CN214279923U - Gap measuring instrument, reaction cavity and semiconductor equipment - Google Patents
Gap measuring instrument, reaction cavity and semiconductor equipment Download PDFInfo
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- CN214279923U CN214279923U CN202120536419.4U CN202120536419U CN214279923U CN 214279923 U CN214279923 U CN 214279923U CN 202120536419 U CN202120536419 U CN 202120536419U CN 214279923 U CN214279923 U CN 214279923U
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Abstract
The utility model provides a clearance measuring instrument, a reaction cavity and semiconductor equipment, wherein the clearance measuring instrument comprises a light source, a probe, two image sensors and a data processor; the probe comprises two lenses with preset included angles; the light source is used for providing irradiation light to the position to be measured to form reflected light; the two lenses are used for respectively receiving reflected light reflected by the position to be detected and respectively transmitting the reflected light to the image sensors which are correspondingly arranged; the two image sensors are respectively used for carrying out photoelectric conversion on the received optical signals so as to obtain an image of a position to be detected under a corresponding visual angle, and the image is transmitted to the data processor; the data processor is used for calculating the clearance at the position to be measured according to the image. The utility model provides a clearance measuring apparatu can measure the clearance between the part of reaction chamber for the installation clearance between focus ring and the electrostatic absorption dish is even, avoids position department that awaits measuring to produce the particulate matter effectively and arouses the discharge effect.
Description
Technical Field
The utility model relates to a semiconductor equipment technical field especially relates to a clearance measuring apparatu, reaction chamber and semiconductor equipment.
Background
The focus ring (focus ring) of a TEL Vigus model can be replaced each time when the cavity is maintained, the current method is to use a protective cover of an electrostatic adsorption disc special for TEL company and a plastic card of 0.1mm to ensure that the installation gap is uniform, and a plug gauge is used for measuring the gap after the installation is finished.
However, the gap between the focusing ring and the electrostatic adsorption disc after installation is only 0.09-0.11 mm, and meanwhile, the plastic card is light and thin and is easy to consume and deform, and whether the installation gap is uniform or not can not be ensured to be completely concentric with the electrostatic adsorption disc only by visual inspection, so that the installation precision is not high; when the installation gap is not uniform, polymer is easily accumulated too much in the gap, and then a large potential difference is formed between the electrostatic adsorption disc and the focusing ring to cause a discharge effect, so that metal damage defects of the electrostatic adsorption disc and the focusing ring are easily caused, and particles are easily formed in the gap; when the plug gauge is used for measuring the clearance after installation, the plug gauge can rub against the component, and particulate matters (particles) are easily generated.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a clearance measuring apparatu, reaction chamber and semiconductor device to whether the method precision that adopts the plastic card inspection clearance that exists among the solution prior art is even is not high, adopts the feeler gauge to measure the problem that easily produces the particulate matter and be difficult to avoid the effect of discharging to the clearance.
In order to solve the above technical problem, the present invention provides a gap measuring instrument for measuring a gap between two objects, the gap measuring instrument comprising a light source, a probe, two image sensors and a data processor;
the probe comprises two lenses with preset included angles;
the light source is used for providing irradiation light to the position to be measured so as to form reflected light;
the two lenses are used for respectively receiving reflected light reflected by the position to be detected and respectively transmitting the received reflected light to the image sensors which are correspondingly arranged;
the two image sensors are respectively used for carrying out photoelectric conversion on the received optical signals so as to obtain an image of the position to be detected under a corresponding visual angle, and the obtained image of the position to be detected is transmitted to the data processor;
the data processor is used for calculating the gap at the position to be measured according to the received images of the position to be measured at two different viewing angles.
Optionally, the two image sensors are both CCD image sensors.
Optionally, the light source is connected to the probe through an optical fiber.
Optionally, the data processor is further configured to obtain a three-dimensional image of the position to be measured according to the received images of the position to be measured at the two different viewing angles.
Optionally, the gap measuring instrument further includes a display screen, the display screen is in communication connection with the data processor, and the display screen is used for displaying the three-dimensional image of the position to be measured.
Optionally, the display screen is a touch display screen.
