CN214137358U - Leveling forming base plate for 3D printer and leveling system of forming base plate - Google Patents
Leveling forming base plate for 3D printer and leveling system of forming base plate Download PDFInfo
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- CN214137358U CN214137358U CN202022585191.6U CN202022585191U CN214137358U CN 214137358 U CN214137358 U CN 214137358U CN 202022585191 U CN202022585191 U CN 202022585191U CN 214137358 U CN214137358 U CN 214137358U
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Abstract
The utility model relates to a but, leveling forming substrate and for 3D printer forming substrate leveling system for 3D printer, but leveling forming substrate utilizes the bolt and the elasticity regulation that the cooperation of elastic support piece formed the multiple spot, especially to there being certain tapered forming substrate, the utility model discloses a but leveling board compensation forming substrate's difference in height, the leveling is effectual, simple structure, convenient operation, low cost. The support surface size of leveling board is big, can form stable supporting effect to the shaping base plate, at the printing in-process, guarantees that overall structure is more stable. The forming substrate leveling system for the 3D printer is based on the leveling forming substrate, the leveling of the forming substrate is carried out by matching with the three-dimensional detection scanner, the leveling effect is good, the structure is simple, the operation is convenient, and the cost is low. The external three-dimensional detection scanner is not limited to be used for only one 3D printer, and can be used for leveling the forming base plate of a plurality of 3D printers, so that the equipment cost is further reduced.
Description
Technical Field
The utility model relates to a 3D prints technical field, more specifically says, relates to a but, leveling forming substrate for 3D printer to and a forming substrate leveling system for 3D printer.
Background
3D printing is a technique for building objects by layer-by-layer printing using powdered materials based on digital model files. With the increase of product demand, 3D printing is more and more widely applied, and cost reduction is an important index for enterprises with a large number of printers.
In the 3D printing process, the forming substrate can be repeatedly used through flat grinding. Generally, a molded substrate after flat grinding has little influence on the preparation of a sample with low precision requirement, but the preparation of a sample with high precision requirement, which is sensitive to the inclination and stability of the molded substrate, has great influence.
The flat grinding equipment with higher processing precision is expensive, and the molded substrate processed by the conventional flat grinding equipment has the problem of poor flatness precision, even has a certain taper, and needs to be leveled before use.
In the prior art, a device and a method for leveling a molded base plate are related, for example, Chinese patent application 201811638729.6 discloses a molded base plate leveling mechanism of a three-dimensional printer, leveling is carried out by an intelligent means based on a sensor, and the cost is overhigh; meanwhile, the sensor is matched with the horizontal rod to level, the accuracy of the mechanical structure directly determines the leveling accuracy, the high-accuracy mechanical structure is ensured, and the cost is further increased; some spare parts set up in the inside of 3D printer, are not convenient for maintain.
Also like Chinese patent application 201910217602.5, the invention discloses a 3D printer bottom plate leveling device and method, leveling is performed based on a structure that a scraper is matched with a dial indicator, and although leveling with higher precision can be realized, the problems of lower leveling efficiency, higher operation requirement and the like exist.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art not enough, provide a but, leveling forming substrate for 3D printer to and a forming substrate leveling system for 3D printer, under current hardware condition, can satisfy the requirement of the forming substrate leveling after the processing of conventional flat grinding equipment, the leveling is effectual, simple structure, convenient operation, low cost.
The technical scheme of the utility model as follows:
a leveling forming substrate for a 3D printer comprises a supporting plate, a leveling plate and a forming substrate which are sequentially arranged from bottom to top; the leveling plate is connected with the supporting plate through a plurality of first bolts, and a first elastic supporting piece is arranged between the leveling plate and the supporting plate and corresponds to the first bolts; the forming substrate is connected with the leveling plate through a plurality of second bolts, and second elastic supporting pieces are arranged between the forming substrate and the leveling plate and correspond to the second bolts.
Preferably, the first elastic supporting member and the second elastic supporting member are springs respectively sleeved on the first bolt and the second bolt.
