CN214400338U - Silica gel adhesive tape - Google Patents

Silica gel adhesive tape Download PDF

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Publication number
CN214400338U
CN214400338U CN202021434864.1U CN202021434864U CN214400338U CN 214400338 U CN214400338 U CN 214400338U CN 202021434864 U CN202021434864 U CN 202021434864U CN 214400338 U CN214400338 U CN 214400338U
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China
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layer
silica gel
material layer
adhesive
adhesive layer
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CN202021434864.1U
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Chinese (zh)
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廖凤兰
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Suzhou Deyou New Material Technology Co ltd
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Suzhou Deyou New Material Technology Co ltd
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Priority to CN202021434864.1U priority Critical patent/CN214400338U/en
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Abstract

The utility model discloses a silica gel adhesive tape, include PI substrate layer, under coat, gluing agent layer and leave type material layer. The thickness of the PI base material layer is 175-200 mu m. The priming layer is arranged on the PI base material layer. The adhesive layer is arranged at one end, back to the PI base material layer, of the bottom coating. The release material layer is arranged at one end of the adhesive layer, which is back to the base coat. The primer layer and the adhesive layer contain the same catalyst. The undercoat layer mainly contains an undercoat agent having a heat resistance temperature of 250 ℃ or higher. The utility model discloses silica gel sticky tape can restrain gluing agent layer through high temperature hot pressing processing procedure after the climbing of peeling strength, is convenient for tear it from the product to can not produce the destruction to the product.

Description

Silica gel adhesive tape
Technical Field
The utility model relates to an adhesive material technical field, specific be a silica gel sticky tape.
Background
In the manufacturing process of electronic component products, a silica gel tape is often used to assist in processing.
Electronic component products typically include a multilayer structure in which a hot melt adhesive layer is provided under a black thin film printed layer thereof. In the manufacturing process, the hot melt adhesive layer needs to be activated by high-temperature hot pressing. And in the high-temperature hot-pressing activation process, a silica gel adhesive tape is required to be used for assisting in processing so as to prevent the problems of glue overflow and the like of the hot melt adhesive in the high-temperature hot-pressing process. After the high-temperature hot-pressing process is completed, the silica gel tape for auxiliary processing needs to be torn off.
Traditional silica gel sticky tape, in high temperature hot pressing technology, high temperature acts on its gluing agent layer, leads to the peeling strength on gluing agent layer to climb rapidly to when needs are torn, be difficult to peel off silica gel sticky tape from the product, peel off by force and then can lead to gluing agent to remain, the black film printing layer of product suffers destruction scheduling problem.
Therefore, there is a need for improvement of the conventional silicone adhesive tape to solve the above technical problems.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects in the prior art, the embodiment of the utility model provides a silica gel adhesive tape, it can restrain the climbing of power of peeling off behind high temperature hot pressing processing procedure in gluing agent layer, is convenient for tear from the product.
The utility model discloses a silica gel adhesive tape, include:
the PI substrate layer is 175-200 mu m thick;
the bottom coating is arranged on the PI base material layer;
the adhesive layer is arranged at one end, back to the PI base material layer, of the bottom coating;
the release material layer is arranged at one end, back to the base coating, of the adhesive layer;
wherein the primer layer and the adhesive layer contain the same catalyst.
Preferably, the primer layer mainly contains a primer having a heat resistant temperature of 250 ℃ or higher.
Preferably, the thickness of the primer layer is in the range of 0.1 to 1 μm.
Preferably, the thickness of the adhesive layer ranges from 8 to 12 μm.
Preferably, the thickness of the release material layer is in a range of 15-25 μm.
Preferably, the adhesive layer is an organic silicon adhesive layer
Preferably, the primer layer and the adhesive layer both contain platinum catalyst.
The utility model has the advantages as follows:
the utility model discloses the thickness that the silica gel sticky tape set up the PI substrate layer is 175 ~ 200 mu m for the PI substrate layer has great thickness, can play fine thermal-insulated effect, thereby makes the influence of high temperature to the gluing agent layer of silica gel sticky tape less, has reduced climbing of the power of peeling off on gluing agent layer. Meanwhile, the PI base material layer is thicker, so that when the silica gel tape is torn off, the PI base material layer can generate certain stress, and the stress can overcome part of adhesive force between the adhesive layer and a product, so that the adhesive layer can be better separated from the product.
The utility model discloses silica gel sticky tape contains same kind of catalyst in setting up under coat and gluing agent layer for can be better interact between under coat and the gluing agent layer, make the adhesion that gluing agent layer can be better on the PI substrate layer, make this embodiment silica gel sticky tape be difficult to come unstuck, thereby be convenient for this embodiment silica gel sticky tape to tear off from the product.
The utility model discloses silica gel sticky tape sets up the used primer of under coat and is the primer above 250 ℃ for heat resisting temperature, can improve silica gel sticky tape's in this embodiment stability and heat resistance.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural view of a silica gel tape according to an embodiment of the present invention;
reference numerals of the above figures:
1-PI base material layer; 2-a base coat; 3-an adhesive layer; 4-release material layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model discloses a silica gel adhesive tape, include:
the PI substrate layer 1, wherein the thickness of the PI substrate layer 1 is 175-200 mu m;
the bottom coating 2 is arranged on the PI base material layer 1;
the adhesive layer 3 is arranged at one end, back to the PI base material layer 1, of the bottom coating layer 2;
the release material layer 4 is arranged at one end, back to the bottom coating 2, of the adhesive layer 3;
wherein, the primer layer 2 and the adhesive layer 3 contain the same kind of catalyst.
Referring to fig. 1, the present embodiment provides a silica gel tape, which includes a PI substrate layer 1, a primer layer 2, an adhesive layer 3, and a release material layer 4.
The base coat 2 is decorated on the PI base material layer 1, and the thickness range of the base coat 2 is 0.1-1 μm. The primer is coated on the PI base material layer 1 to form the primer layer 2, and the PI base material layer 1 and the adhesive layer 3 can be well bonded by the primer layer 2, so that the bonding strength and the long-term stability are improved.
The adhesive layer 3 is arranged at one end, back to the PI base material layer 1, of the bottom coating 2, and the thickness range of the adhesive layer 3 is 8-12 microns. In this embodiment, the adhesive layer 3 is made of an organic silicon adhesive. A cross-linking agent, an anchoring agent and a catalyst are added into the organic silicon adhesive to improve the performance of the organic silicon adhesive, and the auxiliary agents are common raw materials in the market. The catalyst of the adhesive layer 3 is a platinum catalyst.
The release material layer 4 is arranged at one end, back to the bottom coating 2, of the adhesive layer 3, the release material layer 4 is made of PET, and the thickness range of the release material layer 4 is 15-25 micrometers.
In the present embodiment, the thickness of the PI substrate layer 1 is 175 to 200 μm.
Electronic component products typically include a multilayer structure in which a hot melt adhesive layer is provided under a black thin film printed layer of the product. In the manufacturing process, the hot melt adhesive layer needs to be activated by high-temperature hot pressing. The silica gel tape in this embodiment is disposed above the product black film printing layer. The adhesive layer of the silica gel tape is connected with the black film printing layer of the product. The arrangement of the silica gel adhesive tape is to prevent the hot melt adhesive layer from overflowing in the high-temperature hot-pressing activation process and protect the black film printing layer of the product. After the high-temperature hot-pressing process is completed, the silica gel tape in this embodiment is torn off. This embodiment PI substrate layer 1 has great thickness, and in high temperature hot pressing process, PI substrate layer 1 can play fine thermal-insulated effect for the influence of high temperature to gluing agent layer 3 is less, has reduced climbing of the peel strength of gluing agent layer 3, thereby makes the adhesion strength between gluing agent layer 3 and the product black film printing layer can not rise, in order to tear.
Simultaneously because the PI substrate layer 1 of this embodiment silica gel sticky tape is thicker, when tearing off the silica gel sticky tape, PI substrate layer 1 can produce certain stress, and some adhesive force between gluing agent layer 3 and the product can be overcome to this stress for gluing agent layer 3 can be better break away from with the product.
The embodiment sets up and contains the catalyst of same kind in priming coat 2 and the gluing agent layer 3, and platinum catalyst form's priming coat and gluing agent have been selected for use to this embodiment, the selection of catalyst of same kind for can be better interact between priming coat 2 and the gluing agent layer 3, make the adhesion that gluing agent layer 3 can be better on PI substrate layer 1, make this embodiment silica gel sticky tape be difficult to come unstuck, thereby the silica gel sticky tape of this embodiment of being convenient for tears off from the product.
The primer used for providing the undercoat layer 2 in this example is a primer having a heat resistant temperature of 250 ℃ or higher, and the primer is a primer commonly used in the market. The primer with high temperature resistance is selected, so that the stability and the heat resistance of the silica gel adhesive tape in the embodiment can be improved.
The utility model discloses the principle and the implementation mode of the utility model are explained by applying the concrete embodiment, and the explanation of the above embodiment is only used for helping to understand the technical scheme and the core idea of the utility model; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the specific implementation and application scope, to sum up, the content of the present specification should not be understood as the limitation of the present invention.

