CN214313134U

CN214313134U - Multilayer chip welding die bonder

Info

Publication number: CN214313134U
Application number: CN202023024864.7U
Authority: CN
Inventors: 张建
Original assignee: Suzhou Yingerjie Semiconductor Co ltd
Current assignee: Suzhou Yingerjie Semiconductor Co ltd
Priority date: 2020-12-15
Filing date: 2020-12-15
Publication date: 2021-09-28
Anticipated expiration: 2030-12-15

Abstract

The utility model discloses a solid brilliant machine of multilayer chip welding, including connecting plate, solid brilliant quick-witted body, chip fixed station and connecting cylinder, one side of connecting plate is provided with the removal horizontal pole, and the intermediate position that removes the horizontal pole is provided with solid brilliant quick-witted body to one side of connecting plate is connected with a connection limit section of thick bamboo, the inside of a connection limit section of thick bamboo is provided with first threaded rod, and the inside of a connection limit section of thick bamboo is provided with first movable block. The utility model discloses a can realize driving solid crystal machine body with the removal horizontal pole that first movable block is connected and carry out the lift work at the rotation that usable first motor drove first threaded rod, and the right-hand member that removes the horizontal pole through reciprocating of the mode auxiliary first movable block that reciprocates equally, make more of its lift have stability, the height of the solid crystal machine body of regulation that from this can be random, use when facilitating the use, and solid crystal machine body can remove on removing the horizontal pole and control, then can promote the process range of solid crystal machine body.

Description

Multilayer chip welding die bonder

Technical Field

The utility model relates to a oodle maker technical field specifically is a solid brilliant machine of multilayer chip welding.

Background

The invention and the use of the existing chip bring great changes to the development of electrical appliances, and the tiny integrated circuit enables the electric wires in the electrical appliances to be replaced in large batch, the chip not only reduces the use of the circuit, but also enables the volume of the electrical appliances to change obviously, and can also solve the problem that the electric wires are easy to short circuit, the existing chip welding die bonder still has certain problems and defects, and the specific problems are as follows:

1. the existing chip welding die bonder needs to be manually placed and taken out during processing, is very troublesome and has low efficiency;

2. the existing chip welding die bonder has single equipment functionality and can not meet the requirements of people at present;

3. the existing chip welding die bonder has the defects of no flexibility, difficult operation and low efficiency.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a solid brilliant machine of multilayer chip welding to solve the solid brilliant machine of current chip welding who proposes in the above-mentioned background art, add man-hour needs the manual work to place and take out, trouble very, the lower scheduling problem of efficiency.

In order to achieve the above object, the utility model provides a following technical scheme: a multilayer chip welding die bonder comprises a connecting plate, a die bonder body, a chip fixing table and a connecting cylinder, wherein a movable cross rod is arranged on one side of the connecting plate, the die bonder body is arranged at the middle position of the movable cross rod, a connecting side cylinder is connected to one side of the connecting plate, a first threaded rod is arranged inside the connecting side cylinder, a first moving block is arranged inside the connecting side cylinder, a first motor is installed at the top end of the connecting side cylinder, a conveying table is arranged at the bottom end of the die bonder body, a connecting box is arranged at one end of the conveying table, a driving roller is arranged inside the connecting box, a driven roller is arranged at the other end of the conveying table, the left position and the right position of the die bonder body are controlled by a power supply to be started to move on the movable cross rod, and the die bonder body is lifted under the action of the first motor, the first threaded rod and the first moving block, the conveying table realizes conveying work through the action of the driving roller and the driven roller.

Preferably, a hydraulic press is installed on one side of the connecting side barrel, one end of the hydraulic press is connected with a second motor, the bottom end of the second motor is connected with an electric telescopic rod, the hydraulic press and the connecting side barrel are fixedly connected and then located right above the conveying table, the second motor can achieve the effect that the sucker moves back and forth, the sucker can move to the position above the chip fixing table conveniently, and the electric telescopic rod can achieve the effect that the sucker goes up and down.

Preferably, the bottom end of the conveying table is connected with a base, a second screw is arranged in the base, a second moving block is arranged in the base, and the second moving block, the second screw and the rotating handle are matched to realize left-right movement fine adjustment of a chip fixing table connected with the second moving block.