Preferably, the leveling plate is provided with a screw hole corresponding to the second bolt, the upper surface of the leveling plate is provided with a counter bore corresponding to the screw hole, and one end of the spring is arranged in the counter bore.
Preferably, the edge of the upper surface of the leveling plate is a peripheral inclined surface, and an area surrounded by the peripheral inclined surface is a supporting surface.
Preferably, the first bolts are regularly arranged on the support surface.
Preferably, the leveling plate is rectangular, the inclined surfaces are arranged along four sides of the leveling plate, the supporting surface is rectangular, and the first bolts are arranged corresponding to four corners of the supporting surface.
Preferably, the second bolts are regularly provided on the molding substrate.
Preferably, the molding substrate has a rectangular shape, and the second bolts are provided corresponding to four corners of the molding substrate.
A forming base plate leveling system for a 3D printer comprises a leveling forming base plate, a forming cylinder, a lifting mechanism and a three-dimensional detection scanner, wherein a supporting plate, a leveling plate and a forming base plate of the leveling forming base plate are arranged in a cavity of the forming cylinder, and the lifting mechanism is connected to the bottom surface of the supporting plate; the three-dimensional detection scanner is arranged outside the forming cylinder.
Preferably, the device further comprises a plurality of pre-fixing gaskets, wherein the pre-fixing gaskets are inserted between the forming base plate and the forming cylinder before the forming base plate is installed, the forming base plate is aligned with the leveling plate, and the periphery of the forming base plate is equidistant and parallel to the forming cylinder.
The utility model has the advantages as follows:
a but, leveling forming substrate for 3D printer, utilize bolt and elastic support piece cooperation to form the elastic adjustment of multiple spot, especially to there being certain tapered forming substrate, the utility model discloses a but, leveling plate compensation forming substrate's difference in height, the leveling is effectual, simple structure, convenient operation, low cost. The support surface size of leveling board is big, can form stable supporting effect to the shaping base plate, at the printing in-process, guarantees that overall structure is more stable.
3D is forming substrate leveling system for printer, based on can level up forming substrate, the three-dimensional leveling that carries out forming substrate of cooperation detection scanner, the leveling is effectual, simple structure, convenient operation, low cost. The external three-dimensional detection scanner is not limited to be used for only one 3D printer, and can be used for leveling the forming base plate of a plurality of 3D printers, so that the equipment cost is further reduced.
Drawings
FIG. 1 is an exploded view of a structure of a flattenable formed substrate;
FIG. 2 is an exploded view of the structure of the modeling substrate leveling system for a 3D printer (three-dimensional survey scanner not shown);
FIG. 3 is a cross-sectional view of a structure of a profiled substrate leveling system along a diagonal line for a 3D printer (three-dimensional probe scanner not shown);
FIG. 4 is a schematic structural diagram of a molding base leveling system for a 3D printer;
FIG. 5 is a schematic view of an embodiment of a pre-fixed shim;
FIG. 6 is a schematic structural view (partially in section) of a leveling plate;
in the figure: 10 is a support plate, 20 is a leveling plate, 21 is a first bolt, 22 is a first elastic support, 23 is a screw hole, 24 is a counter bore, 25 is an inclined surface, 26 is a support surface, 30 is a molding base plate, 31 is a second bolt, 32 is a second elastic support, 40 is a lifting mechanism, 50 is a molding cylinder, 60 is a three-dimensional detection scanner, and 70 is a pre-fixing gasket.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
The leveling forming substrate for the 3D printer, as shown in fig. 1, comprises a supporting plate 10, a leveling plate 20 and a forming substrate, which are arranged in sequence from bottom to top; the leveling plate 20 is connected with the support plate 10 through a plurality of first bolts 21, and a first elastic support member 22 is arranged between the leveling plate 20 and the support plate 10 and corresponds to the first bolts 21; the molding substrate is connected with the leveling plate 20 through a plurality of second bolts 31, and a second elastic supporting member 32 is arranged between the molding substrate and the leveling plate 20 corresponding to the second bolts 31. The utility model discloses in, the leveling principle of forming substrate on leveling board 20 is the same with the leveling principle of leveling board 20 in backup pad 10, all is the elasticity through adjusting bolt, based on elastic support piece's elastic support effect, adjusts the leveling board 20 or the height of forming substrate of every bolt position, finally reaches the purpose of leveling board 20 and forming substrate.
