CN214452077U

CN214452077U - Chip feeding device

Info

Publication number: CN214452077U
Application number: CN202023215695.5U
Authority: CN
Inventors: 门洪达; 陶建军
Original assignee: Dongguan Guanzai Robot Co Ltd
Current assignee: Dongguan Guanzai Robot Co Ltd
Priority date: 2020-12-28
Filing date: 2020-12-28
Publication date: 2021-10-22
Anticipated expiration: 2030-12-28

Abstract

The utility model provides a pair of chip feedway, include the support frame, install the stacker on the support frame, the stacker below is equipped with and pushes away the material pipe that the material subassembly is used for the propelling movement to place in the stacker, it connects on the support frame to push away material subassembly sliding connection, the feed guide rail that the slope set up is installed to one side of support frame, the top of feed guide rail is equipped with gets the material subassembly and is used for the material pipe of taking. Compared with the prior art, the utility model provides a pair of chip feedway adopts automatic feed, pour into the transport that carries out the chip in the feed slide rail after getting the material pipe of material subassembly and taking and slope, only need to take the chip in last silo position installation manipulator can be with the material pipe of going up in the silo, reduce the artifical probability of taking, avoid the chip to appear harmfully such as damage, can push into the material pipe of empty in the collection box when getting the material pipe and collect, do not need manual intervention to collect, reduce the cost of labor, the material loading efficiency has been improved.

Description

Chip feeding device

Technical Field

The utility model relates to the technical field of mechanical equipment, specifically a chip feedway.

Background

In chip manufacturing process, in order to make the production and manufacturing of resistance chip adapt to automated production operation, generally can carry out the braid earlier to the chip and handle, the chip need load square long banding material pipe after the preparation in, place the braid after unpacking the material pipe of the integrated circuit chip that has packed again, be about to the chip is in turn the adhesion braid, can arrange a plurality of chips through the braid and adhere on the production tool or the location cardboard that correspond like this for subsequent chip processing operation of can being convenient for. Traditional chip braid operation is through the manual work material loading, pours the chip slope in the material pipe back and places on the carrier band again, needs the operation personnel to wait always to carry out the feed beside the braider, and the operation fatigue appears easily in the long-term operation of operation personnel to the efficiency and the quality that lead to the material loading are relatively poor, increase manufacturing cost.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a chip feedway to solve the technical problem in the background art.

In order to achieve the above object, the present invention provides the following technical solutions:

the utility model provides a chip feedway, includes the support frame, installs the windrow on the support frame, windrow frame below is equipped with and pushes away the material pipe that the material subassembly is used for propelling movement placing in the windrow frame, it connects on the support frame to push away the material subassembly sliding connection, the feed guide rail that the slope set up is installed to one side of support frame, the top of feed guide rail is equipped with gets the material subassembly and is used for taking the material pipe.

The material pushing assembly comprises a material pushing plate and a material pushing cylinder, wherein a material containing groove for containing a material pipe is formed in the material pushing plate, the material containing groove penetrates through the front end and the rear end of the material pushing plate, the material pushing cylinder is fixed on the supporting frame, and the material pushing cylinder drives the material pushing plate to move along the X-axis direction.

The feed guide rail includes mounting panel and feed slide rail, the feed slide rail is fixed on the mounting panel, the mounting panel slope is fixed, the one end and the support frame fixed connection of mounting panel, be equipped with the slide in the feed slide rail and be used for carrying the chip, the below of feed slide rail is equipped with first material subassembly that ends, first material subassembly that ends includes first flitch and first material cylinder that ends, first material cylinder that ends is installed on the mounting panel, first flitch and first material cylinder drive connection that ends, first material board that ends inserts in the slide, the bottom of feed slide rail is equipped with the silo and communicates with each other with the slide, the discharge gate position of going up the silo is equipped with and keeps off the material subassembly and prevent the chip landing.

