CN214333656U - Spacecraft shell monitoring system - Google Patents

Abstract

The utility model provides a spacecraft shell monitoring system, this spacecraft shell monitoring system includes strain gauge subassembly, strain gauge subassembly covers on the surface of spacecraft shell, the monitoring circuit who is connected with strain gauge subassembly, strain gauge subassembly and monitoring circuit adopt 3D vibration material disk to make the surface of technique printing at the spacecraft shell to adopt multilayer thermal insulation material to cover strain gauge subassembly and monitoring circuit, wherein, monitoring circuit monitors strain gauge subassembly's first resistance change signal, and the first resistance change signal of analysis obtains corresponding shell deformation volume. Through the utility model discloses can effectively promote the monitoring effect of spacecraft shell, effectively alleviate spacecraft shell monitoring system's weight and volume to reduce the cost of delivery of spacecraft.

Description

Spacecraft shell monitoring system

Technical Field

The utility model relates to an electronic equipment technical field especially relates to a spacecraft shell monitoring system.

Background

The normal working environment of the spacecraft in the outer space is quite severe, the environment temperature is between 50 ℃ below zero and 120 ℃, and a complex radiation environment also exists. If the protection of the spacecraft cannot be achieved, an electronic system of the spacecraft is overturned by charged particles in the universe with high probability, or electronic components fail due to the fact that the operating temperature exceeds the range. Therefore, the protection measures of the spacecraft are an important part for ensuring the stable operation of the spacecraft. And the important part of the part is the outer shell of the spacecraft. The outer shell is arranged on the outermost layer of the spacecraft to form the outer surface of the spacecraft and can also be used as a bearing component. The shape of the shell is various, such as a sphere, a multi-face column, a cone, or various irregular polyhedrons. In addition to maintaining shape, the housing should also meet the requirements of surface area, thermal control, satellite internal volume, various surface openings, spatial radiation protection, and the like.

In the related art, the traditional spacecraft shell monitoring system utilizes various electronic sensors to be uniformly fixed on the surface of a shell of a spacecraft.

In this way, the traditional electronic sensor is easily influenced by the outer space working environment, the power consumption is high, the internal space of the spacecraft is occupied, and the micro-satellite and the micro-nano satellite cannot be additionally installed, so that the actual monitoring capability of the system is influenced, and the weight and the volume of the traditional spacecraft shell monitoring system are large, so that the carrying cost of the spacecraft is increased.

Disclosure of Invention

The present invention aims at solving at least one of the technical problems in the related art to a certain extent.

Therefore, the utility model aims to provide a spacecraft shell monitoring system can effectively promote the monitoring effect of spacecraft shell, effectively alleviates spacecraft shell monitoring system's weight and volume to reduce the cost of delivery of spacecraft.

In order to achieve the above object, an embodiment of the present invention provides a spacecraft shell monitoring system, including: the strain gauge component is covered on the outer surface of the spacecraft shell, the monitoring circuit is connected with the strain gauge component, the strain gauge component and the monitoring circuit are printed on the outer surface of the spacecraft shell by adopting a 3D additive manufacturing technology, and the strain gauge component and the monitoring circuit are covered by adopting a plurality of layers of heat insulation materials, wherein the monitoring circuit monitors a first resistance change signal of the strain gauge component and analyzes the first resistance change signal to obtain a corresponding shell deformation quantity.

The embodiment of the utility model provides a spacecraft shell monitoring system, through configuration strain gauge subassembly, strain gauge subassembly covers on the surface of spacecraft shell, the monitoring circuit who is connected with strain gauge subassembly, strain gauge subassembly and monitoring circuit adopt 3D vibration material disk to make the surface of technique printing at the spacecraft shell, and adopt multilayer thermal insulation material to cover strain gauge subassembly and monitoring circuit, monitoring circuit monitors strain gauge subassembly's first resistance change signal, and the first resistance change signal of analysis obtains corresponding shell deformation volume, thereby can effectively promote the monitoring effect of spacecraft shell, effectively alleviate spacecraft shell monitoring system's weight and volume, thereby reduce the cost of delivery of spacecraft.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a spacecraft shell monitoring system according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a spacecraft shell monitoring system according to another embodiment of the present invention;

fig. 3 is a schematic structural diagram of a spacecraft shell monitoring system according to another embodiment of the present invention;

fig. 4 is a schematic diagram of multiplexing in an embodiment of the present invention;

fig. 5 is the circuit structure schematic diagram of the middle spacecraft shell monitoring system of the present invention.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention. On the contrary, the embodiments of the invention include all changes, modifications and equivalents coming within the spirit and terms of the claims appended hereto.

