to align, and the upper and lower contact holes also align; a plurality of lamination sheets 210, which are stacked up and down in a staggered manner and horizontally coupled, are formed by the horizontal coupling means 120 to be bonded to the support substrate;

the implementation manner of the second embodiment is specifically as follows: the lamination sheets 210 are stacked in a staggered manner and horizontally arranged in a proper number to have a desired area, and then the positioning pins 222 are inserted into the positioning holes 221 formed between the upper and lower lamination sheets 210 aligned by being staggered with each other, so that the lamination sheets 210 are overlapped and horizontally coupled, and the lamination sheets 210 having a multi-layer structure are formed to enhance bending resistance, thereby having excellent rigidity; the number of the positioning holes 221 on the lamination sheets 210 reaches more than four, and the number of the positioning pins 222 for fixing the lamination sheets 210 arranged up and down reaches more than two, so that the second contact holes 211 between the lamination sheets 210 can be aligned; only one alignment pin 222 is used to couple the lamination stack 210, and the alignment protrusions of the alignment pin 222 align the alignment holes 221 with each other, thereby aligning the upper and lower contact holes with each other.

The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;

secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (8)

1. A silicon substrate for a probe card having contact holes for fixing and arranging probes, characterized in that: the novel split-type packaging structure comprises a plurality of split pieces (110), a plurality of arrangement parts (140) are uniformly arranged at the outer edge of each split piece (110), each arrangement part (140) comprises an arrangement lug (141) and an arrangement groove (142), the arrangement lugs (141) and the arrangement grooves (142) are distributed at intervals, the plurality of split pieces (110) are longitudinally provided with a plurality of first contact holes (111) in a penetrating mode and horizontally arranged, a horizontal connecting device (120) and an elastic part (130) are arranged between every two adjacent split pieces (110), the horizontal connecting device (120) is located at the contact part between the split pieces (110) to horizontally connect the split pieces (110), and the elastic part (130) is located on one or all opposite side faces between the split pieces (110) connected through the horizontal connecting device (120).

2. The silicon substrate with contact holes for fixing and arranging the probe card according to claim 1, wherein: the elastic part (130) is made of a spring, and the elastic part (130) is integrated with the divided piece (110).

3. The silicon substrate with contact holes for fixing and arranging the probe card according to claim 1, wherein: the horizontal connecting device (120) comprises a clamping hook (121) and a pair of clamping pieces (122), the clamping hook (121) is positioned on the side surface of the dividing sheet (110), the clamping pieces (122) are positioned on the side surface of the dividing sheet (110) opposite to the clamping hook (121), and the clamping pieces (122) are buckled with the clamping hook (121).

4. The silicon substrate with contact holes for fixing and arranging the probe card according to claim 3, wherein: the elastic parts (130) are respectively positioned at two sides of the pair of clamping pieces (122), and the elastic parts (130) are fixedly connected with the dividing pieces (110).

5. A silicon substrate for a probe card having contact holes for fixing and arranging probes, characterized in that: the novel lamination stacking device comprises a plurality of laminations (210), wherein a plurality of second contact holes (211) are uniformly formed in two sides of each lamination (210), and a positioning coupling device (220) is arranged between every two adjacent laminations (210).

6. The silicon substrate with contact holes for fixing and arranging the probe card according to claim 5, wherein: the positioning and coupling device (220) comprises a plurality of positioning holes (221) and positioning pins (222) formed on each lamination (210) and used for vertically inserting the positioning holes (221) of the laminations (210) which are staggered and stacked up and down.

7. The silicon substrate with contact holes for fixing and arranging the probe card according to claim 6, wherein: the positioning holes (221) are formed in a directional shape, and the positioning pins (222) keep the directions of the positioning holes (221) arranged up and down in a consistent manner by using the vertical cross section as a positioning reference.

8. The silicon substrate with contact holes for fixing and arranging the probe card according to claim 7, wherein: the vertical section of the positioning hole (221) is in a shape of a Chinese character 'yi' or a shape of a Chinese character 'ten', a plurality of positioning protrusions are formed on the positioning pin (222) along the length direction of the outer surface, and the positioning protrusions include three types: the positioning device comprises a linear positioning protrusion (222 a), a bent positioning protrusion (222 b) and a positioning protrusion (222 c) with bulges at the tail end, wherein the positioning protrusions are obliquely arranged.

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