CN214312474U

CN214312474U - LED luminous glass curtain wall

Info

Publication number: CN214312474U
Application number: CN202120121289.8U
Authority: CN
Inventors: 李淑玲
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-01-15
Filing date: 2021-01-15
Publication date: 2021-09-28
Anticipated expiration: 2031-01-15

Abstract

The utility model relates to a LED luminous glass curtain wall, which comprises a front transparent plate, a back transparent plate and LED lamp beads; a printed circuit layer is arranged on the transparent plate on the front side; the front transparent plate and the back transparent plate form an installation space for accommodating the LED lamp beads; the LED lamp bead comprises a base and a light-emitting wafer, and the light-emitting wafer is arranged on the base; a chip mounting surface is formed on the base, pins are led out from the chip mounting surface, and the pins are bent and then attached to the top of the base; the pins are electrically connected with the printed circuit layer, and the base is arranged on the front transparent plate; the light emitting surface of the LED lamp bead faces the front transparent plate. Through the structure that changes LED lamp pearl, make it can install on the more suitable position of LED luminous glass curtain wall, when installing LED lamp pearl at LED luminous glass curtain wall, it can hug closely on the positive transparent plate of LED luminous glass curtain wall for the light that LED lamp pearl sent can be more effectively transmitted away from on the positive transparent plate.

Description

LED luminous glass curtain wall

Technical Field

The utility model belongs to the technical field of the lamp pearl, especially, relate to a LED light-emitting glass curtain wall.

Background

Transparent LED display screens are gradually used in the market and develop various product forms, such as LED light-emitting glass curtain walls, in which LED lamps are arranged between two transparent glasses arranged at intervals, and different light patterns are displayed by the LED lamps emitting light.

The LED lamp plays an important role in the LED luminous glass curtain wall, and determines the overall presenting effect of the LED luminous glass curtain wall.

At present, the most commonly used LED lamp bead mainly comprises a base and a light emitting chip mounted on the base, and a plurality of pins are LED out from the upper side of the base; the driving of the LED lamp is required to be externally connected with a driving chip or a driving circuit so as to drive the light-emitting wafers in the LED lamp beads to be lightened according to the setting. After the technology is improved, a structure that a driving chip is arranged in an LED lamp bead appears; the LED lamp bead with the driving chip can simplify circuit connection, improves the circuit design efficiency, is often applied to LED lamp strips and LED display screens, and has the common packaging size of 5050 (the external dimension is 5mm x 5mm), 2727 (the external dimension is 2.7mm x 2.7mm) and the like.

As shown in fig. 1 and 2, it introduces a TOP type packaging structure LED lamp bead, which includes a base 1 in the form of an insulating base, the bottom of the base 1 extends out of a plurality of pins 11; the upper part of the base 1 forms a cup-shaped space, a chip mounting surface 10 is formed on the cup-shaped space, a driving chip 2 and three light-emitting chips 3 are mounted on the chip mounting surface 10, and light rays emitted by the light-emitting chips 3 can be emitted from the top of the cup-shaped base 2.

However, when the applicant manufactures the LED light-emitting glass curtain wall by using the LED lamp bead with the structure, the applicant finds the problem as shown in fig. 3, the LED light-emitting glass curtain wall includes a front glass 1 ' and a back glass 2 ', the front glass 1 ' and the back glass 2 ' are arranged at intervals, the LED lamp bead is arranged between the front glass 1 ' and the back glass 2 ', the light 3 ' emitted by the LED lamp bead is transmitted through the front glass, because the pin 11 of the existing LED lamp bead is arranged at the bottom of the base 1, the structure of the LED lamp bead determines that the LED lamp bead can only be installed on the back glass 2 ' of the LED light-emitting glass curtain wall to transmit the light from the front glass 1 ', when the LED light-emitting glass curtain wall is manufactured by using the LED lamp bead with the structure, because the space is arranged between the LED lamp bead and the front glass, a part of the light can be reflected by the front glass, so that the whole effect of the light pattern emitted by the front glass is poor, therefore, the LED luminous glass curtain wall has poor lighting effect.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: aiming at the problem of poor lighting effect of the existing LED luminous glass curtain wall, the LED luminous glass curtain wall is provided.

In order to solve the technical problem, an embodiment of the utility model provides an LED light-emitting glass curtain wall, which comprises a front transparent plate, a back transparent plate and LED lamp beads; a printed circuit layer is arranged on the front transparent plate; the front transparent plate and the back transparent plate form an installation space for accommodating the LED lamp beads; the LED lamp bead comprises a base and a light-emitting wafer, and the light-emitting wafer is arranged on the base; a chip mounting surface is formed on the base, pins are led out from the chip mounting surface, and the pins are bent and then attached to the top of the base;

the pins are electrically connected with the printed circuit layer and the base is installed on the front transparent plate; the light emitting surface of the LED lamp bead faces the front transparent plate.

Optionally, the pins are led out from the chip mounting surface and bent upwards along the side wall of the base to form bending sections, and the tail ends of the bending sections are bent along the top wall of the base to form connecting sections for electrically connecting with the printed circuit layer.