Optionally, the clearance measuring instrument further comprises a protective cover, the protective cover is arranged outside the probe, and an opening is formed in one end, far away from the probe, of the protective cover.
Optionally, the protective cover is made of rubber.
The utility model also provides a reaction chamber is applied to semiconductor equipment, include as above clearance measuring apparatu.
The utility model also provides a semiconductor device, include as above the reaction chamber.
Compared with the prior art, the utility model provides a clearance measuring apparatu, reaction chamber and semiconductor device have following advantage:
(1) the utility model provides a clearance measuring instrument, which comprises a light source, a probe, two image sensors and a data processor; the probe comprises two lenses with preset included angles, so that the light source can provide irradiating light to a position to be detected to form reflected light; reflected light reflected by the position to be detected can be received through the two lenses respectively, and the received reflected light is transmitted to the image sensors correspondingly arranged to the reflected light respectively; the two image sensors can respectively perform photoelectric conversion on the received optical signals so as to acquire an image of the position to be detected under a corresponding visual angle, and the acquired image of the position to be detected is transmitted to the data processor; and calculating the gap at the position to be measured according to the received images of the position to be measured at two different viewing angles by the data processor. The utility model provides a clearance measuring apparatu's probe has two and is the camera lens of predetermineeing the contained angle, clearance measuring apparatu can pass through two images under the different visual angles of probe magnification shooting position department that awaits measuring, in order to acquire the three-dimensional information of position department that awaits measuring, through the image transmission of the position that awaits measuring under two different visual angles that will gather extremely data processor has guaranteed data processor can acquire the three-dimensional information of position department that awaits measuring, and according to three-dimensional information calculates the size in the clearance of position department that awaits measuring.
(2) Because the utility model provides a reaction chamber includes as above clearance measuring apparatu, from this, the utility model provides a reaction chamber includes clearance measuring apparatu's all advantages, through clearance between the different parts in the reaction chamber is measured to clearance measuring apparatu to can avoid producing the problem of particulate matter because of adopting the clearance department that the clearance leads to of plug gauge measurement. In addition, when the focusing ring is replaced for cavity maintenance, the mounting gap between the focusing ring and the electrostatic adsorption disc can be accurately measured, so that the focusing ring and the electrostatic adsorption disc are concentrically mounted, the uniformity of the mounting gap is ensured, the potential difference caused by overlarge mounting deviation of the focusing ring and the electrostatic adsorption disc is avoided, and the discharge effect caused by accumulation of polymers in gaps is effectively prevented.
(3) Because the utility model provides a semiconductor device includes as above the reaction chamber, from this, the utility model provides a semiconductor device includes all advantages of reaction chamber are no longer repeated here.
Drawings
Fig. 1 is a schematic view of an overall structure of a gap measuring instrument according to an embodiment of the present invention;
fig. 2 is a cross-sectional view of a probe of a gap measuring instrument according to an embodiment of the present invention;
fig. 3 is a schematic view illustrating that a probe of the gap measuring apparatus according to an embodiment of the present invention measures a gap between the electrostatic chuck and the focusing ring.
Wherein the reference numbers are as follows:
200-gap measuring instrument, 210-light source, 220-probe, 221-optical fiber, 222-lens, 223-protective cover, 230-image sensor, 240-data processor, 250-display screen, 300-focusing ring, 400-electrostatic adsorption disk.
Detailed Description
To make the objects, advantages and features of the present invention clearer, the gap measuring instrument, the reaction chamber and the semiconductor device according to the present invention will be described in further detail with reference to fig. 1 to 3. It should be noted that the drawings are simplified and have non-precise ratios, and are only used for convenience and clarity to assist in describing the embodiments of the present invention, and are not used for limiting the implementation of the present invention, so that the present invention has no technical essential significance, and any structural modification, ratio relationship change or size adjustment should still fall within the scope that the technical content disclosed by the present invention can cover without affecting the function and the achievable purpose of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "fixed" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood as appropriate by those of ordinary skill in the art.