Preferably, a movable groove is formed in the middle of the base, a connecting cylinder is connected to one side of the second motor, the movable groove is the moving range of the chip fixing table, and the connecting cylinder is the moving length range of the sucker.

Preferably, a chip fixing table is mounted at the top end of the second moving block, one end of the second screw is connected with a rotating handle, the rotating handle controls the rotation of the second screw, the second screw rotates to enable the second moving block to move on the second screw, the chip fixing table is fixedly connected with the second moving block, and the chip fixing table is also enabled to move on the base.

Preferably, the inside of chip fixed station is provided with the limiting plate, and one side of limiting plate is connected with the centre gripping cushion to the bottom of limiting plate is connected with the slider, and the slider moves on the spout and can realize that the limiting plate carries out automatic positioning according to the width of chip.

Preferably, electric telescopic handle's top is connected with the aspiration pump, and one side of aspiration pump is connected with coupling hose to electric telescopic handle's bottom is connected with the sucking disc, and the aspiration pump starts to carry the work of breathing in through coupling hose, makes the sucking disc possess the low pressure and breathes in, then can take the chip of carrying the bench, and places on the chip fixed station.

Preferably, the bottom of slider is provided with the spout, and the opposite side of limiting plate is connected with the spring, and the spring can make limiting plate have elasticity and can compress and automatic re-setting.

Preferably, a third screw is arranged in the connecting cylinder, a third moving block is arranged in the connecting cylinder, the second motor drives the third screw to rotate, and meanwhile the third moving block can move in the connecting cylinder, so that the sucker can move back and forth.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) according to the multilayer chip welding die bonder, when the multilayer chip welding die bonder is used, the first motor can be used for driving the first threaded rod to rotate, so that the movable transverse rod connected with the first movable block can drive the die bonder body to lift, the right end of the movable transverse rod assists the first movable block to move up and down in the same up-and-down moving mode, the lifting of the movable transverse rod is more stable, the height of the die bonder body can be adjusted randomly, the multilayer chip welding die bonder is convenient to use, the die bonder can move left and right on the movable transverse rod, the processing range of the die bonder body can be enlarged, the practicability is increased, and the chip can realize conveying work under the action of the driving roller, the driven roller and the conveying table;

(2) this kind of solid brilliant machine of multilayer chip welding, through the position about at hydraulic press exportable transfer sucking disc, and stretch out and draw back from top to bottom through electric telescopic handle's effect realization, it can contact to transporting the chip to the chip fixed station to be convenient for the sucking disc, and can realize utilizing the effect that the third movable block moved on the third screw rod to drive the third screw rod pivoted simultaneously through the second motor can drive the sucking disc and carry out the back-and-forth movement, then can enlarge the displacement range of sucking disc, improve certain practicality, and coupling hose's both ends are respectively in aspiration pump and sucking disc fixed connection, then the material is soft originally, then when the sucking disc carries out the lift work through electric telescopic handle, then can not hinder coupling hose's tensile.

(3) This kind of solid brilliant machine of multilayer chip welding through when placing the chip on the chip fixed station, the limiting plate can carry out the centre gripping with the both sides of chip automatically, and can realize that the limiting plate can carry out automation spacing and removal according to the width of chip through the elastic action of slider slip and spring on the spout, has improved the convenience of equipment, and the centre gripping cushion is the cushion, can be when carrying out the centre gripping to the chip, and can avoid the dynamics of centre gripping to damage the chip.

Drawings

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is a schematic view of the structure of the sucking disc of the present invention;

FIG. 3 is an enlarged schematic view of the chip fixing table of the present invention;

fig. 4 is a schematic top view of the present invention;

fig. 5 is a schematic side view of the connecting cylinder of the present invention.

