CN214176009U - Semiconductor device heat dissipation packaging structure - Google Patents
Semiconductor device heat dissipation packaging structure Download PDFInfo
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- CN214176009U CN214176009U CN202022600701.2U CN202022600701U CN214176009U CN 214176009 U CN214176009 U CN 214176009U CN 202022600701 U CN202022600701 U CN 202022600701U CN 214176009 U CN214176009 U CN 214176009U
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- heat dissipation
- semiconductor device
- bottom plate
- cooling liquid
- package structure
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Abstract
The utility model relates to a semiconductor device heat dissipation packaging structure, include: the cooling device comprises a heat dissipation shell, a cooling liquid inlet and a cooling liquid outlet are formed in the heat dissipation shell; a bottom plate connected with the heat dissipation housing to seal the heat dissipation housing, the bottom plate simultaneously serving as a substrate of a semiconductor device; the bottom plate is provided with grooves connected with the cooling liquid inlet and the cooling liquid outlet, and the grooves are arranged in a circuitous shape. The utility model discloses a semiconductor device heat dissipation packaging structure forms as an organic whole with semiconductor device, and the structure is very compact, and the thermal resistance that low coefficient of heat conductivity silica gel produced has been avoided to the form of integrative encapsulation, has improved semiconductor device's radiating effect greatly.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor, concretely relates to semiconductor device heat dissipation packaging structure.
Background
The heat generated by semiconductor devices during operation limits device performance and reliability, and heat dissipation is one of the major tasks in semiconductor device production and application. The use performance of most semiconductor devices including IGBT modules can be affected by overhigh temperature, even irreversible damage to power devices can be caused, and the normal use of the devices can be affected. The 10 ℃ rule shows that when the device temperature is reduced by 10 ℃, the reliability of the device will be doubled. Therefore, how to dissipate heat of a semiconductor device has become a hot spot of research in various countries from the viewpoint of improving reliability of use of the semiconductor device.
The conventional heat dissipation measures are to mount the device on a heat sink with a large heat dissipation area, or to air-cool or water-cool the heat sink at the same time. According to the traditional water-cooling radiator, the water-cooling panel wall of the water-cooling cavity is connected with the power device substrate through the heat-conducting silicone grease, and the heat-conducting silicone grease is low in heat conductivity coefficient and easy to generate bubbles and the like during smearing, so that high thermal resistance is formed, local temperature is extremely easy to be too high, and the overall radiating effect of a power element is poor. In addition, in the conventional water-cooled radiator, the polygonal columnar radiating fins form radiating channels, so that the defects that water circulation is not uniform, the radiating fins are easily blocked by ditches, cleaning is difficult and the like exist.
SUMMERY OF THE UTILITY MODEL
In order to solve the above-mentioned problem that exists among the prior art, the utility model provides a semiconductor device heat dissipation packaging structure. The to-be-solved technical problem of the utility model is realized through following technical scheme:
the utility model provides a semiconductor device heat dissipation packaging structure, include:
the cooling device comprises a heat dissipation shell, a cooling liquid inlet and a cooling liquid outlet are formed in the heat dissipation shell;
a bottom plate connected with the heat dissipation housing to seal the heat dissipation housing, the bottom plate simultaneously serving as a substrate of a semiconductor device;
the bottom plate is provided with grooves connected with the cooling liquid inlet and the cooling liquid outlet, and the grooves are arranged in a circuitous shape.
In an embodiment of the present invention, the inner wall of the groove is smooth, and the turning point is in smooth transition.
In an embodiment of the present invention, a vacuum cavity is disposed inside the bottom plate, and a liquid phase change medium is filled inside the vacuum cavity.
In an embodiment of the present invention, a plurality of capillary structures are uniformly distributed on a surface of the vacuum chamber close to the semiconductor device.
In one embodiment of the present invention, the cross-sectional shape of the capillary structure is triangular, trapezoidal or rectangular.
In an embodiment of the present invention, the bottom plate is made of AlSiC.
The utility model discloses an in one embodiment, the edge of heat dissipation casing sets up sealed recess, set up the sealing washer in the sealed recess, the edge of bottom plate with in the sealed recess the sealing washer press fit is in order to realize sealed fixed.
Compared with the prior art, the beneficial effects of the utility model reside in that:
1. the utility model discloses a semiconductor device heat dissipation packaging structure has the heat dissipation casing of splendid attire coolant liquid, is provided with the slot with coolant liquid import and exit linkage on the bottom plate of heat dissipation casing, simultaneously, and the opposite side of bottom plate becomes semiconductor device's base plate, promptly, the utility model discloses well heat dissipation packaging structure and semiconductor device form as an organic whole, and the structure is very compact, and the thermal resistance that low coefficient of thermal conductivity silica gel produced has been avoided to the form of integrative encapsulation, has improved semiconductor device's radiating effect greatly.
2. The utility model discloses a semiconductor device heat dissipation packaging structure, the slot that sets up on the bottom plate with coolant liquid import and exit linkage is circuitous shape and arranges, can guarantee that coolant liquid and bottom plate have sufficient area of contact heat dissipation for whole heat dissipation area evenly dispels the heat.
