CN214254416U

CN214254416U - Power module and radiating bottom plate thereof

Info

Publication number: CN214254416U
Application number: CN202120224241.XU
Authority: CN
Inventors: 崔晓; 黄蕾; 闫鹏修
Original assignee: Guangdong Core Juneng Semiconductor Co ltd
Current assignee: Guangdong Core Juneng Semiconductor Co ltd
Priority date: 2021-01-27
Filing date: 2021-01-27
Publication date: 2021-09-21
Anticipated expiration: 2031-01-27

Abstract

The utility model relates to a power module and heat dissipation bottom plate thereof, power module's heat dissipation bottom plate includes the bottom plate body. The surface of the bottom plate body is provided with a welding part used for welding with a copper-clad ceramic plate of the power module, the surface of the bottom plate body is also provided with a separation structure, and the separation structure is used for separating solder paste at the welding part so that the solder paste is located at the welding part. In welding the equipment process with covering copper ceramic plate, because be equipped with separation structure on the bottom plate body, the tin cream that welding position department can be separated to separation structure avoids among the welding process tin cream to be heated and melts and flows to the region beyond the welding position, can guarantee that the tin cream is in the welding position all the time in welding process. So, can guarantee to cover after copper ceramic plate and bottom plate body adopt vacuum reflow soldering, cover the thickness value and the lower voidage of copper ceramic plate and heat dissipation bottom plate welded layer, can improve the reliability and the heat-sinking capability of welding layer, can prolong power module's life greatly.

Description

Power module and radiating bottom plate thereof

Technical Field

The utility model relates to a semiconductor device technical field especially relates to a power module and radiating bottom plate thereof.

Background

The conventional solder layer structure of the power module exists between a chip (e.g., IGBT, SiC, MOSFET, diode, etc.) of the power module and a copper-clad ceramic board, the copper-clad ceramic board and a heat dissipation base plate. Wherein, the copper-clad ceramic plate is large in size, large in contact area with the radiating bottom plate, and larger in both chip and copper-clad ceramic plate compared with the connecting area of the welding layer and the welding layer formed between the copper-clad ceramic plate and the radiating bottom plate. In the process of welding the copper-clad ceramic plate and the radiating bottom plate by adopting a vacuum reflow soldering technology, bubbles formed in the vacuum reflow soldering process or uneven smearing of a solder layer and the like can generate cavities with different shapes and sizes in a welding layer. The solder layer is not only a main channel for heat dissipation of the power module, but also bears periodic stress generated by mismatch of thermal expansion coefficients of materials in a temperature cycle process, so that damage of the chip caused by mechanical stress is relieved. In addition, voids in the solder layer can also induce current crowding effects, leading to thermoelectric breakdown. As the voltage level of the power module is increased and the power density is increased, the power consumption of the chip is increased, and therefore higher requirements on the heat transfer and mechanical properties of the solder layer are provided. In the process of high-frequency switching, the creep of the welding layer can generate more holes, so that heat cannot be effectively dissipated, and finally the power module is failed.

SUMMERY OF THE UTILITY MODEL

Accordingly, there is a need to overcome the drawbacks of the prior art and to provide a power module and a heat dissipation base plate thereof, which can ensure that the copper-clad ceramic plate does not deviate from the preset position during the welding process, ensure the thickness of the welding layer between the copper-clad ceramic plate and the heat dissipation base plate, and reduce the void ratio.

The technical scheme is as follows: a heat sink base plate for a power module, the heat sink base plate comprising: the base plate comprises a base plate body, wherein a welding part used for welding with a copper-clad ceramic plate of the power module is arranged on the surface of the base plate body, a separation structure is further arranged on the surface of the base plate body, and the separation structure is used for separating solder paste at the welding part so that the solder paste is located at the welding part.

Foretell power module's heat dissipation bottom plate welds the equipment in-process with covering copper ceramic plate, because be equipped with the separation structure on the bottom plate body, the tin cream that the separation structure can separation welding position department avoids among the welding process tin cream to be heated and melts and flow to the region beyond the welding position to can guarantee that the tin cream is in the welding position all the time in welding process. So, can guarantee to cover after copper ceramic plate and bottom plate body adopt vacuum reflow soldering, cover the thickness value and the lower void ratio of copper ceramic plate and heat dissipation bottom plate welding layer to can improve the reliability and the heat-sinking capability of welding layer, can prolong power module's life greatly, can avoid causing unnecessary electrical connection and creepage distance value not enough, can also avoid covering drift and the skew of copper ceramic plate, in order to ensure welding position's accuracy.

