CN214458338U - Etching device with pre-etching process - Google Patents
Etching device with pre-etching process Download PDFInfo
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- CN214458338U CN214458338U CN202120483397.XU CN202120483397U CN214458338U CN 214458338 U CN214458338 U CN 214458338U CN 202120483397 U CN202120483397 U CN 202120483397U CN 214458338 U CN214458338 U CN 214458338U
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Abstract
The utility model relates to an etching device with etching process in advance, it has a measuring mechanism who sets up side by side, a leveling mechanism, an etching mechanism and one run through the transfer mechanism that is located each inside of mechanism, this measuring mechanism and this leveling mechanism treat the circuit board of processing and measure and make the copper foil thickness of circuit board the same with etching process in advance, this etching mechanism carries out rough etching treatment with first etching portion to the circuit board, carry out comparatively careful etching treatment with the etching liquid of second etching portion spun specific proportion, and get rid of the processing with the etching liquid of establishing absorption portion with the circuit board, reach the efficiency that improves the etching factor from this.
Description
Technical Field
The present invention relates to a printed circuit board manufacturing apparatus, and more particularly, to an etching apparatus for removing conductive material to form a circuit or a pattern by using an etching technique.
Background
The circuit board of the prior art is constructed by disposing a conductive copper foil on a substrate, coating a resist film as a mask layer on the copper foil of the substrate at the position where a circuit or a pattern is to be formed, removing the conductive layer of the copper foil which is not blocked by the resist film by an etching solution, and finally forming the circuit or the pattern with a conductive function on the substrate.
In order to provide the use of various high-tech products, the volume of the circuit board is gradually reduced and more circuits are arranged, so that the width of the arranged circuits or the intervals among the circuits are greatly reduced, therefore, when the circuits or the patterns are processed by using an etching engineering, an etching device sprays etching liquid on the copper foil of the substrate, the etching liquid and the copper foil which is not shielded and protected by a resistance agent film are etched, and the circuits or the patterns with extremely small intervals among the circuits cannot be processed due to the large grain size of the etching liquid, so that the defect that the etching factor (E/F etch factor) is difficult to improve exists.
To solve the above-mentioned problem, the prior art discloses the "etching method and etching apparatus" patent of Taiwan invention TWI539876, the technical means comprises a 1 st etching step of spraying an etching solution from a 1 st fluid nozzle to blow the etching solution onto an etching target surface of an object to be etched to etch the etching target surface, and mixing the etching solution with gas, spraying from the 2 fluid nozzle, and blowing the etching solution onto the etched surface in the 1 st etching step, so as to achieve the 2 nd etching process for further etching the etching object surface, wherein the 2 nd etching process has etching solution with more tiny droplets, and the etching solution is blown on the etching object surface by stronger impact force than the 1 st etching process, therefore, the etching factor can be properly increased by effectively combining the etching solution sprayed from the fluid nozzle 1 and the mixed solution of the etching solution and the gas sprayed from the fluid nozzle 2.
Although the aforementioned technical means of the prior art disclosed invention can improve the etching factor, the current circuit board is in response to the needs of high-tech products, and the trend of the etched lines or patterns is toward miniaturization, so there is a need for further improvement in terms of the improvement of the etching factor.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a solve the problem and the shortcoming that aforementioned prior art exists, the copper foil on the circuit board of treating processing earlier of applied technical means makes the copper foil have the same thickness with etching process in advance, carry out rough etching treatment to the circuit board with first etching portion again, the proportion that the total amount was erupted for first nozzle and second nozzle with the second etching liquid volume that second etching portion spun accounts for more than 55% after that, carry out comparatively careful etching treatment to the circuit board copper foil, can obtain higher etching factor.