Optionally, a groove is formed in the base, and the bending section and the connecting section are embedded in the groove; the upper surface of the connecting section is higher than the top surface of the base.

Optionally, the chip mounting surface comprises an isolation channel, and an electrode pad and a signal pad which are isolated from each other by the isolation channel;

the electrode pads comprise cathode pads and anode pads; the signal bonding pads comprise signal input bonding pads and signal output bonding pads; the signal bonding pad and the electrode bonding pad are electrically connected with the driving chip.

Optionally, a plurality of pins are disposed on the driving chip, and the pins on the driving chip are electrically connected to the chip mounting surface and the light emitting die by direct soldering or by bonding wires.

Optionally, the pins include signal pins, electrode pins, and color control pins; the signal pins comprise a signal input pin and a signal output pin;

the pins comprise electrode pins and signal pins; the first end of the electrode pin is electrically connected with the electrode bonding pad, and the second end of the electrode pin is electrically connected with the printed circuit layer; the first end of the signal pin is electrically connected with the signal bonding pad, and the second end of the signal pin is electrically connected with the printed circuit layer;

the signal pin on the driving chip is electrically connected with the signal bonding pad on the base; the electrode pins on the driving chip are electrically connected with the electrode bonding pads on the base;

the light emitting wafer comprises a first electrode and a second electrode; the first electrode is used for being electrically connected with a color control pin on the driving chip; the second electrode is used for being electrically connected with a certain electrode pin on the driving chip or a certain electrode pad on the base.

Optionally, the front transparent panel comprises a first transparent layer;

a metal sheet is embedded in the first transparent layer; the printed circuit layer is distributed on the first transparent layer; the printed circuit layer comprises a lamp bead power supply bonding pad, a lamp bead signal bonding pad and lamp bead welding areas which are arranged in an array and used for installing LED lamp beads;

each lamp bead welding area is provided with a pin bonding pad corresponding to a pin of the LED lamp bead; the pin bonding pads comprise signal pin bonding pads and electrode pin bonding pads;

signal wires for signal transmission are arranged between the lamp bead signal bonding pad and the signal pin bonding pad in the lamp bead welding area and between the signal pin bonding pads of the lamp bead welding areas, so that control signals for controlling the on and off of the LED lamp beads can be transmitted in sequence through the LED lamp beads;

and the metal sheet embedded in the first transparent layer electrically connects the electrode pin bonding pad with the same polarity on the lamp bead welding area with the lamp bead power supply bonding pad.

Optionally, N rows by M columns of bead lands are arranged on the printed circuit layer;

m lamp bead signal bonding pads are arranged on the printed circuit layer; and the M lamp bead signal pads are sequentially connected in series with the signal pin pads in the N lamp bead welding areas on the same column through signal lines.

Optionally, M pairs of lamp bead power pads are arranged on the printed circuit layer, and each pair of lamp bead power pads comprises a first lamp bead power pad and a second lamp bead power pad with opposite polarities;

the electrode pin bonding pads comprise a first electrode pin bonding pad and a second electrode pin bonding pad; a first epitaxial part is led out of the first electrode pin bonding pad; a second external extension part is led out of the second electrode pin bonding pad;

electrically connecting a first extension part of the first electrode pin bonding pad on the N lamp bead welding areas on the same column with a first lamp bead power supply bonding pad with the same polarity through a first metal sheet embedded in the first transparent layer; and electrically connecting a second extending part of the second electrode pin pad on the lamp bead welding area on the same row with a second lamp bead power supply pad with the same polarity through a second metal sheet embedded in the first transparent layer.

Optionally, the signal pin bonding pad on each lamp bead welding area at least comprises a first signal input pin bonding pad and a first signal output pin bonding pad;

m lamp bead signal bonding pads are arranged on the printed circuit layer; the M lamp bead signal pads are sequentially connected in series through signal lines with first signal input pin pads and first signal output pin pads in the N lamp bead welding areas on the same column.

The embodiment of the utility model provides a LED luminous glass curtain wall compares with prior art, through the structure that changes LED lamp pearl, makes it can install on the more suitable position of LED luminous glass curtain wall to can demonstrate better light effect on the positive transparent plate of LED luminous glass curtain wall. The LED light source comprises a base, a chip mounting face is formed on the base, pins are LED out from the chip mounting face and are attached to the top of the base after being bent, so that the power input and signal connection positions of LED lamp beads are arranged at the top of the base, the LED lamp beads can be tightly attached to a front transparent plate of an LED light-emitting glass curtain wall when being mounted on the LED light-emitting glass curtain wall, and light rays emitted by the LED lamp beads can be effectively transmitted out of the front transparent plate.