Get the material subassembly and include the U-shaped supporting seat and get the material cylinder, the supporting seat includes support arm and under bracing arm, it fixes in the mounting panel below to get the material cylinder, the under bracing arm rotation connection of linking arm and supporting seat is passed through in the drive shaft of getting the material cylinder, the one end and the under bracing arm fixed connection of linking arm, its other end through the pivot with get the material cylinder and rotate and be connected, it is rotatory along the pivot to get material cylinder drive supporting seat, it installs the material subassembly of pressing in the top of going up the support arm, press the material subassembly including pressing the material cylinder and pressing the material piece, press the material cylinder to fix on the upper bracing arm, press the material piece to press the material cylinder below and press the material cylinder drive to be connected, it is spacing to be equipped with pressing the material groove on the material piece and be used for carrying out the pressfitting to the material pipe.

One side of pushing away the material subassembly is equipped with the several cushion, the cushion just protrudes the scraping wings outside in the scraping wings below, the cushion with get material subassembly position corresponding, support frame one side is equipped with the case that gathers materials, the case that gathers materials and cushion are in the same one side of support frame.

Keep off material subassembly below and be equipped with the defective products slide rail, the defective products slide rail communicates with each other with the feed slide rail, it includes striker plate and keeps off the material cylinder to keep off the material subassembly, the striker plate is between defective products slide rail and feed slide rail, striker plate and fender material cylinder drive connection, keep off material cylinder and mounting panel fixed connection.

Compared with the prior art, the utility model provides a pair of chip feedway adopts automatic feed, pour into the transport that carries out the chip in the feed slide rail after getting the material pipe of material subassembly and taking and slope, only need to take the chip in last silo position installation manipulator can be with the material pipe of going up in the silo, reduce the artifical probability of taking, avoid the chip to appear harmfully such as damage, can push into the material pipe of empty in the collection box when getting the material pipe and collect, do not need manual intervention to collect, reduce the cost of labor, the material loading efficiency has been improved.

Drawings

FIG. 1: a schematic three-dimensional structure diagram of the chip feeding mechanism;

FIG. 2: a top view of the chip feeding mechanism;

FIG. 3: a schematic three-dimensional structure diagram of the pushing assembly;

FIG. 4: a schematic three-dimensional structure of the feeding guide rail;

FIG. 5: fig. 6 is an enlarged view at a;

FIG. 6: get material subassembly spatial structure sketch map.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

Specific example 1: please refer to fig. 1 to 6, in an embodiment of the present invention, a chip feeding device includes a support frame 4, and a stacker 5 installed on the support frame 4, a pushing assembly 6 is installed below the stacker 5 for pushing a material pipe placed in the stacker 5, the pushing assembly 6 is slidably connected to the support frame 4, a feeding guide rail 9 disposed obliquely is installed on one side of the support frame 4, a bottom end of the feeding guide rail 9 is located at a rear side of a chip transfer mechanism 12, and a material taking assembly 8 is installed at a top end of the feeding guide rail 9 for taking the material pipe.

The pushing assembly 6 comprises a pushing plate 602 and a pushing cylinder 601, the pushing plate 602 is provided with an object placing groove 602-1 for placing a material tube, the object placing groove 602-1 penetrates through the front end and the rear end of the pushing plate 602, the pushing cylinder 601 is fixed on the support frame 4, and the pushing cylinder 601 drives the pushing plate 602 to move along the X-axis direction. The material pushing plate 602 is arranged below the stacking rack 5 and used for receiving the material pipe falling from the stacking rack 5 and then moving the material pipe towards the material taking assembly 8 to convey the material pipe.

The supply rail 9 comprises a mounting plate 901 and a supply rail 902, the supply rail 902 is fixed to the mounting plate 901, the mounting plate 901 is fixed obliquely, one end of the mounting plate 901 is fixedly connected with the support frame 4, a slideway 902-1 is arranged in the feeding slide rail 902 and used for conveying the chip, a first material stopping component 903 is arranged below the feeding slide rail 902, the first material stopping component 903 comprises a first material stopping plate 903-2 and a first material stopping cylinder 903-1, the first material stopping cylinder 903-1 is installed on the installation plate 901, the first material stopping plate 903-2 is in driving connection with the first material stopping cylinder 903-1, the first material stopping plate 903-2 is inserted into the slideway 902-1, the bottom end of the material supply slide rail 902 is provided with a feeding groove 902-2 communicated with the slideway 902-1, and a material blocking assembly 904 is arranged at the discharge hole of the feeding trough 902-2 to prevent the chip from sliding down. The material taking assembly 8 takes the material pipe and then pours the chips in the material pipe into the slide 902-1 along the material supply slide 902 to convey the chips.