In order to achieve the above object of the present invention, the present invention provides an etching apparatus with a pre-etching process, which comprises a transfer mechanism, a measuring mechanism, a leveling mechanism and an etching mechanism, wherein the transfer mechanism penetrates through the measuring mechanism, the leveling mechanism and the etching mechanism arranged in sequence;
the transfer mechanism can be used for transferring a circuit board to be processed and is provided with a frame, a plurality of lower transfer rod bodies which are arranged in parallel are arranged on the frame, each lower transfer rod body forms a first transverse transfer position, a plurality of upper transfer rod bodies which are arranged in parallel are arranged on the frame, each upper transfer rod body forms a second transverse transfer position and is oppositely positioned on the etching mechanism, and an interval for transferring the circuit board is formed between the first transverse transfer position and the second transverse transfer position;
the measuring mechanism comprises at least one sensor and is arranged on a frame body, the sensor can measure the thickness of the copper foil of the circuit board at the first transverse transfer position and transmit the measured information to an arithmetic processing unit;
the leveling mechanism is provided with a pre-etcher and a plurality of nozzles, the pre-etcher and each nozzle are corresponding to the conveying path of the transfer mechanism, the pre-etcher is connected with the arithmetic processing unit, and the arithmetic processing unit can control the etching liquid sprayed by each nozzle to pre-etch the surface of the copper foil of the circuit board;
the etching mechanism is provided with an etching processing chamber, a hollow body of the etching processing chamber is provided with a groove body at the bottom, etching liquid is contained in the groove body, a first etching part, a second etching part and a suction part are arranged in the etching processing chamber, the first etching part and the second etching part are arranged in parallel along the transfer direction of the circuit board, the suction part is provided with a plurality of suction nozzles, each suction nozzle is arranged adjacent to the first etching part and the second etching part, and the suction nozzle is provided with at least one suction port and corresponds to the upper surface of the circuit board which is transferred to pass through so as to remove the etching liquid on the circuit board;
the first etching part is provided with a first nozzle, the first nozzle sprays first etching liquid, the second etching part is provided with a second nozzle, the second nozzle sprays second etching liquid, the second etching liquid is pressurized by a pump and is conveyed to the second nozzle through a pipeline after being introduced with air at high pressure to be sprayed, and the liquid amount of the second etching liquid sprayed by the second nozzle accounts for more than 55 percent of the total amount sprayed by the first nozzle and the second nozzle.
The etching device with the pre-etching process is characterized in that the first nozzle is provided with a plurality of first upper nozzles and a plurality of first lower nozzles, the first etching liquid is pressurized by a pump and then is conveyed to the first upper nozzles and the first lower nozzles through pipelines to be sprayed out, the liquid drops of the first etching liquid can roughly etch the copper foil of the circuit board, the second nozzle is provided with a plurality of second upper nozzles and a plurality of second lower nozzles, the second etching liquid is pressurized by a pump and is introduced into air at high pressure and then is conveyed to the second upper nozzles and the second lower nozzles through pipelines, and the second etching liquid is sprayed out to be fine liquid drops to carry out fine etching treatment.
The utility model discloses an application of aforementioned technical means, treat the circuit board of processing behind the etching process in advance of measuring mechanism and etching mechanism in advance, can make the copper foil thickness on the circuit board reach evenly the same, it carries out rough etching treatment to the first etching solution of etching mechanism through the first nozzle spun of first etching portion to transfer, reentrant second etching portion, the second nozzle spun second etching solution liquid volume of second etching portion accounts for more than 55% for the proportion of first nozzle and the total amount that the second nozzle jetted, the second etching solution has small liquid drop and can form and have stronger impact force, in order to reach and make etching factor (E/F) increase by a wide margin.
Drawings
Fig. 1 is a schematic configuration diagram of the present invention.
Fig. 2 is an enlarged schematic view of the measuring mechanism and the leveling mechanism of the present invention.
Fig. 3 is a schematic view of the circuit board to be processed according to the present invention.
Fig. 4 is a schematic diagram of the circuit board to be processed in the transfer mechanism and the measuring mechanism according to the present invention.
Fig. 5 is an enlarged schematic view of the etching mechanism of the present invention.
Fig. 6 is a schematic diagram of the circuit board after being processed by the leveling mechanism of the present invention.
