CN214322112U - Reflow soldering machine with dust removal function for integrated circuit packaging - Google Patents
Reflow soldering machine with dust removal function for integrated circuit packaging Download PDFInfo
- Publication number
- CN214322112U CN214322112U CN202022542713.4U CN202022542713U CN214322112U CN 214322112 U CN214322112 U CN 214322112U CN 202022542713 U CN202022542713 U CN 202022542713U CN 214322112 U CN214322112 U CN 214322112U
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- reflow soldering
- soldering machine
- dust
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000428 dust Substances 0.000 title claims abstract description 49
- 238000005476 soldering Methods 0.000 title claims abstract description 30
- 238000004806 packaging method and process Methods 0.000 title description 4
- 238000005538 encapsulation Methods 0.000 claims abstract description 5
- 238000003466 welding Methods 0.000 claims abstract description 5
- 125000006850 spacer group Chemical group 0.000 claims abstract description 3
- 238000005192 partition Methods 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 4
- 241000883990 Flabellum Species 0.000 abstract description 3
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- 230000007246 mechanism Effects 0.000 abstract description 3
- 238000009434 installation Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a reflow soldering machine is used in integrated circuit encapsulation with dust removal function, which comprises a housin, the left side fixedly connected with reflow soldering machine body at casing top, the left rear end intercommunication of casing has the dust exhaust pipe, the top fixedly connected with fan of dust exhaust pipe, dust absorption pipe and reflow soldering machine body intercommunication are passed through at the top of fan, the left side of casing inner chamber bottom is provided with the pivot, the axis fixedly connected with flabellum of department on pivot surface. The utility model discloses a backward flow welding machine body, fan, dust exhaust pipe, dust absorption pipe, baffle, link, filter screen, pivot, flabellum, brush board, spacer pin, diaphragm, dodge gate, movable block, movable rod, sliding seat, the cooperation of fixed block and bayonet lock, solved the current most backward flow welding machine and did not possess dust removal function at the during operation, even installed dust removal mechanism a bit, also can be because dust removal effect is poor and can not reach the operation requirement to the inconvenient problem of using.
Description
Technical Field
The utility model relates to a reflow soldering machine technical field specifically is a reflow soldering machine is used in integrated circuit encapsulation with dust removal function.
Background
The reflow soldering machine is also called as reflow soldering machine or 'reflow oven', which is a device that can reliably combine surface mount components and PCB pads together through solder paste alloy by providing a heating environment to heat and melt solder paste.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a not enough to prior art, the utility model provides a backflow welder is used in integrated circuit encapsulation with dust removal function to solve the problem that proposes in the above-mentioned background art.
(II) technical scheme
In order to achieve the above object, the utility model provides a following technical scheme: a reflow soldering machine with a dust removal function for integrated circuit packaging comprises a shell, wherein a reflow soldering machine body is fixedly connected to the left side of the top of the shell, a dust exhaust pipe is communicated with the rear end of the left side of the shell, a fan is fixedly connected to the top of the dust exhaust pipe, the top of the fan is communicated with the reflow soldering machine body through the dust exhaust pipe, a rotating shaft is arranged on the left side of the bottom of an inner cavity of the shell, fan blades are fixedly connected to the middle shaft of the surface of the rotating shaft, a brush plate is fixedly connected to the top of the rotating shaft, a partition plate is fixedly connected to the right side of the inner wall of the shell, a connecting frame is sleeved in the inner cavity of the partition plate, a filter screen is fixedly connected to the left side of the inner cavity of the connecting frame, a limiting pin is clamped to the right side of the inner cavity of the connecting frame, a transverse plate is fixedly connected to the bottom of the limiting pin, a movable door is movably connected to the right side of the shell, and a movable block is fixedly connected to the left side of the movable door, the bottom of the movable block is movably connected with a movable rod, and the bottom of the movable rod is movably connected with a movable seat.
Preferably, the right side fixedly connected with fixed block at casing top, the inner chamber cover of fixed block is equipped with the bayonet lock.