Specifically, the leveling plate 20 is first mounted on the upper surface of the supporting plate 10 by the first bolt 21, the first bolt 21 is tightened until the first elastic supporting member 22 is in a compressed state, and the state that the two ends of the first elastic supporting member 22 respectively apply elastic restoring force to the supporting plate 10 and the leveling plate 20 is maintained. When the height of the position corresponding to a certain position of the first bolt 21 needs to be adjusted to rise, the first bolt 21 at the position is loosened, the other opposite first bolt 21 is screwed, and the height of the leveling plate 20 at the position rises under the action of the elastic resetting force of the first elastic supporting piece 22; otherwise, the first bolt 21 at the position is tightened, and the first bolt 21 at the opposite position is loosened.
Similarly, after the leveling plate 20 is installed and leveled, the molding substrate is installed on the upper surface of the leveling plate 20 through the second bolt 31, the second bolt 31 is tightened until the second elastic supporting member 32 is in a compressed state, and the state that the two ends of the second elastic supporting member 32 apply elastic restoring acting force to the leveling plate 20 and the molding substrate respectively is maintained. When the height of the position corresponding to one second bolt 31 needs to be adjusted to rise, the second bolt 31 at the position is loosened, the other opposite second bolt 31 is screwed, and the height of the molding substrate at the position rises under the action of the elastic resetting force of the second elastic supporting piece 32; otherwise, the second bolt 31 is tightened and the opposite second bolt 31 is loosened.
Based on the leveling forming substrate, the utility model discloses still provide a forming substrate leveling system for 3D printer, as shown in fig. 2, fig. 3, fig. 4, include leveling forming substrate to and forming cylinder 50, elevating system 40, three-dimensional detection scanner 60, the backup pad 10, leveling board 20, the forming substrate of leveling forming substrate set up in the cavity of forming cylinder 50, elevating system 40 connects in the bottom surface of backup pad 10; the three-dimensional detection scanner 60 is disposed outside the forming cylinder 50 at a suitable position to detect the area of the forming cylinder 50. The three-dimensional detection scanner 60 is used for detecting the height difference of each position of the feedback leveling plate 20 and the molded substrate, and ensuring the leveling effect of the leveling plate 20 and the molded substrate in the process of leveling the leveling plate 20 and the molded substrate; in this embodiment, the data accuracy of the three-dimensional detection scanner 60 is ± 5 μm, and the response speed is within 1 min. The three-dimensional detection scanner 60 is not only fast in measurement response speed, but also free from the influence of a molding cabin because the three-dimensional detection scanner 60 is independent of the 3D printer, and can be detached and used for leveling another 3D printer after leveling one 3D printer, so that one three-dimensional detection scanner 60 can be used for leveling a molding substrate of a plurality of 3D printers.
3D is forming substrate leveling system for printer in, in order to guarantee the use of forming substrate in the installation and after the installation, avoid forming substrate and forming cylinder 50 to take place the contact, cause the card to die, as shown in fig. 5, the utility model discloses still include a plurality of pre-fixing gasket 70 for before the installation forming substrate, will pre-fixing gasket 70 inserts and locates between forming substrate and forming cylinder 50, make forming substrate and leveling board 20 align, form equidistant and parallel between forming substrate's periphery and the forming cylinder 50, guarantee that forming substrate is located forming cylinder 50's cavity center all the time, avoid forming substrate and forming cylinder 50 to take place the contact.
In this embodiment, the first elastic supporting member 22 and the second elastic supporting member 32 are springs, and are respectively sleeved on the first bolt 21 and the second bolt 31, so that the assembly is convenient, and a complex positioning structure is not required to prevent the falling of the bolts.
