CN214429817U - Substrate for standard power module and high-power-density standard power module - Google Patents
Substrate for standard power module and high-power-density standard power module Download PDFInfo
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- CN214429817U CN214429817U CN202120331040.XU CN202120331040U CN214429817U CN 214429817 U CN214429817 U CN 214429817U CN 202120331040 U CN202120331040 U CN 202120331040U CN 214429817 U CN214429817 U CN 214429817U
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- circuit board
- aluminum substrate
- power circuit
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Abstract
The utility model relates to a base plate for a standard power supply module, which comprises an aluminum substrate main body and fixing columns, wherein the aluminum substrate main body is rectangular, and the fixing columns are respectively arranged at four angular positions of the aluminum substrate main body; the aluminum substrate is characterized in that a connecting pin for fixing the relative position between the aluminum substrate main body and the power circuit board in the vertical direction is further arranged on the aluminum substrate main body, one end of the connecting pin is connected to the aluminum substrate main body, and the other end of the connecting pin extends out towards the direction when the power circuit board is placed on the aluminum substrate main body and is connected to the power circuit board when the power circuit board is placed on the aluminum substrate main body. The utility model discloses still relate to a high power density standard power module. Implement the utility model discloses a base plate and high power density standard power module for standard power module has following beneficial effect: the cost is lower, and the maintenance is easier.
Description
Technical Field
The utility model relates to a power electronic equipment, more specifically say, relate to a base plate and high power density standard power module for standard power module.
Background
For standard power supply modules, in particular for high power density, the usual structure is to have a base plate, two superposed interconnected circuit boards and a housing placed on the base plate; the housing and the substrate enclose the circuit board therebetween, so that the power module forms a whole. Specifically, the two circuit boards are generally divided into a power circuit board and a control circuit board, which are connected to each other through PINs or PIN PINs. The power circuit board is concentrated with power devices required for realizing the functions of the power module, and the power circuit board needs better heat dissipation conditions, and is usually placed at a position only depending on the substrate so as to be beneficial to heat dissipation. In this case, the horizontal position between the power circuit board and the substrate is defined by the fixing posts on the substrate and the housing, but the vertical position between the substrate and the power circuit board is usually achieved by pouring heat-conductive fixing glue, which is not only costly but also substantially difficult to repair in case of failure. Therefore, it is expensive and difficult to maintain.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model lies in, higher to the above-mentioned cost of prior art, the comparatively difficult defect of maintenance provides a cost lower, maintains comparatively easy base plate and the high power density standard power module that is used for standard power module.
The utility model provides a technical scheme that its technical problem adopted is: constructing a base plate for a standard power supply module, which comprises an aluminum base plate main body and a plurality of fixing columns arranged on the aluminum base plate main body, wherein the fixing columns are used for fixing a power circuit board, a control circuit board and a shell which are placed on the aluminum base plate main body, so that the shell can be fixed on the aluminum base plate main body by fixing screws from the outer surface of the shell, and the horizontal positions of the control circuit board and the power circuit board in a space formed by the shell and the aluminum base plate main body are limited to form the standard power supply module; the aluminum substrate main body is rectangular, and the fixing columns are respectively arranged at four angular positions of the aluminum substrate main body; the aluminum substrate main body is further provided with a connecting pin for fixing the relative position between the aluminum substrate main body and the power circuit board in the vertical direction, one end of the connecting pin is connected to the aluminum substrate main body, and the other end of the connecting pin extends out towards the direction of the power circuit board when placed on the aluminum substrate main body and is connected to the power circuit board when placed on the aluminum substrate main body.
Furthermore, the other end of the connecting pin passes through a separate metalized via hole arranged on the power circuit board and is welded on the via hole.
Furthermore, the connecting pins comprise a plurality of connecting pins which are respectively arranged on the aluminum substrate main body at positions adjacent to the fixing columns.
Further, the connecting pin is arranged between the fixed column and an intersection point of two edges of the aluminum substrate main body.
Furthermore, the bottom end of the connecting pin is riveted on the aluminum substrate main body.
Furthermore, the aluminum substrate main body is provided with connecting pin mounting holes, the connecting pin mounting holes penetrate through the top surface and the bottom surface of the aluminum substrate main body, and the bottom surface is provided with a sunken platform; the bottom end of the connecting needle is provided with a bottom end head matched with the platform, the connecting needle penetrates through the connecting needle mounting hole, and the other end of the connecting needle is welded in the metalized through hole of the power circuit board, so that the bottom end head is matched with the platform to fix the relative position between the aluminum substrate main body and the power circuit board.
