CN214313173U

CN214313173U - Wafer defect detection machine

Info

Publication number: CN214313173U
Application number: CN202120469546.7U
Authority: CN
Inventors: 李云华; 黄雷
Original assignee: Jiangsu Sizhi Semiconductor Technology Co ltd
Current assignee: Jiangsu Sizhi Semiconductor Technology Co ltd
Priority date: 2021-03-04
Filing date: 2021-03-04
Publication date: 2021-09-28
Anticipated expiration: 2031-03-04

Abstract

The utility model discloses a wafer defect detection board, including the testboard, the top both sides of testboard all are provided with the riser, be provided with the roof between the top of riser, the bottom of roof is provided with optical detection device, be provided with fixed subassembly between the bottom of riser, the both ends of fixed subassembly both sides all are provided with the slide bar, the slide bar is kept away from the one end of fixed subassembly all is provided with sliding block one, just the inboard of riser all seted up with a sliding block matched with spout, the intermediate position of fixed subassembly both sides all is provided with rotating assembly. Has the advantages that: the wafer fixing device has the advantages that the wafer can be fixed, so that the stability of the wafer on the test board is effectively improved, the irradiation effect of the optical detection device on the surface is effectively prevented from being influenced due to the fact that the wafer moves randomly, and the detection effect of the wafer is effectively guaranteed.

Description

Wafer defect detection machine

Technical Field

The utility model relates to a wafer detects technical field, particularly, relates to a wafer defect detection board.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit element structures can be processed on a silicon wafer to form an IC product with specific electrical functions. In the wafer processing process, because the limitation of the detection means often leads to the fact that the wafer with the surface defect can not be found at the source and flows into the next procedure, the phenomena of cracks or scrapping and the like are likely to occur in the processing process, and a great deal of manpower and resource waste is caused.

Therefore, in order to avoid the occurrence of a large amount of wasted manpower and resources, the defect detection of the wafer is required, however, the existing market has the following defects for the equipment in the aspect of wafer detection: the wafer cannot be fixed on the test board, so that the stability of the wafer on the test board is poor, the irradiation effect of the optical detection device on the surface of the wafer is easily influenced, and the detection result is influenced.

An effective solution to the problems in the related art has not been proposed yet.

SUMMERY OF THE UTILITY MODEL

To the problem among the correlation technique, the utility model provides a wafer defect detects board to overcome the above-mentioned technical problem that current correlation technique exists.

Therefore, the utility model discloses a specific technical scheme as follows:

the utility model provides a wafer defect detection board, includes the testboard, the top both sides of testboard all are provided with the riser, are provided with the roof between the top of riser, and the bottom of roof is provided with optical detection device, is provided with fixed subassembly between the bottom of riser, and the both ends of fixed subassembly both sides all are provided with the slide bar, and the one end that fixed subassembly was kept away from to the slide bar all is provided with sliding block one, and the inboard of riser all seted up with sliding block one matched with spout, and the intermediate position of fixed subassembly both sides all is provided with rotating assembly.

Further, for the convenience of operating personnel controls, one side of riser is provided with control panel, is provided with a plurality of control button on the control panel.

Further, in order to realize the fixing of the wafer, the stability of the wafer on the test board is improved, the fixing assembly comprises a fixing frame, the two sides of the inside of the fixing frame are provided with movable plates, the two sides of the inside of the fixing frame and the two sides of the movable plates perpendicular to the movable plates are provided with adjusting assemblies, arc-shaped grooves are formed in the inner sides of the movable plates, arc-shaped clamping plates are arranged on the inner sides of the arc-shaped grooves, buffer cavities are formed in the inside of the movable plates, buffer assemblies are arranged in the inside of the buffer cavities, and the inner sides of the buffer assemblies are connected with the arc-shaped clamping plates.

Further, in order to better realize the clamping fixation of the wafer, a plurality of clamping blocks are uniformly arranged on the inner side of the arc-shaped clamping plate, and clamping grooves are formed in the middle of the inner side of each clamping block.

Further, in order to realize the regulation to the distance between the fly leaf, can realize better that the centre gripping to the wafer is fixed, adjusting part includes the dwang, the one end of dwang and fixed frame's inner wall connection, the other end of dwang passes through gear motor one and fixed frame's opposite side inner wall connection, the both sides of dwang all are provided with the thread and revolve to opposite external screw thread, the outside of external screw thread all overlaps and is equipped with matched with sliding block two with it, and the one side of sliding block two and the one end fixed connection of fly leaf.