Fig. 1 is a schematic structural diagram of a spacecraft shell monitoring system according to an embodiment of the present invention.

Referring to fig. 1, the spacecraft case monitoring system 10 includes:

the strain gauge assembly 101, the strain gauge assembly 101 covers on the outer surface of the spacecraft shell, the monitoring circuit 102 is connected with the strain gauge assembly 101, the strain gauge assembly 101 and the monitoring circuit 102 are printed on the outer surface of the spacecraft shell by adopting a 3D additive manufacturing technology, and the strain gauge assembly 101 and the monitoring circuit 102 are covered by adopting a multi-layer heat insulation material, wherein the monitoring circuit 102 monitors a first resistance change signal of the strain gauge assembly 101 and analyzes the first resistance change signal to obtain a corresponding shell deformation quantity.

The strain gauge assembly 101 may specifically be formed by the strain gauge 1011, for example, the strain gauge assembly 101 may include one strain gauge 1011, or may be formed by a plurality of strain gauges 1011.

It can be understood that, the embodiment of the utility model provides an on the surface of spacecraft shell with strain gauge subassembly 101 and monitoring circuit 102 print through adopting 3D vibration material disk technique, can effectively combine in the middle of actual spacecraft shell monitoring system 10 with strain gauge 1011, and, owing to be on the surface of spacecraft shell with strain gauge subassembly 101 and monitoring circuit 102 print, and adopt multilayer thermal insulation material to cover strain gauge subassembly 101 and monitoring circuit 102, therefore, can effectively avoid receiving outer space operational environment's influence, thereby effectively promote actual monitoring ability, still owing to applied 3D vibration material disk technique, thereby can effectively alleviate the weight and the volume of spacecraft shell monitoring system 10, thereby reduce the cost of delivery of spacecraft.

The heat insulating material may be, for example, polyimide, which is not limited thereto.

The embodiment of the utility model provides a foil gage 1011 is the conductor, and it has corresponding physical properties and geometric properties, when it receives external force in the elastic limit when tensile, it can not be broken or produce permanent deformation, and can narrow down and become long, and this kind of deformation has leaded to its end resistance to change greatly. On the contrary, it becomes wider and shorter when it is compressed, and this deformation causes its terminal resistance to be small.

Thus, in this embodiment, by measuring the resistance of the strain gauge 1011, the strain in the covered area can be correspondingly estimated. The sensitive grid of the strain gauge 1011 is a group of parallel wires formed by zigzag arrangement of narrow conductor bars, and the arrangement mode can accumulate the tiny deformation in the direction of the base line to form a larger accumulated value of the resistance variation, so that the value of the deformation of the shell can be obtained by measuring the voltage variation at two ends through an electric bridge.

The monitoring circuit 102 monitors the resistance change signal of the strain gauge assembly 101, which may be referred to as a first resistance change signal, which can be used to describe the resistance change of the strain gauge assembly 101, and then analyzes the first resistance change signal to obtain the corresponding housing deformation amount.

The monitoring circuit 102 may specifically include a wheatstone bridge, so that the voltage variation at two ends of the strain gauge component 101 is monitored based on the wheatstone bridge, and the resistance variation signal is analyzed based on the voltage variation, which is not limited herein.

In some embodiments of the present invention, referring to fig. 2, the strain gauge assembly 101 is a strain gauge 1011 matrix, the strain gauge 1011 matrix is composed of a plurality of strain gauges 1011, each strain gauge 1011 is printed on the outer surface of the outer shell of the spacecraft by using a 3D additive manufacturing technology, and the strain gauges 1011 are connected to the monitoring circuit 102.

Therefore, the embodiment of the utility model provides an in through configuration foil gauge 1011 matrix, this foil gauge 1011 matrix includes a plurality of foil gauges 1011 for every foil gauge 1011 corresponds a coverage area, thereby realizes the monitoring of fine grit, can be in order to monitor the small deformation volume of every foil gauge 1011 coverage area, thereby makes the result of monitoring more accurate.