Drawings

Fig. 1 is a cross-sectional view of an LED lamp bead provided in the prior art;

fig. 2 is a schematic structural diagram of an LED lamp bead provided in the prior art;

FIG. 3 is a schematic structural diagram of an LED light-emitting glass curtain wall manufactured by using the existing LED lamp beads;

fig. 4 is a schematic structural diagram of an LED lamp bead provided in an embodiment of the present invention;

fig. 5 is a cross-sectional view of an LED lamp bead provided in an embodiment of the present invention;

fig. 6 is a top view of a base of an LED lamp bead provided in an embodiment of the present invention;

fig. 7 is a top view of a driving chip according to an embodiment of the present invention;

fig. 8 is a top view of an LED lamp bead provided in an embodiment of the present invention;

fig. 9 is a schematic structural view of an LED light-emitting glass curtain wall manufactured by using the LED lamp beads provided by the present invention;

fig. 10 is a partial cross-sectional view of an LED lamp bead provided by the present invention when mounted on a front transparent plate;

fig. 11 is a partial cross-sectional view of the LED lamp bead provided by the present invention installed on the front transparent plate and sealed with glue;

fig. 12 is a schematic top view of a front transparent plate with a metal sheet and a printed circuit layer embedded therein according to the present invention;

fig. 13 is an enlarged schematic view at a in fig. 12.

The reference numerals in the specification are as follows:

1', front glass; 2', back glass; 3', light; 100. LED lamp beads; 200. installing a frame;

1. a base; 2. a driving chip; 3. a light emitting chip;

10. a chip mounting surface; 11. a pin; 115. bending the section; 116. a connecting section;

21. a signal input pin; 22. a red pin; 23. a negative electrode pin; 24. a positive electrode pin; 25. a blue pin; 26. a signal output pin; 27. a green pin;

31. a first light emitting chip; 32. a second light emitting chip; 33. a third light emitting chip;

311. a first electrode; 312. a second electrode;

101. a signal input pad; 102. an anode pad; 103. a signal output pad; 104. a cathode pad; 105. isolating the river channel;

111. a signal input pin; 112. a negative electrode pin; 113. a signal output pin; 114. a positive electrode pin;

4. a metal sheet; 4a, a first metal sheet; 4b, a second metal sheet;

5. a glue sealing layer;

6. printing a circuit layer; 61. a lamp bead welding area; 62. a lamp bead power supply pad; 63. a lamp bead signal pad; 64. a signal line; 61a, a first electrode pin pad; 61b, a second electrode pin pad; 61c, a first signal input pin pad; 61d, a first signal output pin pad; 611. an extension portion; 611a, a first extension; 611b, a second extension; 62a, a first lamp bead power supply pad; 62b, a second lamp bead power supply pad; 64a, a first track; 64b, a second track;

7. a front transparent plate; 71. a second transparent layer; 72. a first transparent layer;

8. a back transparent plate; 9. and (5) sealing the filler.

Detailed Description

In order to make the technical problem, technical solution and advantageous effects solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

As shown in fig. 4-6 and 9-12, the LED light-emitting glass curtain wall provided by the embodiment of the present invention includes a front transparent plate 7, a back transparent plate 8 and LED lamp beads 100; a printed circuit layer 6 is arranged on the front transparent plate 7; the front transparent plate 7 and the back transparent plate 8 form an installation space for accommodating the LED lamp beads 100; the LED lamp bead 100 comprises a base 1, a driving chip 2 and a light-emitting wafer 3, wherein the driving chip 2 and the light-emitting wafer 3 are installed on the base 1; a chip mounting surface 10 is formed on the base 1, a pin 11 is led out from the chip mounting surface 10, and the pin 11 is bent and then attached to the top of the base 1;

the pins 11 are electrically connected with the printed circuit layer 6 and the base 1 is mounted on the front transparent plate 7; the light emitting surface of the LED lamp bead 100 faces the front transparent plate 7.

The embodiment of the utility model provides a LED luminous glass curtain wall compares with prior art, through the structure that changes LED lamp pearl 100, makes it install on LED luminous glass curtain wall's more suitable position to can demonstrate better light effect on LED luminous glass curtain wall's positive transparent plate 7. A chip mounting surface 10 is formed on a base 1, a pin 11 is LED out from the chip mounting surface 10, and the pin 11 is pasted on the top of the base 1 after being bent, so that the power input and signal connection positions of the LED lamp beads 100 are arranged on the top of the base 1, and the LED lamp beads 100 can be tightly attached to a front transparent plate 7 of an LED light-emitting glass curtain wall when being mounted on the LED light-emitting glass curtain wall, and light rays emitted by the LED lamp beads 100 can be effectively transmitted out from the front transparent plate 7.

It will be right below that the utility model discloses a LED lamp pearl specifically explains:

in one embodiment, as shown in fig. 8, the light emitting chip 3 includes a first light emitting chip 31, a second light emitting chip 32 and a third light emitting chip 33.

