CN214333099U

CN214333099U - Refrigerating and heating device

Info

Publication number: CN214333099U
Application number: CN202120273108.3U
Authority: CN
Inventors: 周洪章
Original assignee: Guangdong Guanghe Zhilian Technology Co ltd
Current assignee: Guangdong Guanghe Zhilian Technology Co ltd
Priority date: 2021-01-30
Filing date: 2021-01-30
Publication date: 2021-10-01
Anticipated expiration: 2031-01-30

Abstract

The utility model relates to a refrigeration and heating device, it includes radiator, fan, semiconductor wafer and heating panel, and the heating panel offsets with the back of semiconductor wafer, and the front of semiconductor wafer offsets with the rear portion of radiator, and the heating panel exposes in the medial surface of middle arm. The utility model discloses an utilize the semiconductor wafer refrigeration or heat, heating panel and user's health contact, the heating panel gives user's health with the produced heat of semiconductor wafer or cold volume transmission to the realization is human intensification or cooling, the utility model discloses compact structure, small, the quality is light, the refrigeration heating efficiency is high.

Description

Refrigerating and heating device

Technical Field

The utility model relates to a technical field of heating refrigeration device, in particular to refrigerating and heating device.

Background

The existing thermoelectric cooling and heating module has unreasonable structure, which results in large volume, incompact structure and low cooling and heating efficiency. Therefore, the structure of the existing thermoelectric cooling and heating module needs to be further improved.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a compact structure, refrigeration heat device that the efficiency of making heat is high.

The purpose of the utility model is realized like this:

a refrigerating and heating device comprises a radiator, a fan, a semiconductor wafer and a radiating plate, wherein the radiating plate is abutted against the back face of the semiconductor wafer, the front face of the semiconductor wafer is abutted against the rear portion of the radiator, and the fan is arranged at the front portion of the radiator. When the utility model discloses during the back refrigeration of semiconductor wafer, the produced cold volume at the back of semiconductor wafer is conducted by the heating panel, and the produced heat in front of semiconductor wafer is conducted by the radiator, and the fan air current flow with higher speed for the heat dissipation of radiator is faster, and is opposite, works as the utility model discloses during the back heating of semiconductor wafer, the fan also must make the heat exchange efficiency of radiator improve, consequently the utility model discloses a refrigeration heating efficiency is higher.

The utility model can be further improved as follows.

And the radiator and the semiconductor chip are respectively provided with a first temperature sensor and a second temperature sensor. The utility model discloses utilize the temperature of first temperature sensor and second temperature sensor real-time detection radiator and semiconductor wafer to be favorable to the most suitable temperature of providing to the human body.

The radiator is provided with a mounting groove and an air inlet separation cover, the air inlet separation cover is arranged in the mounting groove, the fan is arranged in the air inlet separation cover, the air inlet separation cover is provided with an air inlet, the front part of the radiator is provided with a plurality of radiating fins, a radiating channel is arranged between every two adjacent radiating fins, and the radiating channel is communicated with the mounting groove and the air outlet. Therefore, the fan sucks cold air from the air inlet separation cover, the cold air enters the plurality of radiating channels through the mounting groove, the cold air exchanges heat with the radiating fins, the heat of the radiating fins is taken away by the cold air, and the cold air is discharged from the front parts of the radiating channels and finally discharged from the air outlet.

The two ends and the rear part of the heat dissipation channels are sealed, the front parts of the heat dissipation channels are opened, so that air outlets are formed in the front parts of the heat dissipation channels, and the mounting grooves vertically penetrate through the heat dissipation channels.

The utility model has the advantages as follows:

(one) the utility model discloses an utilize the semiconductor wafer refrigeration or heat, heating panel and user's health contact, the heating panel gives user's health with the produced heat of semiconductor wafer or cold volume transmission to realize for human body intensification or cooling, the utility model discloses compact structure, small, the quality is light, refrigeration heating efficiency is high.

Drawings

Fig. 1 is a schematic structural diagram of a portable air conditioner according to a first embodiment of the present invention.

Fig. 2 is a schematic view of the structure of fig. 1 from another angle.

Fig. 3 is a front view of a portable air conditioner according to a first embodiment of the present invention.

Fig. 4 is a cross-sectional view at a-a in fig. 3.

Fig. 5 is a sectional view at B-B in fig. 3.

Fig. 6 is a schematic structural view of the refrigerating and heating apparatus of the present invention.

Fig. 7 is a schematic view of the structure of fig. 6 at another angle.

Fig. 8 is a schematic view of the connection between the third hinge member and the fourth hinge member according to the present invention.

Fig. 9 is a partially exploded view of a portable air conditioner according to a first embodiment of the present invention.

Fig. 10 is an overall exploded view of a portable air conditioner according to a first embodiment of the present invention.

Fig. 11 is a schematic structural diagram of a second embodiment of the portable air conditioner of the present invention.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and examples.