In one embodiment, the barrier is a boss disposed circumferentially around the weld site.

In one embodiment, the barrier structure is a wire groove disposed circumferentially around the weld site.

In one embodiment, the line grooves are formed in the surface of the base plate body by a laser scribing process, an etching process, or milling by a milling cutter.

In one embodiment, the welding portion is a groove formed on the plate surface of the bottom plate body, and the blocking structure is a portion of the bottom plate body other than the groove.

In one embodiment, the depth of the groove is 0.1mm to 0.4 mm.

In one embodiment, the number of the welding positions is two or more, the number of the barrier structures is two or more, and the two or more barrier structures are arranged in one-to-one correspondence with the two or more welding positions.

In one embodiment, the heat dissipation bottom plate is a heat dissipation copper plate, a heat dissipation aluminum plate or an AlSiC plate; and a plurality of cooling water pipes, cooling fins or cooling columns are arranged on the side surface of the heat dissipation bottom plate, which is far away from the copper-clad ceramic plate.

The power module comprises a heat dissipation bottom plate of the power module, and the power module further comprises a copper-clad ceramic plate, wherein the copper-clad ceramic plate is welded and fixed on a welding part.

Foretell power module welds the equipment in-process at radiating bottom plate and copper-clad ceramic plate, because be equipped with the separation structure on the bottom plate body, the tin cream that the welding position department can be separated to the separation structure, avoids among the welding process tin cream to be heated and melts and flow to the region beyond the welding position to can guarantee that the tin cream is in the welding position all the time at the welding process. So, can guarantee to cover after copper ceramic plate and bottom plate body adopt vacuum reflow soldering, cover the thickness value and the lower void ratio of copper ceramic plate and heat dissipation bottom plate welding layer to can improve the reliability and the heat-sinking capability of welding layer, can prolong power module's life greatly, can avoid causing unnecessary electrical connection and creepage distance value not enough, can also avoid covering drift and the skew of copper ceramic plate, in order to ensure welding position's accuracy.

In one embodiment, the power module further comprises a chip and a shell, wherein the chip is connected with the side, away from the heat dissipation bottom plate, of the copper-clad ceramic plate through solder paste in a welding mode; the shell is covered on the heat dissipation bottom plate and covers the chip and the copper-clad ceramic plate; the shell is provided with a through hole, and the pin of the chip penetrates through the through hole and extends out of the shell.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification.

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a view structural diagram of a heat dissipation base plate of a power module according to an embodiment of the present invention;

FIG. 2 is an enlarged schematic view of FIG. 1 at A;

fig. 3 is another view structural diagram of a heat dissipation base plate of a power module according to an embodiment of the present invention;

fig. 4 is a view of a heat dissipation base plate of a power module according to an embodiment of the present invention;

fig. 5 is a view-angle structure diagram of a heat dissipation bottom plate of a power module according to an embodiment of the present invention;

fig. 6 is a view structural diagram of a heat dissipation base plate of a power module according to another embodiment of the present invention;

FIG. 7 is an enlarged view of FIG. 6 at B;

fig. 8 is a view structural diagram of a heat dissipating base plate of a power module according to another embodiment of the present invention;

fig. 9 is an enlarged schematic view of fig. 8 at C.

10. A bottom plate body; 11. a boss; 12. welding parts; 13. an external part; 14. a wire slot; 15. a groove; 16. a heat-dissipating stud.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

Generally, a large amount of solder paste is printed when the copper clad ceramic plate and the heat dissipating copper base plate are soldered, and in the vacuum reflow soldering process, the melted solder paste flows under the impact of flux gas and the gravity of the copper clad ceramic plate. Partial solder paste melts outside the coverage area that flows to covering copper ceramic plate, causes the actual solder paste volume of connecting area to be less than the solder paste volume of prediction a lot, leads to having the cavity of great area in the welding layer, and the thickness value of actual welding layer also has certain difference with the thickness value of predetermineeing, very big influence the heat dissipation of chip and encapsulation module thermal management reliability, accelerated the power module and became invalid, shortened power module's life. In addition, the preprinted solder paste melts and flows during reflow soldering, and an irregular solder paste layer is formed around the copper-clad ceramic plate under the condition of serious flow. If the copper-clad ceramic plate is relatively close to the edge of the copper base plate, the molten solder paste flows to the edge of the copper base plate, which causes problems of unnecessary electrical connection, insufficient creepage distance value and the like.