The first light emitting chip 31 is a blue light emitting chip, the second light emitting chip 32 is a red light emitting chip, and the third light emitting chip 33 is a green light emitting chip;

as shown in fig. 5 and 6, a chip mounting surface 10 is formed on the base 1, and a lead 11 is led out from the chip mounting surface 10. The TOP structure of the LED lamp bead in this example is a structure that a PLCC (Chinese full name: Plastic Chip Carrier with lead wire; English full name: Plastic LED Chip Carrier) Plastic support is adopted as a base 1, and a pin 11 of a PLCC Plastic support packaging structure is bent inwards at the TOP. Generally comprises the working procedures of punching, electroplating, PPA (polyphthalamide) injection molding, bending, five-sided three-dimensional ink jet and the like. The core of the method is that a chip mounting surface 10 is formed on the surface of a plastic support through a metal material belt; and a pin 11 extends from the chip mounting surface 10, as shown in fig. 5, the pin 11 is led out from the chip mounting surface 10 and bent upward along the side wall of the base 1 to form a bending section 115, and the tail end of the bending section 115 is bent along the top wall of the base 1 to form a connection section 116 for electrically connecting with the outside. Through buckling pin 11 and pasting at the top of base 1 for the power input of LED lamp pearl and signal connection's position are at the top of base 1, thereby when installing LED lamp pearl at the luminous glass curtain wall of LED, it can hug closely on the positive transparent plate 7 of the luminous glass curtain wall of LED (as shown in fig. 9), and light 3' that LED lamp pearl sent can be more effectively transmitted away from positive transparent plate 7.

Preferably, the base 1 is a cup-shaped base, and the light 3' emitted by the light-emitting wafer 3 can be emitted from the top of the cup-shaped base, so that the LED lamp bead can emit light better.

Preferably, the base 1 is provided with a groove, and the bending section 115 and the connecting section 116 are embedded in the groove to fix the pins 11 better, so that the LED lamp bead is more stable and reliable when being connected with the front transparent plate 7 of the LED light-emitting glass curtain wall.

Preferably, the upper surface of the connecting section 116 is higher than the top surface of the base 1, so as to facilitate the electrical connection with the printed circuit layer 6 on the LED light-emitting glass curtain wall, and the electrical connection is more reliable.

In one embodiment, as shown in fig. 6, the chip mounting surface 10 includes an isolation channel 105 and pads isolated from each other by the isolation channel 105; a pin 11 is led out of the bonding pad; in this example, the bonding pad is actually a metal sheet made of the same material as the pins, the metal sheet is formed by stamping, the vacant positions are filled by injection molding, and the isolation riverway 105 is formed, the isolation riverway 105 is actually an insulating plastic material, the pins are respectively isolated, and the isolation riverway plays a role of fixing the base. Specifically, the pads include electrode pads and signal pads; the electrode pads include a cathode pad 104 and an anode pad 102; the signal pads include a signal input pad 101 and a signal output pad 103; the pins 11 comprise electrode pins and signal pins, the electrode pins are electrically connected with the electrode pads, and the signal pins are electrically connected with the signal pads; wherein, the electrode pins comprise a positive electrode pin 114 and a negative electrode pin 112; the signal pins include a signal input pin 111 and a signal output pin 113; a positive electrode pin 114 is led out of the cathode bonding pad 104; a negative pin 112 is led out of the anode bonding pad 102. A signal input pin 111 is led out of the signal input pad 101, and a signal output pin 113 is led out of the signal output pad 103. The isolation channel 105 separates the cathode pad 104, the anode pad 102, the signal input pad 101, and the signal output pad 103. Only one interval is arranged between two adjacent bonding pads, and the design greatly reduces the complexity of the design of the base 1. The overall external dimensions of the base 1 can be made smaller and more compact.

The driving chip 2 is shown in fig. 7, and the driving chip 2 is generally known, and the driving chip 2 is integrated with a driving circuit therein, and the driving chip 2 is provided with a passivation layer, which is a surface insulating layer formed when the driving chip 2 is manufactured. The driving chip 2 is provided with a plurality of pins (or called terminals), and the pins on the driving chip 2 are electrically connected with the chip mounting surface 10 and the light-emitting wafer 3 through direct welding or bonding wires. Pins (english name: PAD) are generally provided on the passivation layer, which are terminals inside the chip. The pins comprise signal pins, electrode pins and color control pins; the signal pins are used for inputting control signals, and as an optimization, the signal pins are generally used for transmitting the control signals to the subordinate LED lamp beads, so that the signal pins generally comprise signal input pins 21 and signal output pins 26; the number of the signal input pins 21 and the signal output pins 26 may vary according to practical application scenarios, for example, some scenarios may include only one signal input pin 21, and some scenarios may require 2 signal input pins 21; the electrode pins are used for connecting the electrode pins on the base 1 and providing power for the driving chip 2; the electrode pins in this example include a positive electrode pin 24 and a negative electrode pin 23, and for convenience of connection, the number of the electrode pins may be multiple and disposed at different positions so as to be electrically connected to the light emitting chip 3 or the pins 11 on the base 1. Meanwhile, the color control pin provided by the driving chip 2 is used to connect one of the electrodes on the light emitting wafer 3, such as the first electrode 311 (cathode or anode), and the other electrode of the light emitting wafer 3, such as the second electrode 312 (the electrode is a common anode or a common cathode), to one of the pins 11 on the submount 1 (the polarity of the pin 11 is the same as the polarity of the second electrode 312) or to an electrode pin on the driving chip 2 (the polarity of the electrode pin is the same as the polarity of the second electrode 312). After the driving chip 2 inputs the control signal through the signal input pin 21, the driving chip outputs a current value or controls a current ratio to each light emitting wafer 3 after being processed by an internal driving circuit, and the internal driving circuit adjusts the output current of each control pin, so that the light emitting intensity of each light emitting wafer 3 is kept in a corresponding preset range.