FIG. 7 is a schematic diagram of a circuit board with a resist applied at the circuit or pattern locations.
Fig. 8 is a schematic diagram of the circuit board etched by the etching mechanism of the present invention.
Detailed Description
Referring to fig. 1, the present invention relates to an etching apparatus with a pre-etching process, which comprises a transfer mechanism 10, a measuring mechanism 20, a leveling mechanism 30 and an etching mechanism 40, wherein the transfer mechanism 10 is disposed inside the measuring mechanism 20, the leveling mechanism 30 and the etching mechanism 40 arranged in sequence, and a circuit board 50 to be processed is disposed on the transfer mechanism 10 and moves towards the measuring mechanism 20, the leveling mechanism 30 and the etching mechanism 40 for processing.
Referring to fig. 2, 3 and 4, the transfer mechanism 10 is disposed on a frame, which is a prior art frame and is not shown. The circuit board 50 to be processed can be transferred by the transfer mechanism 10, and the transfer mechanism 10 shown in the figure is one embodiment of the prior art that can be used to transfer the circuit board 50 to be processed, and is configured to roughly arrange a plurality of lower transfer rods 11 on the frame, wherein each of the lower transfer rods 11 is arranged in parallel with each other, so that the circuit board 50 to be processed is transferred on a plane, and each of the lower transfer rods 11 forms a first transverse transfer position. Referring to fig. 5, a plurality of upper transfer bars 12 are disposed on a frame opposite to the etching mechanism 40, the upper transfer bars 12 are disposed parallel to each other on another transfer plane, each of the upper transfer bars 12 is formed at a second lateral transfer position, a space is formed between each of the lower transfer bars 11 and each of the upper transfer bars 12, and a circuit board 50 is movable above each of the lower transfer bars 11 at the first lateral transfer position or is transferred in a space formed between each of the upper transfer bars 12 and each of the lower transfer bars 11.
The measuring mechanism 20 includes at least one sensor 21, which can be disposed on a frame of the prior art, the detecting direction of each sensor 21 is toward the transfer mechanism 10, the embodiment shown in the figure is downward detection of the circuit board 50 passing through, when the circuit board 50 passes through the measuring mechanism 20, the sensor 21 can measure the thickness of the copper foil 51 of the circuit board 50 at different positions, and the measured information is transmitted to an arithmetic processing unit, which is prior art and is not shown in the figure.
One embodiment of the measuring mechanism 20 can be a radio frequency copper measuring instrument used in the prior art, each of the sensors 21 can project radio frequency and receive radio frequency, the ranges of the radio frequency projected are mutually overlapped, and the surface of the circuit board 50 can be completely covered to measure the thickness of the copper foil 51. Since the thickness of the copper foil 51 of the circuit board 50 provided on the substrate is not completely the same in each of the different regions, as shown in fig. 3, the copper foil 51 has a plurality of projections 511, and the thickness of each of the projections 511 is thicker in a region than in other regions, and when the circuit board 50 is placed on the transfer mechanism 10 and conveyed to the measurement mechanism 20, each sensor 21 measures each region of the copper foil 51 of the circuit board 50, and the measurement mechanism 20 can detect and acquire position information corresponding to each of the projections 511.
The leveling mechanism 30, which has a pre-etcher 31 and a plurality of nozzles 32, the pre-etcher 31 corresponding to the conveying path of the transfer mechanism 10, each nozzle 32 disposed on the pre-etcher 31 and facing the circuit board 50 located on the transfer mechanism 10, the number of nozzles 32 installed in the pre-etcher 31 can be adjusted according to the need, the pre-etcher 31 of the leveling mechanism 30 can be connected to the arithmetic processing unit, and can transmit the information of the position of the protrusion 511 of the circuit board 50 detected by the measuring mechanism 20 to the pre-etcher 31 of the leveling mechanism 30, the pre-etcher 31 starts the nozzle 32 corresponding to the protrusion 511 of the circuit board 50, the etching solution sprayed from the nozzle 32 can etch each protrusion 511 on the copper foil 51, therefore, the thickness of the copper foil 51 is trimmed, and the thickness of the copper foil 51 on the circuit board 50 can be approximately uniform at each position.