The core thought of the utility model lies in providing a clearance measuring apparatu, reaction chamber and semiconductor device to the realization is avoided adopting the feeler gauge to measure and is leaded to the production of granule and the risk of discharge effect, improves the precision of measuring the clearance simultaneously, thereby guarantees that the clearance between electrostatic absorption dish and the focus ring is even, makes the focus ring with the electrostatic absorption dish is concentric the installation.
To achieve the above idea, the present invention provides a gap measuring instrument for measuring a gap between two objects, please refer to fig. 1 to 3, wherein fig. 1 schematically shows an overall structural diagram of the gap measuring instrument provided by the present invention; fig. 2 schematically shows a cross-sectional view of a probe of a gap measuring instrument according to the present invention; fig. 3 schematically shows a schematic diagram of the gap between the electrostatic adsorption disc and the focusing ring measured by the probe of the gap measuring apparatus provided by the present invention. As shown in fig. 1 to 3, the gap gauge 200 includes a light source 210, a probe 220, two image sensors 230, and a data processor 240; the probe 220 comprises two lenses 222 with a preset included angle; the light source 210 is used for providing irradiation light to the position to be measured to form reflected light; the two lenses 222 are configured to receive the reflected light reflected from the position to be measured, and transmit the received reflected light to the image sensors 230 correspondingly; the two image sensors 230 are respectively configured to perform photoelectric conversion on the received optical signals to obtain an image of the position to be measured at a corresponding viewing angle, and transmit the obtained image of the position to be measured to the data processor 240; the data processor 240 is configured to calculate a gap at the position to be measured according to the received images of the position to be measured at two different viewing angles. Thereby, the light source 210 can provide the irradiation light to the position to be measured to form the reflected light; the two lenses 222 can respectively receive the reflected light reflected by the position to be measured, and respectively transmit the received reflected light to the image sensors 230 correspondingly arranged to the reflected light; the two image sensors 230 can respectively perform photoelectric conversion on the received optical signals to acquire an image of the position to be measured at a corresponding viewing angle, and transmit the acquired image of the position to be measured to the data processor 240; the data processor 240 can calculate the gap at the position to be measured according to the received images of the position to be measured at two different viewing angles. The utility model provides a probe 220 of clearance measurement appearance 200 has two and is preset contained angle camera lens 222, clearance measurement appearance 200 can pass through probe 220 enlargies two images under the different visual angles of shooting position department that awaits measuring, in order to acquire the three-dimensional information on position department surface that awaits measuring, by image sensor 230 will gather image transmission extremely data processor 240 has guaranteed data processor 240 can be according to acquireing three-dimensional information calculates the size in the clearance of position department that awaits measuring.
Preferably, both of the image sensors 230 are CCD image sensors 230. Therefore, the CCD image sensor 230 can effectively convert the received optical signal into an electrical signal, and transmit the electrical signal carrying the image information to the data processor 240, so that the data processor 240 can process the acquired image information to obtain the three-dimensional information of the position to be measured, and the data processor 240 can calculate the actual size of the gap between the objects according to the three-dimensional information. It should be noted that, when the data processor 240 processes the images of the two positions to be measured at different viewing angles to obtain the three-dimensional information at the position to be measured and calculate the gap at the position to be measured, the data such as the preset included angle and the size of the lens 222 may be combined to perform processing and calculation.
Preferably, the light source 210 is connected to the probe 220 through an optical fiber 221. Thereby, the optical fiber 221 can be utilized to transmit the irradiation light to the position to be measured to form the reflected light. In addition, the transmission of the illumination light through the optical fiber 221 has better adaptability, and the position of the probe 220 can be adjusted according to specific situations.
Preferably, the data processor 240 is further configured to obtain a three-dimensional image of the position to be measured according to the received images of the position to be measured at two different viewing angles. Therefore, this arrangement facilitates the operator to select the profile structure to be measured, i.e. the gap at the position to be measured, on the three-dimensional image, so that the data processor 240 can calculate the actual size of the gap at the position to be measured according to the selected profile structure.
