CN214173290U - Ultrasonic-based veneer thickness measuring system - Google Patents
Ultrasonic-based veneer thickness measuring system Download PDFInfo
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- CN214173290U CN214173290U CN202120144399.6U CN202120144399U CN214173290U CN 214173290 U CN214173290 U CN 214173290U CN 202120144399 U CN202120144399 U CN 202120144399U CN 214173290 U CN214173290 U CN 214173290U
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Abstract
The utility model discloses a veneer thickness measuring system based on ultrasonic wave, which comprises a transmitting circuit, an ultrasonic probe I, an ultrasonic probe II, a receiving circuit, a signal processing circuit, an MCU control circuit, an LCD display circuit, a work indicating circuit and an alarm circuit; the transmitting circuit comprises a switch control circuit, the receiving circuit comprises a preprocessing circuit and a secondary proportional amplifying circuit, and the signal processing circuit comprises a full-wave rectifying circuit, an envelope detecting circuit and an over-peak judging circuit; the ultrasonic probe II, the pre-processing circuit, the secondary proportional amplification circuit, the full-wave rectification circuit, the envelope detection circuit, the over-peak judgment circuit and the MCU control circuit are connected in sequence. The utility model has simple and reliable circuit, and can quickly obtain the thickness information of the single plate by analyzing and processing the ultrasonic signal; the ultrasonic thickness measurement technology is used for replacing the traditional manual thickness measurement, and the production efficiency of the veneer is favorably improved.
Description
Technical Field
The utility model relates to an supersound thickness measurement technical field, concretely relates to veneer thickness measurement system based on ultrasonic wave.
Background
With the rapid development of economy, the development trend of furniture manufacturing is leaping forward. The demand for wood in the industrial production of furniture manufacture is increasing. Wooden floors, tables, chairs and other furniture become essential for interior decoration, and the manufacture of the wooden furniture is not separated from artificial boards. Naturally, the demand for the production of artificial boards is also increasing. Artificial boards are often made from veneers that are glued together.
Veneers are also known as veneers or veneers. The method is mainly used for producing various artificial wood board materials such as plywood, core-board boards or templates. The production of veneers requires a lot of labour. As a result, such products are produced more in developing countries. China is the country with the largest single board yield. The near-Yiyi has become the world's largest single-board trading place. In China, the luckiness wood industry in the near-Yitian is the most famous single-board enterprise, and the production advantages of large scale, high yield and stable quality are the production advantages.
The single board has two production modes of rotary cutting and slicing, and most of the single boards for the artificial board are formed by rotary cutting. The regions of Babuya New Guinea, Africa and the like in southeast Asia are the main importation places of the raw wood produced by veneers in China. The main varieties of the raw wood include flos Osmanthi Fragrantis, flos persicae (also called Oregaman), fructus Canarii albi, brass, Terminalia catappa, bonbonbon, Ruta graveolens, Liu' an, Dabai wood, Jun cypress, Dilunula with a size of 270mm × 2500mm, Cryptomeria japonica, birch, pine, etc.
The thickness of the wrapper is very varied. The wood skin in southeast Asia and other countries is generally thicker because the industrial technology is poor and the wood skin cannot be peeled off too thin. In China, veneer manufacturers can even spin-cut veneers as thin as white writing paper, and the thickness of the veneers can be from 0.10mm to 1 mm. The thinner single board can reduce the production cost of the single board and the cost of buyers.
The requirements of buyers in different regions for the quality of the dough sheet are also different. Since veneers are a more primitive, natural product, no more uniform national standard has been formed in the market yet. So that the grade standards of different manufacturers in a region are different. Generally, the grades of the single boards are mainly divided into the following grades: a, B, C, A, B, D, dry scar, A, B. In the production process of plywood and core-board, manufacturers often use the second and third surfaces as the surfaces of the boards and use other types of veneers as the bottom surfaces of the multi-layer boards. The quality of the single plates is very different, and the price is different. Moreover, the price between two adjacent plants also varies greatly.
With the continuous improvement of the production technology level of the artificial board, the production process gradually realizes automation, and the requirement on the detection of the thickness of the veneer is also continuously improved. The thickness of the single plate is one of the important technical indexes for measuring the quality of the single plate. In the rotary cutting production process of wood, the thickness information of the produced single boards needs to be mastered in time so as to judge whether the production requirements are met. Only by rapidly acquiring the thickness information of the veneer can the production of the veneer meet the requirements.
In order to meet the requirements of modern industrial production, the traditional manual measurement method is inevitably replaced due to low efficiency. By utilizing modern technology, the system capable of measuring the thickness of the veneer on line is designed to have research significance.
Disclosure of Invention
The utility model aims to solve the technical problem that the ultrasonic wave-based single plate thickness measuring system is provided aiming at the defects of the prior art, the whole circuit is simple and reliable, and the thickness information of the single plate can be quickly obtained by analyzing and processing the ultrasonic wave signals; the ultrasonic thickness measurement technology is used for replacing the traditional manual thickness measurement, and the production efficiency of the veneer is favorably improved.
In order to realize the technical purpose, the utility model discloses the technical scheme who takes does:
a single-plate thickness measuring system based on ultrasonic waves comprises a transmitting circuit, a first ultrasonic probe LS1, a second ultrasonic probe LS2, a receiving circuit, a signal processing circuit, an MCU control circuit, an LCD display circuit, a work indicating circuit and an alarm circuit;
the transmitting circuit comprises a switch control circuit, the receiving circuit comprises a pre-processing circuit and a secondary proportional amplifying circuit, and the signal processing circuit comprises a full-wave rectifying circuit, an envelope detection circuit and an over-peak judging circuit;
the ultrasonic monitoring system is characterized in that the MCU control circuit is connected with the switch control circuit, the switch control circuit is connected with the first ultrasonic probe LS1, the second ultrasonic probe LS2 is connected with the preprocessing circuit, the preprocessing circuit is connected with the second-stage proportional amplifying circuit, the second-stage proportional amplifying circuit is connected with the full-wave rectifying circuit, the full-wave rectifying circuit is connected with the envelope detection circuit, the envelope detection circuit is connected with the peak crossing judging circuit, the peak crossing judging circuit is connected with the MCU control circuit, and the MCU control circuit is simultaneously connected with the LCD display circuit, the work indicating circuit and the alarm circuit.
As a further improved technical solution of the present invention, the switch control circuit includes a NOT gate chip 74HC04, a driving chip MC34151P, a MOS transistor Q1, a resistor R1 and a resistor R2, the pin 14 of the NOT gate chip 74HC04 is connected with a +5V power supply, the pin 1 of the NOT gate chip 74HC04 is connected with an MCU control circuit, pin 2 of the not chip 74HC04 is connected to pin 2 of the driving chip MC34151P, pin 7 of the not chip 74HC04 is connected to pin 3 of the driving chip MC34151P, pin 3 of the driving chip MC34151P is connected with a ground wire, pin 6 of the driving chip MC34151P is connected with a +12V power supply, the pin 7 of the driving chip MC34151P is connected to the gate of the MOS transistor Q1 through a resistor R2, the source electrode of the MOS tube Q1 is connected with a ground wire, the drain electrode of the MOS tube Q1 is connected with a +30V power supply through a resistor R1, and a first ultrasonic probe LS1 is connected between the drain electrode and the source electrode of the MOS tube Q1; the MOS transistor Q1 adopts an MOS transistor IRF 840.