Referring to fig. 6, after the circuit board 50 is processed, the thickness of the copper foil 51 on the surface of the substrate 52 of the circuit board 50 is the same, and then the circuit or pattern is formed, as shown in fig. 7, a resist film 53 is coated on the surface of the copper foil 51 of the circuit board 50 and the surface to be formed with the circuit or pattern, and the circuit board 50 completed with the semi-finished product is transferred from the transfer mechanism 10 to the next processing station.
Referring to fig. 5, the etching mechanism 40 has an etching chamber, which is a hollow body, a first etching portion 41, a second etching portion 42 and a suction portion 43 are installed inside the etching chamber, a tank 400 is installed at the bottom of the tank of the etching mechanism 40, etching solution 401 is contained inside the tank 400, the first etching portion 41 and the second etching portion 42 are arranged in parallel along the conveying direction of the circuit board 50 in the conveying mechanism 10, the suction portion 43 has a plurality of suction nozzles 431, the suction portion 43 is arranged adjacent to the first etching portion 41 and the second etching portion 42, the suction nozzles 431 have at least one suction port, the suction port of each suction nozzle 431 is corresponding to the upper surface of the circuit board 50 passing through the conveying mechanism, in practice, the etching solution 401 inside the tank 400 is conveyed to the first etching portion 41 and the second etching portion 42 by a pipeline to etch the circuit board 50, the etched etching solution 401 flows into the tank 400, the etching solution remaining on the circuit board 50 is sucked by the suction nozzles 431 of the suction parts 43 through the suction parts 43, so that the etching solution is separated from the surface of the circuit board 50 to prevent the unexpected over-etching during the transfer of the transfer mechanism 10.
The first etching part 41 has a first nozzle 410, the first nozzle 410 ejects a first etching solution, the first nozzle 410 has a plurality of first upper nozzles 411 and a plurality of first lower nozzles 412, and droplets of the first etching solution ejected by the first nozzle 410 are large. The first etching solution is pressurized by a pump and then is transported to each first upper nozzle 411 and each first lower nozzle 412 through a pipeline to be sprayed, each first upper nozzle 411 is arranged at the upper position of the transfer mechanism 10, the sprayed first etching solution is sprayed downwards, each first lower nozzle 412 is arranged at the lower position of the transfer mechanism 10, the sprayed first etching solution is sprayed upwards, and the droplets of the first etching solution sprayed by the first nozzles 410 are large, so that the copper foil 51 of the circuit board 50 can be roughly etched.
The second etching part 42 has a second nozzle 420, the second nozzle 420 sprays the second etching solution, the second nozzle 420 has a plurality of second upper nozzles 421 and a plurality of second lower nozzles 422, the second etching solution is pressurized by a pump and introduced with air at high pressure and then is delivered to each of the second upper nozzles 421 and each of the second lower nozzles 422 through a pipeline to spray, each of the second upper nozzles 421 is disposed at an upper position of the transfer mechanism 10 and sprays the second etching solution mixed with gas downward, each of the second lower nozzles 422 is disposed at a lower position of the transfer mechanism 10 and sprays the second etching solution mixed with gas upward. The utility model discloses the second etching solution that second nozzle 420 erupted mixes has highly-compressed air to erupt by second nozzle 420 again, because the second etching solution of second etching portion 42 is the liquid drop of micronizing, the second etching solution that erupts has more tiny liquid drop and can form and have stronger impact force than first etching solution to tiny etching solution liquid drop carries out comparatively careful etching treatment to circuit board 50's copper foil 51, consequently can obtain the circuit or the careful pattern of less width.