3. The utility model discloses a semiconductor device heat dissipation packaging structure, the inside of bottom plate sets up the vacuum cavity, liquid phase change medium is equipped with to the inside of vacuum cavity, can conduct the great calorific capacity of core in the semiconductor device to the base plate (the bottom plate of the casing that dispels the heat promptly) through evaporation and condensation process fast, in addition, be provided with a plurality of evenly distributed's capillary structure on the face of being close to the semiconductor device in the vacuum cavity, so that liquid phase change medium evenly distributed, be favorable to with the heat that comes from the semiconductor device in the coolant liquid of the casing that dispels the heat fast transfer income, further improve radiating efficiency and effect.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented according to the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more obvious and understandable, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Drawings
Fig. 1 is a schematic diagram of a heat dissipation package structure of a semiconductor device according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a groove according to an embodiment of the present invention;
fig. 3 is a schematic diagram of another heat dissipation package structure for a semiconductor device according to an embodiment of the present invention.
Detailed Description
In order to further explain the technical means and effects of the present invention adopted to achieve the objectives of the present invention, the following detailed description will be made in conjunction with the accompanying drawings and the detailed description of the preferred embodiments of the present invention.
The foregoing and other technical matters, features and effects of the present invention will be apparent from the following detailed description of the embodiments, which is to be read in connection with the accompanying drawings. The technical means and effects of the present invention to achieve the predetermined objects can be more deeply and specifically understood through the description of the specific embodiments, however, the attached drawings are only for reference and description and are not intended to limit the technical solution of the present invention.
Example one
Referring to fig. 1 and fig. 2 in combination, fig. 1 is a schematic view of a heat dissipation package structure of a semiconductor device according to an embodiment of the present invention, and fig. 2 is a schematic view of a structure of a trench according to an embodiment of the present invention. As shown in the figure, the heat dissipation package structure of the semiconductor device of the present embodiment includes: the cooling device comprises a heat dissipation shell 1 and a bottom plate 2, wherein a cooling liquid inlet 101 and a cooling liquid outlet 102 are formed in the heat dissipation shell 1; the base plate 2 is connected with the heat dissipation housing 1 to seal the heat dissipation housing 1, and the base plate 2 is used as a substrate of the semiconductor device 4; the bottom plate 2 is provided with grooves 201 connected with the cooling liquid inlet 101 and the cooling liquid outlet 102, and the grooves 201 are arranged in a winding shape.
In the present embodiment, the semiconductor device 4 is bonded to the base plate 2 of the present embodiment by a heat-dissipating adhesive.
Specifically, heat dissipation casing 1 is an open slot by roof and two lateral walls integrated into one piece, and the edge of open slot sets up sealed recess (not shown in the figure), set up the sealing washer in the sealed recess, the edge of bottom plate 2 and the sealing washer press fit in the sealed recess in order to realize bottom plate 2 and heat dissipation casing 1 sealed fixed, and then form the cavity that is used for the splendid attire coolant liquid. Wherein, all seted up the window on two lateral walls to as coolant liquid import 101 and coolant liquid export 102 respectively, the coolant liquid leads into the cavity of heat dissipation casing 1 through coolant liquid import 101 in, leads out the cavity of heat dissipation casing 1 through coolant liquid export 102 after the use is accomplished.
In the present embodiment, the middle of the trench 201 has no branch and is a single tube type, and the inner wall thereof is smooth, and the turning point is smooth transition, so as to reduce the flow resistance and avoid scaling.
In the present embodiment, the base plate 2 is made of AlSiC.
The semiconductor device heat dissipation packaging structure of the embodiment has the heat dissipation shell 1 for containing the cooling liquid, the groove 201 connected with the cooling liquid inlet 101 and the cooling liquid outlet 102 is arranged on the bottom plate 2 of the heat dissipation shell 1, and meanwhile, the other side of the bottom plate 2 becomes the substrate of the semiconductor device 4, namely, the heat dissipation packaging structure and the semiconductor device 4 are integrated into a whole in the embodiment, the structure is very compact, the heat resistance generated by the silica gel with low thermal conductivity is avoided by the integrated packaging mode, and the heat dissipation effect of the semiconductor device 4 is greatly improved.
Further, in the heat dissipation package structure of the semiconductor device of this embodiment, the grooves 201 connected to the cooling liquid inlet 101 and the cooling liquid outlet 102 are arranged on the bottom plate 2 in a winding shape, so that the cooling liquid and the bottom plate can have sufficient contact area for heat dissipation, and the whole heat dissipation area can dissipate heat uniformly.
