CN214264355U

CN214264355U - Light beam drilling device using multi-focus adjusting part

Info

Publication number: CN214264355U
Application number: CN202022527001.5U
Authority: CN
Inventors: 成奎栋
Original assignee: Eo Technics Co ltd Suzhou
Current assignee: Eo Technics Co ltd Suzhou
Priority date: 2020-11-05
Filing date: 2020-11-05
Publication date: 2021-09-24
Anticipated expiration: 2030-11-05

Abstract

A light beam drilling device using a multi-focus adjusting part comprises a light source, an optical modulator for changing a light path formed by transmitting the light source, a multi-focus adjusting part for changing a light focusing distance transmitted by the optical modulator, a scanning part for moving light transmitted from the multi-focus adjusting part to an object, an object having a first layer and a second layer, and an XY stage for supporting the object. The utility model discloses a set up light regulator, many burnt regulating part and scanning portion for in laser beam machining process, reduced the required time of change of focus distance, increased machining efficiency, improved the processing quality.

Description

Light beam drilling device using multi-focus adjusting part

Technical Field

The utility model relates to an utilize light beam drilling equipment of many burnt regulating parts.

Background

In many industries, a pattern processing technology has been developed for cutting and punching an object. In general, this kind of processing technology is a technology for injecting a laser beam onto a surface of a workpiece to process a shape or a physical shape of the surface of the workpiece, and there are many examples of the object to be processed, including a two-dimensional planar object such as a silicon wafer, and a technology for accelerating the processing of the object to be processed can improve manufacturability and bring many benefits in terms of cost, and therefore, the development of the technology is in progress.

Generally, in the processing of the blind via, the processing equipment of the printed circuit board can process the blind via in 2 stages, namely, the stage of processing the upper copper foil and the stage of processing the middle polymer, and at this time, the processing time is prolonged and the processing quality is low because the movement of the Z-axis motor is required when the copper foil and the polymer are processed in 2 stages.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to provide an utilize light beam drilling equipment of many burnt regulating parts.

In order to solve the technical problem, the utility model discloses a technical scheme is: a light beam drilling device using a multi-focus adjusting part comprises a light source, an optical modulator for changing a light path formed by transmitting the light source, a multi-focus adjusting part for changing a light focusing distance transmitted by the optical modulator, a scanning part for moving light transmitted from the multi-focus adjusting part to an object, an object with a multilayer structure, and an XY platform for supporting the object.

In some embodiments, the object includes a first layer and a second layer, the first layer and the second layer are sequentially arranged from top to bottom, the first layer is disposed above the second layer, the first layer is a copper foil layer, and the second layer is a polyimide layer.

In some embodiments, the control unit controls the first layer to be processed with a focused beam and the second layer to be processed with an unfocused beam, the first layer is made of copper foil, the second layer is made of polyimide, and the first layer has a lower hardness than the second layer.

In some embodiments, the multi-focus adjustment section includes a first beam expander having a focused beam, a second beam expander having an unfocused beam.

In some embodiments, the apparatus further comprises a control unit for controlling the light source, the light modulator, the scanning unit, the XY stage, and the focused beam to machine the object, wherein the control unit controls the focused beam to machine the first layer and controls the unfocused beam to machine the second layer.

In some embodiments, the XY stage is disposed below the subject, and the control unit controls the XY stage and the scanning portion to be processed into a closed loop configuration for removing the first layer.

In some embodiments, the light modulator is disposed in front of the multi-focus adjusting section, and the light modulator is an acousto-optic modulator.

The scope of the present invention is not limited to the technical solutions formed by specific combinations of the above technical features, and other technical solutions formed by arbitrary combinations of the above technical features or equivalent features should be covered. For example, the above features and the technical features (but not limited to) having similar functions disclosed in the present application are mutually replaced to form the technical solution.

Because of the application of the technical scheme, compared with the prior art, the utility model has the following advantages: the utility model discloses a set up light regulator, many burnt regulating part and scanning portion for in laser beam machining process, reduced the required time of change of focus, increased machining efficiency, improved the processing quality.