Preferably, the right side of the bottom of the inner cavity of the shell is provided with a sliding groove, and the inner cavity of the sliding groove is in sliding connection with the movable seat.
Preferably, the bottom of the surface of the rotating shaft is movably connected with a dustproof bearing, and the bottom of the dustproof bearing is fixedly connected with the shell.
Preferably, the left side of the top of the shell and the bottom of the reflow soldering machine body are both provided with a through groove, and the bottom of the shell is communicated with a fixed pipe.
(III) advantageous effects
Compared with the prior art, the utility model provides a backflow welder is used in integrated circuit encapsulation with dust removal function possesses following beneficial effect:
1. the utility model sucks and discharges the dust in the reflow soldering machine body to the inside of the shell through the matching of the fan, the dust discharging pipe and the dust absorbing pipe, the dust in the air is filtered by the filter screen, meanwhile, the gas can be blown to the surface of the fan blade, thereby driving the fan blade to rotate, the fan blade drives the rotating shaft to rotate, the rotating shaft drives the brush board to rotate, the filter screen is brushed by the brush board, thereby avoiding the filter screen from being easily blocked, when the filter screen needs to be replaced, the movable door is opened, the movable door can drive the movable block to move, the movable block drives the movable rod to move, the movable rod can be far away from the transverse plate, then the transverse plate is pressed downwards, the transverse plate can drive the limit pin to move, when the limit pin is separated from the connecting frame, the connecting frame can be pulled to the right side to complete the disassembly, and the installation can be rapidly completed through the steps, thereby solving the problem that most of the existing reflow soldering machines do not have the dust removing function during the work, even some are installed with dust removal mechanisms, the dust removal effect is poor, so that the use requirements cannot be met, and the problem of inconvenient use is solved.
2. The utility model discloses a set up fixed block and bayonet lock, it is convenient to carry on spacingly to the dodge gate, has avoided the dodge gate during operation unstable, through setting up the spout, has stabilized the work of sliding seat, has carried out balanced support to the sliding seat, has avoided the sliding seat during operation unstable, through setting up dust retainer, has stabilized the work of pivot, has carried out spacingly to the countershaft, has avoided the pivot during operation unstable.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the present invention in a partial cross-sectional view;
fig. 3 is a schematic view of the top view structure of the connection frame of the present invention.
In the figure: 1. a housing; 2. a reflow soldering machine body; 3. a fan; 4. a dust exhaust pipe; 5. a dust collection pipe; 6. a partition plate; 7. a connecting frame; 8. a filter screen; 9. a rotating shaft; 10. a fan blade; 11. brushing the board; 12. a spacing pin; 13. a transverse plate; 14. a movable door; 15. a movable block; 16. a movable rod; 17. a movable seat; 18. a fixed block; 19. a bayonet lock.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to be referred must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The utility model discloses a casing 1, reflow soldering machine body 2, fan 3, dust exhaust pipe 4, dust absorption pipe 5, baffle 6, link 7, filter screen 8, pivot 9, flabellum 10, brush board 11, spacer pin 12, diaphragm 13, dodge gate 14, movable block 15, movable rod 16, sliding seat 17, fixed block 18 and bayonet lock 19 part are the parts that universal standard spare or technical personnel in the field know, and its structure and principle all are this technical personnel and all can learn the manual or learn through conventional experimental method through the technique.