The material taking assembly 8 comprises a U-shaped supporting seat 801 and a material taking cylinder 802, the supporting seat 801 comprises an upper supporting arm 801-1 and a lower supporting arm 801-2, the material taking cylinder 802 is fixed below an installation plate 901, a driving shaft of the material taking cylinder 802 is rotatably connected with the lower supporting arm 801-2 of the supporting seat 801 through a connecting arm 803, one end of the connecting arm 803 is fixedly connected with the lower supporting arm 801-2, the other end of the connecting arm is rotatably connected with the material taking cylinder 802 through a rotating shaft 804, the material taking cylinder 802 drives the supporting seat 801 to rotate along the rotating shaft, a material pressing assembly 805 is installed above the upper supporting arm 801-1, the material pressing assembly 805 comprises a material pressing cylinder 805-1 and a material pressing block 805-2, the material pressing cylinder 805-1 is fixed on the upper supporting arm 801-1, the material pressing block 805-2 is in driving connection with the material pressing cylinder 805-1 below the material pressing cylinder 805-1, the pressing block 805-2 is provided with a pressing groove 805-2-1 matched with the shape of the material pipe for pressing and limiting the material pipe. When material taking operation is performed, the material taking cylinder 802 pulls the connecting arm 803 downwards, the connecting arm 803 rotates along the rotating shaft, so that the supporting seat 801 is driven to rotate upwards the supporting frame 4, the lower supporting arm 801-2 rotates to one side of the material pushing plate 602 to receive a material pipe conveyed from the material pushing plate 602, the material pressing cylinder 805-1 drives the material pressing block 805-2 to move downwards, the material pipe is pressed between the material pressing block 805-2 and the lower supporting arm 801-2, the supporting seat 801 resets, and a chip in the material pipe is poured into the slide 902-1 on the material supplying slide 902.

One side of pushing away material subassembly 6 is equipped with two cushion 7 and is used for placing empty material pipe, cushion 7 is in pushing away material board 602 below and the protrusion pushing away material board 602 outside, cushion 7 with get material subassembly 8 position corresponding, support frame 4 one side is equipped with the workbin 11 that gathers materials and is used for empty material pipe to collect, workbin 11 and cushion 7 are in the same one side of support frame 4. After all the chips in the material pipe are poured into the slide 902-1, the supporting seat 801 drives the material pipe to rotate to the position above the cushion block 7, the material pipe is placed on the cushion block 7, at this time, the material pushing plate 602 moves towards the material taking assembly 8, the empty material pipe placed on the cushion block 7 is simultaneously retreated to the material collecting box 11 while the material pushing plate 602 moves, the material pipe on the material pushing plate 602 is transferred to the material taking assembly 8, and the material pipe reciprocates to perform the next conveying action.

A defective product sliding rail 10 is arranged below the material blocking assembly 904, the defective product sliding rail 10 is communicated with the feeding sliding rail 902, the material blocking assembly 904 comprises a material blocking plate 904-2 and a material blocking cylinder 904-1, the material blocking plate 904-2 is arranged between the defective product sliding rail 10 and the feeding sliding rail 902, the material blocking plate 904-2 is in driving connection with the material blocking cylinder 904-1, and the material blocking cylinder 904-1 is fixedly connected with the mounting plate 901. A defective product collecting box can be placed at the bottom end of the defective product slide rail 10 for collecting defective products.

After the unqualified chips are placed in the feeding groove 902-2, the material baffle 904-2 at the discharge hole of the feeding groove 902-2 moves downwards to communicate the feeding groove 902-2 with the defective product slide rail 10, the chips in the feeding groove 902-2 slide downwards along the defective product slide rail 10 to fall into a defective product collection box for collection, the material baffle 904-2 resets, and the feeding slide rail 902 feeds the chips in the feeding groove 902-2 again.