As a further improved technical solution of the present invention, the preprocessing circuit includes a resistor R3, a resistor R4, a capacitor C1, a diode D1, and a diode D2, one end of the resistor R3 is connected to one end of the ultrasonic probe two LS2, the other end of the resistor R3 is connected to one end of the capacitor C1, the other end of the ultrasonic probe two LS2 is connected to the ground, the other end of the capacitor C1, the negative electrode of the diode D1, the positive electrode of the diode D2, and one end of the resistor R4 are all connected to the second-stage proportional amplifier circuit, and the positive electrode of the diode D1, the negative electrode of the diode D2, and the other end of the resistor R4 are all connected to the ground.
As a further improved technical solution of the present invention, the two-stage proportional amplifying circuit includes a chip TL082, a resistor R5, a resistor R6, a sliding resistor R7, a sliding resistor R8, a resistor R9, a resistor R10, a capacitor C2 and a capacitor C3, one end of the resistor R6 is connected to one end of a resistor R4 in the pre-processing circuit, the other end of the resistor R6 is connected to a pin 3 of the chip TL082, the pin 1 of the chip TL082 is connected to a pin 5 of the chip TL082 through a resistor R10, the pin 1 of the chip TL082 is connected to a sliding end of a sliding resistor R7, the pin 2 of the chip TL082 is connected to one end of a resistor R5 and one end of a sliding resistor R7, the other end of the sliding resistor R8 is connected to a ground, the other end of the resistor R5 is connected to a ground through a capacitor C2, the pin 4 of the chip TL082 is connected to a-12V power supply, the pin 6 of the chip TL082 is connected to one end of the resistor R8 and one end of the sliding resistor R8, the other end of the resistor R9 is connected with the ground wire through a capacitor C3, the other end of the slide resistor R8 is connected with the ground wire, a pin 7 of the chip TL082 is simultaneously connected with the slide end of the slide resistor R8 and the full-wave rectification circuit, and a pin 8 of the chip TL082 is connected with a 12V power supply.
As a further improvement of the present invention, the full-wave rectification circuit comprises OP37 operational amplifier chip U4, OP37 operational amplifier chip U5, resistor R11 to resistor R17, diode D3 and diode D4, wherein one end of resistor R16 and one end of resistor R11 are connected to pin 7 of chip TL082 in the two-stage proportional amplifier circuit, the other end of resistor R16 is connected to one end of resistor R12, the cathode of diode D4 and pin 2 of OP37 operational amplifier chip U4, pin 3 of OP37 operational amplifier chip U4 is connected to ground through resistor R17, pin 4 of OP37 operational amplifier chip U4 is connected to 12V power supply, pin 6 of OP37 operational amplifier chip U4 is connected to the anode of diode D4 and the cathode of diode D3, the other end of resistor R12 is connected to the anode of diode D3 and one end of resistor R13, the other end of the resistor R13 is connected with the other end of the resistor R11, one end of the resistor R14 and a pin 2 of an OP37 operational amplifier chip U5, a pin 3 of the OP37 operational amplifier chip U5 is connected with the ground through a resistor R15, a pin 4 of the OP37 operational amplifier chip U5 is connected with a-12V power supply, a pin 7 of the OP37 operational amplifier chip U5 is connected with a +12V power supply, the other end of the resistor R14 is connected with a pin 6 of the OP37 operational amplifier chip U5, and a pin 6 of the OP37 operational amplifier chip U5 is connected with an envelope detection circuit.
As a further improved technical solution of the present invention, the envelope detection circuit includes a resistor R18, a resistor R19, a capacitor C4 and a capacitor C5, one end of the resistor R18 is connected to the pin 6 of the OP37 operational amplifier chip U5 in the full-wave rectification circuit, the other end of the resistor R18 is connected to one end of the capacitor C4 and one end of the resistor R19, the other end of the resistor R19 is connected to one end of the capacitor C5 and the peak-crossing determination circuit, and the other end of the capacitor C4 and the other end of the capacitor C5 are both connected to the ground.
As a further improved technical solution of the present invention, the over-peak determining circuit includes an operational amplifier chip OP07, a resistor R20 to a resistor R29, a resistor C6 to a capacitor C10, a diode D5 and a voltage comparison chip LM393, wherein one end of the resistor R21 is connected to one end of a resistor R19 in the envelope detection circuit, the other end of the resistor R21 is connected to one end of a capacitor C9, the other end of the capacitor C9 is connected to one end of a capacitor C6, one end of the resistor R20 and a pin 2 of the operational amplifier chip OP07, a pin 3 of the operational amplifier chip OP07 is connected to a ground through a resistor R22, a pin 4 of the operational amplifier chip OP07 is connected to a-12V power supply and the pin 4 is connected to a ground through a capacitor C8, a pin 7 of the operational amplifier chip OP07 is connected to a 12V power supply and the pin 7 is connected to a ground through a capacitor C7, and the other end of the pin 6 of the operational amplifier chip OP07 is connected to the other end of the capacitor C6, The other end of the resistor R20 is connected with one end of the resistor R23, the other end of the resistor R23 is simultaneously connected with the anode of the diode D5 and one end of the resistor R24, the other end of the resistor R24 is connected with one end of the resistor R27 and the pin 3 of the voltage comparison chip LM393 at the same time, the pin 4 of the voltage comparison chip LM393 is connected with the ground wire, the pin 2 of the voltage comparison chip LM393 is simultaneously connected with one end of the resistor R28, one end of the resistor R25 and one end of the resistor R26, the other end of the resistor R26 is simultaneously connected with the other end of the resistor R27 and a +5V power supply, pin 8 of the voltage comparison chip LM393 is connected to a +5V power supply and this pin 8 is connected to ground through a capacitor C10, the pin 1 of the voltage comparison chip LM393 is connected to both the other end of the resistor R28 and one end of the resistor R29, the other end of the resistor R29 is connected with a +5V power supply, and a pin 1 of the voltage comparison chip LM393 is connected with the MCU control circuit.
As a further improved technical proposal of the utility model, the MCU control circuit comprises a singlechip STC12C5A60S2, the pin 9 of the single chip microcomputer STC12C5A60S2 is simultaneously connected with one end of a resistor R31 and one end of a capacitor C13, the other end of the capacitor C13 is connected with a +5V power supply, the other end of the resistor R31 is connected with a ground wire, the pin 18 of the single chip microcomputer STC12C5A60S2 is simultaneously connected with one end of a crystal oscillator Y1 and one end of a capacitor C14, the pin 19 of the single chip microcomputer STC12C5A60S2 is simultaneously connected with the other end of the crystal oscillator Y1 and one end of the capacitor C15, the other end of the capacitor C14 and the other end of the capacitor C15 are both connected with a ground wire, the pin 20 of the single-chip STC12C5A60S2 is connected with a ground wire, the pin 40 of the single-chip STC12C5A60S2 is connected with a +5V power supply, pin 1 of the single chip microcomputer STC12C5A60S2 is connected with pin 1 of a NOT gate chip 74HC04 in the switch control circuit, and a pin 12 of the singlechip STC12C5A60S2 is connected with a pin 1 of a voltage comparison chip LM393 in the over-peak judging circuit.