In this example, as shown in fig. 7 and 8, the color control pins include red pins 22, blue pins 25, and green pins 27, the first light emitting chip 31 is a blue light emitting chip, the second light emitting chip 32 is a red light emitting chip, and the third light emitting chip 33 is a green light emitting chip; wherein, the red pin 22 is electrically connected with the first electrode 311 of the red light emitting chip; the green pin 27 is electrically connected with the first electrode 311 of the green light-emitting chip; the blue pin 25 is electrically connected with the first electrode 311 of the blue light-emitting chip; the second electrodes 312 of the red, green and red light emitting chips are all connected to a same electrode pad on the submount 1, so that the red, green and red light emitting chips form a common cathode or common anode circuit structure.

The signal pad and the electrode pad are electrically connected to the driving chip 2. Specifically, a signal pin on the driving chip 2 is electrically connected with a signal pad on the base 1; the electrode pins on the driving chip 2 are electrically connected with the electrode pads on the base 1;

more specifically, the positive pin 24 of the driving chip 2 is electrically connected to the cathode pad 104 of the submount 1, and the negative pin 23 is electrically connected to the anode pad 102 of the submount 1.

The electrical connection among the driving chip 2, the light emitting chip 3, and the chip mounting surface 10 on the base 1 may be a direct soldering electrical connection or a bonding connection through a bonding wire.

Of course, the LED lamp bead is further packaged by using a transparent adhesive layer, which is known to the public, for example, epoxy resin, organic silicon, and the like are used as transparent glue for packaging. And will not be described in detail.

In one embodiment, as shown in fig. 6 and 8, the signal input pad 101 and the cathode pad 104 are disposed at one side of the anode pad 102, and the signal output pad 103 is disposed at the other side of the anode pad 102;

the driving chip 2, the first light emitting chip 31 (blue light emitting chip) and the second light emitting chip 32 (red light emitting chip) are mounted on the upper portion of the anode pad 102; the third light emitting chip 33 (green light emitting chip) is mounted on the signal input pad 101. The structure is more compact.

The first light emitting wafer 31 is a blue light emitting wafer, and since both electrodes of the blue light emitting wafer are disposed on the upper surface of the blue light emitting wafer, the blue light emitting wafer is electrically connected to the corresponding blue pins 25 and the corresponding anode pads 102 on the driving chip 2 by means of bonding wires. The first electrode 311 of the first light emitting chip 31 is bonded to the blue pins 25 by bonding wires, and the second electrode 312 is bonded to the anode pad 102 by bonding wires.

The second light emitting chip 32 is a red light emitting chip, and since two electrodes of the red light emitting chip are respectively disposed on the upper and lower surfaces of the red light emitting chip, the second electrode of the red light emitting chip is directly soldered to the anode pad 102 through silver paste, and the first electrode 311 is connected to the red pin 22 of the driving chip 2 through a bonding wire.

The third light emitting chip 33 is a green light emitting chip, and two electrodes of the green light emitting chip are disposed on one surface of the third light emitting chip, so that after the green light emitting chip is adhered to the signal input pad 101 by gluing, the green pin 27 and the anode pad 102 on the driving chip 2 need to be connected by a bonding wire. Specifically, the first electrode 311 of the third light emitting chip 33 is connected to the green pin 27 of the driver chip 2 by bonding wire bonding, and the second electrode 312 is connected to the anode pad 102 of the submount 1 by bonding wire bonding. The bonding wires typically include gold wires, copper wires, palladium-plated copper wires, alloy wires, and the like.

Preferably, in order to further reduce the size of the LED lamp bead, the blue light emitting chip can be placed above the driving chip 2, because the volume of the blue light is the smallest under the condition of white balance matching, it is most suitable to mount the blue light emitting chip on the driving chip 2, the area occupied by the blue light emitting chip on the driving chip 2 is smaller, and the size of the driving chip 2 can be made smaller. And because the current of blue luminescent wafer is minimum, put on driver chip 2 calorific capacity minimum, red luminescent wafer, green luminescent wafer electric current are big, generate heat greatly, put more do benefit to heat conduction and distribute away the heat on the base.

It will be right below that the utility model discloses a positive transparent plate 7 of LED light-emitting glass curtain wall and the concrete structure of printed circuit layer 6 on it and the relation of connection between the LED lamp pearl specifically explain:

the front transparent plate 7 may be made of glass, and the printed circuit layer 6 is formed by directly coating copper on the glass, that is, coating copper on the glass by using a UV curing technology, so as to form the printed circuit layer 6 on the glass.