Preferably, the gap measuring instrument 200 further includes a display screen 250, the display screen 250 is in communication connection with the data processor 240, and the display screen 250 is configured to display a three-dimensional image of the position to be measured. Therefore, the display screen 250 can display the three-dimensional image of the position to be measured, so that the profile structure to be measured can be conveniently selected, the numerical value of the actual size of the gap at the position to be measured, which is calculated by the data processor 240, can be displayed, so that the reading and the control of the gap uniformity by an operator are facilitated, and the concentric installation between the focusing ring 300 and the electrostatic adsorption disc 400 is ensured.
Preferably, the display screen 250 is a touch display screen. Therefore, an operator can more conveniently and quickly select the contour structure to be measured, and the numerical value of the actual size of the gap at the position to be measured is displayed on the display screen 250 by selecting the two sides of the gap at the position to be measured in the three-dimensional image and calculating through the data processor 240.
Preferably, the data processor 240 calculates an actual distance between any two points on the three-dimensional image according to the preset angle, the size of the lens 222, the size of the three-dimensional image, and the size of the display screen 250.
Preferably, as shown in fig. 2, the gap measuring instrument 200 further includes a protective cover 223, the protective cover 223 covers the outside of the probe 220, and an opening is formed at an end of the protective cover 223 far away from the probe 220. Therefore, the protection cover 223 can effectively protect the probe 220 from being damaged, and meanwhile, when the probe 220 is placed at the position to be measured for measurement, the protection cover 223 can enable the probe 220 to be stably placed at the position to be measured, so that friction between the probe 220 and a cavity component is reduced, the generation of particles can be reduced, and the discharge effect can be effectively avoided. In addition, the opening can ensure that the irradiation light provided by the light source 210 can be irradiated to the position to be measured to form reflected light, and meanwhile, the reflected light can be received by the lens 222 through the opening.
Preferably, the material of the protective cover 223 is rubber. Therefore, the protective cover 223 made of rubber has a good insulating effect, and the probe 220 is placed at the position to be measured, so that the discharge effect and the generation of particles caused by friction between the protective cover 223 and the cavity component can be effectively avoided, and the defect of metal damage to the cavity component can be effectively avoided.
In order to realize the above idea, the present invention further provides a reaction chamber applied to a semiconductor device, as shown in fig. 3, the reaction chamber includes the gap measuring apparatus 200 as described above. Therefore, the utility model provides a reaction chamber can enough avoid adopting the feeler gauge to measure the clearance and lead to the production of clearance department particulate matter when carrying out the cavity maintenance and changing focus ring 300, can accurately measure the installation clearance between focus ring 300 and the electrostatic absorption dish 400 again, makes focus ring 300 can with for concentric installation between the electrostatic absorption dish 400, guaranteed installation clearance's is even to avoided because focus ring 300 and electrostatic absorption dish 400's installation deviation is too big and produce the potential difference, prevented that the polymer from piling up in the gap and the discharge effect who causes.
In order to realize the above idea, the present invention further provides a semiconductor device, comprising the reaction chamber as described above. Because the utility model provides a semiconductor equipment includes as above reaction chamber, therefore, the utility model provides a semiconductor equipment can measure the actual size in clearance between the part in reaction chamber effectively, can enough avoid leading to the problem that clearance department produced the particulate matter because of adopting the feeler gauge to measure the clearance, can be again when maintaining the reaction chamber and changing the focus ring, the accurate installation clearance of measuring between focus ring and the electrostatic absorption dish makes focus ring with for concentric installation between the electrostatic absorption dish, guaranteed installation clearance's is even to avoided because focus ring and electrostatic absorption dish's installation deviation is too big and produce the potential difference, prevented that the polymer from piling up in the gap and the discharge effect who causes.