Further, in order to play certain buffering effect to the centre gripping of wafer, avoid the influence because of the centre gripping dynamics is too big for the wafer to bring, the buffering subassembly includes the buffer board, the both ends of buffer board all run through and are provided with a plurality of guide arms, and the both ends of guide arm all with the interior wall connection of cushion chamber, the outside of guide arm just is located and all is provided with the spring between the both sides of buffer board and the inner wall of cushion chamber, the inboard of buffer board is provided with a plurality of connecting rods, and the connecting rod keep away from the one end of buffer board all with one side fixed connection of arc grip block.

Further, in order to realize the detection to the wafer positive and negative, rotating assembly includes the axis of rotation, and the one end and the fixed frame fixed connection of axis of rotation, the other end of axis of rotation passes through bearing and riser swing joint, the cover is equipped with conical gear one in the axis of rotation, the bottom of conical gear one is provided with conical gear two with it engaged with, the bottom of conical gear two is provided with gear motor two, and gear motor two's bottom and the top fixed connection of testboard.

The utility model has the advantages that:

1) the fixing component is arranged, so that the arc-shaped clamping plate can be fixed to the wafer, the stability of the wafer on the test board is effectively improved, the irradiation effect of the optical detection device on the surface of the optical detection device due to the fact that the wafer is moved randomly is effectively avoided, and the detection effect of the wafer is effectively guaranteed.

2) Through being provided with rotating assembly, can drive fixed frame and rotate to make the arc grip block can drive the wafer and realize automatic turn-ups, thereby make optical detection device can realize comparing in traditional artifical manual turn-ups to the detection of wafer positive and negative, the utility model discloses can realize the turn-ups of wafer automatically, thereby reduce staff's intensity of labour effectively, improve detection rate, can satisfy the user demand of enterprise better.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a wafer defect detecting machine according to an embodiment of the present invention;

fig. 2 is a side view of a vertical plate in a wafer defect detecting machine according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a fixing component in a wafer defect detecting machine according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a clamping block in a wafer defect detecting machine according to an embodiment of the present invention;

fig. 5 is a schematic view illustrating a connection between a fixing member and a vertical plate in a wafer defect detecting machine according to an embodiment of the present invention.

In the figure:

1. a test bench; 2. a vertical plate; 3. a top plate; 4. an optical detection device; 5. a fixing assembly; 501. a fixed frame; 502. a movable plate; 503. an arc-shaped slot; 504. an arc-shaped clamping plate; 505. a buffer chamber; 506. a clamping block; 507. a clamping groove; 508. rotating the rod; 509. a first speed reducing motor; 510. an external thread; 511. a second sliding block; 512. a buffer plate; 513. a guide bar; 514. a spring; 515. a connecting rod; 6. a slide bar; 7. a first sliding block; 8. a chute; 9. a rotating assembly; 901. a rotating shaft; 902. a first conical gear; 903. a second bevel gear; 904. a second speed reducing motor; 10. a control panel.

Detailed Description

For further explanation of the embodiments, the drawings are provided as part of the disclosure and serve primarily to illustrate the embodiments and, together with the description, to explain the principles of operation of the embodiments, and to provide further explanation of the invention and advantages thereof, it will be understood by those skilled in the art that various other embodiments and advantages of the invention are possible, and that elements in the drawings are not to scale and that like reference numerals are generally used to designate like elements.

According to the utility model discloses an embodiment provides a wafer defect detects board.

It is right to combine the attached drawing now with the detailed description of the embodiment the utility model discloses further explain, as shown in fig. 1-5, according to the utility model discloses a wafer defect detecting board, including testboard 1, testboard 1's top both sides all are provided with riser 2, are provided with roof 3 between riser 2's the top, and roof 3's bottom is provided with optical detection device 4, is provided with fixed subassembly 5 between riser 2's the bottom, and the both ends at fixed subassembly 5 both sides all are provided with slide bar 6, and slide bar 6 keeps away from the one end of fixed subassembly 5 and all is provided with sliding block 7, and riser 2's inboard all seted up with sliding block 7 matched with spout 8, and the intermediate position at fixed subassembly 5 both sides all is provided with rotating assembly 9. In specific applications, the optical inspection apparatus 4 in this embodiment is a conventional wafer inspection apparatus, and generally includes a light source, a beam splitter, a polarizing plate, at least one polarization splitting prism, at least one objective lens, an analyzer, an image sensor, and other components, which are not described in detail herein.

By means of the technical scheme, the fixing component 5 is arranged, so that the arc-shaped clamping plate 504 can fix the wafer, the stability of the wafer on the test board 1 is effectively improved, the irradiation effect of the optical detection device 4 on the surface of the wafer is effectively prevented from being influenced due to the random movement of the wafer, and the detection effect of the wafer is effectively guaranteed.

In one embodiment, a control panel 10 is disposed on one side of the vertical plate 2, and a plurality of control buttons are disposed on the control panel 10. Through setting up like this, the operating personnel of being convenient for controls.

