CN214353408U - Cutting device is used in production of wafer paster ring - Google Patents
Cutting device is used in production of wafer paster ring Download PDFInfo
- Publication number
- CN214353408U CN214353408U CN202023293677.9U CN202023293677U CN214353408U CN 214353408 U CN214353408 U CN 214353408U CN 202023293677 U CN202023293677 U CN 202023293677U CN 214353408 U CN214353408 U CN 214353408U
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- Prior art keywords
- fixedly connected
- cutting
- cutting device
- rotation
- wall
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- 238000005520 cutting process Methods 0.000 title claims abstract description 57
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000002347 injection Methods 0.000 claims abstract description 33
- 239000007924 injection Substances 0.000 claims abstract description 33
- 239000002173 cutting fluid Substances 0.000 claims abstract description 13
- 238000005096 rolling process Methods 0.000 claims abstract description 5
- 230000000694 effects Effects 0.000 claims description 10
- 238000005498 polishing Methods 0.000 claims description 8
- 238000013016 damping Methods 0.000 claims description 7
- 239000013078 crystal Substances 0.000 claims description 5
- 230000002146 bilateral effect Effects 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model discloses a cutting device is used in production of wafer paster ring, including the frame car, the first rotation motor of inner wall fixedly connected with of frame car, first rotation motor passes through output shaft fixedly connected with cutting gear, the first axis of rotation of bearing fixedly connected with is passed through at the top of frame car, the top fixedly connected with diaphragm of first axis of rotation, the one end fixedly connected with injection tube of first axis of rotation is kept away from to the diaphragm. The utility model discloses when starting first rotation motor and carrying out the pivoted, first rotation motor drives the cutting gear and carries out basic cutting function, the rolling disc drives the second transfer line and does the circular motion about and drive first transfer line and move about the inner wall of injection tube, drive the connecting rod through the injection pole, the connecting rod is constantly extrudeed cutting fluid, make cutting fluid slowly drip on the surface of cutting gear, make the cutting gear more lubricated, long-time use has certain guard action to the cutting gear.
Description
Technical Field
The utility model relates to a cutting technical field specifically is a cutting device is used in production of wafer paster ring.
Background
The cutting device for the wafer flow sheet is an auxiliary device which is used for cutting the wafer flow sheet in the production process of the wafer flow sheet so as to facilitate the subsequent processing, and is widely used in the subsidiary field of the wafer flow sheet production; the existing cutting device for the wafer flow sheet comprises a workbench, a cutting machine and a base, wherein the workbench is arranged at the top end of the base, the cutting machine is arranged on the right half area of the top end of the workbench, and a cutter is arranged at the output end of the cutting machine; when the existing cutting device for the wafer flow sheet is used, only a material needs to be placed on the workbench, the area needing to be cut is located under the cutter, then the material is fixed by hand, and meanwhile, the cutter is controlled to drive the cutter to move downwards to cut the material.
However, in actual use of the prior art, the existing cutting device for wafer flow sheets is found that the cutting device is passivated due to long-time cutting, general operations are grinding and polishing after the operation, and preliminary pretreatment is not performed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a wafer paster ring production is with cutting device to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a cutting device for producing wafer paster rings comprises a frame vehicle, wherein a first rotating motor is fixedly connected to the inner wall of the frame vehicle, a cutting gear is fixedly connected to the first rotating motor through an output shaft, a first rotating shaft is fixedly connected to the top of the frame vehicle through a bearing, a transverse plate is fixedly connected to the top of the first rotating shaft, an injection tube is fixedly connected to one end, away from the first rotating shaft, of the transverse plate, the inner wall of the injection tube is movably connected with an injection rod, a first spring is fixedly connected to the bottom of the injection rod, a connecting rod is fixedly connected to the bottom of the first spring, cutting fluid is tightly attached to the inner wall of the injection tube, the cutting fluid is arranged at the bottom of the connecting rod, a fixing plate is fixedly connected to the top of the injection rod, a first transmission rod is fixedly connected to the upper surface of the fixing plate, and a second transmission rod is hinged to the top of the first transmission rod, the top of the second transmission rod is hinged with a rotating disc, a second rotating motor is fixedly connected to the middle of the surface of the rotating disc, and the second rotating motor is fixedly connected with the surface of the transverse plate through a support.
Preferably, the bottom fixedly connected with universal wheel of frame car, the quantity of universal wheel is four, and two universal wheels are a set of bottom central line bilateral symmetry about the frame car.
Preferably, the bottom of the inner wall of the frame vehicle is fixedly connected with a support flat plate, and a crystal cylinder is placed on the upper surface of the support flat plate.
Preferably, the inner wall of frame car has the activity to hold the platform pole through thread bush threaded connection, the activity holds the platform pole and runs through the frame car and extend to the inside of frame car, the activity holds the platform pole and keeps away from the one end of frame car and passes through bearing fixedly connected with second axis of rotation, the top fixedly connected with third rotation motor of second axis of rotation, the bottom fixedly connected with of second axis of rotation polishes the piece.