As a further improved technical solution of the present invention, the LCD display circuit includes a display LCD1602, pin 1 of the display LCD1602 is connected to the ground, pin 2 is connected to one end of a capacitor C11, one end of a sliding resistor R30 and +5V power supply, the other end of the capacitor C11 and the other end of the sliding resistor R30 are both connected to the ground, pin 3 of the display LCD1602 is connected to the sliding end of a sliding resistor R30, pin 4 of the display LCD1602 is connected to pin 27 of a single-chip microcomputer STC12C5A60S2, pin 5 of the display LCD1602 is connected to pin 26 of a single-chip microcomputer STC12C5A60S2, pin 6 of the display LCD1602 is connected to pin 28 of a single-chip microcomputer STC12C5A60S2, pin 7 of the display LCD1602 is connected to pin 39 of an STC 12A 60S2 and pin 7 of the single-chip microcomputer STC12C5A60S2 is connected to the +5V power supply through an exclusion RP1, pin 8 of the display LCD1602 and pin 5A 5S 4838 is connected to the single-chip microcomputer STC12C 5S 4838 and +5V power supply through pin 1, pin 9 of the display screen LCD1602 is connected with pin 37 of the singlechip STC12C5A60S2, pin 9 is connected with a +5V power supply through an exclusion RP1, pin 10 of the display screen LCD1602 is connected with pin 36 of the singlechip STC12C5A60S2, pin 10 is connected with a +5V power supply through an exclusion RP1, pin 11 of the display screen LCD1602 is connected with pin 35 of the singlechip STC12C5A60S2, pin 11 is connected with a +5V power supply through an exclusion RP1, pin 12 of the display screen LCD1602 is connected with pin 34 of the singlechip STC12C5A60S2, pin 12 is connected with a +5V power supply through an exclusion RP1, pin 13 of the display screen LCD1602 is connected with pin 33 of the singlechip STC 12A 60S2, pin 13 is connected with a +5V power supply through an exclusion RP1, pin 14 of the display screen LCD1602 is connected with pin 32 of the singlechip STC12C5A60S 4, pin 14 is connected with pin 3614 of the singlechip STC 5A60S 1602, pin 3614 is connected with a +5V power supply through a +5V power supply 3615, and pin 3615 is connected with a display screen LCD 3615, pin 16 of the display screen LCD1602 is connected to ground.
As a further improved technical solution of the present invention, the working indication circuit includes a light emitting diode D6, the anode of the light emitting diode D6 is connected to the pin 21 of the single chip microcomputer STC12C5a60S2, and the cathode of the light emitting diode D6 is connected to the ground; the alarm circuit comprises a resistor R32, a resistor R33, a triode Q2 and a buzzer BZ1, one end of the resistor R32 is connected with a pin 22 of a single-chip microcomputer STC12C5A60S2, the other end of the resistor R32 is connected with a base electrode of the triode Q2, a collector electrode of the triode Q2 is connected with a +5V power supply, an emitter electrode of the triode Q2 is connected with one end of the buzzer BZ1, and the other end of the buzzer BZ1 is connected with a ground wire through the resistor R33.
The utility model has the advantages that:
the utility model discloses a transmitting circuit stimulates ultrasonic probe LS1 transmission ultrasonic wave, transmission veneer. The ultrasonic wave is received by another ultrasonic probe II LS2, and the ultrasonic wave signal is denoised and amplified through a receiving circuit so as to be processed by a subsequent circuit. The signal processing circuit processes the ultrasonic signals and is matched with a single chip microcomputer chip in the MCU control circuit to obtain the transmission time of the ultrasonic waves. The singlechip chip converts the transmission time of the ultrasonic waves into thickness information of the singlechip and displays the thickness information through the LCD display circuit. The whole circuit is simple and reliable, and the thickness information of the single plate can be quickly obtained by analyzing and processing the ultrasonic signals; the ultrasonic thickness measurement technology is used for replacing the traditional manual thickness measurement, and the production efficiency of the veneer is favorably improved. And simultaneously, the utility model discloses still have work instruction and alarming function.
Drawings
Fig. 1 is a diagram of the whole circuit framework of the present invention.
Fig. 2 is a schematic diagram of the switch control circuit of the present invention.
Fig. 3 is a schematic diagram of the pre-processing circuit of the present invention.
Fig. 4 is a schematic diagram of the second-stage proportional amplification circuit of the present invention.
Fig. 5 is a schematic diagram of the principle of the full-wave rectification circuit of the present invention.
Fig. 6 is a schematic diagram of the envelope detection circuit of the present invention.
Fig. 7 is a schematic diagram of the peak-crossing determining circuit of the present invention.
Fig. 8 is the schematic diagram of the principle of the MCU control circuit, the LCD display circuit and the work indication circuit of the present invention.
Fig. 9 is a schematic diagram of the alarm circuit of the present invention.
Detailed Description
The following further description of embodiments of the invention is made with reference to the accompanying drawings:
as shown in fig. 1, a single-plate thickness measuring system based on ultrasonic waves comprises a transmitting circuit, a first ultrasonic probe LS1, a second ultrasonic probe LS2, a receiving circuit, a signal processing circuit, an MCU control circuit, an LCD display circuit, a work indication circuit and an alarm circuit.
The transmitting circuit comprises a switch control circuit, the receiving circuit comprises a pre-processing circuit and a secondary proportional amplifying circuit, and the signal processing circuit comprises a full-wave rectifying circuit, an envelope detecting circuit and an over-peak judging circuit.
The ultrasonic monitoring system is characterized in that the MCU control circuit is connected with the switch control circuit, the switch control circuit is connected with the first ultrasonic probe LS1, the second ultrasonic probe LS2 is connected with the preprocessing circuit, the preprocessing circuit is connected with the second-stage proportional amplifying circuit, the second-stage proportional amplifying circuit is connected with the full-wave rectifying circuit, the full-wave rectifying circuit is connected with the envelope detection circuit, the envelope detection circuit is connected with the peak crossing judging circuit, the peak crossing judging circuit is connected with the MCU control circuit, and the MCU control circuit is simultaneously connected with the LCD display circuit, the work indicating circuit and the alarm circuit.
In the embodiment, the transmitting circuit excites an ultrasonic probe LS1 to transmit ultrasonic waves, and the ultrasonic waves are transmitted through the single plate. The ultrasonic wave is received by another ultrasonic probe II LS2, and the ultrasonic wave signal is denoised and amplified through a receiving circuit so as to be processed by a subsequent circuit. The signal processing circuit processes the ultrasonic signals and acquires the transmission time of the ultrasonic waves by matching with the single chip microcomputer chip. The singlechip chip converts the transmission time of the ultrasonic waves into thickness information of the singlechip, and the thickness information is displayed through an LCD screen.