Based on this, referring to fig. 1 to 5, fig. 1 shows that fig. 1 is the utility model discloses a power module's radiating bottom plate's of an embodiment one of them visual angle structure chart, fig. 2 shows fig. 1 at the enlarged structure schematic diagram of a department, fig. 3 shows the utility model discloses a power module's radiating bottom plate's of an embodiment another visual angle structure chart, fig. 4 shows the utility model discloses a power module's radiating bottom plate's of an embodiment another visual angle structure chart, fig. 5 shows the utility model discloses a power module's of an embodiment's another visual angle structure chart. An embodiment of the utility model provides a pair of power module's heat dissipation bottom plate, power module's heat dissipation bottom plate includes bottom plate body 10. The surface of the bottom plate body 10 is provided with a welding portion 12 for welding with a copper-clad ceramic plate (not shown) of the power module, and the surface of the bottom plate body 10 is further provided with a separation structure for separating solder paste at the welding portion 12 so that the solder paste is located at the welding portion 12.

The heat dissipation bottom plate of the power module is welded and assembled with the copper-clad ceramic plate, and the separation structure is arranged on the bottom plate body 10 and can separate solder paste at the welding position 12, so that the solder paste is prevented from being heated, melted and flowing to the area outside the welding position 12 in the welding process, and the solder paste can be guaranteed to be always positioned at the welding position 12 in the welding process. So, can guarantee to cover after copper ceramic plate and bottom plate body 10 adopt vacuum reflow soldering, cover the thickness value and the lower void ratio of copper ceramic plate and heat dissipation bottom plate welding layer to can improve the reliability and the heat-sinking capability of welding layer, can prolong power module's life greatly, can avoid causing unnecessary electrical connection and creepage distance value not enough, can also avoid covering drift and the skew of copper ceramic plate, in order to ensure welding position's accuracy.

Referring again to fig. 2, in one embodiment, the blocking structure is a boss 11 circumferentially disposed around the welding portion 12. Like this, boss 11 protrusion in the surface to bottom plate body 10, and the circumference of going around welding position 12 sets up, and boss 11 makes welding position 12 and welding position 12 on the surface of this body separate with each other hindering apart at position 13 beyond like this, can avoid the solder paste to flow to welding position 12 beyond position 13 for the solder paste is in welding position 12 all the time in welding process. It should be noted that the boss 11 is adapted to the shape of the welding portion 12, that is, the boss 11 is wound around the edge of the welding portion 12 for one circle, specifically for example: when the welding part 12 is square, the area formed by the boss 11 is correspondingly square; when the welding portion 12 has a circular shape, the area surrounded by the boss 11 has a circular shape. When the welding portion 12 may also be in other shapes, the area surrounded by the boss 11 may also be in other shapes, which is not described herein again, and may be set according to actual situations.

It should be further noted that, the height of the specific protrusion of the boss 11 on the surface of the heat dissipation base plate and the width of the boss 11 can be flexibly set, and the specific size and the specific shape of the boss 11 are not limited and described herein as long as the assembly connection of the copper-clad ceramic plate and the base plate body 10 is not affected.

It should be noted that, in the infringement comparison, the "boss 11" may be a "part of the soleplate body 10", that is, the "boss 11" and "the other part of the soleplate body 10" are integrally manufactured; or a separate member that can be separated from the other parts of the soleplate body 10, that is, the boss 11 can be manufactured separately and then combined with the other parts of the soleplate body 10 into a whole. As shown in fig. 3, in one embodiment, the "boss 11" is a part of the "bottom plate body 10" that is integrally formed.

Referring to fig. 6 and 7, fig. 6 illustrates a view structure diagram of a heat dissipation bottom plate of a power module according to another embodiment of the present invention, and fig. 7 illustrates an enlarged structure diagram of fig. 6 at B. In another embodiment, the blocking structure is a wire slot 14 disposed circumferentially around the weld site 12. In this way, the wire groove 14 is provided around the circumferential direction of the soldering portion 12, and the molten solder paste does not flow to the portion 13 other than the wire groove 14 due to the surface tension. Thus, the wire grooves 14 enable the welding positions 12 and the positions 13 except the welding positions 12 on the surface of the bottom body to be mutually isolated in a resistance mode, solder paste can be prevented from flowing to the positions 13 except the welding positions 12, and the solder paste is enabled to be always located at the welding positions 12 in the welding process.

Referring to fig. 6 and 7, further, the line grooves 14 are formed on the surface of the bottom plate body 10 by a laser scribing process, an etching process or milling by a milling cutter. It should be noted that the line grooves 14 may also be formed on the surface of the bottom plate body 10 by other methods, and are not limited to the laser scribing process, the etching process or the milling method.