In a first embodiment, as shown in fig. 1 to 10, a portable air conditioner includes a C-shaped air conditioner body 1, a wearing opening 37 with an adjustable size is formed between two ends of the air conditioner body, the cooling and heating device 5, a battery 7, a circuit board 8 and a vent 33, the cooling and heating device 5 includes a heat sink 51, a fan 6, a semiconductor wafer 52 and a heat dissipation plate 53, the heat dissipation plate 53 abuts against a back surface of the semiconductor wafer 52, a front surface of the semiconductor wafer abuts against a rear portion of the heat sink 51, the fan 6 is disposed in a front portion of the heat sink 51, and the heat dissipation plate is exposed on an inner side surface of the air conditioner body.

As a more specific technical solution of the present invention.

Air conditioner body 1's middle part is equipped with refrigeration heating device, of course, the utility model discloses also can only set up refrigeration heating device in the both sides of air conditioner body, equally, in order to improve the utility model discloses your refrigeration heating efficiency, the utility model discloses also can set up refrigeration heating device simultaneously in the middle part and the both sides of air conditioner body.

Air conditioner body's lateral surface is located to vent 33, consequently, the fan outwards airs exhaust through vent 33, and wind can not blow the human body to avoid influencing the utility model discloses a comfort level.

The shape of the outer surface of the heat dissipation plate is matched with the shape of the inner side face of the air conditioner body. The inner side surface of the air conditioner body is provided with a yielding hole 341 corresponding to the heat dissipation plate, and the heat dissipation plate is arranged on the yielding hole 341.

As a more specific technical solution of the present invention.

Air conditioner body 1 specifically includes middle arm 3, left side arm lock 2 and right side arm lock 4, the outer single of left

side arm lock

2 and 4 outer ends of right side arm lock rotate respectively and connect in the both ends of middle arm 3, exist between left side arm lock 2 and the right side arm lock 4 dress opening 37, refrigeration heating device 5 locates on middle arm 3, battery 7 locates in the left side arm lock 2, circuit board 8 locates in the right side arm lock 4, middle arm 3 corresponds refrigeration heating device 5 and is equipped with vent 33.

The middle arm 3 is formed by folding the middle inner shell 34 and the middle outer shell 35 towards each other.

The left clamping arm 2 is formed by oppositely folding a left inner shell 21 and a left outer shell 22.

The right clamping arm 4 is formed by oppositely folding a right inner shell 41 and a right outer shell 42.

The heat dissipation plate 53 is exposed on the inner side surface of the intermediate arm 3.

The ventilation opening 33 is provided on the outer side surface of the intermediate arm 3. The ventilation opening 33 is provided with a ventilation grille 331.

The heat sink 51 and the semiconductor wafer 52 are provided with a first temperature sensor 54 and a second temperature sensor 55, respectively.

The circuit board is electrically connected with the battery 7, the semiconductor wafer 52, the fan 6, the first temperature sensor 54 and the second temperature sensor 55 through wires 36.

The air conditioner body 1 is provided with a charging hole 11, a switch key 12 and a work indicator light 13.

Be equipped with mounting groove 56 and air inlet partition lid 57 on radiator 51, the air inlet is separated lid 57 and is located in mounting groove 56, fan 6 is located in the air inlet partition lid 57, be equipped with air intake 32 on the air inlet partition lid 57, radiator 51's front portion is equipped with multi-disc radiating fin 59 and air outlet 31 along the horizontal direction, be heat dissipation channel 510 between two adjacent radiating fin 59, heat dissipation channel 510 intercommunication mounting groove 56 and air outlet 31. The air outlet 31 and the air inlet 32 are respectively communicated with the ventilation opening 33.

The two ends and the rear portion of the plurality of heat dissipation channels 510 are closed, the front portion of the heat dissipation channels 510 is open to form the air outlet 31 in the front portion of the heat dissipation channels 510, and the mounting grooves vertically penetrate through the plurality of heat dissipation channels 510.

As a more detailed technical solution of the present invention.

A first flexible outer shell 81, a first hinge 82, a second hinge 83 and a first torsion spring 84 are arranged at the rotating connection position of the left clamp arm 2 and the middle arm 3, the first hinge 82 and the second hinge 83 are positioned in the first flexible outer shell 81, the first hinge 82 and the second hinge 83 are respectively and fixedly connected with the middle arm 3 and the left clamp arm 2, the first hinge 82 is hinged with the second hinge 83, one end of the first torsion spring 84 abuts against the first hinge 82, the other end of the first torsion spring 84 abuts against the second hinge 83, a second flexible outer shell 85, a third hinge 86, a fourth hinge 87 and a second torsion spring 88 are arranged at the rotating connection position of the right clamp arm 4 and the middle arm 3, the third hinge 86 and the fourth hinge 87 are respectively and fixedly connected with the middle arm 3 and the left clamp arm 2, the third hinge 86 and the fourth hinge 87 are positioned in the second flexible outer shell 85, the third hinge member 86 is hinged to the fourth hinge member 87, one end of the second torsion spring 88 abuts against the third hinge member 86, and the other end of the second torsion spring 88 abuts against the fourth hinge member 87.