Preferably, as shown in fig. 10-12, the front transparent plate 7 includes a first transparent layer 72;

a metal sheet 4 is embedded in the first transparent layer 72; the printed circuit layer 6 is arranged on the first transparent layer 72; the printed circuit layer 6 comprises a lamp bead power supply pad 62, a lamp bead signal pad 63 and lamp bead welding areas 61 which are arranged in an array and are used for installing the LED lamp beads 100;

each lamp bead welding area 61 is provided with a pin pad corresponding to the pin 11 of the LED lamp bead 100; the pin bonding pads comprise signal pin bonding pads and electrode pin bonding pads; the electrode pins of the LED lamp beads 100 are electrically connected with electrode pin bonding pads on the lamp bead welding area 61, and the signal pins of the LED lamp beads 100 are electrically connected with signal pin bonding pads on the lamp bead welding area 61.

Signal lines 64 for signal transmission are arranged between the lamp bead signal pads 63 and signal pin pads in the lamp bead welding areas 61 and between the signal pin pads of each lamp bead welding area 61, so that control signals for controlling the on and off of each LED lamp bead 100 can be transmitted in sequence through each LED lamp bead 100; specifically, for example, signal lines 64 for signal transmission are provided between the lamp bead signal pads 63 and signal pin pads in the lamp bead soldering area 61, and between signal pin pads in adjacent lamp bead soldering areas 61 in the same row or the same column; however, it is not limited that the adjacent LED beads 100 are connected by the signal line 64, and the LED beads 100 at the tail of one column are LED to the LED beads at the head of the adjacent column by the signal line 64 for connection, etc.

The metal sheet 4 embedded in the first transparent layer 72 electrically connects the electrode pin pad with the same polarity on the bead soldering area 61 and the bead power pad 62.

Preferably, the present embodiment preferably includes a second transparent layer 71, and the first transparent layer 72 is disposed below the second transparent layer 71.

The form of the metal sheet 4 is not particularly limited. For example, the cross section of the metal sheet 4 includes a circle, a semicircle, a triangle, an ellipse, a quadrangle, or other regular or irregular polygon. Through this kind of mode, can effectively adjust the width and the height of its sheetmetal 4, make the width less relatively, and promote its height, guarantee its power supply demand on the one hand, simultaneously, can not influence the whole penetrating effect of positive transparent plate 7 again. In this example, the cross section of the metal sheet 4 is quadrilateral, wherein the width of the metal sheet 4 is 0.1-1mm, and the height is 1-3 mm. Within the size range, the power supply requirement of the whole column of LED lamp beads 100 can be ideally met, and the power supply requirement is many times stronger than the power supply capacity of other transparent conductive materials. Meanwhile, the blocking of the sight is small, and high permeability can be guaranteed. For example, in this embodiment, the width of the metal sheet 4 is 0.3mm, the height thereof is 2mm, the cross-sectional area thereof is 0.6mm2, and the metal sheet corresponds to a copper wire with a diameter of 1.6mm, and has a strong conductive capability. The metal sheet 4 is not particularly limited to a specific material, and the like, as long as the conductive ability is satisfactory, and a metal having high conductivity is generally preferable. In this case, a copper sheet is preferably used.

In this example, referring to the view angle of fig. 10, the lower end surface of the metal sheet 4 is located on the same plane as the lower plane of the first transparent layer 72, or the lower end surface of the metal sheet 4 is slightly higher than the lower plane. Of course, it is preferable that the lower end surface of the metal sheet 4 is parallel to the lower plane of the first transparent layer 72. The method is better in process, and the consistency and the stability are easy to realize.

By adopting the power supply mode of the metal sheet 4 provided by the embodiment, the size of the LED lamp beads 100 can be further reduced, and the gaps between the LED lamp beads 100 are reduced, for example, the length of the LED lamp beads is 1-5mm, and the width of the LED lamp beads is 1-5 mm. . The gap between the LED lamp beads 100 is 3-10 mm. The gap mentioned herein refers to a distance between centers of adjacent LED beads 100, for example, the gap of the LED bead 100 may be 5mm in this example.

The second transparent layer 71 may be made of various rigid or flexible materials known in the public, for example, the second transparent layer 71 may be a glass substrate, a PET (Polyethylene terephthalate) substrate, a PI (polyimide) film, or the like.

The first transparent layer 72 is typically a transparent layer obtained by casting and hardening a transparent material, which incorporates the above-mentioned metal sheet 4 during the casting process and allows the metal sheet 4 to be arranged as desired to allow the subsequently formed printed circuit layer 6 to be electrically connected thereto. The transparent material may be, for example, epoxy resin, PET (Polyethylene terephthalate, chinese), acrylic (polymethyl Methacrylate, PMMA, etc.).

As shown in fig. 12 and 13, the lamp bead power pad 62 in this example is used for connecting with an externally connected dc power supply, and the dc power supply is connected to each LED lamp bead 100 through the lamp bead power pad 62 by the metal sheet 4 mentioned in this application; the lamp bulb power supply comprises a first lamp bulb power supply pad 62a and a second lamp bulb power supply pad 62b which are opposite in polarity; for example, in this example, the first lamp bead power pad 62a is an anode pad; second lamp pearl power pad 62b is the negative pole pad.

