CN214544477U

CN214544477U - Optical anti-shake assembly and electronic equipment

Info

Publication number: CN214544477U
Application number: CN202120648295.9U
Authority: CN
Inventors: 汪科; 罗科
Original assignee: Nanchang OFilm Optoelectronics Technology Co Ltd
Current assignee: Nanchang OFilm Tech Co Ltd; Nanchang OFilm Optoelectronics Technology Co Ltd
Priority date: 2021-03-30
Filing date: 2021-03-30
Publication date: 2021-10-29
Anticipated expiration: 2031-03-30

Abstract

The application discloses optics anti-shake subassembly and electronic equipment, wherein, optics anti-shake subassembly includes: a circuit board, a shield member, and an optical drive assembly; the optical drive assembly is mounted on the protective part; the circuit board is arranged on one side of the protection part, which is far away from the optical drive assembly; the circuit board comprises a buffer part and a mounting part, and the mounting part surrounds the buffer part; the mounting part is fixedly connected with the protection part, and a gap is arranged between the buffering part and the protection part. In this application, only the installation department is fixed with the protection piece because of the circuit board, and buffer and protection piece are contactless state because of having the interval, therefore, partly fall the installation department that the stress acted on the circuit board, and partly fall the interval department that the stress transmitted between buffer and the protection piece, this interval has been equivalent to having set up the air buffer layer, can cushion partial stress, the impact force that makes MEMS receive from this reduces by a wide margin to protect MEMS, increased the product yield.

Description

Optical anti-shake assembly and electronic equipment

Technical Field

The present application relates to the field of optics, and in particular, to an optical anti-shake assembly and an electronic device.

Background

With the development of electronic products, the camera function has become one of the necessary functions of electronic products. The function of making a video recording mainly realizes through the module of making a video recording that has photosensitive assembly.

Current camera modules include circuit boards and micro-electro-mechanical systems (MEMS), wherein EMES is required to be attached to the circuit boards. However, because the accuracy of the plane required for mounting the EMES is very high, a severe requirement is imposed on the accuracy of the plane of the circuit board on which the EMES is mounted.

However, although the current equipment has machined a high-precision plane on the circuit board as much as possible, after the EMES is installed on the plane, the accuracy of the installed plane is not up to the standard, so that the drop stress is directly transmitted to the MEMS during the drop test, and a large amount of unqualified products are produced.

SUMMERY OF THE UTILITY MODEL

An object of the application is to provide an optics anti-shake subassembly and electronic equipment sets up fixed baseplate between circuit board and MEMS, disperses from this and falls stress, improves the product percent of pass.

The application provides an optical anti-shake subassembly in first aspect, includes: an optical drive assembly; a shield on which the optical drive assembly is mounted; the circuit board is arranged on one side of the protection part, which is far away from the optical drive assembly; the circuit board comprises a buffer part and a mounting part, and the mounting part surrounds the buffer part; the mounting part is fixedly connected with the protection part, and a gap is arranged between the buffering part and the protection part.

In some embodiments, a side of the buffer portion facing the guard is sunk with respect to the mounting portion to form a sunk groove; the part of the protection piece corresponding to the buffer part is at least partially positioned in the sunken groove.

In some embodiments, the shield includes a base plate and a flap plate that is outwardly folded along an edge of the base plate; the optical driving assembly is arranged on the substrate, the mounting part is fixedly connected with the turnover plate, and a gap is arranged between the buffer part and the substrate; the substrate corresponds to the buffer part and is at least partially positioned in the sinking groove.

In some embodiments, a surface of the substrate facing the optical driving component is flush with a surface of the mounting portion facing the optical driving component; or, the surface of one side of the substrate facing the optical drive assembly is lower than the surface of one side of the mounting part facing the optical drive assembly.

In some embodiments, the buffer portion includes a portion of the circuit board forming a sink groove; the mounting portion includes at least a portion of a circuit board that surrounds the sink.

In some embodiments, a first through hole is formed in the circuit board, and a sunken groove is formed in one side of the first through hole, which faces the protection part; the side of the first through hole, which is far away from the protection part, forms a buffer part, and at least part of the circuit board surrounding the first through hole forms a mounting part.

In some embodiments, the guard defines a second through-hole, the second through-hole communicating with the first through-hole; the optical drive assembly is provided with a closed cavity at the position, and air in the closed cavity is adsorbed through the second through hole, so that the optical drive assembly is adsorbed on the protection piece in a vacuum mode.

In some embodiments, the optical drive assembly is secured to the shield by an adhesive bond.

In some embodiments, a buffer is provided within the gap.

The second aspect of the present application provides an electronic device including a camera module in the second aspect of the present application. The electronic equipment using the camera module has stronger falling resistance strength of the camera module, so the whole service life is prolonged.