Referring to fig. 1-3, a reflow soldering machine for integrated circuit packaging with dust removal function comprises a housing 1, a reflow soldering machine body 2 is fixedly connected to the left side of the top of the housing 1, through grooves are formed in the left side of the top of the housing 1 and the bottom of the reflow soldering machine body 2, a fixed pipe is communicated with the bottom of the housing 1, a dust exhaust pipe 4 is communicated with the rear end of the left side of the housing 1, a fan 3 is fixedly connected to the top of the dust exhaust pipe 4, the top of the fan 3 is communicated with the reflow soldering machine body 2 through a dust exhaust pipe 5, a rotating shaft 9 is arranged on the left side of the bottom of an inner cavity of the housing 1, a dust-proof bearing is movably connected to the bottom of the surface of the rotating shaft 9, the bottom of the dust-proof bearing is fixedly connected with the housing 1, the operation of the rotating shaft 9 is stabilized through the dust-proof bearing, the rotating shaft 9 is limited, the instability of the rotating shaft 9 during operation is avoided, and fan blades 10 are fixedly connected to the middle shaft on the surface of the rotating shaft 9, the brush plate 11 is fixedly connected to the top of the rotating shaft 9, the partition plate 6 is fixedly connected to the right side of the inner wall of the shell 1, the connecting frame 7 is sleeved in the inner cavity of the partition plate 6, the filter screen 8 is fixedly connected to the left side of the inner cavity of the connecting frame 7, the limiting pin 12 is clamped on the right side of the inner cavity of the connecting frame 7, the transverse plate 13 is fixedly connected to the bottom of the limiting pin 12, the movable door 14 is movably connected to the right side of the shell 1, the fixed block 18 is fixedly connected to the right side of the top of the shell 1, the bayonet pin 19 is sleeved in the inner cavity of the fixed block 18, the movable door 14 is conveniently limited by arranging the fixed block 18 and the bayonet pin 19, instability of the movable door 14 during operation is avoided, the movable block 15 is fixedly connected to the left side of the movable door 14, the movable rod 16 is movably connected to the bottom of the movable block 15, the movable seat 17 is movably connected to the bottom of the movable rod 16, the right side of the bottom of the inner cavity of the shell 1 is provided with a sliding groove, and the inner cavity of the sliding seat 17 is connected with the movable seat in a sliding manner, through setting up the spout, stabilized the work of sliding seat 17, carried out the balanced support to sliding seat 17, avoided sliding seat 17 during operation unstable.
When the welding machine is used, the fan 3 is controlled to work through the external controller, dust in the reflow welding machine body 2 is sucked and discharged into the shell 1 through the matching of the fan 3, the dust discharge pipe 4 and the dust suction pipe 5, the dust in the air is filtered through the filter screen 8, and meanwhile, the air is blown to the surface of the fan blade 10, so that the fan blade 10 is driven to rotate, the fan blade 10 drives the rotating shaft 9 to rotate, the rotating shaft 9 drives the brush plate 11 to rotate, the filter screen 8 is brushed through the brush plate 11, so that the filter screen 8 is prevented from being easily blocked, when the filter screen 8 needs to be replaced, the movable door 14 is opened, the movable door 14 drives the movable block 15 to move, the movable block 15 drives the movable rod 16 to move, the movable rod 16 is far away from the transverse plate 13, then the transverse plate 13 is pressed downwards, the transverse plate 13 drives the limit pin 12 to move, and when the limit pin 12 is separated from the connecting frame 7, to the right side pulling link 7 can accomplish the dismantlement, and also can accomplish the installation fast through above-mentioned step, solved current most reflow soldering machine and did not possess the dust removal function at the during operation, even install dust removal mechanism a bit, also can not reach the operation requirement because dust removal effect is poor, thereby the inconvenient problem of using, peripheral hardware controller is the PLC controller in this application, and simultaneously, two wiring ends of peripheral hardware controller are connected with power plug through the wire, and adopt the commercial power to supply power in this application.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a reflow soldering machine is used in integrated circuit encapsulation with dust removal function, includes casing (1), its characterized in that: the welding machine is characterized in that a reflow soldering machine body (2) is fixedly connected to the left side of the top of the shell (1), a dust exhaust pipe (4) is communicated with the left rear end of the shell (1), a fan (3) is fixedly connected to the top of the dust exhaust pipe (4), the top of the fan (3) is communicated with the reflow soldering machine body (2) through a dust suction pipe (5), a rotating shaft (9) is arranged on the left side of the bottom of an inner cavity of the shell (1), fan blades (10) are fixedly connected to the middle shaft of the surface of the rotating shaft (9), a brush plate (11) is fixedly connected to the top of the rotating shaft (9), a partition plate (6) is fixedly connected to the right side of the inner wall of the shell (1), a connecting frame (7) is sleeved on an inner cavity of the partition plate (6), a filter screen (8) is fixedly connected to the left side of the inner cavity of the connecting frame (7), and a limiting pin (12) is clamped to the right side of the inner cavity of the connecting frame (7), the bottom fixedly connected with diaphragm (13) of spacer pin (12), the right side swing joint of casing (1) has dodge gate (14), the left side fixedly connected with movable block (15) of dodge gate (14), the bottom swing joint of movable block (15) has movable rod (16), the bottom swing joint of movable rod (16) has sliding seat (17).