Ultrasonic probe one LS1 may be excited by a square wave voltage. When excited by a corresponding excitation voltage, the ultrasonic probe LS1 can emit ultrasonic waves. The frequency of the ultrasonic wave emitted by the ultrasonic probe LS1 is determined by its own parameters. The ultrasonic power is related to the amplitude of the excitation voltage, and the larger the amplitude of the excitation voltage, the larger the ultrasonic energy emitted by the ultrasonic probe-LS 1. It should be noted that the excitation voltage should be within the tolerance range of the ultrasound probe. The ultrasonic wave transmitting circuit is composed of a switch control circuit. The switch control circuit can generate a single square wave voltage signal to control the on-off of the 30V power supply, so that the ultrasonic probe LS1 is excited to emit ultrasonic waves. As shown in fig. 2, the switch control circuit specifically includes a not chip 74HC04(U1), a driving chip MC34151P (U2), a MOS transistor Q1, a resistor R1, and a resistor R2, the pin 14 of the NOT gate chip 74HC04 is connected with a +5V power supply, the pin 1 of the NOT gate chip 74HC04 is connected with an MCU control circuit, pin 2 of the not chip 74HC04 is connected to pin 2 of the driving chip MC34151P, pin 7 of the not chip 74HC04 is connected to pin 3 of the driving chip MC34151P, pin 3 of the driving chip MC34151P is connected with a ground wire, pin 6 of the driving chip MC34151P is connected with a +12V power supply, the pin 7 of the driving chip MC34151P is connected to the gate of the MOS transistor Q1 through a resistor R2, the source electrode of the MOS tube Q1 is connected with the ground wire, the drain electrode of the MOS tube Q1 is connected with a +30V power supply through a resistor R1, and a first ultrasonic probe LS1 is connected between the drain electrode and the source electrode of the MOS tube Q1.
As shown in fig. 2, the MOS transistor Q1 adopts a MOS transistor IRF 840; the maximum working voltage is 500V, and the voltage withstanding requirement is met; the conduction time is short; the on-resistance is small and is only 0.85 omega; the requirements of the embodiment are met.
The single square wave signal is generated by single chip software in the MCU control circuit. The load capacity of the single chip is low, and the load capacity is increased by adopting an inverter chip which adopts 74HC 04. The gate driving voltage of the MOS transistor Q1 needs to reach 12V, and a driving chip MC34151P is used to generate a 12V square wave voltage. The MOS transistor Q1 is easily damaged by static electricity due to too small gate resistance, and the on-time is prolonged due to too large gate resistance, which is 62 Ω of the gate resistor R2.
The 30V voltage is supplied by an external independent power supply. The power supply of the power circuit and the control circuit needs to be isolated to avoid interference. The resistance value of the current limiting resistor R1 is not suitable to be too large; when the resistance value exceeds 10k omega, the drain current is too small, and the MOS transistor Q1 can not normally output power; when the resistance is smaller than 1k Ω, the power voltage will be pulled low due to the over-small current-limiting resistor, and the normal operation will not be possible.
The first ultrasonic probe LS1 and the second ultrasonic probe LS2 are both 50K-P28F in model. A pair of ultrasonic probes is selected, one is used as a transmitting end, and the other is used as a receiving end. The working frequency of the 50K-P28F ultrasonic probe is 50kHz, and the maximum working voltage is 500V.
Simulating a transmitting circuit in Protues, wherein a channel A is a square wave signal generated by a singlechip chip in an MCU control circuit, and the amplitude of the square wave signal is 5V; channel B is a square wave output from the drain of MOS transistor Q1 and has an amplitude of 30V. The simulation result meets the expected requirement.
The ultrasonic receiving circuit consists of a preprocessing circuit and a two-stage proportional amplifying circuit. The pre-processing circuit is responsible for eliminating noise, and the secondary proportional amplifying circuit can amplify weak ultrasonic signals to logic level.
Noise in the environment may be involved in the received ultrasonic signal, and directly analyzing the signal may have a great influence on the result. Before the signal is processed and analyzed, the signal needs to be simply filtered by a pre-processing circuit to remove high-frequency noise. The pre-processing circuit has two functions of eliminating offset and limiting amplitude. As shown in fig. 3, the bias capacitor C1 and the drain resistor R3 in the pre-processing circuit remove the dc bias of the ultrasonic signal. The clipping function consists of two anti-phase parallel diodes D1 and D2 connected to ground. The ultrasonic signal is in millivolt level, the diode can not be conducted, and the ultrasonic signal can directly flow into a subsequent amplifying circuit; the noise signal will turn on the diode and flow to ground. The front-end processing circuit specifically comprises a resistor R3, a resistor R4, a capacitor C1, a diode D1 and a diode D2, one end of the resistor R3 is connected with one end of a second ultrasonic probe LS2, the other end of the resistor R3 is connected with one end of the capacitor C1, the other end of the second ultrasonic probe LS2 is connected with a ground wire, the other end of the capacitor C1, the cathode of the diode D1, the anode of the diode D2 and one end of the resistor R4 are all connected with a two-stage proportional amplification circuit, and the anode of the diode D1, the cathode of the diode D2 and the other end of the resistor R4 are all connected with the ground wire.
The ultrasonic signal is a weak small signal, generally at millivolt level, and needs to be amplified. In the embodiment, a TL082 integrated operational amplifier chip (U3) is selected in the two-stage proportional amplification circuit, the bandwidth is 3MHz, the slew rate is 5V/us, and the amplification requirement of ultrasonic signals is met. As shown in fig. 4, the two-stage proportional amplifying circuit specifically includes a chip TL082, a resistor R5, a resistor R6, a sliding resistor R7, a sliding resistor R8, a resistor R9, a resistor R10, a capacitor C2 and a capacitor C3, one end of the resistor R6 is connected to one end of a resistor R4 in the pre-processing circuit, the other end of the resistor R6 is connected to a pin 3 of the chip TL082, the pin 1 of the chip TL082 is connected to the pin 5 of the chip TL082 through a resistor R10, the pin 1 of the chip TL082 is connected to a sliding end of a sliding resistor R7, the pin 2 of the chip TL082 is connected to one end of a resistor R5 and one end of a sliding resistor R7, the other end of the sliding resistor R7 is connected to a ground, the other end of the resistor R5 is connected to a ground through a capacitor C2, the pin 4 of the chip TL082 is connected to a power supply 12V, the pin 6 of the chip TL082 is connected to one end of a resistor R8 and one end of the resistor R9, the other end of the resistor R9 is connected with the ground wire through a capacitor C3, the other end of the slide resistor R8 is connected with the ground wire, a pin 7 of the chip TL082 is simultaneously connected with the slide end of the slide resistor R8 and the full-wave rectification circuit, and a pin 8 of the chip TL082 is connected with a 12V power supply. The present embodiment can obtain the required amplification factor by adjusting the resistance value of the sliding resistor R7. The single-stage amplification can amplify signals to hundreds of times, and the two-stage amplification can obtain high-power amplification effect.
The two-stage proportional amplification circuit was simulated in Protues. Channel A is the input sinusoidal signal waveform with an amplitude of 20mV and a frequency of 50 kHz. And the channel B is an output waveform of the two-stage proportional amplifying circuit, and the amplitude of the output waveform is 2V. The second-stage proportional amplifying circuit amplifies the signal by 100 times, and the simulation result meets the expected requirement.
In this embodiment, the signal processing circuit can extract the peak time from the ultrasonic signal, and finally obtain the propagation time of the ultrasonic wave in the single board. The signal processing circuit is composed of a full-wave rectifying circuit, an envelope detection circuit and an over-peak judging circuit. The full-wave rectifying circuit can convert the negative half cycle signal of the signal into a positive signal, so that the processing is convenient. The envelope detection circuit may then highlight the maximum peak of the signal. The over-peak judging circuit facilitates the measurement of the peak value moment.