The suction unit 43 includes a plurality of suction nozzles 431, each of the suction nozzles 431 is located above the circuit board 50 transported by the transporting mechanism 10, a suction port of one end of each of the suction nozzles 431 is adjacent to the upper surface of the circuit board 50, and the other end is connected to a suction device (not shown), which is a conventional suction device (not shown), for example: the suction device is a negative pressure generating device, which can make the suction ports of the suction nozzles 431 have a suction force, and each suction nozzle 431 can suck the etching solution above the circuit board 50.
The second etching solution sprayed from the second nozzle 420 of the second etching portion 42 is formed by mixing the etching solution and high-pressure air, the second etching solution is pressurized by a pump and then is conveyed to the second nozzle 420 through a pipeline, the pressurized air is conveyed to the nozzle 420 through an air pipeline, the mixed second etching solution containing the high-pressure air is sprayed from the second upper nozzles 421 and the second lower nozzles 422, the copper foil 51 of the circuit board 50 which is not covered by the resist film 53 is etched, and the circuit board 50 has the designed circuit 510 or pattern after the completion.
The utility model discloses in implementing preparation circuit board 50, at first with semi-manufactured goods circuit board 50 via the processing operation of this measuring mechanism 20 and this leveling mechanism 30, make the thickness of copper foil 51 can tend to same thickness, when circuit board 50 is transferred to etching mechanism 40, etch the copper foil 51 that is not covered by resistance agent membrane 53 with the first etching solution of first nozzle 410 spun of first etching portion 41, because first etching solution liquid drop is great, can carry out rough etching to circuit board 50's copper foil 51, semi-manufactured goods circuit board 50 transfers again and etches via the second etching solution of second nozzle 420 spun of second etching portion 42, have more minute liquid drop and can form and have stronger impact force by first etching solution, make the line width or the pattern that the etching was made can be comparatively small.
The etching mechanism 40 of the present invention performs an etching test on the circuit board, and the etching test mode is the same as the etching test mode of taiwan invention TWI539876 of china proposed by the background art. The following table shows the test of the circuit board formed with two different lines or patterns, one of which is the line or pattern formation with L/S of 20/20 μm for the circuit board with 18 μm copper foil, and the other is the line or pattern formation with L/S of 50/50 μm for the circuit board with 35 μm copper foil, with reference to fig. 8, where L denotes the width of the line 510 or pattern between the resist film 53 and the substrate 52, and S denotes the spacing distance between the line 510 or pattern between the resist film 53 and the substrate 52 as two adjacent resist films 53.
For example, the test example described in the table as L/S20/20 μm has a line 510 or pattern width and a spacing distance between two adjacent lines 510 or patterns of 20 μm. Further, the etching conditions of the experimental examples were set such that the first etching hydraulic pressure of the first nozzle 410 was 0.2Mpa and the second engraving hydraulic pressure of the second nozzle 420 was 0.3 Mpa. The etching factors (E/F) obtained by the tests were 4.7, 5.9, 6.5, 6.9, 7.1, 7.2, 7.5, 7.7 and 7.8, respectively, in which the amounts of the second etching solution liquid sprayed from the second nozzle 420 were changed to 0.0%, 2.0%, 6.0%, 12.1%, 24.1%, 44.1%, 55.0%, 75.1% and 100.0%, respectively.
The test results obtained from the table contents after the test are optimized to be 55% or more of the amount of the second etching liquid ejected from the second nozzle 420 relative to the total amount of the liquids ejected from the first nozzle 410 and the second nozzle 420, and the etching factor (E/F) is greatly increased, thereby having a more appropriate etching factor (E/F).