In order to ensure that the first elastic supporting element 22 and the second elastic supporting element 32 implemented as springs can stand upright and avoid excessive inclination and influence on the supporting effect, in the embodiment, the leveling plate 20 is provided with a screw hole 23 corresponding to the second bolt 31, the upper surface of the leveling plate 20 is provided with a counter bore 24 corresponding to the screw hole 23, and one end of the spring (i.e., the second elastic supporting element 32) is disposed in the counter bore 24 to fix the end of the spring and prevent the end of the spring from inclining. Meanwhile, in the process that the lifting mechanism 40 drives the support plate 10 to lift so as to drive the molded substrate to lift, the springs are fixed through the counter bores 24, so that the stability of the molded substrate can be ensured. Similarly, according to the implementation requirement, counterbores 24 may be formed on the upper surface of the supporting plate 10 and the lower surface of the leveling plate 20, corresponding to the two end portions of the first elastic supporting member 22 implemented as a spring, and the two end portions of the spring (i.e., the first elastic supporting member 22) are disposed in the counterbores 24.
In this embodiment, as shown in fig. 6, the edge of the upper surface of the leveling plate 20 is a peripheral inclined surface 25, and the inclined surface 25 with a certain inclination angle can provide a space for height adjustment of each position of the molded substrate, meanwhile, an area surrounded by the peripheral inclined surface 25 is a supporting surface 26, and the supporting surface 26 with a larger area is used for supporting the molded substrate, so as to improve stability and reliability of the molded substrate during printing.
In order to ensure that the position of the leveling plate 20 for height adjustment has a certain regularity, correspondingly, the first bolts 21 are regularly arranged on the supporting surface 26, so that height adjustment of the corresponding positions is performed according to the distribution rule of the first bolts 21. In the present embodiment, the leveling plate 20 is rectangular, and correspondingly, the inclined surface 25 is disposed along four sides of the rectangular leveling plate 20, so that the supporting surface 26 is also rectangular, and the first bolts 21 are disposed corresponding to four corners of the supporting surface 26. Especially, the leveling plate 20 is square, and the first bolts 21 are uniformly distributed, so that the height adjustment is more convenient.
Similarly, in the embodiment, the second bolts 31 are regularly arranged on the molding substrate, the molding substrate is rectangular (especially square), and the second bolts 31 are arranged corresponding to four corners of the molding substrate, so as to facilitate leveling of the molding substrate.
The utility model discloses the process of installing and leveling as follows:
installing the leveling plate 20: a leveling plate 20 is mounted on the support plate 10. The first elastic supporting pieces 22 and the matched first bolts 21 (M3-M6) are assembled at four corners of the leveling plate 20, four groups of the first bolts 21 are screwed by a torque wrench, and the screwing torque is 3-10M/N M. In this embodiment, M4 bolts are used, and the torque is 3.5M/N × M, so that the four torques are the same. After screwing, the difference in elevation of the four corners A, B, C and D is obtained using the three-dimensional probe scanner 60 fixed in place in advance, resulting in data feedback (response speed within 1 min). If the height of the point a is lower, the leveling plate 20 is leveled by appropriately loosening the first bolts 21 corresponding to the point a and appropriately tightening the first bolts 21 corresponding to the points B, C and D, and then detecting the difference in height of the four corners. The principle of the adjustment is to properly loosen the first bolt 21 at the lower point or side and properly tighten the first bolt 21 relative to the other first bolts 21 according to the feedback height difference, and to calibrate the level. Leveling for 2-4 times to obtain a height difference result of +/-5 microns, and the required time is 3-5 min. After the leveling plate 20 is adjusted, it is not necessary to adjust every printing end, and adjustment is only performed when a deviation occurs.
Mounting the pre-fixing gasket 70: the pre-fixing gasket 70 is inserted into the gap between the forming cylinder 50 and the forming substrate to ensure that the forming substrate is aligned with the leveling plate 20 and the forming substrate is parallel to the inner wall of the forming cylinder 50.