For example, suppose that the strain gauge assembly 101 in the embodiment of the present invention includes a plurality of strain gauges 1011, each strain gauge 1011 has a corresponding coverage area, the monitoring circuit 102 monitors the first resistance variation signal of the strain gauge assembly 101, and analyzes the first resistance variation signal to obtain a corresponding housing deformation amount, which may specifically be the target strain gauge 1011 to which the monitoring circuit 102 determines the first resistance variation signal belongs, the target strain gauge 1011 may be any one of the plurality of strain gauges 1011, and then, the coverage area corresponding to the target strain gauge 1011 is determined, and analyzes the first resistance variation signal to obtain a first resistance variation amount, and in combination with a preset corresponding relationship, the housing deformation amount corresponding to the first resistance variation amount is determined, and the housing deformation amount is taken as the housing deformation amount corresponding to the coverage area, and the corresponding relationship includes: a first resistance variation amount, and a housing deformation amount corresponding to the first resistance variation amount.

In some embodiments of the present invention, referring to fig. 2, the system further comprises: the temperature monitoring component 103 is connected with the monitoring circuit 102, the temperature monitoring component 103 is matched with the monitoring circuit, the temperature monitoring component 103 prints a bonding pad and a line required by installing a thermistor (such as an industrial thermistor) on the outer surface of a shell of the spacecraft by adopting a 3D additive manufacturing technology, and the bonding pad is welded with the thermistor to obtain the temperature monitoring component, wherein the monitoring circuit 102 monitors a second resistance change signal of the temperature monitoring component 103 and analyzes the second resistance change signal to obtain a corresponding temperature change amount.

In some embodiments of the present invention, referring to fig. 2, the temperature monitoring assembly 103 includes a plurality of temperature detecting sensors 1031, and 3D printing additive manufacturing technique is adopted to print each the bonding pads and lines required for the installation of the temperature detecting sensors are printed on the outer surface of the spacecraft shell, and placed under the multilayer insulation material, and the temperature detecting sensors 1031 are connected with the monitoring circuit 102, so that the spacecraft shell monitoring system 10 can realize the dual monitoring functions of the damage and the temperature of the spacecraft shell.

That is to say, the embodiment of the utility model provides an in can realize carrying out 3D to the foil gage of spacecraft shell monitoring system 10 and will install required pad of thermistor and circuit and print, and weld each thermistor on the pad, thereby realize in the aspect of the monitoring effect, not only can monitor the shell deformation volume effectively, can also monitor the temperature variation of the surface of shell effectively, high accuracy 3D vibration material disk makes whole set of system line and 3D print the foil gage and spreads all over the spacecraft shell surface, thereby can alleviate spacecraft shell monitoring system 10's quality effectively.

The utility model discloses an in some embodiments, temperature detect sensor 1031 is the thermistor of target encapsulation size (target encapsulation size is for example long 0.6mm, wide 0.3mm), and the encapsulation of this target encapsulation size's thermistor is minimum, perhaps, also can be other arbitrary possible temperature detect sensor 1031, does not do the restriction to this, when temperature detect sensor 1031 is the thermistor of target encapsulation size, can reduce and occupy spacecraft surface and inner space, reduce the total power consumption on the planet.

The utility model provides an each temperature detection sensor 1031 can cover on corresponding foil gage 1011 is surperficial, then the coverage area that foil gage 1011 corresponds can be regarded as the coverage area who corresponds with the temperature detection sensor 1031 that covers on its surface equally.

For example, assuming that the temperature monitoring component 103 includes a plurality of temperature detecting sensors 1031, and each temperature detecting sensor 1031 is connected to the monitoring circuit 102, the monitoring circuit 102 monitors a second resistance change signal of the temperature monitoring component 103, and analyzes the second resistance change signal to obtain a corresponding temperature change amount, which may specifically be a step in which the monitoring circuit 102 determines a target thermistor to which the second resistance change signal belongs, where the target thermistor may be any one of the plurality of thermistors, and determines a coverage area corresponding to the target thermistor, and then analyzes the second resistance change signal to obtain a second resistance change amount, and determines a temperature change amount corresponding to the second resistance change amount by combining a preset corresponding relationship, and takes the temperature change amount as a temperature change amount corresponding to the coverage area.

In some embodiments of the present invention, referring to fig. 3, the system further comprises:

the first analog-to-digital conversion module 104 is connected to the strain gauge assembly 101, the first analog-to-digital conversion module 104 is connected to the monitoring circuit 102, and the first analog-to-digital conversion module 104 is configured to acquire a first resistance change signal and perform analog-to-digital conversion on the first resistance change signal.