In one embodiment, the fixing assembly 5 includes a fixing frame 501, the movable plates 502 are disposed on two sides of the fixing frame 501, the adjusting assemblies are disposed inside the fixing frame 501 and perpendicular to two sides of the movable plates 502, the arc-shaped grooves 503 are disposed on the inner sides of the movable plates 502, the arc-shaped clamping plates 504 are disposed on the inner sides of the arc-shaped grooves 503, the buffer cavities 505 are disposed on the inner sides of the movable plates 502, the buffer components are disposed inside the buffer cavities 505, and the inner sides of the buffer components are connected to the arc-shaped clamping plates 504. Through the arrangement, the arc-shaped clamping plate 504 can fix the wafer, the stability of the wafer on the test board 1 is improved, the irradiation effect of the optical detection device 4 on the surface is effectively prevented from being influenced due to the fact that the wafer moves randomly, and the detection effect of the wafer is effectively guaranteed.

In one embodiment, a plurality of clamping blocks 506 are uniformly arranged on the inner side of the arc-shaped clamping plate 504, and clamping grooves 507 are formed in the middle of the inner sides of the clamping blocks 506. By the arrangement, the clamping blocks 506 are matched with the clamping grooves 507, so that the wafer can be better clamped and fixed. In specific application, the depth of the clamping groove 507 is shallow, and the detection of the wafer cannot be influenced.

In one embodiment, the adjusting component includes a rotating rod 508, one end of the rotating rod 508 is connected to the inner wall of the fixed frame 501, the other end of the rotating rod 508 is connected to the inner wall of the other side of the fixed frame 501 through a first reduction motor 509, external threads 510 with opposite thread turns are respectively disposed on two sides of the rotating rod 508, a second sliding block 511 matched with the external threads 510 is respectively sleeved on the outer sides of the external threads 510, and one side of the second sliding block 511 is fixedly connected to one end of the movable plate 502. Through such an arrangement, the distance between the movable plates 502 can be adjusted, so that the wafer can be clamped and fixed better.

In one embodiment, the buffer assembly includes a buffer plate 512, a plurality of guide rods 513 are disposed at both ends of the buffer plate 512, both ends of each guide rod 513 are connected to the inner wall of the buffer chamber 505, springs 514 are disposed outside the guide rods 513 and between both sides of the buffer plate 512 and the inner wall of the buffer chamber 505, a plurality of connecting rods 515 are disposed inside the buffer plate 512, and one end of each connecting rod 515 far away from the buffer plate 512 is fixedly connected to one side of the arc-shaped clamping plate 504. Through the arrangement, the buffering assembly can play a certain buffering effect on the clamping of the wafer, so that the influence on the wafer due to overlarge clamping force is effectively avoided.

In one embodiment, the rotating assembly 9 includes a rotating shaft 901, one end of the rotating shaft 901 is fixedly connected to the fixed frame 501, the other end of the rotating shaft 901 is movably connected to the vertical plate 2 through a bearing, a first conical gear 902 is sleeved on the rotating shaft 901, a second conical gear 903 meshed with the first conical gear 902 is arranged at the bottom of the first conical gear 902, a second reduction motor 904 is arranged at the bottom of the second conical gear 903, and the bottom of the second reduction motor 904 is fixedly connected to the top of the test bench 1. Through setting up like this for rotating assembly 9 can drive fixed frame 501 and rotate, thereby makes arc grip block 504 can drive the wafer and carry out the turn-ups, thereby makes optical detection device 4 can realize comparing in the manual turn-ups of traditional manual work to the detection of wafer positive and negative, the utility model discloses can realize the turn-ups of wafer automatically, reduce staff's intensity of labour effectively, improve detection rate, can satisfy the user demand of enterprise better. During specific application, in order to ensure that the wafer after being turned over at each time is in a horizontal state, the front side and the back side of the wafer can be turned over by controlling the working time of the second reducing motor 904, that is, the working time of the second reducing motor 904 can be controlled by a timing module in the control panel 10, and the working time is obtained through experiments in advance.

For the convenience of understanding the technical solution of the present invention, the following detailed description is made on the working principle or the operation mode of the present invention in the practical process.

In practical application, firstly, one side of a wafer is contacted with the clamping block 506 on the arc-shaped clamping plate 504, then, the two groups of speed reducing motors 509 are controlled to rotate in the same direction through the control button, so that the speed reducing motors drive the rotating rod 508 to rotate in the same direction, the rotating rod 508 drives the sliding blocks 511 to move relatively under the action of the threads, the movable plate 502 drives the guide rod 513 to move inwards, the buffer plate 512 drives the connecting rod 515 to move inwards, the arc-shaped clamping plate 504 drives the clamping block 506 to move inwards and clamp and fix the wafer, and then, the surface of the wafer can be detected through the optical detection device;

when the back of the wafer needs to be detected, the two groups of speed reducing motors 904 are controlled to rotate in the same direction only through the control button, so that the two conical gears 903 drive the first conical gear 902 to rotate, the first conical gear 902 drives the rotating shaft 901 to rotate, the fixed frame 501 drives the wafer to rotate, and the flanging operation of the wafer can be realized.