The lamp bead signal pad 63 is used for connecting with an external signal input source, and is usually connected to a control chip at the previous stage; the number of the lamp bead signal pads 63 is not particularly limited, for example, only one lamp bead signal pad 63 is provided, and the control signal is input through one lamp bead signal pad 63 and then sequentially transmitted to each LED lamp bead 100 connected in series through the signal line 64. Of course, it can be set according to the number of I/O ports on the control chip. For example, it is permissible that the same bead signal pad 63 be used for LED beads 100 in the same row or column, or that the same bead signal pad 63 be used for LED beads 100 in multiple rows or columns.

As the signal lines 64 defined herein, printed signal lines printed on the first transparent layer 72, such as ITO (Indium Tin oxide) lines or silver paste lines or copper-clad lines, in this case, a grid-like copper-clad lines printed on the first transparent layer 72, may be used. Or point-to-point connection is formed by using a metal wire machine to beat up and remove flying wires. Similarly, the pads and the epitaxial portion 611 on the printed circuit layer 6 can be made of transparent conductive material, such as metal mesh, ITO, nano silver, etc.

As shown in fig. 11, after the LED lamp bead 100 is soldered to the corresponding lamp bead soldering area 61 on the printed circuit layer 6 by the surface mount technology, a layer of adhesive tape 5 is integrally packaged on the surface of the LED lamp bead. Further, a back transparent plate 8 may be disposed on the upper side of the sealant layer 5 as required. And the wiring harness is led out from the lamp bead power supply pad 62 and the lamp bead signal pad 63, and the edge between the back transparent plate 8 and the front transparent plate 7 is sealed and packaged, so that the waterproof effect is achieved. For example, as shown in fig. 9, a sealing filler 9 may be provided at the edge between the back transparent plate 8 and the front transparent plate 7, and preferably, after the sealing filler 9 is filled, a mounting frame 200 is provided at the edge of the LED luminous glass curtain wall to further reinforce the connection between the back transparent plate 8 and the front transparent plate 7.

The sealant layer 5 may be obtained by casting and hardening a transparent material, for example, epoxy resin, transparent silicone, or other transparent materials may be used. The back transparent plate 8 is typically a glass cover plate or alternatively a transparent part made of printed plastic material. Cover again after the encapsulating layer 5 on first stratum lucidum 72 and cover back transparent plate 8, can guarantee fine gas tightness, be difficult to let steam invasion lead to LED lamp pearl 100 to make its inefficacy.

The manner in which the metal sheet 4 and the printed circuit lines are connected will be explained further below with reference to a specific preferred embodiment.

As shown in fig. 12 and 13, the printed circuit layer 6 is provided with N rows by M columns of bead lands 61;

the printed circuit layer 6 is provided with M lamp bead signal pads 63; the M lamp bead signal pads 63 and the signal pin pads in the N lamp bead welding areas 61 on the same column are sequentially connected in series through signal lines 64. The signal pin pads on each lamp bead land 61 include at least a first signal input pin pad 61c and a first signal output pin pad 61 d. Specifically, the M lamp bead signal pads 63 and the first signal input pin pads 61c and the first signal output pin pads 61d in the N lamp bead soldering areas 61 on the same column thereof are sequentially connected in series through the signal lines 64.

By way of example, assume N ═ 5; m is 5; in this example 5 x 5 bead lands 61 are printed on the first transparent layer 72. In order to make the skilled in the art understand the concept of the present invention, the columns formed by the bead weld zones 61 on the same row are called as weld rows; the columns of bead lands 61 on the same column will be referred to as solder columns.

In this example, 5 lamp bead signal pads 63 are arranged on the printed circuit layer 6; the 5 lamp bead signal pads 63 are sequentially connected in series with signal pin pads in the 5 lamp bead welding areas 61 on the same column through signal lines 64; specifically, a first signal input pin pad 61c and a first signal output pin pad 61d are arranged in the lamp bead welding area 61; in the serial connection, the lamp bead signal pads 63 on the corresponding row are connected to the first signal input pin pad 61c in the first lamp bead pad 61 on the row through a signal line 64 (for the sake of distinction, the signal line 64 is referred to as a first track 64a in this example); then, the 3 rd, 4 th and 5 th lamp bead lands 61 are connected in series by connecting a first signal output pin pad 61d in the first lamp bead land 61 to a first signal input pin pad 61c in a second lamp bead land 61 on the same column through a signal line 64 (in this example, the signal line 64 in the adjacent lamp bead land 61 is referred to as a second printed line 64 b). Of course, the way of concatenation is not necessarily limited to the same row or the same column. The signal lines 64 in this example are all in a grid form, which can further increase the transparency of the LED light-emitting glass curtain wall. The first signal input pin pad 61c is electrically connected with the signal input pin 111 of the LED lamp bead, and the first signal output pin pad 61d is electrically connected with the signal output pin 113 of the LED lamp bead.