The working process is as follows: install this feedway in carrier band packagine machine one side and be used for the chip material loading, the material pipe of placing the chip piles up and places on stacker 5, carry out single the transport to the material pipe on stacker 5 through scraping wings 602, it takes material subassembly 8 to take the material pipe and pours into of chip toward feed slide rail 902, through slide 902-1 with end material subassembly with the chip landing one by one again to the silo 902-2 in the rethread manipulator take single chip, it places to carry the single absorption of chip in the storage check of the carrier band on the carrier band packagine machine, detect through detection mechanism again, detect again to the carrier band carry out heat-seal packing after faultless, detect the condition that has the defective products, the carrier band carries out the direction and carries out, the manipulator falls into defective products slide rail 10 after taking the chip, the carrier band resumes forward transport again, operation is repeated to this.

It is obvious to a person skilled in the art that the invention is not restricted to details of the foregoing exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A chip feedway which characterized in that: the feeding device comprises a support frame and a stacking frame installed on the support frame, wherein a material pushing assembly is arranged below the stacking frame and used for pushing a material pipe placed in the stacking frame, the material pushing assembly is connected to the support frame in a sliding mode, a feeding guide rail arranged in an inclined mode is installed on one side of the support frame, and a material taking assembly used for taking the material pipe is arranged at the top end of the feeding guide rail.

2. The die feeding apparatus according to claim 1, wherein: the material pushing assembly comprises a material pushing plate and a material pushing cylinder, wherein a material containing groove for containing a material pipe is formed in the material pushing plate, the material containing groove penetrates through the front end and the rear end of the material pushing plate, the material pushing cylinder is fixed on the supporting frame, and the material pushing cylinder drives the material pushing plate to move along the X-axis direction.

3. The die feeding apparatus according to claim 1, wherein: the feed guide rail includes mounting panel and feed slide rail, the feed slide rail is fixed on the mounting panel, the mounting panel slope is fixed, the one end and the support frame fixed connection of mounting panel, be equipped with the slide in the feed slide rail and be used for carrying the chip, the below of feed slide rail is equipped with first material subassembly that ends, first material subassembly that ends includes first flitch and first material cylinder that ends, first material cylinder that ends is installed on the mounting panel, first flitch and first material cylinder drive connection that ends, first material board that ends inserts in the slide, the bottom of feed slide rail is equipped with the silo and communicates with each other with the slide, the discharge gate position of going up the silo is equipped with and keeps off the material subassembly and prevent the chip landing.

4. The die feeding apparatus according to claim 1, wherein: get the material subassembly and include the U-shaped supporting seat and get the material cylinder, the supporting seat includes support arm and under bracing arm, it fixes in the mounting panel below to get the material cylinder, the under bracing arm rotation connection of linking arm and supporting seat is passed through in the drive shaft of getting the material cylinder, the one end and the under bracing arm fixed connection of linking arm, its other end through the pivot with get the material cylinder and rotate and be connected, it is rotatory along the pivot to get material cylinder drive supporting seat, it installs the material subassembly of pressing in the top of going up the support arm, press the material subassembly including pressing the material cylinder and pressing the material piece, press the material cylinder to fix on the upper bracing arm, press the material piece to press the material cylinder below and press the material cylinder drive to be connected, it is spacing to be equipped with pressing the material groove on the material piece and be used for carrying out the pressfitting to the material pipe.

5. The die feeding apparatus according to claim 2, wherein: one side of pushing away the material subassembly is equipped with the several cushion, the cushion just protrudes the scraping wings outside in the scraping wings below, the cushion with get material subassembly position corresponding, support frame one side is equipped with the case that gathers materials, the case that gathers materials and cushion are in the same one side of support frame.

6. A chip supply apparatus according to claim 3, wherein: keep off material subassembly below and be equipped with the defective products slide rail, the defective products slide rail communicates with each other with the feed slide rail, it includes striker plate and keeps off the material cylinder to keep off the material subassembly, the striker plate is between defective products slide rail and feed slide rail, striker plate and fender material cylinder drive connection, keep off material cylinder and mounting panel fixed connection.