The first hinge 82, the second hinge 83, the third hinge 86 and the fourth hinge 87 are provided with threading holes 89, and the electric wire 36 passes through the threading holes 89.

The working principle of the utility model is as follows;

when a user wants to wear the air conditioner of the utility model to warm in cold winter, the user firstly presses the switch button, the work indicator light shows red color, the air conditioner of the utility model enters a heating mode, the semiconductor wafer 52 and the fan are started together, the inner end surface of the semiconductor wafer 52 starts to heat, the outer end surface of the semiconductor wafer 52 starts to refrigerate, then the user rotates the left and right side clamp arms outwards to enlarge the wearing opening 37 between the left and right side clamp arms, the first torsion spring and the second torsion spring are deformed by pressure, then the user clamps the air conditioner body into the neck of the user and leads the heat dissipation plate to be abutted against the neck of the user, then the user loosens the left and right side clamp arms, the first torsion spring and the second torsion spring recover elastic deformation, the left and right side clamp arms clamp the neck of the user, thereby leading the air conditioner body of the utility model to be hung on the human body, the heat of the semiconductor wafer 52 is transferred to the human body through the heat dissipation plate, thereby realizing heating for human body heating. The heat sink and the fan discharge the cooling energy generated from the outer end surface of the semiconductor fin 52 to the atmosphere.

On the contrary, when the hot summer of user's department, want to wear the utility model discloses during the air conditioner cooling, the user presses the switch button earlier, and the work pilot lamp shows green, the utility model discloses the air conditioner gets into the refrigeration mode, and semiconductor wafer 52 and fan start together, and the interior terminal surface of semiconductor wafer 52 begins to refrigerate, and the outer terminal surface of semiconductor wafer 52 begins to heat, and the user is according to foretell mode, will the utility model discloses the air conditioner is dressed on user's neck to make the heating panel support and lean on user's neck, semiconductor wafer 52's cold volume passes through heating panel 53 and transmits for the human body, thereby realizes for human refrigeration cooling. The heat sink 51 and the fan 6 discharge heat generated from the outer end surface of the semiconductor wafer 52 to the atmosphere.

Example two, as shown in fig. 11, the implementation of example two is similar to that of example one, and the only difference is that: the air conditioner comprises an air conditioner body 1 and is characterized in that a first massage electrode 9, a second massage electrode 10, a first key 14 and a second key 15 are arranged on the air conditioner body 1, the first massage electrode 9 and the second massage electrode 10 are respectively and electrically connected with a circuit board, preferably, the first massage electrode 9 and the second massage electrode 10 are arranged on a middle arm 3, and the first massage electrode 9 and the second massage electrode 10 are respectively located on the left side and the right side of a heat dissipation plate 53.

When the utility model discloses during the start-up massage function, the utility model discloses a circuit board is to first massage electrode 9 and second massage electrode 10 circular telegram, and first massage electrode 9 and second massage electrode 10 support and lean on user's neck to form a circuit return circuit, then the circuit board provides the little current of pulse change and gives above-mentioned circuit return circuit, first button 14 and second button 15 are used for controlling pulse current's size, and the user adjusts pulse current's size through first button 14 and second button 15 are expert. Under the action of micro-current, the micro-current activates skin nerves to cause skin and muscle suction and storage, muscle contraction and activity, and promotes local blood circulation, thereby achieving the massage effect.

Claims

1. A refrigerating and heating device is characterized by comprising a radiator, a fan, a semiconductor wafer and a heat dissipation plate, wherein the fan is arranged at the front part of the radiator, the front side of the semiconductor wafer is abutted against the rear part of the radiator, and the heat dissipation plate is abutted against the back side of the semiconductor wafer.

2. The refrigerating and heating apparatus as claimed in claim 1, wherein the heat sink and the semiconductor chip are respectively provided with a first temperature sensor and a second temperature sensor.

3. The refrigerating and heating apparatus as claimed in claim 1, wherein the heat sink is provided with a mounting groove and an air inlet partition cover, the air inlet partition cover is disposed in the mounting groove, the blower is disposed in the air inlet partition cover, and the air inlet partition cover is provided with an air inlet.

4. The refrigerating and heating apparatus as claimed in claim 1, wherein the heat sink has a plurality of fins and an air outlet at a front portion thereof, and a heat dissipating passage is defined between two adjacent fins and communicates the mounting groove and the air outlet.

5. The refrigerating and heating apparatus as claimed in claim 4, wherein both ends and rear portions of the plurality of heat dissipating channels are closed, the front portions of the heat dissipating channels are opened to form the air outlet at the front portions of the heat dissipating channels, and the mounting groove vertically penetrates the plurality of heat dissipating channels.