In an embodiment, M pairs of lamp bead power pads 62 are arranged on the printed circuit layer 6, and each pair of lamp bead power pads 62 includes a first lamp bead power pad 62a and a second lamp bead power pad 62b with opposite polarities;

in this example, as shown in fig. 12 and 13, 5 pairs of bead power pads 62 are disposed on the printed circuit layer 6; each pair of lamp bead power supply pads 62 comprises a first lamp bead power supply pad 62a and a second lamp bead power supply pad 62b with opposite polarities;

as shown in fig. 13, the electrode pin pads in each of the bead lands 61 include a first electrode pin pad 61a and a second electrode pin pad 61 b; a first extension part 611a is led out of the first electrode pin pad 61 a; a second outer extension portion 611b is led out from the second electrode pin pad 61 b; electrically connecting the first outer extensions 611a of the first electrode pin pads 61a on the N bead lands 61 in the same column with the first bead power pads 62a of the same polarity through the first metal sheet 4a embedded in the first transparent layer 72; the second outer extension 611b of the second electrode pin pad 61b on the lamp bead soldering area 61 on the same column is electrically connected with the second lamp bead power pad 62b of the same polarity through the second metal sheet 4b embedded in the first transparent layer 72.

In this example, the first extending portion 611a of the first electrode pin pad 61a on the 5 bead lands 61 in the same column and the first bead power pad 62a with the same polarity are electrically connected by welding through the first metal sheet 4 a; and the second outer extension 611b of the second electrode pin pad 61b on the lamp bead welding area 61 on the same column is electrically connected with the second lamp bead power pad 62b with the same polarity by welding through a second metal sheet 4 b. The first electrode pin pad 61a and the second electrode pin pad 61b are used for being electrically connected with electrode pins of the LED lamp beads, so that power is provided for the LED lamp beads, and the polarities of the first electrode pin pad 61a and the second electrode pin pad correspond to the polarities of the electrode pins of the LED lamp beads.

After the LED lamp bead 100 is mounted on the printed circuit layer 6, the LED lamp bead is electrically connected to the extending portion 611 extending from the electrode pin pad on the bead soldering area 61 through the bead power pad 62 via the metal sheet 4, and the current is electrically communicated from the electrode pin of the LED lamp bead 100 via the electrode pin pad to form a power supply loop. Meanwhile, the control signal flowing from the lamp signal pad 63 flows through the LED lamp beads 100 connected in series in sequence, and is received by the previous LED lamp bead 100 and transmitted to the next LED lamp bead 100. So as to realize the control of the on/off and color change of the light-emitting wafer 3 on each LED lamp bead 100.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. An LED luminous glass curtain wall comprises a front transparent plate, a back transparent plate and LED lamp beads; a printed circuit layer is arranged on the front transparent plate; the front transparent plate and the back transparent plate form an installation space for accommodating the LED lamp beads; the LED lamp bead is characterized by comprising a base and a light-emitting wafer, wherein the light-emitting wafer is arranged on the base; a chip mounting surface is formed on the base, pins are led out from the chip mounting surface, and the pins are bent and then attached to the top of the base;

2. The LED luminescent glass curtain wall as claimed in claim 1, wherein the pins are LED out from the chip mounting surface and bent upwards along the side wall of the base to form bent sections, and the tail ends of the bent sections are bent along the top wall of the base to form connecting sections for being electrically connected with the printed circuit layer.

3. The LED luminescent glass curtain wall as claimed in claim 2, wherein the base is provided with a groove, and the bending section and the connecting section are embedded in the groove; the upper surface of the connecting section is higher than the top surface of the base.

4. The LED luminescent glass curtain wall as claimed in claim 1, wherein the LED bead further comprises a driving chip, and the driving chip is mounted on the base; the chip mounting surface comprises an isolation riverway, and an electrode pad and a signal pad which are isolated from each other through the isolation riverway;

5. The LED luminescent glass curtain wall as claimed in claim 4, wherein the driving chip is provided with a plurality of pins, and the pins on the driving chip are electrically connected with the chip mounting surface and the luminescent wafer through direct welding or bonding wires.

6. The LED luminescent glass curtain wall as claimed in claim 5, wherein the pins comprise signal pins, electrode pins and color control pins; the signal pins comprise a signal input pin and a signal output pin;

7. The LED luminescent glass curtain wall as claimed in claim 1, wherein the front transparent panel comprises a first transparent layer;

8. The LED luminescent glass curtain wall as claimed in claim 7, wherein N rows by M columns of bead lands are provided on the printed circuit layer;

9. The LED luminescent glass curtain wall of claim 8, wherein M pairs of lamp bead power pads are disposed on the printed circuit layer, each pair of lamp bead power pads comprising a first lamp bead power pad and a second lamp bead power pad of opposite polarity;

10. The LED luminescent glass curtain wall as claimed in claim 8, wherein the signal pin pads on each bead solder area comprise at least a first signal input pin pad and a first signal output pin pad;