Preferably, the side face of the third rotating motor is fixedly connected with a damping spring, and one end, far away from the second rotating shaft, of the damping spring is fixedly connected with the inner wall of the frame vehicle.
Preferably, the crystal cylinder moves at the bottom of the polishing sheet.
Preferably, the cutting gear rotates at the bottom of the injection cylinder, and the highest point of the cutting gear is five centimeters away from the bottom of the injection cylinder.
Preferably, the first rotating motor, the second rotating motor and the third rotating motor are all servo motors, and the first rotating motor, the second rotating motor and the third rotating motor are electrically connected with the whole device.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses when starting first rotation motor and rotating, first rotation motor drives the cutting gear and carries out basic cutting function, simultaneously through starting second rotation motor, second rotation motor drives the rolling disc, the rolling disc drives the second transfer line and does the circular motion about doing and drive first transfer line and move from top to bottom at the inner wall of injection tube, drive the connecting rod through the injection pole, the connecting rod is constantly extrudeed cutting fluid, make cutting fluid slowly drip on the surface of cutting gear, make the cutting gear more lubricated, long-time use has certain guard action to the cutting gear;
2. the utility model discloses still rotate the motor simultaneously through starting the third, the third rotates the motor and drives the second axis of rotation, and the second axis of rotation drives the piece of polishing and carries out preliminary treatment on the surface of wafer post, polishes on the surface of wafer post through the piece of polishing is slow, holistic cutting efficiency with higher speed.
Drawings
FIG. 1 is a front sectional view of the overall structure of a cutting device for wafer ring production according to the present invention;
FIG. 2 is a schematic view of a second rotating motor of the cutting device for wafer ring production according to the present invention;
fig. 3 is a top view of the first rotating shaft of the cutting device for producing wafer-bonding rings of the present invention.
In the figure: 1. a frame vehicle; 2. a universal wheel; 3. a first rotating electric machine; 4. cutting the gear; 5. a support plate; 6. a first rotating shaft; 7. a transverse plate; 8. an injection tube; 9. an injection rod; 10. a first spring; 11. a connecting rod; 12. cutting fluid; 13. a fixing plate; 14. a first drive lever; 15. a second transmission rod; 16. rotating the disc; 17. a second rotating electric machine; 18. a movable platform bearing rod; 19. a second rotating shaft; 20. a third rotating electric machine; 21. a damping spring; 22. grinding the sheets; 23. and (4) crystal cylinders.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a cutting device for producing a wafer ring comprises a frame vehicle 1, wherein a first rotating motor 3 is fixedly installed on the inner wall of the frame vehicle 1, a cutting gear 4 is fixedly installed on the first rotating motor 3 through an output shaft, a first rotating shaft 6 is fixedly installed on the top of the frame vehicle 1 through a bearing, a transverse plate 7 is fixedly installed on the top of the first rotating shaft 6, an injection tube 8 is fixedly installed at one end, far away from the first rotating shaft 6, of the transverse plate 7, an injection rod 9 is movably connected to the inner wall of the injection tube 8, a first spring 10 is fixedly installed at the bottom of the injection rod 9, a connecting rod 11 is fixedly installed at the bottom of the first spring 10, cutting fluid 12 is tightly attached to the inner wall of the injection tube 8, the cutting fluid 12 is arranged at the bottom of the connecting rod 11, a fixing plate 13 is fixedly installed at the top of the injection rod 9, a first transmission rod 14 is fixedly installed on the upper surface of the fixing plate 13, and a second transmission rod 15 is hinged to the top of the first transmission rod 14, the top of the second transmission rod 15 is hinged with a rotating disc 16, a second rotating motor 17 is fixedly installed in the middle of the surface of the rotating disc 16, and the second rotating motor 17 is fixedly installed on the surface of the transverse plate 7 through a support.
The bottom fixed mounting of frame car 1 has universal wheel 2, and the quantity of universal wheel 2 is four, and two universal wheels 2 are a set of bottom central line bilateral symmetry about frame car 1.
The bottom of the inner wall of the frame vehicle 1 is fixedly provided with a support flat plate 5, and a crystal cylinder 23 is arranged on the upper surface of the support flat plate 5.
The inner wall of frame car 1 has the activity to hold platform pole 18 through thread bush threaded connection, and activity holds platform pole 18 and runs through frame car 1 and extend to the inside of frame car 1, and the one end that frame car 1 was kept away from to activity holds platform pole 18 has second axis of rotation 19 through bearing fixed mounting, and the top fixed mounting of second axis of rotation 19 has third rotation motor 20, and the bottom fixed mounting of second axis of rotation 19 has polishing piece 22.
A damping spring 21 is fixedly mounted on the side surface of the third rotating motor 20, and one end of the damping spring 21 far away from the second rotating shaft 19 is fixedly mounted on the inner wall of the frame vehicle 1.
The wafer cylinder 23 is movable at the bottom of the polishing plate 22.
The cutting gear 4 rotates at the bottom of the injection cylinder 8, and the highest point of the cutting gear 4 is five centimeters away from the bottom of the injection cylinder 8.