Claims (6)

1. A silica gel tape, comprising:
the PI substrate layer is 175-200 mu m thick;
the bottom coating is arranged on the PI base material layer;
the adhesive layer is arranged at one end, back to the PI base material layer, of the bottom coating;
the release material layer is arranged at one end, back to the base coating, of the adhesive layer;
wherein the primer layer and the adhesive layer contain the same catalyst.
2. The silica gel tape according to claim 1, wherein the primer layer contains a primer agent having a heat resistant temperature of 250 ℃ or higher as a main component.
3. The silica gel tape according to claim 1, wherein the thickness of the primer layer is in the range of 0.1 to 1 μm.
4. The silica gel tape according to claim 1, wherein the thickness of the adhesive layer is in a range of 8 to 12 μm.
5. The silicone adhesive tape according to claim 1, wherein the release material layer has a thickness in the range of 15 to 25 μm.
6. The silica gel tape of claim 1, wherein the adhesive layer is a silicone adhesive layer.
CN202021434864.1U 2020-07-20 2020-07-20 Silica gel adhesive tape Active CN214400338U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021434864.1U CN214400338U (en) 2020-07-20 2020-07-20 Silica gel adhesive tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021434864.1U CN214400338U (en) 2020-07-20 2020-07-20 Silica gel adhesive tape

Publications (1)

Publication Number Publication Date
CN214400338U true CN214400338U (en) 2021-10-15

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Application Number Title Priority Date Filing Date
CN202021434864.1U Active CN214400338U (en) 2020-07-20 2020-07-20 Silica gel adhesive tape

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115404017A (en) * 2022-08-12 2022-11-29 中山市皇冠胶粘制品有限公司 Flexible high-temperature-resistant four-resistance silica gel protective film and preparation method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115404017A (en) * 2022-08-12 2022-11-29 中山市皇冠胶粘制品有限公司 Flexible high-temperature-resistant four-resistance silica gel protective film and preparation method thereof

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