As the singlechip chip STC12C55A60S2 can only recognize the voltage of 0-5V, the ultrasonic signal after amplification treatment needs full-wave rectification treatment. Meanwhile, the ultrasonic signal has oscillation attenuation phenomenon, the peak point of the ultrasonic signal may appear in the negative half period, which is inconvenient for measurement, and the full-wave rectification treatment can solve the problem. The full-wave rectifying circuit specifically comprises an OP37 operational amplifier chip U4, an OP37 operational amplifier chip U5, a resistor R11 to a resistor R17, a diode D3 and a diode D4, wherein one end of the resistor R16 and one end of the resistor R11 are both connected to a pin 7 of a chip TL082 in the two-stage proportional amplifier circuit, the other end of the resistor R16 is simultaneously connected to one end of a resistor R12, a cathode of a diode D4 and a pin 2 of an OP37 operational amplifier chip U4, a pin 3 of the OP37 operational amplifier chip U4 is connected to a ground through a resistor R17, a pin 4 of the OP37 operational amplifier chip U4 is connected to a 12V power supply, a pin 6 of the OP37 operational amplifier chip U4 is simultaneously connected to an anode of a diode D4 and a cathode of a diode D3, the other end of the resistor R12 is simultaneously connected to an anode of a diode D3 and one end of a resistor R13, and the other end of the resistor R13 is simultaneously connected to a pin 11, One end of a resistor R14 is connected with a pin 2 of an OP37 operational amplifier chip U5, a pin 3 of the OP37 operational amplifier chip U5 is connected with a ground wire through a resistor R15, a pin 4 of the OP37 operational amplifier chip U5 is connected with a-12V power supply, a pin 7 of the OP37 operational amplifier chip U5 is connected with a +12V power supply, the other end of the resistor R14 is connected with a pin 6 of the OP37 operational amplifier chip U5, and the pin 6 of the OP37 operational amplifier chip U5 is connected with an envelope detection circuit.
The frequency of the ultrasonic wave used by the system is 50 kHz. The frequency of the ultrasonic wave is higher, and in order to ensure that signals are not distorted in the processing process, an integrated operational amplifier chip OP37 with higher performance is adopted. When processing high frequency signals, a processing circuit formed by common integrated operational amplifier chips such as TL081, TL082 and the like generates a burr phenomenon. This is due to the low performance of the chip itself, which leads to signal distortion. When a high-frequency signal is processed by using a processing circuit formed by an integrated operational amplifier chip OP37 with higher performance, the phenomenon of signal distortion does not occur.
For full-wave rectification circuitPrinciple analysis was performed. Remember that the input is Ui2The output is Uo1. When the input ultrasonic signal is positive, i.e. Ui2>At 0, the diode D4 is turned off, D3 is turned on, and U4 performs an inverting amplification function. The output voltage of the 6 th pin of U4 is U60＝-2Ui2U6 output to resistor R1302Is also approximately equal to-2Ui2. At this time, U5 outputs Uo1＝-(U60+Ui2)＝Ui2. When the input ultrasonic signal is negative, i.e. Ui2<At 0, U60>0, the diode D4 is turned on, the D3 is turned off, the circuit is in an open circuit state, and the feedback resistor R12 enables the output voltage U to be outputo2Equal to the U4 pin 2 voltage; meanwhile, according to the virtual short principle, the voltages of the No. 2 and No. 3 pins are approximately equal and are zero. Thus, the output voltage Uo20. At this time, U5 has an inverting and proportional amplifying circuit composed of resistors R14 and R11, and outputs Uo1＝-Ui2. To sum up, when Ui2>At 0, Uo1＝Ui2(ii) a When U is turnedi2<0，Uo1＝-Ui2The circuit realizes the full-wave rectification effect.
In Protues, a full-wave rectifier circuit was simulated, with channel A being the input sinusoidal signal waveform, with an amplitude of 5V and a frequency of 50 kHz. And the channel B is the output waveform of the full-wave rectifying circuit, and the simulation result meets the expected requirement.
In the calculation of the ultrasonic wave propagation time, it is necessary to acquire a peak time. Due to the oscillation attenuation phenomenon of the ultrasonic signal, the ultrasonic signal has a plurality of maximum value points, which increases the difficulty of reading the peak value moment. And (4) describing the amplitude envelope of the ultrasonic signal oscillation by adopting envelope detection processing. Therefore, the peak value of the original signal can be reserved, and the difficulty in reading the peak value moment is simplified by filtering a plurality of maximum value points of the original signal oscillation. The detection method for analyzing the ultrasonic wave envelope peak value further improves the precision of ultrasonic detection. The envelope detection circuit is composed of a low-pass filter circuit. In order to make the effect of the envelope more obvious, a low-pass filter circuit is adopted. The frequency of the output signal of the low-pass filter circuit is about 1/10 to 1/3 of the frequency of the original signal, so that the effect of forming an envelope is achieved. As shown in fig. 6, the envelope detection circuit specifically includes a resistor R18, a resistor R19, a capacitor C4, and a capacitor C5, one end of the resistor R18 is connected to a pin 6 of an OP37 operational amplifier chip U5 in the full-wave rectification circuit, the other end of the resistor R18 is connected to one end of the capacitor C4 and one end of the resistor R19, the other end of the resistor R19 is connected to one end of the capacitor C5 and the over-peak determination circuit, and the other end of the capacitor C4 and the other end of the capacitor C5 are both connected to a ground line.
The envelope detection circuit was simulated in Protues with channel A being an input square wave signal waveform with an amplitude of 5V and a frequency of 50 kHz. The channel B is the output waveform of the envelope detection circuit, and the simulation result shows that the high-frequency part in the square wave signal is filtered, and the simulation result meets the expected requirement.
In order to enable the single chip to acquire the peak time of the signal, a circuit capable of self-checking when the signal reaches the peak time needs to be designed. The over-peak judging circuit can generate a falling edge pulse for the main control chip to identify when the signal reaches the peak value. As shown in fig. 7, the over-peak determining circuit specifically includes an operational amplifier chip OP07(U6), a resistor R20 to a resistor R29, a resistor C6 to a capacitor C10, a diode D5, and a voltage comparison chip LM393(U7), wherein one end of the resistor R21 is connected to one end of a resistor R19 in the envelope detection circuit, the other end of the resistor R21 is connected to one end of a capacitor C9, the other end of the capacitor C9 is simultaneously connected to one end of a capacitor C6, one end of the resistor R20 and a pin 2 of the operational amplifier chip OP07, a pin 3 of the operational amplifier chip OP07 is connected to a ground through a resistor R22, a pin 4 of the operational amplifier chip OP07 is connected to a-12V power supply and the pin 4 is connected to a ground through a capacitor C8, a pin 7 of the operational amplifier chip OP07 is connected to a 12V power supply and the pin 7 is connected to a ground through a capacitor C7, and the other end of the pin 6 of the operational amplifier chip OP07 is connected to the other end of the capacitor C6, The other end of the resistor R20 is connected with one end of the resistor R23, the other end of the resistor R23 is simultaneously connected with the anode of the diode D5 and one end of the resistor R24, the other end of the resistor R24 is connected with one end of the resistor R27 and the pin 3 of the voltage comparison chip LM393 at the same time, the pin 4 of the voltage comparison chip LM393 is connected with the ground wire, the pin 2 of the voltage comparison chip LM393 is simultaneously connected with one end of the resistor R28, one end of the resistor R25 and one end of the resistor R26, the other end of the resistor R26 is simultaneously connected with the other end of the resistor R27 and a +5V power supply, pin 8 of the voltage comparison chip LM393 is connected to a +5V power supply and this pin 8 is connected to ground through a capacitor C10, the pin 1 of the voltage comparison chip LM393 is connected to both the other end of the resistor R28 and one end of the resistor R29, the other end of the resistor R29 is connected with a +5V power supply, and a pin 1 of the voltage comparison chip LM393 is connected with the MCU control circuit.