Further, referring to fig. 3, fig. 3 is a schematic view of another heat dissipation package structure of a semiconductor device according to an embodiment of the present invention. As shown in the figure, compared with the above embodiments, in the heat dissipation package structure of the semiconductor device of this embodiment, the vacuum cavity 3 is disposed inside the bottom plate 2, and the liquid phase change medium 301 is filled inside the vacuum cavity 3. In the present embodiment, the liquid phase change medium 301 is a new fluorocarbon. A plurality of capillary structures, i.e., grooves (not shown) are uniformly distributed on the surface of the vacuum chamber 3 close to the semiconductor device 4, so as to uniformly distribute the liquid phase-change medium 301. Optionally, the cross-sectional shape of the capillary structure is triangular, trapezoidal or rectangular. The rest of the structure is the same as the above embodiment, and is not described again.
When the semiconductor device 4 works, heat is finally conducted to the bottom plate 2 serving as a substrate, a plurality of capillary structures which are convenient for the phase change medium 132 to be uniformly distributed are formed on the surface, close to the heat transmission direction of the semiconductor device 4, of the vacuum cavity 3, so that the liquid phase change medium 301 can be uniformly distributed on the surface, close to the heat transmission direction of the semiconductor device 4, the situation that the temperature of the liquid phase change medium 301 is sharply increased when the semiconductor device 4 is placed in a non-horizontal mode or does not move stably is avoided, the evaporation process of the liquid phase change medium 301 is ensured to be smoothly carried out, heat is uniformly transmitted, and therefore the heat from the semiconductor device 4 is favorably and rapidly transmitted into the heat dissipation shell 1, and the heat dissipation efficiency and the heat dissipation effect are further improved.
Meanwhile, the heat of the temperature extreme point is more easily and rapidly conducted out, and the high heat flow density of the vacuum cavity 3 enables the volume of the heat dissipation device to be smaller, and the weight is effectively reduced.
The semiconductor device heat dissipation packaging structure of this embodiment, bottom plate 2's inside sets up vacuum cavity 3, liquid phase change medium 301 is equipped with to vacuum cavity 3's inside, can conduct the great calorific capacity of core to the base plate (being the bottom plate 2 of heat dissipation casing 1) through evaporation and condensation process fast in the semiconductor device 4, in addition, be provided with a plurality of evenly distributed's capillary structure on the face of being close to semiconductor device 4 in the vacuum cavity 3, so that liquid phase change medium 301 evenly distributed, be favorable to with coming from in the heat fast transfer who dispels the heat of semiconductor device 4 gets into in the coolant liquid of heat dissipation casing 1, further improve radiating efficiency and effect.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or device that comprises a list of elements does not include only those elements but may include other elements not expressly listed. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of additional like elements in the article or device comprising the element. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The directional or positional relationships indicated by "upper", "lower", "left", "right", etc. are based on the directional or positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
The foregoing is a more detailed description of the present invention, taken in conjunction with the specific preferred embodiments thereof, and it is not intended that the invention be limited to the specific embodiments shown and described. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.
Claims (7)
1. A heat dissipation package structure of a semiconductor device, comprising:
the cooling device comprises a heat dissipation shell (1), wherein a cooling liquid inlet (101) and a cooling liquid outlet (102) are formed in the heat dissipation shell (1);
a bottom plate (2) connected to the heat dissipation case (1) to seal the heat dissipation case (1), the bottom plate (2) simultaneously serving as a substrate of a semiconductor device;
the bottom plate (2) is provided with grooves (201) connected with the cooling liquid inlet (101) and the cooling liquid outlet (102), and the grooves (201) are arranged in a winding manner.
2. The heat dissipation package structure of claim 1, wherein the inner wall of the trench (201) is smooth, and the turn is rounded.
3. The heat dissipation package structure of a semiconductor device as claimed in claim 1, wherein a vacuum cavity (3) is disposed inside the bottom plate (2), and a liquid phase change medium (301) is filled inside the vacuum cavity (3).
4. The heat dissipation package structure of a semiconductor device as claimed in claim 3, wherein a plurality of capillary structures are uniformly distributed on the surface of the vacuum chamber (3) close to the semiconductor device.
5. The heat dissipation package structure of claim 4, wherein the capillary structure has a triangular, trapezoidal or rectangular cross-sectional shape.
6. The heat dissipation package structure of semiconductor device as claimed in claim 1, wherein the base plate (2) is made of AlSiC.
7. The heat dissipation package structure of semiconductor device as claimed in claim 1, wherein a sealing groove is formed at an edge of the heat dissipation housing (1), a sealing ring is disposed in the sealing groove, and an edge of the bottom plate (2) is press-fitted with the sealing ring in the sealing groove to achieve sealing fixation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022600701.2U CN214176009U (en) | 2020-11-11 | 2020-11-11 | Semiconductor device heat dissipation packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022600701.2U CN214176009U (en) | 2020-11-11 | 2020-11-11 | Semiconductor device heat dissipation packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214176009U true CN214176009U (en) | 2021-09-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022600701.2U Active CN214176009U (en) | 2020-11-11 | 2020-11-11 | Semiconductor device heat dissipation packaging structure |
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| CN (1) | CN214176009U (en) |
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- 2020-11-11 CN CN202022600701.2U patent/CN214176009U/en active Active
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