In this application, only the installation department is fixed with the protection piece because of the circuit board, and buffer and protection piece are contactless state because of having the interval, therefore, partly fall the installation department that the stress acted on the circuit board, and partly fall the interval department that the stress transmitted between buffer and the protection piece, this interval has been equivalent to having set up the air buffer layer, can cushion partial stress, the impact force that makes MEMS receive from this reduces by a wide margin to protect MEMS, increased the product yield.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings used in the embodiments will be briefly described below.

FIG. 1 is a schematic view of a camera assembly provided in an embodiment of the present application;

FIG. 2 is a schematic diagram of an optical anti-shake assembly provided in one embodiment of the present application;

fig. 3 is a schematic diagram of an optical anti-shake assembly provided in another embodiment of the present application.

Description of reference numerals:

the optical driving module comprises a circuit board 10, a buffer part 11, a buffer plate 111, a first through hole 112, a mounting part 12, a protection part 20, a base plate 21, a second through hole 211, a second surface 212, a first surface 213, a sink 13, a turnover plate 22, a first turnover edge 221, a second turnover edge 222, an optical driving module 30, a spacer 40, an image sensor 50, a lens 60, an optical filter 70, a protection shell 80, a cavity 81 and a lens seat 90.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

Generally, a camera module is often disposed on an electronic device, which includes a mobile phone, a tablet computer, a notebook computer, a palm computer, a Personal Digital Assistant (PDA), a Portable Media Player (PMP), a navigation device, a Digital TV, a desktop computer, a camera, a video camera, a telephone watch, and other electronic products.

Referring to fig. 3, the camera module includes a lens 60, a lens holder 90, a filter 70, an image sensor 50, and an optical anti-shake device. The image sensor 50 is installed in the optical anti-shake device, the lens holder 90 is disposed on the optical anti-shake device, the lens 60 is installed in the lens holder 90, and the optical filter 70 is disposed between the lens 60 and the optical anti-shake device.

The following details two specific structures of the optical anti-shake device provided in the embodiments of the present application.

Referring to fig. 1, in one embodiment, the optical anti-shake apparatus includes a circuit board 10, a shielding member 20, and an optical driving assembly 30.

The optical driving component 30 may be a MEMS optical driving component, and the optical driving component 30 may be attached to the back of the image sensor 50 to drive the image sensor 50 to move on three rotation axes. Therefore, in the photographing process, the optical driving assembly 30 can sense the instantaneous shake in the photographing process through the gyroscope, calculate the moving amplitude of the motor by depending on a certain algorithm, and perform quick compensation so as to avoid the blurring of the photographed image due to the shake.

The circuit board 10 may be a flexible board, a rigid board, or a rigid-flexible board, which is not limited in this application.

The guard 20 may be made of a steel plate, an alloy plate, or the like. The protection member 20, which is made of a steel plate or an alloy plate, etc., can be processed to have a very high flatness, so that the mounting accuracy requirement of the optical driving assembly 30 can be satisfied. The steel plate or alloy plate is also relatively strong in structural strength, and can increase the strength of the protector 20.

Specifically, the circuit board 10 includes a buffer portion 11 and a mounting portion 12, and the mounting portion 12 surrounds the buffer plate 111. The mounting portion 12 is fixedly connected to the protector 20, and a space 40 is provided between the buffer portion 11 and the protector 20.

Because the circuit board 10 only has the mounting portion 12 fixed with the protection member 20, and the buffer portion 11 and the protection member 20 are in a non-contact state due to the space 40, a part of the falling stress acts on the mounting portion 12 of the circuit board 10, and a part of the falling stress is transmitted to the space 40 between the buffer portion 11 and the protection member 20, the space 40 is equivalent to an air buffer layer, and can buffer a part of the falling stress, so that the impact force applied to the optical driving assembly 30 is greatly reduced, the optical driving assembly 30 is protected, and the product yield is increased.

It is understood that the optical driving assembly 30 is connected to a portion of the protection member 20 corresponding to the buffer portion 11 of the circuit board 10. Since the buffer portion 11 is not in direct contact with the protector 20, the optical drive unit 30 is protected by connecting only the optical drive unit 30 to the position corresponding to the buffer portion 11, and the optical drive unit 30 is protected by reducing the influence of the drop stress of the mounting portion 12 on the optical drive unit 30.

In some embodiments, a side of the cushioning portion 11 facing the protection member 20 is sunk with respect to the mounting portion 12 to form a sinking groove 13; the protection member 20 is at least partially located in the sink groove 13 at a portion corresponding to the cushioning portion 11. When a part of the portion of the protection element 20 opposite to the buffer portion 11 is located in the sinking groove 13, the space utilization rate is high, and the thickness of the optical anti-shake assembly can be reduced, the volume can be reduced, and the structure compactness can be enhanced.