It should also be noted that the wire groove 14 is adapted to the shape of the welding location 12, that is, the wire groove 14 is circumferentially wound by one turn along the edge of the welding location 12, specifically, for example: when the welding part 12 is square, the area formed by the wire casing 14 is correspondingly square; when the welding site 12 is circular, the area enclosed by the wire groove 14 is correspondingly circular. When the welding part 12 may also be in other shapes, the area formed by the enclosure of the wire casing 14 may also be in other shapes, which is not described herein again, and may be set according to actual situations.

It should be further noted that the depth of the wire chase 14 and the width of the wire chase 14 can be flexibly set, and the specific depth, the specific width and the specific shape are not limited or described herein as long as the assembly connection between the copper-clad ceramic plate and the bottom plate body 10 is not affected.

Referring to fig. 8 and 9, fig. 8 is a view structural diagram of a heat dissipation bottom plate of a power module according to another embodiment of the present invention, and fig. 9 is an enlarged structural diagram of fig. 8 at C. In another embodiment, the welding portion 12 is a groove 15 formed on the surface of the bottom plate body 10, and the blocking structure is a portion 13 outside the groove 15 on the bottom plate body 10. Thus, in the process of producing the bottom plate body 10, the groove 15 with a predetermined depth is correspondingly formed at the predetermined welding portion 12 of the bottom plate body 10. In the assembly process of welding the heat dissipation bottom plate and the copper-clad ceramic plate, solder paste is printed in the groove 15, or a soldering lug is placed in the groove 15, then the copper-clad ceramic plate is placed in a corresponding solder paste area or a soldering lug position, so that the molten solder paste or the soldering lug can be ensured to be located in the groove 15 in the reflow soldering process, and the molten solder paste or the soldering lug cannot flow to the part 13 outside the groove 15. In addition, particularly, the shape of recess 15 suits with the shape of covering the copper ceramic plate, and recess 15 plays the positioning action to covering the copper ceramic plate, can prevent to appear in the production operation process covering the copper ceramic plate and place the condition of dislocation, can improve production efficiency greatly.

Referring to fig. 8 and 9, further, the depth of the groove 15 is 0.1mm-0.4 mm. Therefore, the depth of the groove 15 is set properly, so that the soldering flux in the solder paste reflow soldering process can be smoothly volatilized, and the soldering quality is ensured.

Referring to fig. 1, fig. 6 or fig. 8, further, there are more than two welding portions 12, there are more than two barrier structures, and the two or more barrier structures are disposed in one-to-one correspondence with the two or more welding portions 12. Therefore, more than two copper-clad ceramic plates can be fixedly arranged on the heat dissipation bottom plate.

Specifically, when the blocking structure is the boss 11, more than two bosses 11 are arranged on the bottom plate body 10 at intervals; when the blocking structure is the wire casing 14, more than two wire casings 14 are arranged on the bottom plate body 10 at intervals.

In addition, when the welding portion 12 is the groove 15, and when the welding portion 12 is two or more, the portion 13 outside the groove 15 on the bottom plate body 10 should be understood as the blocking structure, that is, the two or more blocking structures are integrally connected to each other.

Of course, the number of the welding positions 12 may be only one, and accordingly, the number of the blocking structures is one, that is, one copper-clad ceramic plate is welded on the heat dissipation base plate. The specific number of the welding points 12 is determined by the number of the copper-clad ceramic plates, and is not limited herein.

Further, the heat dissipation bottom plate is a heat dissipation copper plate, a heat dissipation aluminum plate or an AlSiC plate. The AlSiC plate is aluminum silicon carbide, is short for aluminum-based silicon carbide particle reinforced composite materials and has good heat conductivity, good mechanical property and good processability. In addition, the heat dissipation bottom plate can also be a heat dissipation plate made of other materials, and is not limited herein and can be arranged as required.

Referring to fig. 4 and 5, further, a plurality of heat dissipation fins or heat dissipation columns 16 are disposed on a side of the heat dissipation base plate away from the copper-clad ceramic plate. Therefore, the power module has better heat dissipation performance, and the service life of the power module can be prolonged. Specifically, the heat-dissipating stud 16 is integrally formed with the heat-dissipating base plate. The integrated molding mode can be realized by adopting the processes of extrusion, casting, press fitting, injection molding, welding and the like. Of course, the fastening connection may also be made by bolts, screws, pins, rivets, fasteners, glue, etc., and is not limited herein.

Referring to fig. 1 to 3, in an embodiment, a power module includes a heat dissipation base plate of the power module, and a copper-clad ceramic plate welded and fixed to a welding portion 12.