The first rotating motor 3, the second rotating motor 17 and the third rotating motor 20 are all servo motors, and the first rotating motor 3, the second rotating motor 17 and the third rotating motor 20 are electrically connected with the whole device.
The working principle is as follows: when the utility model is used, when the first rotating motor 3 is started to rotate, the first rotating motor 3 drives the cutting gear 4 to perform basic cutting function, meanwhile, the second rotating motor 17 is started, the second rotating motor 17 drives the rotating disc 16, the rotating disc 16 drives the second transmission rod 15 to do up-and-down circular motion to drive the first transmission rod 14 to move up and down on the inner wall of the injection tube 8, the connecting rod 11 is driven by the injection rod 9, the connecting rod 11 continuously extrudes the cutting fluid 12, the cutting fluid 12 slowly drips on the surface of the cutting gear 4, the cutting gear 4 is more lubricated, the long-time use has certain protection effect on the cutting gear 4, the utility model also simultaneously starts the third rotating motor 20, the third rotating motor 20 drives the second rotating shaft 19, the second rotating shaft 19 drives the polishing disc 22 to perform preliminary pretreatment on the surface of the wafer column 23, the overall cutting efficiency is accelerated by the slow application of the abrasive sheet 22 against the surface of the wafer column 23.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a wafer ring cutting device for production, includes frame car (1), its characterized in that: the inner wall of the frame trolley (1) is fixedly connected with a first rotating motor (3), the first rotating motor (3) is fixedly connected with a cutting gear (4) through an output shaft, the top of the frame trolley (1) is fixedly connected with a first rotating shaft (6) through a bearing, the top of the first rotating shaft (6) is fixedly connected with a transverse plate (7), one end, far away from the first rotating shaft (6), of the transverse plate (7) is fixedly connected with an injection tube (8), the inner wall of the injection tube (8) is movably connected with an injection rod (9), the bottom of the injection rod (9) is fixedly connected with a first spring (10), the bottom of the first spring (10) is fixedly connected with a connecting rod (11), the inner wall of the injection tube (8) is tightly attached with cutting fluid (12), the cutting fluid (12) is arranged at the bottom of the connecting rod (11), and the top of the injection rod (9) is fixedly connected with a fixing plate (13), the upper surface fixed connection of fixed plate (13) has first transfer line (14), the top of first transfer line (14) articulates there is second transfer line (15), the top of second transfer line (15) articulates there is rolling disc (16), fixed connection has second rotating electrical machines (17) in the middle of the surface of rolling disc (16), second rotating electrical machines (17) are through the fixed surface connection of support and diaphragm (7).
2. The cutting device for wafer ring production according to claim 1, characterized in that: the bottom fixedly connected with universal wheel (2) of frame car (1), the quantity of universal wheel (2) is four, and two universal wheels (2) are a set of bottom central line bilateral symmetry about frame car (1).
3. The cutting device for wafer ring production according to claim 1, characterized in that: the bottom fixedly connected with support flat board (5) of frame car (1) inner wall, brilliant cylinder (23) have been placed to the upper surface of support flat board (5).
4. The cutting device for wafer ring production according to claim 1, characterized in that: the inner wall of frame car (1) has activity to hold platform pole (18) through thread bush threaded connection, activity holds platform pole (18) and runs through frame car (1) and extends to the inside of frame car (1), the one end that frame car (1) was kept away from in activity holds platform pole (18) is through bearing fixedly connected with second axis of rotation (19), the top fixedly connected with third rotation motor (20) of second axis of rotation (19), the bottom fixedly connected with of second axis of rotation (19) grinds piece (22).
5. The cutting device for wafer ring production according to claim 1, characterized in that: the side face of the third rotating motor (20) is fixedly connected with a damping spring (21), and one end, far away from the second rotating shaft (19), of the damping spring (21) is fixedly connected with the inner wall of the frame vehicle (1).
6. The cutting device for wafer ring production according to claim 1, characterized in that: the crystal cylinder (23) moves at the bottom of the polishing sheet (22).
7. The cutting device for wafer ring production according to claim 1, characterized in that: the cutting gear (4) rotates at the bottom of the injection cylinder (8), and the highest point of the cutting gear (4) is five centimeters away from the bottom of the injection cylinder (8).
8. The cutting device for wafer ring production according to claim 1, characterized in that: first rotating electrical machines (3), second rotating electrical machines (17) and third rotating electrical machines (20) are servo motors, be electric connection between first rotating electrical machines (3), second rotating electrical machines (17) and third rotating electrical machines (20) and the whole device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023293677.9U CN214353408U (en) | 2020-12-30 | 2020-12-30 | Cutting device is used in production of wafer paster ring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023293677.9U CN214353408U (en) | 2020-12-30 | 2020-12-30 | Cutting device is used in production of wafer paster ring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214353408U true CN214353408U (en) | 2021-10-08 |
Family
ID=77950380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023293677.9U Expired - Fee Related CN214353408U (en) | 2020-12-30 | 2020-12-30 | Cutting device is used in production of wafer paster ring |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214353408U (en) |
-
2020
- 2020-12-30 CN CN202023293677.9U patent/CN214353408U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211008 |