Drawings

FIG. 1 is a cross-sectional view of an object of a green sheet and an outline of a blind via formation process;

FIG. 2 is a sequence diagram of an overview of a beam drilling method;

FIG. 3 is a schematic view of a beam drilling apparatus (first embodiment)

FIG. 4 is a detailed sequence diagram of a beam drilling method (embodiment one);

FIG. 5 is a schematic diagram of the generation of a light modulator drive signal that continuously drives the light source and shifts the focal length without time loss (embodiment one);

FIG. 6 is a schematic view of a beam drilling apparatus (example II);

FIG. 7 is a sectional view of a processing object having a multilayer structure, and an outline of a blind hole forming process (embodiment II);

FIG. 8 is a detailed sequence diagram of a beam drilling method (example two);

wherein, 1, a first layer; 2. a second layer; 3. a third layer; 4. a fourth layer; 5. a fifth layer; ob, object;

100. beam drilling apparatus (embodiment one); 110. a control unit; 120. a light source; 130. an optical modulator; 140. a multiple focus adjusting part; 141. a first beam expander; 142. a second beam expander; 150. a scanning section; 160. an XY stage;

200. beam drilling apparatus (example two); 220. a control unit; 220. a light source; 230. an optical modulator; 240. a multiple focus adjusting part; 242. a first beam expander; 242. a second beam expander; 250. a scanning section; 260. and (4) an XY platform.

Detailed Description

Fig. 1 is a sectional view of the processing object ob having a printed circuit board structure and an outline of a blind hole forming process. As shown in fig. 1, the object body ob in the form of a printed circuit board includes a first layer, a second layer, and a third layer, and the second layer is provided between the first layer and the third layer and is formed of a material softer than the first layer and the third layer. For example, the second layer may form polyimide. Generally, the first layer is formed of the same material as the third layer to form a copper foil. However, this is only an example on the premise of the object to be processed ob in the form of a printed circuit board, and is not limited thereto.

In general, a printed circuit board is formed by embedding copper foil on both surfaces of an epoxy heating insulation layer, and a double-sided printed circuit board pattern or a multi-layer printed circuit board pattern is formed.

Referring to fig. 1 (a), the object ob has a multilayer structure of 3 or more layers.

Referring to (b) of fig. 1, a via hole may be formed in a portion of the first layer located at the uppermost end of the multi-layer structure.

Referring to (c) of fig. 1, a via hole may be formed in a portion of the second layer located at the lower end of the first layer of the multi-layer structure.

Since the first and second layers of the printed circuit board are different in material and hardness, a processing apparatus and a processing method reflecting such a hardness difference are used when processing is performed by a laser beam.

The first embodiment is as follows: referring to fig. 2, according to the beam drilling method of the related art, in order to process the first layer of the object ob, the Z-axis motor is moved to focus the laser beam S1.

And driving the XY platform and the scanning part to move to the X-Y plane, processing and removing the first layer of the object ob, and forming a blind hole in the second layer through the object ob.

After that, the Z-axis motor is moved to perform the divergent processing on the focused beam, and as described above, the positions and materials of the first layer and the second layer are different, and thus the focal lengths required for the processing are also different. Therefore, in order to adjust the focal length, it is necessary to adjust the focal length of the laser beam using a Z-axis motor, for example, in printed circuit board processing, the second layer is an insulating layer and has lower hardness than the first layer and the third layer of the conductive layer, so that the laser beam can be diverged to be processed into the second layer as a whole on the premise of using the same power light.

Then, the XY stage and the scanning unit are driven to move to the X-Y plane, and the second layer is processed and removed.

The beam drilling method according to the conventional art requires a Z-axis motor to move the optical module in the Z-axis direction and change the focal length, and this Z-axis driving causes problems of an increase in processing time and a decrease in processing quality, and particularly, in laser beam processing, the mass of the scanning unit and the motor unit is several hundred grams or more, and there are problems of time required for acceleration and stop due to inertia and vibration generation in Z-axis driving.

Fig. 3 is a schematic diagram of the beam drilling apparatus 100. The beam drilling apparatus includes a control unit 110, a light source 120, a light modulator 130, a multi-focus adjusting part 140, a scanning part 150, and an XY stage 160.

The control unit 110 controls the movement of the light source 120, the light modulator 130, the multi-focus adjusting part 140, the scanning part 150 and the XY stage 160, and the control unit 110 includes an input device (not shown) or an output device (not shown), receives a user input, and outputs a control state to the user. The control unit 110 includes a communication unit (not shown) and can receive external devices and information. For example, the information may include control-related control data of the light modulator 130, control-related control data of the multi-focus adjusting part 140, control-related control data of the scanning part 150, and control-related control data of the light source 120.

The light source 120 may emit light by controlling the optical modulator 130, the light source 120 may emit high-power light for processing an object, and the light source 120 may use various types of laser light sources such as a carbon dioxide laser, a he-ne laser, an Argon-ion laser, an excimer laser, a semiconductor laser, a solid laser, and a liquid laser, but is not limited to a specific embodiment.