The over-peak judging circuit is composed of a differential circuit and a zero-crossing comparator. The differential circuit is composed of an operational amplifier OP07, a resistor R20, and a capacitor C9. The resistor R21 is a compensation resistor, which can improve the stability of the circuit, reduce the high frequency noise and increase the input impedance of the circuit too much. The zero-crossing voltage comparator consists of a voltage comparison chip LM393 and a peripheral circuit and is a single-power-supply voltage comparator. When the output of the differential circuit is larger than zero, namely the voltage signal is increased, the diode D5 is cut off in the reverse direction, the positive input voltage of the zero-crossing comparator circuit is larger than the voltage of the negative input end, and high level is output; when the output of the differential circuit is less than zero, namely the voltage signal is reduced, the diode D5 is conducted in the forward direction, the positive input end voltage of the zero-crossing comparator circuit is less than the negative input end voltage, and low level is output. When the signal peak value comes, the output voltage of the zero-crossing comparator jumps from high level to low level, and the singlechip can detect the level change, so that the peak value moment is recorded.
The over-peak judging circuit was simulated in Protues, where channel A is a sinusoidal input signal with an amplitude of 5V and a frequency of 40 kHz. The channel B is an output signal, and as can be seen from the simulation result, when the sinusoidal signal passes through the peak value, the over-peak judging circuit outputs a falling edge pulse, which is in line with the design expectation.
In this embodiment, as shown in fig. 8, the MCU control circuit includes a single-chip STC12C5a60S2(U8), and the chip has functional modules such as a common I/O port, ADC conversion, serial communication, external interrupt, timer interrupt, and external crystal oscillator, and can meet general control requirements. Meanwhile, the cost performance of the chip is high, the chip is one of the commonly used chips, and the use and development technology is mature. In an actual circuit, a port P0 of a singlechip is selected to input data to the LCD1602, and a pull-up resistor is adopted to provide driving current; a singlechip P2.5-P2.7 is selected as a control pin of the LCD 1602. The system main control chip is externally connected with a 12MHz crystal oscillator Y1. The minimum timing frequency of the timer is one twelfth of the external crystal oscillator frequency of the single chip microcomputer, when a 12MHz external crystal oscillator is used, the period is 1us, and no error exists. The use of 12MHz can increase the timing accuracy of the timer and reduce the system error. The MCU control circuit and the LCD display circuit are both shown in FIG. 8, wherein a pin 9 of a singlechip STC12C5A60S2 is simultaneously connected with one end of a resistor R31 and one end of a capacitor C13, the other end of a capacitor C13 is connected with a +5V power supply, the other end of a resistor R31 is connected with a ground wire, a pin 18 of the singlechip STC12C5A60S2 is simultaneously connected with one end of a crystal oscillator Y1 and one end of a capacitor C14, a pin 19 of the singlechip STC12C5A60S2 is simultaneously connected with the other end of a crystal oscillator Y1 and one end of a capacitor C15, the other end of a capacitor C14 and the other end of a capacitor C15 are both connected with the ground wires, a pin 20 of the singlechip STC12C5A60S2 is connected with the ground wire, a pin 40 of the singlechip STC12C5A60S2 is connected with the +5V power supply, a pin 1 of the singlechip STC12C 60S2 is connected with a non-gate 74 in the switch control circuit, and a pin 1 of the singlechip STC 12A 5S 2 is connected with a voltage peak judging circuit.
As shown in fig. 8, the LCD display circuit includes a display LCD1602(U9), pin 1 of the display LCD1602 is connected to ground, pin 2 is connected to one end of a capacitor C11, one end of a sliding resistor R30 and +5V power at the same time, the other end of a capacitor C11 and the other end of a sliding resistor R30 are both connected to ground, pin 3 of the display LCD1602 is connected to a sliding end of a sliding resistor R30, pin 4 of the display LCD1602 is connected to pin 27 of a single-chip STC12C5a60S2, pin 5 of the display LCD1602 is connected to pin 26 of a single-chip STC12C5a60S2, pin 6 of the display LCD1602 is connected to pin 28 of a single-chip STC12C5a60S2, pin 7 of the display LCD1602 is connected to pin 39 of an STC12C5a60S2 and pin 7 of the display LCD1602 is connected to +5V power through an exclusion RP1, pin 8 of the display LCD1602 is connected to +5V power supply RP 60 a 5a60S 1 and 368 is connected to +5V power supply pin 368, pin 9 of the display screen LCD1602 is connected with pin 37 of the singlechip STC12C5A60S2, pin 9 is connected with a +5V power supply through an exclusion RP1, pin 10 of the display screen LCD1602 is connected with pin 36 of the singlechip STC12C5A60S2, pin 10 is connected with a +5V power supply through an exclusion RP1, pin 11 of the display screen LCD1602 is connected with pin 35 of the singlechip STC12C5A60S2, pin 11 is connected with a +5V power supply through an exclusion RP1, pin 12 of the display screen LCD1602 is connected with pin 34 of the singlechip STC12C5A60S2, pin 12 is connected with a +5V power supply through an exclusion RP1, pin 13 of the display screen LCD1602 is connected with pin 33 of the singlechip STC 12A 60S2, pin 13 is connected with a +5V power supply through an exclusion RP1, pin 14 of the display screen LCD1602 is connected with pin 32 of the singlechip STC12C5A60S 4, pin 14 is connected with pin 3614 of the singlechip STC 5A60S 1602, pin 3614 is connected with a +5V power supply through a +5V power supply 3615, and pin 3615 is connected with a display screen LCD 3615, pin 16 of the display screen LCD1602 is connected to ground.
As shown in fig. 8, the operation indicating circuit includes a light emitting diode D6, the anode of the light emitting diode D6 is connected to the pin 21 of the single-chip microcomputer STC12C5a60S2, and the cathode of the light emitting diode D6 is connected to the ground. In operation, the single chip controls the light emitting diode D6 to be on.
As shown in fig. 9, the alarm circuit includes a resistor R32, a resistor R33, a triode Q2 and a buzzer BZ1, one end of the resistor R32 is connected to a pin 22 of the single-chip STC12C5a60S2, the other end of the resistor R32 is connected to a base of the triode Q2, a collector of the triode Q2 is connected to a +5V power supply, an emitter of the triode Q2 is connected to one end of the buzzer BZ1, and the other end of the buzzer BZ1 is connected to a ground through the resistor R33. When the thickness of the wood plate to be measured exceeds 50mm, the single chip microcomputer controls the alarm circuit to be conducted, the buzzer BZ1 gives an alarm to remind, and the measurement precision is increased.