The power module is in the process of welding and assembling the radiating bottom plate and the copper-clad ceramic plate, and the bottom plate body 10 is provided with the separation structure which can separate solder paste at the welding position 12, so that the solder paste is prevented from being heated, melted and flowing to the area outside the welding position 12 in the welding process, and the solder paste can be ensured to be always positioned at the welding position 12 in the welding process. So, can guarantee to cover after copper ceramic plate and bottom plate body 10 adopt vacuum reflow soldering, cover the thickness value and the lower void ratio of copper ceramic plate and heat dissipation bottom plate welding layer to can improve the reliability and the heat-sinking capability of welding layer, can prolong power module's life greatly, can avoid causing unnecessary electrical connection and creepage distance value not enough, can also avoid covering drift and the skew of copper ceramic plate, in order to ensure welding position's accuracy.

In one embodiment, the power module further includes a chip (not shown) and a housing (not shown). The chip is connected with the side surface of the copper-clad ceramic plate, which deviates from the heat dissipation bottom plate, in a welding mode through the solder paste. The shell cover is arranged on the radiating bottom plate and covers the chip and the copper-clad ceramic plate. The shell is provided with a through hole, and the pin of the chip penetrates through the through hole and extends out of the shell.

The power module may be, for example, an IGBT power module, an FRD power module, a MOSFET power module, etc., and is not limited herein. Among them, an Insulated Gate Bipolar Transistor (IGBT) is a composite fully-controlled voltage-driven power semiconductor device composed of a metal-oxide semiconductor field effect Transistor and a fast diode, combines the advantages of the MOSFET and the FRD, has the characteristics of high switching speed, high input impedance, short reverse recovery time, good thermal stability, reduced on-state voltage, high voltage, and the like, is widely applied to the fields of wind energy, solar energy, rail transit, electric vehicles, smart grids, household appliance frequency conversion, and the like, and has become the mainstream of power semiconductor devices. A Fast Recovery Diode (FRD) is a semiconductor Diode having characteristics of good switching characteristics and short reverse Recovery time, and is mainly applied to electronic circuits such as a switching power supply, a PWM pulse width modulator, a frequency converter, and the like, and used as a high-frequency rectifier Diode, a freewheeling Diode, or a damping Diode. A Metal-Oxide Semiconductor Field Effect Transistor (MOSFET) is a Field-Effect Transistor (Field-Effect Transistor) that can be widely used in analog circuits and digital circuits.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Claims

1. A heat sink base plate for a power module, the heat sink base plate comprising:

the base plate comprises a base plate body, wherein a welding part used for welding with a copper-clad ceramic plate of the power module is arranged on the surface of the base plate body, a separation structure is further arranged on the surface of the base plate body, and the separation structure is used for separating solder paste at the welding part so that the solder paste is located at the welding part.

2. The heat sink base plate of claim 1, wherein the barrier structure is a boss disposed circumferentially around the weld.

3. The heat sink base plate of claim 1, wherein the blocking structure is a wire groove disposed circumferentially around the weld.

4. The heat sink base plate of claim 3, wherein the wire grooves are formed in the surface of the base plate body by a laser scribing process, an etching process, or milling by a milling cutter.

5. The heat dissipating base plate of claim 1, wherein the welding portion is a groove formed on a plate surface of the base plate body, and the blocking structure is a portion of the base plate body other than the groove.

6. The heat sink base plate of claim 5, wherein the depth of the groove is 0.1mm to 0.4 mm.

7. The heat dissipation base plate of claim 1, wherein the number of the welding portions is two or more, the number of the barrier structures is two or more, and the two or more barrier structures are disposed in one-to-one correspondence with the two or more welding portions.

8. The heat dissipation base plate of the power module according to claim 1, wherein the heat dissipation base plate is a heat dissipation copper plate, a heat dissipation aluminum plate, or an AlSiC plate; and a plurality of cooling water pipes, cooling fins or cooling columns are arranged on the side surface of the heat dissipation bottom plate, which is far away from the copper-clad ceramic plate.

9. A power module, characterized in that the power module comprises the heat dissipation base plate of the power module according to any one of claims 1 to 8, and further comprises a copper-clad ceramic plate, and the copper-clad ceramic plate is welded and fixed to the welding position.

10. The power module of claim 9, further comprising a chip and a housing, wherein the chip is connected with the side of the copper-clad ceramic plate away from the heat dissipation base plate by soldering paste; the shell is covered on the heat dissipation bottom plate and covers the chip and the copper-clad ceramic plate; the shell is provided with a through hole, and the pin of the chip penetrates through the through hole and extends out of the shell.