Optical modulator 130 may change the optical path transmitted by optical source 120 into the first path or the second path, that is, optical modulator 130 may be a high-speed modulator that modulates the transition time of the optical path to 1 μ s or less; optical modulator 130 may also be an optical-to-sound modulator that can change the light from the first path to the second path or from the second path to the first path within 1 μ s.

The multi-focus adjustment part 140 may adjust a light focusing distance communicated by the light modulator 130. The multi-focus adjusting part 140 may include a first beam expander 141 and a second beam expander 142, the first beam expander 141 may be disposed on a first path, the second beam expander 142 may be disposed on a second path, and light passing through the first beam expander 141 by switching of the optical modulator 130 may have a first focus; in addition, the light passes through the second beam expander 142 by virtue of the conversion of the optical modulator 130, and may have a second focal length. Since the switching time of the optical modulator 130 is 1 μ s or less, the focal length can be changed to 1 μ s or less, and the process is very short and the processing time can be saved as compared with the conventional beam drilling device and method which require several seconds to several tens of seconds.

As shown in fig. 3, the first beam expander 141 and the second beam expander 142 have a combination of a first lens having negative refractive power and a second lens having positive refractive power, the first condenser diffuses light, the second condenser condenses light, and can condense the light at a specific position, the focal lengths of the first beam expander 141 and the second beam expander 142 can be adjusted by arranging the refractive powers of the first condenser and the second condenser and/or adjusting the distance between the first condenser and the second condenser, the first beam expander 141 can form positive focusing of light condensed on the first layer of the object ob, and the second beam expander 142 can form negative focusing of light condensed on the upper portion of the second layer and on the upper end or the lower end of the object ob.

The scanning section 150 can move the light transmitted by the light modulator 130 from the surface of the object ob to a two-dimensional space. The scanning unit 150 is driven in the X-Y plane according to the control of the control unit 110, and forms blind holes in the first layer and the second layer of the object ob.

The platform 160 may support the object ob. The XY stage 160 is movable in the X-Y plane according to the control of the control unit 110, the XY stage 160 is driven at a low speed, the scanning unit 150 is driven at a relatively high speed, and the object ob can be processed at a high efficiency.

The object ob may have a multilayer stack structure, and as described above, the object ob may be a printed circuit board, but is not limited thereto.

According to the light beam drilling apparatus 100, even if the scanning unit 150 is not driven in the Z-axis direction, the focusing distance in the Z-axis direction can be realized by the combination of the optical modulator 130 and the multi-focus adjusting unit 140, the focal length changing time can be changed to be within 1 μ s, the blind hole of the object ob can be formed at high speed, the Z-axis driving can be controlled, and the deterioration of quality due to vibration can be prevented.

Fig. 4 is a sequence diagram of a beam drilling method according to a first embodiment, and as shown in fig. 4, according to the beam drilling method, a laser beam is irradiated on a first beam expander by a light modulator AOM to form a positively focused beam, and the laser beam can be focused on an uppermost layer of an object ob having a multilayer structure. If the object ob is a printed circuit board, the laser beam can be focused on the upper copper foil layer, the uppermost layer is made of metal material, the hardness is high, and the high-power laser beam focusing is favorable for processing.

And secondly, driving the XY platform and the scanning part to move to the X-Y plane, and processing and removing the first layer to form a blind hole on the first layer.

Secondly, the beam drilling method may irradiate a laser beam on the second beam expander with the optical modulator AOM to form a negatively focused laser beam. The laser beam which becomes negatively focused can process the upper layer surface of the object ob leaking out in the second stage, the laser beam can be condensed on the second layer having the insulating function if the object ob is a printed circuit board, and the second layer can be a polyimide material, so that the second layer is formed of a non-metal material, the hardness is low, and the laser beam of high power is advantageous for the processing of the negative focusing.

Next, the XY stage and the scanning section can be driven to move to the X-Y plane, process and remove the second layer, through which blind holes are formed in the second layer.

Fig. 5 is a drawing showing generation of a light modulator driving signal for continuously driving a light source and changing a focal length without time loss. Referring to fig. 5, the light source may continuously generate laser pulse laser light, and the light source may generate laser pulses having a pulse width of several milliseconds to several tens milliseconds.

The light source can continuously generate laser pulses in a transition period between a positive focus processing field as a first processing field and a negative focus processing field as a second processing field. The optical modulator transmits a beam by a first beam expander when processing the first layer, the control unit transmits an optical modulator control signal to a non-generation section of a laser pulse when processing the first layer is completed, the optical modulator transmits and converts the beam by a second beam expander within 1 μ s when receiving the optical modulator control signal, and the laser processing method has a merit of shortening a processing time when converting and processing the second layer in order to form a negative focus while the light source is continuously operated.