Furthermore, a receiving platform is arranged at a set position of the middle section of the connecting pin, and the receiving platform is in contact with the bottom surface of the power circuit board when the connecting pin enters the metallized through hole.
The utility model also relates to a high power density standard power module, which comprises a substrate, a control circuit board, a power circuit board and a shell, wherein the control circuit board, the power circuit board and the shell are sequentially overlapped on the substrate, and the high power density standard power module is obtained after assembly; the substrate comprises the substrate for the standard power supply module.
Still further, still include insulating heat conduction gasket, insulating heat conduction gasket sets up between power circuit board and the base plate.
Implement the utility model discloses a base plate and high power density standard power module for standard power module has following beneficial effect: because the vertical position between the aluminum substrate main body and the power circuit board in the shell is fixed by using the connecting pins, the aluminum substrate main body and the power circuit board are not required to be positioned in the vertical direction by using pouring sealant, the fixing strength can be improved, the power circuit board is more firmly fixed at the set height above the aluminum substrate main body, and in case of failure, the power circuit can be more conveniently detached and maintained. Therefore, the cost is low, and the maintenance is easy.
Drawings
Fig. 1 is a schematic structural diagram of a substrate for a standard power module and an aluminum substrate in an embodiment of a high power density standard power module according to the present invention;
FIG. 2 is a schematic structural diagram illustrating the positions of the aluminum substrate main body and the connecting pins in one case of the embodiment;
fig. 3 is a schematic structural diagram of a high power density standard power module in one case of the embodiment.
Detailed Description
The embodiments of the present invention will be further explained with reference to the drawings.
As shown in fig. 1, fig. 2 and fig. 3, in the embodiment of the substrate for the standard power module and the high power density standard power module of the present invention, the substrate for the standard power module includes an aluminum substrate main body 1 and a plurality of fixing posts 2 disposed on the aluminum substrate main body 1, the fixing posts 2 are used for fixing a power circuit board 4, a control circuit board 5 and a casing 6 disposed on the aluminum substrate main body 1, so that the casing 6 can be fixed on the aluminum substrate main body 1 by fixing screws (from top to bottom) from an outer surface of the casing 6 (see fig. 3), and the horizontal positions of the control circuit board 5 and the power circuit board 4 in a space formed by the casing 6 and the aluminum substrate main body 1 are limited to form the standard power module; the aluminum substrate main body 1 is rectangular, and the fixing columns 2 are respectively arranged at four angular positions of the aluminum substrate main body 1 or the arrangement positions of the fixing columns 2 are respectively adjacent to four corners of the aluminum substrate main body 1; the aluminum substrate main body 1 is further provided with a connecting pin 3 for fixing the relative position between the aluminum substrate main body 1 and the power circuit board 4 in the vertical direction, one end of the connecting pin 3 is connected to the aluminum substrate main body 1, and the other end of the connecting pin 3 extends out in the direction of the power circuit board 1 when placed on the aluminum substrate main body and is connected to the power circuit board 4 when the power circuit board 4 is placed on the aluminum substrate main body 1.
In other words, in the present embodiment, the aluminum substrate body 1 and the housing 6 are connected together by the fixing posts 2 to form a closed space, and the power circuit board 4 and the control circuit board 5 are placed in the space to form a power module; the fixing posts 2, in addition to connecting the aluminum substrate body 1 and the case 6, also limit the horizontal positions of the circuit boards in the space, that is, fix the horizontal positions of the power circuit board 4 and the control circuit board 5 in the space so that they do not move in the horizontal direction in the space. The relative height between the power circuit board 4 and the aluminum substrate body 1 is determined by the arrangement of the connecting PINs 3, that is, the relative position of the power circuit board 4 and the aluminum substrate body 1 in the vertical direction is determined, and the power circuit board 4 and the control circuit board 5 are connected by rigid connecting columns, PIN rows or PIN PINs, so that the relative position of the power circuit board 4 and the control circuit board 5 in the vertical direction is fixed, and therefore, as long as the position of the power circuit board 4 and the aluminum substrate body 1 in the vertical direction is fixed, the vertical positions of the two circuit boards in the space are fixed. Therefore, the aluminum substrate main body 1 and the power circuit board 4 are fixed by the connecting pins 3, so that the effect of fixing the distance between the power circuit board 4 and the aluminum substrate main body 1 in the vertical direction without using pouring sealant is achieved, and the power module is low in cost and convenient to disassemble and maintain.