Claims (2)
1. An etching device with a pre-etching process is characterized by comprising a transfer mechanism, a measuring mechanism, a leveling mechanism and an etching mechanism, wherein the transfer mechanism penetrates through the measuring mechanism, the leveling mechanism and the etching mechanism which are arranged in sequence;
the transfer mechanism can be used for transferring a circuit board to be processed and is provided with a frame, a plurality of lower transfer rod bodies which are arranged in parallel are arranged on the frame, each lower transfer rod body forms a first transverse transfer position, a plurality of upper transfer rod bodies which are arranged in parallel are arranged on the frame, each upper transfer rod body forms a second transverse transfer position and is oppositely positioned on the etching mechanism, and an interval for transferring the circuit board is formed between the first transverse transfer position and the second transverse transfer position;
the measuring mechanism comprises at least one sensor and is arranged on a frame body, the sensor can measure the thickness of the copper foil of the circuit board at the first transverse transfer position and transmit the measured information to an arithmetic processing unit;
the leveling mechanism is provided with a pre-etcher and a plurality of nozzles, the pre-etcher and each nozzle are corresponding to the conveying path of the transfer mechanism, the pre-etcher is connected with the arithmetic processing unit, and the arithmetic processing unit can control the etching liquid sprayed by each nozzle to pre-etch the surface of the copper foil of the circuit board;
the etching mechanism is provided with an etching processing chamber, the etching processing chamber is a hollow body, the bottom of the etching processing chamber is provided with a groove body, etching liquid is contained in the groove body, a first etching part, a second etching part and a suction part are arranged in the etching processing chamber, the first etching part and the second etching part are arranged in parallel along the transfer direction of the circuit board, the suction part is provided with a plurality of suction nozzles, each suction nozzle is arranged adjacent to the first etching part and the second etching part, and the suction nozzle is provided with at least one suction port and corresponds to the upper surface of the circuit board which is transferred to pass through so as to remove the etching liquid on the circuit board;
the first etching part is provided with a first nozzle, the first nozzle sprays first etching liquid, the second etching part is provided with a second nozzle, the second nozzle sprays second etching liquid, the second etching liquid is pressurized by a pump and is conveyed to the second nozzle through a pipeline after being introduced with air at high pressure to be sprayed, and the liquid amount of the second etching liquid sprayed by the second nozzle accounts for more than 55 percent of the total amount of the liquid sprayed by the first nozzle and the second nozzle.
2. The etching apparatus with pre-etching process as claimed in claim 1, wherein the first nozzle has a plurality of first upper nozzles and a plurality of first lower nozzles, the first etching solution is pressurized by a pump and then transported to each of the first upper nozzles and each of the first lower nozzles through a pipe to be sprayed, the droplets of the first etching solution can perform a rough etching process on the copper foil of the circuit board, the second nozzle has a plurality of second upper nozzles and a plurality of second lower nozzles, the second etching solution is pressurized by a pump and introduced with air at a high pressure and then transported to each of the second upper nozzles and each of the second lower nozzles through a pipe to be sprayed, and the second etching solution is finer droplets to perform a fine etching process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120483397.XU CN214458338U (en) | 2021-03-05 | 2021-03-05 | Etching device with pre-etching process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120483397.XU CN214458338U (en) | 2021-03-05 | 2021-03-05 | Etching device with pre-etching process |
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| Publication Number | Publication Date |
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| CN214458338U true CN214458338U (en) | 2021-10-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202120483397.XU Active CN214458338U (en) | 2021-03-05 | 2021-03-05 | Etching device with pre-etching process |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114554715A (en) * | 2022-01-11 | 2022-05-27 | 福建闽威科技股份有限公司 | Novel circuit board surface treatment method |
| CN114574862A (en) * | 2022-03-03 | 2022-06-03 | 东莞赛诺高德蚀刻科技有限公司 | Wind-assisted etching device and method for non-equal-depth structure |
-
2021
- 2021-03-05 CN CN202120483397.XU patent/CN214458338U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114554715A (en) * | 2022-01-11 | 2022-05-27 | 福建闽威科技股份有限公司 | Novel circuit board surface treatment method |
| CN114554715B (en) * | 2022-01-11 | 2023-06-27 | 福建闽威科技股份有限公司 | Circuit board surface treatment method |
| CN114574862A (en) * | 2022-03-03 | 2022-06-03 | 东莞赛诺高德蚀刻科技有限公司 | Wind-assisted etching device and method for non-equal-depth structure |
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