2. The reflow soldering machine for integrated circuit package with dust removing function according to claim 1, wherein: the right side fixedly connected with fixed block (18) at casing (1) top, the inner chamber cover of fixed block (18) is equipped with bayonet lock (19).
3. The reflow soldering machine for integrated circuit package with dust removing function according to claim 1, wherein: the right side of the bottom of the inner cavity of the shell (1) is provided with a sliding groove, and the inner cavity of the sliding groove is connected with the movable seat (17) in a sliding manner.
4. The reflow soldering machine for integrated circuit package with dust removing function according to claim 1, wherein: the bottom of the surface of the rotating shaft (9) is movably connected with a dustproof bearing, and the bottom of the dustproof bearing is fixedly connected with the shell (1).
5. The reflow soldering machine for integrated circuit package with dust removing function according to claim 1, wherein: the left side at casing (1) top and the bottom of reflow soldering machine body (2) have all been seted up logical groove, the bottom intercommunication of casing (1) has fixed pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022542713.4U CN214322112U (en) | 2020-11-06 | 2020-11-06 | Reflow soldering machine with dust removal function for integrated circuit packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022542713.4U CN214322112U (en) | 2020-11-06 | 2020-11-06 | Reflow soldering machine with dust removal function for integrated circuit packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214322112U true CN214322112U (en) | 2021-10-01 |
Family
ID=77894177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022542713.4U Expired - Fee Related CN214322112U (en) | 2020-11-06 | 2020-11-06 | Reflow soldering machine with dust removal function for integrated circuit packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214322112U (en) |
-
2020
- 2020-11-06 CN CN202022542713.4U patent/CN214322112U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN214322112U (en) | Reflow soldering machine with dust removal function for integrated circuit packaging | |
| CN217166947U (en) | Battery welding equipment | |
| CN217832185U (en) | Welding assembly of automatic assembly production line of photovoltaic junction box | |
| CN214042228U (en) | Computer machine case heat dissipation mechanism | |
| CN217607286U (en) | High-efficient radiating safe type high-low voltage distribution cabinet | |
| CN212599826U (en) | Electric lifting device for electric appliance processing | |
| CN213615688U (en) | Double-end-face grinding machine with automatic cleaning function | |
| CN214155109U (en) | Network security early warning device | |
| CN213560788U (en) | Welding tool | |
| CN213467156U (en) | High-efficient dust shaker is used in pellet production | |
| CN211965109U (en) | Ventilation device for limited space | |
| CN212343523U (en) | Heat dissipation type DC brushless motor | |
| CN212020297U (en) | Grinding device is used in processing of computer connector | |
| CN210326647U (en) | Dustproof ventilation type electric power cabinet | |
| CN108718487B (en) | Carrier tool for circuit board machining | |
| CN213053418U (en) | Electrical welding part clamping device | |
| CN212563805U (en) | Volute component structure, air inducing device and integrated stove | |
| CN216421381U (en) | Plasma cutting welding machine | |
| CN214959135U (en) | Motor for efficient range hood | |
| CN218160003U (en) | Dry-type capacitor shell that waterproof performance is good | |
| CN219554367U (en) | Control cabinet of full-automatic back flush filter | |
| CN218306804U (en) | Heat radiation structure of dustproof function of taking of container gas generating set | |
| CN210558699U (en) | Dustproof electric drive switch board | |
| CN214809360U (en) | Multifunctional dust remover | |
| CN212377929U (en) | Car car light that heat dispersion is good |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211001 |