In the present embodiment, both ends of the connecting pin 3 are connected to the aluminum substrate body 1 and the power circuit board 4, respectively. Generally, one end of the connection pin 3 (i.e., the bottom end of the connection pin 3) is disposed on the aluminum substrate body 1, and the other end of the connection pin 3 (i.e., the end of the connection pin 3) is connected to the power circuit board 4. Specifically, in the present embodiment, the other end (distal end) of the connection pin 3 passes through a separate metallized via hole 41 provided on the power circuit board 4 and is soldered to the via hole 41, thereby achieving connection of the connection pin 3 to the power circuit board 4. It should be noted that, in the present embodiment, the metalized via 41 is only present as a fixed structure, that is, the metalized via 41 is not connected to other components or circuit nodes on the control circuit board 4, and is independent, that is, for the power circuit board 4, the metalized via 41 is "isolated island" on the circuit or the electrical connection, and is not connected to other circuits or circuit nodes.
In the present embodiment, the connection between the bottom ends of the connection pins 3 and the aluminum substrate body 1 can be divided into two cases, and in one case, the bottom ends or one ends of the connection pins 3 are fixedly connected to the aluminum substrate body 1, for example, are riveted to the aluminum substrate body 1. In another case, the other end of the connecting pin 3 is connected to the power circuit board 4, so that the positions of the connecting pin 3 and the aluminum substrate main body 1 are relatively fixed, and this connection mode will be described in detail later. When the bottom ends of the connecting pins 3 are riveted to the aluminum substrate main body 1, although the connecting manner is simple and independent, the connecting pins are poor in firmness and easy to detach under stress, and once the connecting pins detach, the aluminum substrate main body 1 can only be replaced integrally, so that the maintenance cost is high.
In the present embodiment, the connection pins 3 include a plurality of connection pins 3, and the connection pins 3 are respectively disposed at positions of the aluminum substrate main body 1 adjacent to the fixing posts 2, and more specifically, the connection pins 3 are disposed between intersection points of two edges of the fixing posts 2 and the aluminum substrate main body 1. Referring to fig. 1, in fig. 1, the connecting pins 3 include 4 pins, and are respectively disposed between the corresponding fixing posts 2 and 4 corners of the horizontal plane of the aluminum substrate body 1.
As shown in fig. 3, in one case of the present embodiment, the aluminum substrate main body 1 is provided with connecting pin mounting holes 13, the connecting pin mounting holes 13 penetrate through the top surface and the bottom surface of the aluminum substrate main body 1, and a recessed platform is provided on the bottom surface; the bottom end of the connecting pin 3 is provided with a bottom end head 31 matched with the platform, the connecting pin 3 penetrates through the connecting pin mounting hole 13, and the other end of the connecting pin is welded in the metalized through hole 41 of the power circuit board 4, so that the bottom end head 31 is matched with the platform to fix the relative position between the aluminum substrate main body 1 and the power circuit board 4. It should be noted that, in this embodiment, a receiving platform 32 is disposed at a set position of the middle section of the connecting pin 3 (i.e., the portion between the bottom end and the end of the connecting pin 3), and the receiving platform 32 contacts the bottom surface of the power circuit board 4 when the connecting pin 3 enters the metalized via 41. Specifically, in the present embodiment, the receiving platform 32 is disposed at a position related to the height of the downward projection of the components on the power circuit board 4 (i.e., in the direction of the aluminum substrate body 1), and when the components on the power circuit board 4 are in contact with the inner surface of the aluminum substrate body 1 (with an insulating material layer disposed therebetween, no electrical connection or contact occurs), the bottom surface of the power circuit board 4 is just in contact with the receiving platform 32. Therefore, the power circuit board cannot move towards the aluminum substrate main body, and at this time, the matching of the bottom head 31 and the platform prevents the power circuit board 4 from moving upwards (away from the aluminum substrate main body 1), so that the relative position between the aluminum substrate main body 1 and the power circuit board 4 is fixed.