Example two: FIG. 6 is a schematic view of a beam drilling apparatus according to a second embodiment.

Referring to fig. 6, in the second embodiment, the light beam drilling apparatus includes a control unit 210, a light source 220, a light modulator 230, a variety of focus adjusting parts 240, a scanning part 250, and an XY stage 260.

The control unit 210 determines an appropriate focusing distance based on the position and material of the object ob, and controls the optical modulator 230, the various focus adjusting sections 240, the scanning section 250, and the XY stage 260.

According to the present embodiment, the multiple focus adjusting part 240 may include a plurality of

beam expanders

241, 242, 243, 244. As shown in fig. 6, the multiple focus adjustment section 240 includes a first beam expander 241 having a first focal length, a second beam expander 242 having a second focal length, an n-1 beam expander 243 having an n-1 th focal length, and an n-th beam expander 244 having an n-th focal length, where n is a natural number of 4 or more.

The multiple focus adjustment unit 240 can examine the focused light corresponding to a plurality of types of object ob only by the switching operation of the optical modulator 230 by the plurality of

beam expanders

241, 242, 243, and 244 having a plurality of focal lengths, the object ob can have a plurality of hierarchies of 4 or more, and the control unit 210 can calculate the appropriate focal distance of each hierarchy based on the thickness and material of the plurality of hierarchies of the object ob by a single input unit (not shown) or an imaging unit (not shown). The control unit 210 may control the optical modulator 230 to select an appropriate beam expander upon processing of each slice based on the result of the operation.

For example, referring to fig. 7, for an object ob including 5 slices, the first slice may perform a first focusing process using a beam expander of a first focal length. The second layer may be second focused using a beam expander of a second focal length. Layer 3 may be processed for a third focus using a beam expander of a third focus. The fourth layer may perform a fourth focus process using a fourth focal length.

Fig. 8 is a sequence diagram of the beam drilling method of the second embodiment.

As shown in fig. 8, the control unit can determine an appropriate focal length based on the position of the object ob and the hardness of the material.

Secondly, the optical path is controlled with a beam expander of an appropriate focusing distance, thereby forming a laser beam having a corresponding focusing distance.

The optical modulator converts the laser beam with a first beam expander to form a laser beam with a first focal length, the optical modulator converts the laser beam with a second beam expander to form a laser beam with a second focal length, and the optical modulator converts the laser beam with an nth beam expander to form a laser beam with an nth focal length. Here, n is a natural number of 3 or more.

The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims

1. A light beam drilling apparatus using a multi-focus adjustment section, comprising a light source (120), a light modulator (130) for changing a light path formed by transmission of the light source (120), characterized in that: the optical system further includes a multi-focus adjustment unit (140) for changing a light focus distance transmitted from the optical modulator (130), a scanning unit (150) for moving from the multi-focus adjustment unit (140) to an object, an object (ob) having a multilayer structure, and an XY stage (160) for supporting the object (ob).

2. A beam drilling apparatus using a multi-focus adjustment section according to claim 1, wherein: the object body (ob) comprises a first layer (1) and a second layer (2), the first layer (1) and the second layer (2) are sequentially arranged from top to bottom, the first layer (1) is arranged above the second layer (2), the first layer (1) is a copper foil layer, and the second layer (2) is a polyimide layer.

3. A beam drilling apparatus using a multi-focus adjustment section according to claim 2, wherein: the multi-focus adjustment section (140) includes a first beam expander (141) having a focused beam, and a second beam expander (142) having an unfocused beam.

4. A beam drilling apparatus using a multi-focus adjustment section according to claim 3, wherein: further comprising a control unit (110) for controlling the light source (120), the light modulator (130), the scanning unit (150), the XY-stage (160), controlling the beam to process the object (ob), the control unit (110) controlling the focused beam to process the first layer (1) and controlling the unfocused beam to process the second layer (2).

5. The beam drilling apparatus using multiple focus adjustment sections according to claim 4, wherein: the XY-stage (160) is disposed below an object (ob), and the control unit (110) controls the XY-stage (160) and the scanning unit (150) to be processed into a closed-loop configuration for removing the first layer (1).

6. A beam drilling apparatus using a multi-focus adjustment section according to claim 1, wherein: the optical modulator (130) is arranged in front of the multi-focus adjusting part (140), and the optical modulator (130) is an acousto-optic modulator.