In the figure: 1. a connecting plate; 2. moving the cross bar; 3. a die bonder body; 4. connecting the side cylinders; 5. a first threaded rod; 6. a first moving block; 7. a first motor; 8. a conveying table; 9. a connecting box; 10. a drive roll; 11. a driven roller; 12. a base; 13. a second screw; 14. a second moving block; 15. a chip fixing table; 16. a handle is rotated; 17. a hydraulic press; 18. a second motor; 19. an electric telescopic rod; 20. an air pump; 21. a connecting hose; 22. a suction cup; 23. a limiting plate; 24. clamping the soft cushion; 25. a slider; 26. a chute; 27. a spring; 28. a movable groove; 29. a connecting cylinder; 30. a third screw; 31. a third moving block.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides an embodiment: a multi-layer chip welding die bonder comprises a connecting plate 1, a die bonder body 3, a chip fixing table 15 and a connecting cylinder 29, wherein a movable cross rod 2 is arranged on one side of the connecting plate 1, the die bonder body 3 is arranged in the middle of the movable cross rod 2, one side of the connecting plate 1 is connected with a connecting side cylinder 4, a hydraulic press 17 is installed on one side of the connecting side cylinder 4, one end of the hydraulic press 17 is connected with a second motor 18, the model of the second motor 18 can be Y90S-2, the bottom end of the second motor 18 is connected with an electric telescopic rod 19, the top end of the electric telescopic rod 19 is connected with an air suction pump 20, one side of the air suction pump 20 is connected with a connecting hose 21, the bottom end of the electric telescopic rod 19 is connected with a suction cup 22, the air suction pump 20 is started to convey air suction work through the connecting hose 21, so that the suction cup 22 has low air pressure to suck air, and can take chips on the conveying table 8, and placed on the chip holding stage 15;

the hydraulic machine 17 is fixedly connected with the connecting side drum 4 and then is positioned right above the conveying table 8, the second motor 18 can realize the forward and backward movement of the suction cup 22, the suction cup can be conveniently moved to the position above the chip fixing table 15, and the electric telescopic rod 19 can realize the lifting of the suction cup 22;

a first threaded rod 5 is arranged inside the connecting side barrel 4, a first moving block 6 is arranged inside the connecting side barrel 4, a first motor 7 is mounted at the top end of the connecting side barrel 4, the type of the first motor 7 can be Y315M-2, a conveying table 8 is arranged at the bottom end of the die bonder body 3, a base 12 is connected to the bottom end of the conveying table 8, a movable groove 28 is formed in the middle of the base 12, a connecting barrel 29 is connected to one side of a second motor 18, the movable groove 28 is the moving range of the chip fixing table 15, and the connecting barrel 29 is the moving length range of the suction cup 22;

a third screw 30 is arranged in the connecting cylinder 29, a third moving block 31 is arranged in the connecting cylinder 29, the second motor 18 drives the third screw 30 to rotate, and meanwhile, the third moving block 31 can move in the connecting cylinder 29, so that the sucking disc 22 can move back and forth;

a second screw 13 is arranged inside the base 12, a second moving block 14 is arranged inside the base 12, a chip fixing table 15 is mounted at the top end of the second moving block 14, a limiting plate 23 is arranged inside the chip fixing table 15, a clamping cushion 24 is connected to one side of the limiting plate 23, a sliding block 25 is connected to the bottom end of the limiting plate 23, and the sliding block 25 moves on the sliding groove 26 to realize automatic positioning of the limiting plate 23 according to the width of the chip;

the bottom end of the sliding block 25 is provided with a sliding chute 26, the other side of the limiting plate 23 is connected with a spring 27, and the limiting plate 23 can be elastically compressed and automatically reset by the spring 27;

one end of the second screw 13 is connected with a rotating handle 16, the rotating handle 16 controls the rotation of the second screw 13, the second screw 13 rotates to realize the movement of the second moving block 14 on the second screw 13, and the chip fixing table 15 is fixedly connected with the second moving block 14, so that the chip fixing table 15 also realizes the movement on the base 12;

the second moving block 14 is matched with the second screw 13 and the rotating handle 16, so that the chip fixing table 15 connected with the second moving block 14 can be finely adjusted in a left-right movement mode;

and one end of the conveying platform 8 is provided with a connecting box 9, a driving roller 10 is arranged in the connecting box 9, the other end of the conveying platform 8 is provided with a driven roller 11, the left and right positions of the die bonder body 3 are controlled and started by a power supply to move on the movable cross rod 2, the lifting work of the die bonder body 3 is realized through the action of the first motor 7, the first threaded rod 5 and the first moving block 6, and the conveying platform 8 realizes the conveying work through the action of the driving roller 10 and the driven roller 11.