In some embodiments, the guard 20 includes a base plate 21 and a flap plate 22 that is folded outwardly along an edge of the base plate 21. Wherein, the turnover plate 22 is turned outwards along the edge of the base plate 21; the optical driving assembly is arranged on the substrate 21, the mounting part 12 is fixedly connected with the turnover plate 22, and a gap 40 is arranged between the buffer part 11 and the substrate 21; the base plate 21 corresponds to the buffer portion 11 and is at least partially located in the sink groove 13.

As can be seen from fig. 1, the above structure corresponds to the buffer plate 111, the base plate 21 and the optical driving assembly 30 being stacked in sequence from bottom to top. And a layer of space 40 is further provided between the buffer plate 111 and the base plate 21. That is, the buffer plate 111, the spacer 40, the base plate 21, and the optical drive unit 30 are sequentially stacked from bottom to top.

Specifically, the turnover plate 22 is fixedly connected to the mounting portion 12 to integrally connect the protection member 20 and the circuit board 10. The mounting portion 12 and the buffer plate 111 may be integrally formed, that is, the sinking groove 13 may be formed on an integral plate to form the protection member 20. Two plates with different thicknesses can be welded to form the plate, and the application is not limited.

The folding plate 22 and the mounting portion 12 may be fixed by welding or by using an adhesive, without limitation. Wherein the folding plate 22 can be a first folding edge 221 extending obliquely upwards along the edge of the base plate 21, and the outer wall of the first folding edge 221 is fixedly connected with the side wall of the sink 13. Alternatively, the folding plate 22 may include a first folding edge 221 extending obliquely upward along an edge of the base plate 21, and a second folding edge 222 extending outward along the edge of the first folding edge 221 and parallel to the base plate 21, and the second folding edge 222 is welded to the mounting portion 12.

The substrate 21 includes a second surface 212 and a first surface 213 opposite to each other along a thickness direction thereof, wherein the second surface 212 faces the buffer plate 111, and the first surface 213 faces the optical driving assembly 30. When the protection member 20 is processed, the flatness of the first surface 213 is enhanced, so that the flatness of the first surface 213 meets the requirement of the optical driving assembly 30 for installation accuracy. The optical drive assembly 30 may then be packaged on the first surface 213, and the optical drive assembly 30 is mounted with high precision after packaging.

This embodiment provides an optical anti-shake apparatus, the drop stress of which mainly acts on the mounting portion 12 of the circuit board 10, and most of the stress is transmitted to the flip plate 22 because the flip plate 22 of the protection member 20 is connected to the mounting portion 12. Even if a small part of stress is transmitted from the turnover plate 22 to the substrate 21, the stress is absorbed by the space 40 at the bottom of the substrate 21, so that the impact force applied to the optical driving assembly 30 is greatly reduced, the optical driving assembly 30 is protected, and the product yield is increased.

In this embodiment, the buffer portion 11 includes a part of the circuit board forming the sink groove 13; the mounting portion 12 includes at least a portion of the circuit board 10 that surrounds the sink 13. Specifically, a part of the circuit board 10 forming the sink 13 is the buffer board 111 in fig. 1, and the rest of the circuit board 10 surrounding the buffer board 111 is the mounting portion 12. Thus, after the mounting portion 12 is wound around the buffer portion 11, the difference in thickness between the mounting portion 12 and the buffer plate 111 forms the aforementioned sink groove 13. The circuit board 10 with the structure has strong structural strength and is simple and convenient to process.

In some embodiments, a surface of the substrate 21 facing the optical driving assembly 30 is flush with a surface of the mounting portion 12 facing the optical driving assembly 30. Alternatively, the surface of the substrate 21 facing the optical driving unit 30 may be lower than the surface of the mounting portion 12 facing the optical driving unit 30. That is, the substrate 21 is located in the sink groove 13, and the upper surface thereof is flush with or slightly lower than the upper end of the sink groove 13, so that the thickness of the optical anti-shake assembly is reduced, the volume is reduced, and the structure is more compact.

In addition, a protective housing 80 may be covered on the circuit board 10, the protective housing 80 has a cavity 81, the side wall edges of the protective housing 80 are fixed to the upper surface of the mounting portion 12, and the protection member 20 and the optical driving assembly 30 are located in the cavity 81. By providing the protective housing 80, on the one hand, the optical drive assembly 30 and other components can be protected, and on the other hand, the protective housing 80 directly contacts the circuit board 10, and partial drop stress can be dispersed, thereby reducing the impact force on the optical drive assembly 30.