The transmission circuit of the present embodiment is constituted by a switch control circuit. The switch control circuit controls the power supply to generate a high-voltage square wave to excite the ultrasonic probe LS1 to emit ultrasonic waves. The ultrasonic signal received by the second ultrasonic probe LS2 is relatively weak, and therefore needs to be amplified. The receiving circuit mainly comprises a preprocessing circuit and a two-stage proportional amplifying circuit. The pre-processing circuit is used for removing clutter signals and direct current bias; the second-stage proportional amplifying circuit is used for amplifying the ultrasonic small signals to a voltage level which can be normally identified by the single chip microcomputer. And processing the amplified ultrasonic signals so as to facilitate the signal acquisition of the main control chip. The signal processing circuit mainly comprises a full-wave rectifying circuit, an envelope detection circuit and an over-peak judging circuit. The full-wave rectification circuit rectifies the bipolar signal into a unipolar signal; the envelope detection circuit is used for describing the amplitude trend of the high-frequency signal; the over-peak judging circuit can generate a falling pulse at the moment of the peak value of the signal. The software controls the switch control circuit to generate a square wave signal to excite the ultrasonic probe LS 1. The falling edge pulse generated by the hardware over-peak judging circuit triggers the external interruption of the single chip microcomputer, so that the peak time of the ultrasonic signal can be recorded; the thickness of the single plate can be obtained by converting the peak time; and finally, displaying the thickness information of the single plate on the LCD. Meanwhile, the embodiment also has the functions of work indication and alarm.
The protection scope of the present invention includes but is not limited to the above embodiments, the protection scope of the present invention is subject to the claims, and any replacement, deformation, and improvement that can be easily conceived by those skilled in the art made by the present technology all fall into the protection scope of the present invention.
Claims (10)
1. A veneer thickness measuring system based on ultrasonic waves is characterized in that: the ultrasonic diagnosis device comprises a transmitting circuit, a first ultrasonic probe LS1, a second ultrasonic probe LS2, a receiving circuit, a signal processing circuit, an MCU control circuit, an LCD display circuit, a work indicating circuit and an alarm circuit;
the transmitting circuit comprises a switch control circuit, the receiving circuit comprises a pre-processing circuit and a secondary proportional amplifying circuit, and the signal processing circuit comprises a full-wave rectifying circuit, an envelope detection circuit and an over-peak judging circuit;
the ultrasonic monitoring system is characterized in that the MCU control circuit is connected with the switch control circuit, the switch control circuit is connected with the first ultrasonic probe LS1, the second ultrasonic probe LS2 is connected with the preprocessing circuit, the preprocessing circuit is connected with the second-stage proportional amplifying circuit, the second-stage proportional amplifying circuit is connected with the full-wave rectifying circuit, the full-wave rectifying circuit is connected with the envelope detection circuit, the envelope detection circuit is connected with the peak crossing judging circuit, the peak crossing judging circuit is connected with the MCU control circuit, and the MCU control circuit is simultaneously connected with the LCD display circuit, the work indicating circuit and the alarm circuit.
2. The ultrasonic-based veneer thickness measuring system according to claim 1, wherein: the switch control circuit comprises a NOT gate chip 74HC04, a drive chip MC34151P, a MOS tube Q1, a resistor R1 and a resistor R2, wherein a pin 14 of the NOT gate chip 74HC04 is connected with a +5V power supply, a pin 1 of the NOT gate chip 74HC04 is connected with an MCU control circuit, a pin 2 of the NOT gate chip 74HC04 is connected with a pin 2 of the drive chip MC34151P, a pin 7 of the NOT gate chip 74HC04 is connected with a pin 3 of the drive chip MC34151P, a pin 3 of the drive chip MC 51 34151P is connected with a ground wire, a pin 6 of the drive chip 341MC 34151P is connected with a +12V power supply, a pin 7 of the drive chip MC34151 341 34151P is connected with a gate of the MOS tube Q1 through the resistor R2, a source of the MOS tube Q1 is connected with the ground wire, a drain of the MOS tube Q1 is connected with a +30V power supply through a resistor R1, and an ultrasonic probe 1 is connected between a drain of the source Q1; the MOS transistor Q1 adopts an MOS transistor IRF 840.
3. The ultrasonic-based veneer thickness measuring system according to claim 2, wherein: the pre-processing circuit comprises a resistor R3, a resistor R4, a capacitor C1, a diode D1 and a diode D2, one end of the resistor R3 is connected with one end of a second ultrasonic probe LS2, the other end of the resistor R3 is connected with one end of the capacitor C1, the other end of the second ultrasonic probe LS2 is connected with a ground wire, the other end of the capacitor C1, the cathode of the diode D1, the anode of the diode D2 and one end of the resistor R4 are connected with a two-stage proportional amplification circuit, and the anode of the diode D1, the cathode of the diode D2 and the other end of the resistor R4 are connected with the ground wire.
4. The ultrasonic-based veneer thickness measuring system according to claim 3, wherein: the two-stage proportional amplifying circuit comprises a chip TL082, a resistor R5, a resistor R6, a sliding resistor R7, a sliding resistor R8, a resistor R9, a resistor R10, a capacitor C2 and a capacitor C3, wherein one end of the resistor R6 is connected with one end of a resistor R4 in the pre-processing circuit, the other end of the resistor R6 is connected with a pin 3 of the chip TL082, the pin 1 of the chip 082 is connected with a pin 5 of the chip TL082 through a resistor R10, the pin 1 of the chip TL082 is connected with a sliding end of the sliding resistor R7, the pin 2 of the chip TL082 is respectively connected with one end of a resistor R5 and one end of the sliding resistor R7, the other end of the sliding resistor R7 is connected with a ground wire, the other end of the resistor R5 is connected with the ground wire through a capacitor C2, the pin 4 of the chip 082 is connected with a-12V power supply, the pin 6 of the chip TL is respectively connected with one end of a resistor R8 and one end of the resistor R9, the other end of the resistor R9 is connected with the ground wire through a capacitor C3, the other end of the slide resistor R8 is connected with the ground wire, a pin 7 of the chip TL082 is simultaneously connected with the slide end of the slide resistor R8 and the full-wave rectification circuit, and a pin 8 of the chip TL082 is connected with a 12V power supply.
5. The ultrasonic-based veneer thickness measuring system according to claim 4, wherein: the full-wave rectifying circuit comprises an OP37 operational amplifier chip U4, an OP37 operational amplifier chip U5, a resistor R11-resistor R17, a diode D3 and a diode D4, one end of the resistor R16 and one end of the resistor R11 are connected with a pin 7 of a chip TL082 in the two-stage proportional amplifying circuit, the other end of the resistor R16 is simultaneously connected with one end of a resistor R12, the cathode of the diode D4 and a pin 2 of an OP37 operational amplifier chip U4, a pin 3 of the OP37 operational amplifier chip U4 is connected with the ground through a resistor R17, a pin 4 of the OP37 operational amplifier chip U4 is connected with a 12V power supply, a pin 6 of the OP37 operational amplifier chip U4 is simultaneously connected with the anode of a diode D4 and the cathode of a diode D3, the other end of the resistor R12 is simultaneously connected with the anode of the diode D3 and one end of the resistor R13, and the other end of the resistor R13 is simultaneously connected with the anode of the resistor R11, One end of a resistor R14 is connected with a pin 2 of an OP37 operational amplifier chip U5, a pin 3 of the OP37 operational amplifier chip U5 is connected with a ground wire through a resistor R15, a pin 4 of the OP37 operational amplifier chip U5 is connected with a-12V power supply, a pin 7 of the OP37 operational amplifier chip U5 is connected with a +12V power supply, the other end of the resistor R14 is connected with a pin 6 of the OP37 operational amplifier chip U5, and the pin 6 of the OP37 operational amplifier chip U5 is connected with an envelope detection circuit.