The embodiment of the utility model provides an in, through configuration and the first analog-to-digital conversion module 104 that foil gage subassembly 101 is connected, first analog-to-digital conversion module 104 is connected with monitoring circuit 102, and first analog-to-digital conversion module 104 is used for gathering first resistance change signal to carry out analog-to-digital conversion to first resistance change signal, the follow-up monitoring circuit 102 of being convenient for is to the processing of signal, and the lift system is handled and response efficiency.

In some embodiments of the present invention, referring to fig. 3, the system further comprises:

and the second analog-to-digital conversion module 105 is connected with the temperature monitoring component 103, the second analog-to-digital conversion module 105 is connected with the monitoring circuit 102, and the second analog-to-digital conversion module 105 is used for acquiring a second resistance change signal and performing analog-to-digital conversion on the second resistance change signal.

The embodiment of the utility model provides an in, through configuration second analog-to-digital conversion module 105 that is connected with temperature monitoring subassembly 103, second analog-to-digital conversion module 105 is connected with monitoring circuit 102, and second analog-to-digital conversion module 105 is used for gathering second resistance change signal to carry out analog-to-digital conversion to second resistance change signal, the follow-up monitoring circuit 102 of being convenient for is to the processing of signal, lift system handles and response efficiency.

In some embodiments of the present invention, the first analog-to-digital conversion module 104 is respectively connected to each strain gauge 1011.

In some embodiments of the present invention, the second analog-to-digital conversion module 105 is respectively connected to the temperature detection sensors 1031.

That is to say, first analog-to-digital conversion module 104 is connected with each foil gauge 1011 respectively, second analog-to-digital conversion module 105 is connected with each temperature detection sensor 1031 respectively, therefore, first resistance change signal of each foil gauge 1011 can be gathered to first analog-to-digital conversion module 104 by the multiplexing mode, second resistance change signal of each temperature detection sensor 1031 can be gathered by second analog-to-digital conversion module 105 by the multiplexing mode, thereby promote the efficiency of data acquisition effectively, can monitor a plurality of coverage areas simultaneously, when promoting the monitoring accuracy, monitoring efficiency has been promoted, thereby promote monitoring ability on the whole.

In some embodiments of the present invention, referring to fig. 3, the system further comprises: and a display assembly 106 connected to the monitoring circuit 102, wherein the display assembly 106 is used for displaying the deformation amount and/or the temperature change amount of the shell.

That is to say, the embodiment of the utility model provides an in not only support the dynamic monitoring to shell shape variable and temperature variation, can also reach and send the result of monitoring to display module 106 on the spot and show, this display module 106 can specifically dispose in the control operation panel of spacecraft, perhaps, also can set up to in the ground monitoring system to be convenient for relevant technical personnel in time take some counter-measures, can effectively promote the security of the whole application of spacecraft.

Referring to fig. 4, fig. 4 is a schematic diagram of multiplexing in an embodiment of the present invention.

Referring to fig. 5, fig. 5 is a schematic circuit structure diagram of the middle spacecraft shell monitoring system of the present invention, which includes: the device comprises an MCU data acquisition and calculation module 51, a strain gauge 52, a thermistor 53, a power supply line 54, a ground wire 55, a strain gauge signal line 56 and a thermistor signal line 57.

In this embodiment, through configuration strain gauge subassembly, strain gauge subassembly covers on the surface of spacecraft shell, the monitoring circuit who is connected with strain gauge subassembly, strain gauge subassembly and monitoring circuit adopt 3D vibration material disk technique to print at the surface of spacecraft shell, and adopt multilayer thermal insulation material to cover strain gauge subassembly and monitoring circuit, monitoring circuit monitors strain gauge subassembly's first resistance change signal, and analyze first resistance change signal and obtain corresponding shell deformation volume, thereby can effectively promote the monitoring effect of spacecraft shell, effectively alleviate the weight and the volume of spacecraft shell monitoring system, thereby reduce the delivery cost of spacecraft. The bonding pads and lines required by mounting the industrial thermistor are printed on the outer surface of the spacecraft shell by adopting a 3D additive manufacturing technology, and the temperature detection sensors (temperature detection sensors such as thermistors) are welded on the bonding pads and are connected with the monitoring circuit, so that the spacecraft shell monitoring system can realize the double monitoring functions of damage and temperature of the spacecraft shell. The strain gauge of the spacecraft shell monitoring system 10 and the bonding pad and the circuit required for installing the industrial thermistor are subjected to 3D printing, and each temperature detection sensor is welded on the bonding pad, so that in the aspect of monitoring effect, not only can the shell deformation quantity be effectively monitored, but also the temperature variation quantity of the outer surface of the shell can be effectively monitored, the whole system circuit and the 3D printed strain gauge can be distributed on the surface of the spacecraft shell by a high-precision 3D material increase manufacturing technology, and the quality of the spacecraft shell monitoring system 10 can be effectively reduced.