The working principle is as follows: when in use, the first motor 7 can be used for driving the first threaded rod 5 to rotate, so that the movable cross rod 2 connected with the first movable block 6 can drive the die bonder body 3 to lift, the right end of the movable cross rod 2 can assist the first movable block 6 to move up and down in the same up-and-down moving mode, so that the lifting of the die bonder body 3 is more stable, the height of the die bonder body 3 can be randomly adjusted, the die bonder is convenient to use, the die bonder body 3 can move left and right on the movable cross rod 2, the processing range of the die bonder body 3 can be enlarged, the practicability is increased, the chips can be conveyed through the action of the driving roller 10, the driven roller 11 and the conveying table 8, the hydraulic machine 17 can output and adjust the left and right positions of the sucking discs 22, the up-and-down stretching can be realized through the action of the electric telescopic rod 19, and the sucking discs 22 can be conveniently contacted with the chips to be conveyed to the chip fixing table 15, and the second motor 18 drives the third screw 30 to rotate and simultaneously can drive the suction cup 22 to move back and forth by utilizing the action of the third moving block 31 moving on the third screw 30, so that the displacement range of the suction cup 22 can be enlarged, and certain practicability is improved, and the two ends of the connecting hose 21 are respectively and fixedly connected with the suction pump 20 and the suction cup 22, so that the original material is soft, when the suction cup 22 is lifted through the electric telescopic rod 19, the stretching of the connecting hose 21 can not be hindered, when the chip is placed on the chip fixing table 15, the limiting plate 23 can automatically clamp the two sides of the chip, and the limiting plate 23 can automatically limit and move according to the width of the chip by the sliding of the sliding block 25 on the sliding groove 26 and the elastic action of the spring 27, so that the convenience of the device is improved, and the clamping cushion 24 is a cushion, when the chip is clamped, and the chip can be prevented from being damaged by clamping force.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a solid brilliant machine of multilayer chip welding, includes connecting plate (1), solid brilliant quick-witted body (3), chip fixed station (15) and connecting cylinder (29), its characterized in that: the die bonder is characterized in that a movable cross rod (2) is arranged on one side of the connecting plate (1), a die bonder body (3) is arranged at the middle position of the movable cross rod (2), a connecting side barrel (4) is connected to one side of the connecting plate (1), a first threaded rod (5) is arranged inside the connecting side barrel (4), a first moving block (6) is arranged inside the connecting side barrel (4), a first motor (7) is installed at the top end of the connecting side barrel (4), a conveying table (8) is arranged at the bottom end of the die bonder body (3), a connecting box (9) is arranged at one end of the conveying table (8), a driving roller (10) is arranged inside the connecting box (9), and a driven roller (11) is arranged at the other end of the conveying table (8).

2. The multilayer chip bonding die bonder of claim 1, wherein: and a hydraulic machine (17) is installed on one side of the connecting side barrel (4), one end of the hydraulic machine (17) is connected with a second motor (18), and the bottom end of the second motor (18) is connected with an electric telescopic rod (19).

3. The multilayer chip bonding die bonder of claim 1, wherein: the bottom end of the conveying table (8) is connected with a base (12), a second screw (13) is arranged inside the base (12), and a second moving block (14) is arranged inside the base (12).

4. The multilayer chip bonding die bonder of claim 3, wherein: a movable groove (28) is formed in the middle of the base (12), and a connecting cylinder (29) is connected to one side of the second motor (18).

5. The multilayer chip bonding die bonder of claim 3, wherein: a chip fixing table (15) is installed at the top end of the second moving block (14), and one end of the second screw (13) is connected with a rotating handle (16).

6. The multilayer chip bonding die bonder of claim 5, wherein: the chip fixing table is characterized in that a limiting plate (23) is arranged inside the chip fixing table (15), one side of the limiting plate (23) is connected with a clamping cushion (24), and the bottom end of the limiting plate (23) is connected with a sliding block (25).

7. The multilayer die bonding die bonder of claim 2, wherein: the top of electric telescopic handle (19) is connected with aspiration pump (20), and one side of aspiration pump (20) is connected with coupling hose (21), and the bottom of electric telescopic handle (19) is connected with sucking disc (22).

8. The multilayer chip bonding die bonder of claim 6, wherein: the bottom of slider (25) is provided with spout (26), and the opposite side of limiting plate (23) is connected with spring (27).

9. The multilayer chip bonding die bonder of claim 4, wherein: a third screw rod (30) is arranged in the connecting cylinder (29), and a third moving block (31) is arranged in the connecting cylinder (29).