6. The ultrasonic-based veneer thickness measuring system according to claim 5, wherein: the envelope detection circuit comprises a resistor R18, a resistor R19, a capacitor C4 and a capacitor C5, one end of the resistor R18 is connected with a pin 6 of an OP37 operational amplifier chip U5 in the full-wave rectification circuit, the other end of the resistor R18 is connected with one end of the capacitor C4 and one end of the resistor R19, the other end of the resistor R19 is connected with one end of the capacitor C5 and the over-peak judgment circuit, and the other end of the capacitor C4 and the other end of the capacitor C5 are both connected with the ground wire.
7. The ultrasonic-based veneer thickness measuring system according to claim 6, wherein: the over-peak judging circuit comprises an operational amplifier chip OP07, a resistor R20 to a resistor R29, a resistor C6 to a capacitor C10, a diode D5 and a voltage comparison chip LM393, wherein one end of the resistor R21 is connected with one end of a resistor R19 in the envelope detection circuit, the other end of the resistor R21 is connected with one end of a capacitor C9, the other end of the capacitor C9 is simultaneously connected with one end of a capacitor C6, one end of the resistor R20 and a pin 2 of the operational amplifier chip OP07, a pin 3 of the operational amplifier chip OP07 is connected with the ground through a resistor R22, a pin 4 of the operational amplifier chip 07 is connected with a-12V power supply and the pin 4 is connected with the ground through a capacitor C8, a pin 7 of the operational amplifier chip OP07 is connected with the 12V power supply and the pin 7 is connected with the ground through a capacitor C7, a pin 6 of the operational amplifier chip 07 is simultaneously connected with the other end of a capacitor C6, the other end of the resistor R20 and one end of the resistor R23, the other end of the resistor R23 is connected with the anode of the diode D5 and one end of the resistor R24, the other end of the resistor R24 is connected with one end of the resistor R27 and one end of the voltage comparison chip LM393, the pin 4 of the voltage comparison chip LM393 is connected with the ground, the pin 2 of the voltage comparison chip LM393 is connected with one end of the resistor R28, one end of the resistor R25 and one end of the resistor R26, the other end of the resistor R26 is connected with the other end of the resistor R27 and the +5V power supply, the pin 8 of the voltage comparison chip LM393 is connected with the +5V power supply and the pin 8 is connected with the ground through the capacitor C10, the pin 1 of the voltage comparison chip LM393 is connected with the other end of the resistor R28 and one end of the resistor R29, the other end of the resistor R29 is connected with the +5V power supply, and the pin 1 of the voltage comparison chip LM393 is connected with the MCU control circuit.
8. The ultrasonic-based veneer thickness measuring system according to claim 7, wherein: the MCU control circuit comprises a singlechip STC12C5A60S2, a pin 9 of the singlechip STC12C5A60S2 is simultaneously connected with one end of a resistor R31 and one end of a capacitor C13, the other end of the capacitor C13 is connected with a +5V power supply, the other end of the resistor R31 is connected with a ground wire, a pin 18 of the singlechip STC12C5A60S2 is simultaneously connected with one end of a crystal oscillator Y1 and one end of a capacitor C14, a pin 19 of the singlechip STC12C5A60S2 is simultaneously connected with the other end of the crystal oscillator Y1 and one end of a capacitor C15, the other end of the capacitor C14 and the other end of the capacitor C15 are both connected with the ground wire, a pin 20 of the singlechip STC12C5A60S2 is connected with the ground wire, a pin 40 of the singlechip STC12C5A60S2 is connected with the +5V power supply, a pin 1 of the singlechip STC 12A 60S2 is connected with a non-gate chip 74 in the switch control circuit 04, and a pin of the singlechip STC 12A 2 is connected with an LM 12 peak judgment chip.
9. The ultrasonic-based veneer thickness measuring system according to claim 8, wherein: the LCD display circuit comprises a display screen LCD1602, a pin 1 of the display screen LCD1602 is connected with a ground wire, a pin 2 is simultaneously connected with one end of a capacitor C11, one end of a sliding resistor R30 and a +5V power supply, the other end of the capacitor C11 and the other end of the sliding resistor R30 are both connected with the ground wire, a pin 3 of the display screen LCD1602 is connected with a sliding end of a sliding resistor R30, a pin 4 of the display screen LCD1602 is connected with a pin 27 of a singlechip STC12C5A60S2, a pin 5 of the display screen LCD1602 is connected with a pin 26 of the singlechip STC12C5A60S2, a pin 6 of the display screen LCD1602 is connected with a pin 28 of the singlechip STC12C5A60S2, a pin 7 of the display screen LCD1602 is connected with a pin 39 of the singlechip STC 12A 60S2, the pin 7 is connected with the +5V power supply through an exclusion 1, a pin 8 of the display screen LCD1602 is connected with a pin 5398 of the singlechip STC 5A 2, and a pin 5398 of the singlechip STC 5A 639V power supply is connected with a pin 9V pin 9 and a pin 9 of the singlechip STC 5A 9 The power supply comprises a source, a pin 10 of a display screen LCD1602 is connected with a pin 36 of a singlechip STC12C5A60S2, the pin 10 is connected with a +5V power supply through an exclusion RP1, a pin 11 of the display screen LCD1602 is connected with a pin 35 of a singlechip STC12C5A60S2, the pin 11 is connected with a +5V power supply through an exclusion RP1, a pin 12 of the display screen LCD1602 is connected with a pin 34 of the singlechip STC12C5A60S2, the pin 12 is connected with the +5V power supply through an exclusion RP1, a pin 13 of the display screen LCD1602 is connected with a pin 33 of a singlechip STC12C5A60S2, the pin 13 is connected with a +5V power supply through an exclusion RP1, a pin 14 of the display screen LCD1602 is connected with a pin 32 of the singlechip STC 12A 60S2, the pin 14 is connected with the +5V power supply through an exclusion RP1, a pin 15 of the display screen LCD1602 is connected with a +5V power supply, the pin 15 is connected with a ground wire of the singlechip STC12C 5S 12, and a ground wire of the display screen LCD1602 is connected with a ground wire 16.
10. The ultrasonic-based veneer thickness measuring system according to claim 8, wherein: the work indicating circuit comprises a light emitting diode D6, the anode of the light emitting diode D6 is connected with a pin 21 of a singlechip STC12C5A60S2, and the cathode of the light emitting diode D6 is connected with the ground wire; the alarm circuit comprises a resistor R32, a resistor R33, a triode Q2 and a buzzer BZ1, one end of the resistor R32 is connected with a pin 22 of a single-chip microcomputer STC12C5A60S2, the other end of the resistor R32 is connected with a base electrode of the triode Q2, a collector electrode of the triode Q2 is connected with a +5V power supply, an emitter electrode of the triode Q2 is connected with one end of the buzzer BZ1, and the other end of the buzzer BZ1 is connected with a ground wire through the resistor R33.
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