It should be noted that, in the description of the present invention, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.

Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps of the process, and the scope of the preferred embodiments of the present invention includes other implementations in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the embodiments of the present invention.

It should be understood that portions of the present invention may be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, the various steps or methods may be implemented in software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any one or combination of the following techniques, which are known in the art, may be used: a discrete logic circuit having a logic gate circuit for implementing a logic function on a data signal, an application specific integrated circuit having an appropriate combinational logic gate circuit, a Programmable Gate Array (PGA), a Field Programmable Gate Array (FPGA), or the like.

It will be understood by those skilled in the art that all or part of the steps carried by the method for implementing the above embodiments may be implemented by hardware related to instructions of a program, which may be stored in a computer readable storage medium, and when the program is executed, the program includes one or a combination of the steps of the method embodiments.

In addition, each functional unit in the embodiments of the present invention may be integrated into one processing module, or each unit may exist alone physically, or two or more units are integrated into one module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode. The integrated module, if implemented in the form of a software functional module and sold or used as a stand-alone product, may also be stored in a computer readable storage medium.

The storage medium mentioned above may be a read-only memory, a magnetic or optical disk, etc.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.

Claims (10)

1. A spacecraft case monitoring system, the system comprising:

a strain gauge assembly overlying an outer surface of the spacecraft case, monitoring circuitry connected to the strain gauge assembly, the strain gauge assembly and the monitoring circuitry printed on the outer surface of the spacecraft case using 3D additive manufacturing techniques, and the strain gauge assembly and the monitoring circuitry covered with multiple layers of thermally insulating material, wherein,

the monitoring circuit monitors a first resistance change signal of the strain gauge component and analyzes the first resistance change signal to obtain a corresponding shell deformation amount.

2. A spacecraft enclosure monitoring system according to claim 1, further comprising: the temperature monitoring component is connected with the monitoring circuit, the temperature monitoring component is matched with the monitoring circuit, the temperature monitoring component is manufactured by printing a bonding pad and a line required by installing a thermistor on the outer surface of a spacecraft shell by adopting the 3D additive manufacturing technology and welding the thermistor on the bonding pad,

the monitoring circuit monitors a second resistance change signal of the temperature monitoring assembly and analyzes the second resistance change signal to obtain a corresponding temperature change amount.

3. A spacecraft skin monitoring system according to claim 1 or 2, wherein the strain gauge assembly is a strain gauge matrix, the strain gauge matrix consisting of a plurality of strain gauges each of which is printed on an outer surface of the spacecraft skin using the 3D additive manufacturing technique, the strain gauges being connected to the monitoring circuitry.

4. A spacecraft enclosure monitoring system according to claim 2, wherein said temperature monitoring assembly is a temperature monitoring array comprising a plurality of temperature sensing sensors, and wherein the pads and wires required for mounting each of said temperature sensing sensors are printed on the outer surface of said spacecraft enclosure and underlying said layers of insulating material using said 3D printing additive manufacturing technique.

5. A spacecraft skin monitoring system according to claim 4, wherein said temperature detection sensor is a thermistor of a target package size.

6. A spacecraft enclosure monitoring system according to claim 3, further comprising:

the first analog-to-digital conversion module is connected with the monitoring circuit and is used for acquiring the first resistance change signal and performing analog-to-digital conversion on the first resistance change signal.

7. A spacecraft skin monitoring system according to claim 4, further comprising:

and the second analog-to-digital conversion module is connected with the monitoring circuit and is used for acquiring the second resistance change signal and performing analog-to-digital conversion on the second resistance change signal.

8. A spacecraft enclosure monitoring system according to claim 6, wherein said first analog-to-digital conversion module is respectively associated with each of said strain gauges.

9. A spacecraft skin monitoring system according to claim 7, wherein said second analog-to-digital conversion module is respectively associated with each of said temperature detection sensors.

10. A spacecraft enclosure monitoring system according to claim 2, further comprising:

and the display component is connected with the monitoring circuit and is used for displaying the shell deformation quantity and/or the temperature variation quantity.

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