Mounting a molded substrate: after the molded substrate is aligned with the leveling plate 20, the second bolts 31 at the four corners E, F, G and H of the molded substrate are locked, in this embodiment, M4 bolts with a moment of 3.5M/N × M are used. During the process of screwing the second bolts 31 at the four corners, the position of the molding substrate is prevented from being moved. The tightness of the second bolt 31 is adjusted by combining the detection feedback of the three-dimensional detection scanner 60, and the leveling process of the molded substrate is consistent with the leveling process of the leveling plate 20.
The height of the molded substrate is adjusted by adjusting the tightness of the second bolt 31, and then the second bolt 31 at the position with lower height is adjusted according to the detection feedback of the three-dimensional detection scanner 60 to compensate for the height difference. Leveling for 2-4 times to obtain a height difference result of +/-5 microns, and the required time is 3-5 min.
The above embodiments are merely illustrative, and not restrictive, of the present invention. Changes, modifications, etc. to the above-described embodiments are intended to fall within the scope of the claims of the present invention, as long as they are in accordance with the technical spirit of the present invention.
Claims (10)
1. A leveling forming substrate for a 3D printer is characterized by comprising a supporting plate, a leveling plate and a forming substrate which are sequentially arranged from bottom to top; the leveling plate is connected with the supporting plate through a plurality of first bolts, and a first elastic supporting piece is arranged between the leveling plate and the supporting plate and corresponds to the first bolts; the forming substrate is connected with the leveling plate through a plurality of second bolts, and second elastic supporting pieces are arranged between the forming substrate and the leveling plate and correspond to the second bolts.
2. The flat forming substrate for a 3D printer according to claim 1, wherein the first elastic supporting member and the second elastic supporting member are springs respectively sleeved on the first bolt and the second bolt.
3. The leveling forming substrate for a 3D printer according to claim 2, wherein the leveling plate has a screw hole corresponding to the second bolt, the upper surface of the leveling plate has a counter bore corresponding to the screw hole, and one end of the spring is disposed in the counter bore.
4. The flattenable forming substrate for a 3D printer of claim 1, wherein the upper surface edge of the flattening plate is a circumferentially disposed bevel, and an area surrounded by the circumferentially disposed bevel is a support surface.
5. The flat adjustable molding base plate for a 3D printer according to claim 4, wherein the first bolts are regularly arranged on the supporting surface.
6. The flat adjustable molding base plate for a 3D printer according to claim 5, wherein the leveling plate is rectangular, the inclined surfaces are arranged along four sides of the leveling plate, the supporting surface is rectangular, and the first bolts are arranged corresponding to four corners of the supporting surface.
7. The flat adjustable molding substrate for a 3D printer according to claim 1, wherein the second bolts are regularly arranged on the molding substrate.
8. The flat adjustable molding base plate for a 3D printer according to claim 7, wherein the molding base plate is rectangular, and the second bolts are disposed corresponding to four corners of the molding base plate.
9. A forming substrate leveling system for a 3D printer is characterized by comprising the leveling forming substrate, a forming cylinder, a lifting mechanism and a three-dimensional detection scanner, wherein the leveling forming substrate, the forming cylinder, the lifting mechanism and the three-dimensional detection scanner are arranged in a cavity of the forming cylinder, a supporting plate of the leveling forming substrate, a leveling plate and the forming substrate are arranged in the cavity of the forming cylinder, and the lifting mechanism is connected to the bottom surface of the supporting plate; the three-dimensional detection scanner is arranged outside the forming cylinder.
10. The molding base plate leveling system for a 3D printer according to claim 9, further comprising a plurality of pre-fixing spacers for insertion between the molding base plate and the molding cylinder before mounting the molding base plate, the molding base plate being aligned with the leveling plate, the molding base plate having a periphery that is equidistant from and parallel to the molding cylinder.
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CN202022585191.6U CN214137358U (en) | 2020-11-10 | 2020-11-10 | Leveling forming base plate for 3D printer and leveling system of forming base plate |
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CN202022585191.6U CN214137358U (en) | 2020-11-10 | 2020-11-10 | Leveling forming base plate for 3D printer and leveling system of forming base plate |
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