To sum up, compare with prior art, the utility model provides a clearance measuring apparatu, reaction chamber and semiconductor equipment have following advantage:
(1) the utility model provides a clearance measuring instrument, which comprises a light source, a probe, two image sensors and a data processor; the probe comprises two lenses with preset included angles, so that the light source can provide irradiating light to a position to be detected to form reflected light; reflected light reflected by the position to be detected can be received through the two lenses respectively, and the received reflected light is transmitted to the image sensors correspondingly arranged to the reflected light respectively; the two image sensors can respectively perform photoelectric conversion on the received optical signals so as to acquire an image of the position to be detected under a corresponding visual angle, and the acquired image of the position to be detected is transmitted to the data processor; and calculating the gap at the position to be measured according to the received images of the position to be measured at two different viewing angles by the data processor. The utility model provides a clearance measuring apparatu's probe has two and is the camera lens of predetermineeing the contained angle, clearance measuring apparatu can pass through two images under the different visual angles of probe magnification shooting position department that awaits measuring, in order to acquire the three-dimensional information of position department that awaits measuring, through the image transmission of the position that awaits measuring under two different visual angles that will gather extremely data processor has guaranteed data processor can acquire the three-dimensional information of position department that awaits measuring, and according to three-dimensional information calculates the size in the clearance of position department that awaits measuring.
(2) Because the utility model provides a reaction chamber includes as above clearance measuring apparatu, from this, the utility model provides a reaction chamber includes clearance measuring apparatu's all advantages, through clearance between the different parts in the reaction chamber is measured to clearance measuring apparatu to can avoid producing the problem of particulate matter because of adopting the clearance department that the clearance leads to of plug gauge measurement. In addition, when the focusing ring is replaced for cavity maintenance, the mounting gap between the focusing ring and the electrostatic adsorption disc can be accurately measured, so that the focusing ring and the electrostatic adsorption disc are concentrically mounted, the uniformity of the mounting gap is ensured, the potential difference caused by overlarge mounting deviation of the focusing ring and the electrostatic adsorption disc is avoided, and the discharge effect caused by accumulation of polymers in gaps is effectively prevented.
(3) Because the utility model provides a semiconductor device includes as above the reaction chamber, from this, the utility model provides a semiconductor device includes all advantages of reaction chamber are no longer repeated here.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.
Claims (10)
1. A gap measuring instrument for measuring a gap between two objects, the gap measuring instrument comprising a light source, a probe, two image sensors and a data processor;
the probe comprises two lenses with preset included angles;
the light source is used for providing irradiation light to the position to be measured so as to form reflected light;
the two lenses are used for respectively receiving reflected light reflected by the position to be detected and respectively transmitting the received reflected light to the image sensors which are correspondingly arranged;
the two image sensors are respectively used for carrying out photoelectric conversion on the received optical signals so as to obtain an image of the position to be detected under a corresponding visual angle, and the obtained image of the position to be detected is transmitted to the data processor;
the data processor is used for calculating the gap at the position to be measured according to the received images of the position to be measured at two different viewing angles.
2. A gap measuring instrument as claimed in claim 1, wherein both of said image sensors are CCD image sensors.
3. A gap measuring instrument as claimed in claim 1, wherein the light source is connected to the probe by an optical fibre.
4. A gap measuring instrument as claimed in claim 1, wherein the data processor is further configured to obtain a three-dimensional image of the position to be measured from the received images of the position to be measured at two different viewing angles.
5. A gap measuring instrument as claimed in claim 4, further comprising a display screen in communication with the data processor, the display screen being adapted to display a three-dimensional image of the location to be measured.
6. A gap gauge as claimed in claim 5, wherein the display screen is a touch display screen.
7. The gap measuring instrument according to claim 1, further comprising a protective cover provided outside the probe, wherein an end of the protective cover remote from the probe is provided with an opening.
8. The gap measuring instrument according to claim 7, wherein the protective cover is made of rubber.
9. A reaction chamber comprising a gap measuring instrument according to any one of claims 1 to 8.
10. A semiconductor device comprising the reaction chamber of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120536419.4U CN214279923U (en) | 2021-03-15 | 2021-03-15 | Gap measuring instrument, reaction cavity and semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120536419.4U CN214279923U (en) | 2021-03-15 | 2021-03-15 | Gap measuring instrument, reaction cavity and semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214279923U true CN214279923U (en) | 2021-09-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120536419.4U Active CN214279923U (en) | 2021-03-15 | 2021-03-15 | Gap measuring instrument, reaction cavity and semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214279923U (en) |
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2021
- 2021-03-15 CN CN202120536419.4U patent/CN214279923U/en active Active
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