In some embodiments, a buffer member may be disposed in the space 40, and the buffer member may be made of a material having elasticity, such as rubber. Through setting up elastic buffer, can utilize this elastic buffer to absorb the stress of base plate transmission for the impact force that optical drive assembly received is lower, and is close to nothing even, thereby promotion product yield that can be better.

Referring to fig. 2, in another embodiment, the optical anti-shake apparatus includes a circuit board 10, a shielding member 20, and an optical driving assembly 30. The same parts of this embodiment as those of the above embodiment will not be described again. The difference section is detailed below.

In this embodiment, the circuit board 10 includes the first through hole 112 as the buffer portion 11 and the mounting portion 12, and the mounting portion 12 surrounds the first through hole 112.

Wherein, a sinking groove 13 is formed on one side of the first through hole 112 facing the protection member 20; the side of the first through hole 112 away from the protection member 20 forms a buffer portion 11, and at least a portion of the circuit board 10 surrounding the first through hole 112 forms a mounting portion 12. The circuit board 10 of this kind of structure, its whole weight is lighter, does benefit to the light weight design of optics anti-shake subassembly.

In this embodiment, the shielding member 20 also includes a substrate 21 and a flip plate 22, wherein the substrate 21 has a second surface 212 and a first surface 213 opposite to each other, the first surface 213 faces the optical driving assembly 30, and the second surface 212 is located in the first through hole 112. And the first surface 213 is flush with the upper surface of the mounting portion 12 or slightly lower than the upper surface of the mounting portion 12.

In some embodiments, the protection member 20 defines a second through hole 211, and the second through hole 211 is communicated with the first through hole 112; the optical driving assembly 30 is disposed in a closed chamber, and air in the closed chamber is sucked through the second through hole 211, so that the optical driving assembly 30 is vacuum-sucked on the protection member 20. The protection member 20 is opened with a second through hole 211 communicating with the first through hole 112, so that the first through hole 112 and the second through hole 211 provide a vacuum suction force to suck the optical driving assembly 30 onto the first surface 213 of the substrate 21. This kind of fixed mode, stability is better, and the operation is convenient.

The foregoing detailed description of the embodiments of the present application has been presented to illustrate the principles and implementations of the present application, and the description of the embodiments is only provided to help understand the method and the core concept of the present application.

Claims

1. An optical anti-shake assembly, comprising:

an optical drive assembly;

a shield on which the optical drive assembly is mounted;

the circuit board is arranged on one side of the protection part, which faces away from the optical drive assembly; the circuit board comprises a buffer part and a mounting part, and the mounting part surrounds the buffer part; the mounting portion is fixedly connected with the protection piece, and a gap is arranged between the buffering portion and the protection piece.

2. The optical anti-shake apparatus according to claim 1, wherein a side of the buffer portion facing the guard is sunk with respect to the mounting portion to form a sunk groove; the part of the protection piece corresponding to the buffer part is at least partially positioned in the sunken groove.

3. The optical anti-shake assembly of claim 2, wherein the guard comprises a base plate and a flap plate that is outwardly folded along an edge of the base plate; the optical driving assembly is arranged on the substrate, the mounting part is fixedly connected with the turnover plate, and the interval is arranged between the buffer part and the substrate;

the substrate corresponds to the buffer part and is at least partially positioned in the sinking groove.

4. The optical anti-shake assembly according to claim 3, wherein a surface of the substrate facing the optical driving assembly is flush with a surface of the mounting portion facing the optical driving assembly; alternatively, the first and second electrodes may be,

the surface of one side of the substrate facing the optical drive assembly is lower than the surface of one side of the mounting part facing the optical drive assembly.

5. The optical anti-shake assembly according to claim 2, wherein the buffer portion includes a portion of the circuit board forming the sink groove; the mounting portion includes at least a portion of the circuit board surrounding the sink.

6. The optical anti-shake apparatus according to claim 2, wherein the circuit board is provided with a first through hole, and a side of the first through hole facing the guard member forms the sink groove; the buffer part is formed on one side of the first through hole, which is far away from the protection part, and the mounting part is formed around at least part of the circuit board around the first through hole.

7. The optical anti-shake assembly according to claim 6, wherein the guard defines a second through hole, the second through hole communicating with the first through hole; the optical drive assembly is provided with a closed cavity at the position, and air in the closed cavity is adsorbed through the second through hole, so that the optical drive assembly is adsorbed on the protection piece in a vacuum mode.

8. The optical anti-shake apparatus according to claim 1, wherein the optical driving assembly is fixed to the protection member by an adhesive.

9. An optical anti-shake assembly according to any of claims 1 to 8, wherein a buffer is provided in the gap.

10. An electronic device comprising the optical anti-shake assembly as claimed in claim 9.