To sum up, with the help of the above technical scheme of the utility model for arc grip block 504 can realize the fixed to the wafer through being provided with fixed subassembly 5, thereby has improved the stability of wafer on testboard 1 effectively, has avoided effectively influencing the effect of shining of optical detection device 4 on its surface because of the wafer removes at will, thereby has guaranteed the detection effect of wafer effectively.

In addition, through being provided with rotating assembly 9, can drive fixed frame 501 and rotate to make arc grip block 504 can drive the wafer and realize automatic turn-ups, thereby make optical detection device 4 can realize the detection to the wafer positive and negative, compare in the manual turn-ups of traditional manual work, the utility model discloses can realize the turn-ups of wafer automatically, thereby reduce staff's intensity of labour effectively, improve detection rate, can satisfy the user demand of enterprise better.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "disposed," "connected," "fixed," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a wafer defect detection board, its characterized in that, includes testboard (1), the top both sides of testboard (1) all are provided with riser (2), be provided with between the top of riser (2) roof (3), the bottom of roof (3) is provided with optical detection device (4), be provided with between the bottom of riser (2) fixed subassembly (5), the both ends of fixed subassembly (5) both sides all are provided with slide bar (6), slide bar (6) are kept away from the one end of fixed subassembly (5) all is provided with sliding block (7), just the inboard of riser (2) all seted up with sliding block (7) matched with spout (8), the intermediate position of fixed subassembly (5) both sides all is provided with rotating assembly (9).

2. The wafer defect detecting machine station according to claim 1, wherein a control panel (10) is disposed on one side of the vertical plate (2), and a plurality of control buttons are disposed on the control panel (10).

3. The wafer defect detecting machine platform of claim 1, wherein the fixing assembly (5) comprises a fixing frame (501), movable plates (502) are disposed on two sides of the inside of the fixing frame (501), adjusting assemblies are disposed on two sides of the inside of the fixing frame (501) and perpendicular to the movable plates (502), arc-shaped grooves (503) are formed on the inner sides of the movable plates (502), arc-shaped clamping plates (504) are disposed on the inner sides of the arc-shaped grooves (503), buffer cavities (505) are formed in the inside of the movable plates (502), buffer assemblies are disposed on the inside of the buffer cavities (505), and the inner sides of the buffer assemblies are connected with the arc-shaped clamping plates (504).

4. The wafer defect detecting machine platform as claimed in claim 3, wherein a plurality of clamping blocks (506) are uniformly arranged on the inner side of the arc-shaped clamping plate (504), and clamping grooves (507) are formed in the middle of the inner sides of the clamping blocks (506).

5. The wafer defect detection machine platform of claim 3, wherein the adjusting component comprises a rotating rod (508), one end of the rotating rod (508) is connected with the inner wall of the fixed frame (501), the other end of the rotating rod (508) is connected with the inner wall of the other side of the fixed frame (501) through a first speed reduction motor (509), the two sides of the rotating rod (508) are provided with external threads (510) with opposite thread lines, the outer side of the external threads (510) is provided with a second sliding block (511) matched with the external threads in a sleeved mode, and one side of the second sliding block (511) is fixedly connected with one end of the movable plate (502).

6. The wafer defect detecting machine table according to claim 3, wherein the buffering assembly comprises a buffering plate (512), a plurality of guide rods (513) are arranged at both ends of the buffering plate (512) in a penetrating manner, both ends of the guide rods (513) are connected with the inner wall of the buffering cavity (505), springs (514) are arranged outside the guide rods (513) and between both sides of the buffering plate (512) and the inner wall of the buffering cavity (505), a plurality of connecting rods (515) are arranged inside the buffering plate (512), and one ends of the connecting rods (515) far away from the buffering plate (512) are fixedly connected with one side of the arc-shaped clamping plate (504).

7. The wafer defect detecting machine table according to claim 3, wherein the rotating assembly (9) comprises a rotating shaft (901), one end of the rotating shaft (901) is fixedly connected with the fixed frame (501), the other end of the rotating shaft (901) is movably connected with the vertical plate (2) through a bearing, a first conical gear (902) is sleeved on the rotating shaft (901), a second conical gear (903) meshed with the first conical gear (902) is arranged at the bottom of the first conical gear (902), a second reducing motor (904) is arranged at the bottom of the second conical gear (903), and the bottom of the second reducing motor (904) is fixedly connected with the top of the test table (1).