As shown in fig. 3, the utility model also relates to a high power density standard power module, which comprises a substrate, a control circuit board 4, a power circuit board 5 and a shell 6, wherein the control circuit board 5, the power circuit board 4 and the shell 6 are sequentially overlapped on the substrate, and the high power density standard power module is obtained after assembly; the substrate comprises the substrate for the standard power supply module. The power supply module further comprises an insulating heat-conducting gasket 7, wherein the insulating heat-conducting gasket 7 is arranged between the power circuit board 4 and the substrate.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (9)
1. A base plate for a standard power supply module comprises an aluminum base plate main body and a plurality of fixing columns arranged on the aluminum base plate main body, wherein the fixing columns are used for fixing a power circuit board, a control circuit board and a shell which are placed on the aluminum base plate main body, so that the shell can be fixed on the aluminum base plate main body by fixing screws from the outer surface of the shell, and the horizontal positions of the control circuit board and the power circuit board in a space formed by the shell and the aluminum base plate main body are limited to form the standard power supply module; the aluminum substrate main body is rectangular, and the fixing columns are respectively arranged at four angular positions of the aluminum substrate main body; the aluminum substrate is characterized in that a connecting pin for fixing the relative position between the aluminum substrate main body and the power circuit board in the vertical direction is further arranged on the aluminum substrate main body, one end of the connecting pin is connected to the aluminum substrate main body, and the other end of the connecting pin extends out towards the direction when the power circuit board is placed on the aluminum substrate main body and is connected to the power circuit board when the power circuit board is placed on the aluminum substrate main body.
2. The substrate for a standard power module of claim 1, wherein the other end of the connecting pin passes through a separate metalized via provided on the power circuit board and is soldered on the metalized via.
3. The substrate for a standard power module as claimed in claim 2, wherein the connecting pins comprise a plurality of connecting pins, and the plurality of connecting pins are respectively disposed on the aluminum substrate main body at positions adjacent to the fixing posts.
4. The substrate for a standard power supply module according to claim 3, wherein the connection pin is disposed between the intersection point of the two edges of the fixing column and the aluminum substrate main body.
5. The substrate for a standard power module of claim 4, wherein the bottom end of the connecting pin is riveted on the aluminum substrate main body.
6. The substrate for a standard power supply module according to claim 4, wherein the aluminum substrate main body is provided with connecting pin mounting holes, the connecting pin mounting holes penetrate through the top surface and the bottom surface of the aluminum substrate main body, and the bottom surface is provided with a recessed platform; the bottom end of the connecting needle is provided with a bottom end head matched with the platform, the connecting needle penetrates through the connecting needle mounting hole, and the other end of the connecting needle is welded in the metalized through hole of the power circuit board, so that the bottom end head is matched with the platform to fix the relative position between the aluminum substrate main body and the power circuit board.
7. The substrate for the standard power module as claimed in claim 5, wherein a receiving platform is disposed on a set position of the middle section of the connecting pin, and the receiving platform contacts with the bottom surface of the power circuit board when the connecting pin enters the metalized via hole.
8. A high-power density standard power supply module comprises a substrate, a control circuit board, a power circuit board and a shell, wherein the control circuit board, the power circuit board and the shell are sequentially overlapped on the substrate, and the high-power density standard power supply module is obtained after assembly; characterized in that the substrate comprises a substrate for a standard power module according to claim 6 or 7.
9. The high power density standard power module of claim 8, further comprising an insulating thermal gasket disposed between the power circuit board and the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120331040.XU CN214429817U (en) | 2021-02-05 | 2021-02-05 | Substrate for standard power module and high-power-density standard power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120331040.XU CN214429817U (en) | 2021-02-05 | 2021-02-05 | Substrate for standard power module and high-power-density standard power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214429817U true CN214429817U (en) | 2021-10-19 |
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ID=78070658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120331040.XU Active CN214429817U (en) | 2021-02-05 | 2021-02-05 | Substrate for standard power module and high-power-density standard power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214429817U (en) |
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2021
- 2021-02-05 CN CN202120331040.XU patent/CN214429817U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 5th floor, building A5, Zhiyuan, 1001 Xueyuan Avenue, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Haowen Electronics Co.,Ltd. Address before: 518000 5th floor, building A5, Zhiyuan, 1001 Xueyuan Avenue, Nanshan District, Shenzhen City, Guangdong Province Patentee before: HAWAN ELECTRONICS Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |