CN214123857U - Clamping device for wafer - Google Patents
Clamping device for wafer Download PDFInfo
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- CN214123857U CN214123857U CN202023305098.1U CN202023305098U CN214123857U CN 214123857 U CN214123857 U CN 214123857U CN 202023305098 U CN202023305098 U CN 202023305098U CN 214123857 U CN214123857 U CN 214123857U
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- clamping
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- clamping block
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Abstract
The utility model belongs to wafer polishing equipment field, concretely relates to clamping device for wafer. The clamping device is arranged on the supporting seat, the supporting seat is connected with the swing arm, and the swing arm can swing up and down under the driving of the servo motor. The clamping device comprises a clamping mounting seat, a clamping cylinder, a rear clamping block and a front clamping block; the clamping cylinder is fixed on the front side of the clamping mounting seat, a piston rod of the cylinder is connected with the connecting block, one end of each of two guide rods arranged in parallel is fixed on the connecting block, and the other end of each guide rod is connected with the rear clamping block; the back side of the clamping mounting seat is fixedly arranged on the connecting shaft, the front clamping block is arranged on the connecting shaft, and the shapes and the clamping angles of the front clamping block and the back clamping block are matched with the outer edge of the wafer. The utility model discloses a be the centre gripping mode, the upper and lower surface of contactless wafer has reduced the damage to the upper and lower surface of wafer.
Description
Technical Field
The utility model belongs to wafer polishing equipment field, concretely relates to clamping device for wafer.
Background
Semiconductor silicon wafer is the main substrate material for manufacturing very large scale integrated circuit, and with the rapid development of semiconductor industry, the precision requirement on the substrate material is higher and higher, especially the edge surface state of the silicon polished wafer is stricter and stricter. For silicon polished wafers with a diameter of more than 6 inches, especially 8 inches and 12 inches, the edge surface of the wafer needs to be polished during substrate processing, so as to ensure that no slip or epitaxial layer fault and other defects are generated at the edge of the wafer during external delay, and further improve the yield of epitaxial wafers or devices. The edge polishing of the wafer is generally performed on a separate device, and a chemical polishing method is adopted to realize a chemical mechanical polishing process under the process conditions of a certain temperature and a certain rotating speed by using polishing solution and polishing cloth. During edge polishing of the wafer, the wafer needs to be fixed.
The conventional wafer fixing method mainly adopts a vacuum chuck, and the wafer is firmly adsorbed by the vacuum force of the vacuum chuck, but the method has a big defect: during the polishing process of the wafer, the polishing solution remained on the surface of the wafer and the edge of the vacuum chuck can generate vacuum absorption marks. With the increasing market demand for 12-inch wafer surfaces, it has become a trend for wafer edge polishing machines to keep the upper and lower surfaces of the wafer from being contacted as much as possible during polishing, and this approach has not been able to meet the requirements of the wafer edge polishing machine.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to overcome not enough among the prior art, provide a clamping device for wafer.
In order to solve the technical problem, the utility model discloses a solution is:
the clamping device is arranged on a supporting seat, the supporting seat is connected with a swing arm, and the swing arm can swing up and down under the driving of a servo motor.
The clamping device comprises a clamping mounting seat, a clamping cylinder, a rear clamping block and a front clamping block; the clamping cylinder is fixed on the front side of the clamping mounting seat, a piston rod of the cylinder is connected with the connecting block, one end of each of two guide rods arranged in parallel is fixed on the connecting block, and the other end of each guide rod is connected with the rear clamping block; the back side of the clamping mounting seat is fixedly arranged on the connecting shaft, the front clamping block is arranged on the connecting shaft, and the shapes and the clamping angles of the front clamping block and the back clamping block are matched with the outer edge of the wafer.
As an improvement, the front clamping block is connected with the connecting shaft through a bolt.
As an improvement, the clamping installation seat is also provided with four cleaning nozzles for cleaning the polished wafer.
The principle of the utility model is that: when the clamping device clamps the wafer, the clamping force can be controlled by adjusting the air pressure of the air cylinder, so that the wafer can not be crushed due to overlarge clamping force, and the wafer can not be fixed due to too small clamping force; after the clamping device clamps the wafer, the V-shaped groove part on the wafer is tightly attached to polishing cloth, the device swings around a rotating shaft within a certain angle along with the swinging arm, and the polishing cloth polishes the upper surface, the middle surface and the lower surface of the V-shaped groove part; the clamping angles of the front clamping block and the rear clamping block are designed according to the edge angle of the wafer, and the front clamping block and the rear clamping block can be tightly attached to the edge outline of the wafer when the wafer is clamped;
compared with the prior art, the utility model has the technical effects that:
1. the utility model discloses a be the centre gripping mode, the upper and lower surface of contactless wafer has reduced the damage to the upper and lower surface of wafer.
2. The utility model discloses a centre gripping mode control through the cylinder and open and shut, the pressure of cylinder is adjustable, just so can control the clamping-force of wafer effectively, can fix the wafer effectively and can not cause the wafer piece again.
3. The utility model discloses install the washing nozzle on clamping device, the wafer polishing is accomplished the back, and the surface that the pure water that the washing nozzle sprays can effectively wash the wafer improves the polishing quality of wafer.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a top view of the present invention;
fig. 3 is a schematic diagram of the wafer and the clamping block according to the present invention.
Reference numerals: 1-swing arm, 2-support seat, 3-clamping device, 4-wafer, 5-V groove polishing cloth, 6-clamping installation seat, 7-connecting block, 8-guide rod, 9-rear clamping block, 10-cleaning nozzle, 11-clamping cylinder, 12-connecting shaft and 13-front clamping block.
Detailed Description
The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings.
As shown in FIG. 1, a wafer clamping device, a clamping device 3 is mounted on a support base 2, and the support base 2 is connected with a swing arm 1. The swing arm 1 can swing up and down around a rotating shaft under the driving of a servo motor.
As shown in fig. 2, the clamping device 3 includes a clamping mount 6, a clamping cylinder 11, a rear clamping block 9 and a front clamping block 13. Wherein the centre gripping cylinder 11 is fixed in 6 front sides of centre gripping mount pads, and the piston rod of centre gripping cylinder 11 is connected with connecting block 7, and the front end of two guide bars 8 is fixed on connecting block 7, and the rear end is connected with back grip block 9, and under the drive of centre gripping cylinder 11, back grip block 9 can the round trip movement. The connecting shaft 12 is fixed on the rear side of the clamping mounting seat 6, and the front clamping block 13 is mounted on the connecting shaft 12 through bolts. Four cleaning nozzles 10 are further provided on the upper end surface of the chuck mount 6 for cleaning the polished wafer 4.
As shown in fig. 3, the front holding block 13 and the rear holding block 9 are oppositely arranged, and the shape and holding angle of the holding surface are matched with the edge of the wafer 4, so that the holding blocks can tightly fit the edge of the wafer when holding. The front clamping block 13 and the rear clamping block 9 both comprise two clamping jaws separated by a certain distance, the V-shaped groove of the wafer 4 can be arranged between the two clamping jaws, and the V-shaped groove is polished by the V-shaped groove polishing cloth 5.
Finally, it is to be noted that the above-mentioned embodiments are only specific embodiments of the present invention. Obviously, the present invention is not limited to the above embodiments, and many variations are possible. All modifications which can be derived or suggested by a person skilled in the art from the disclosure of the invention should be considered as within the scope of the invention.
Claims (3)
1. A clamping device for a wafer is characterized in that the clamping device is arranged on a supporting seat, the supporting seat is connected with a swing arm, and the swing arm can swing up and down under the driving of a servo motor;
the clamping device comprises a clamping mounting seat, a clamping cylinder, a rear clamping block and a front clamping block; the clamping cylinder is fixed on the front side of the clamping mounting seat, a piston rod of the cylinder is connected with the connecting block, one end of each of two guide rods arranged in parallel is fixed on the connecting block, and the other end of each guide rod is connected with the rear clamping block; the back side of the clamping mounting seat is fixedly arranged on the connecting shaft, the front clamping block is arranged on the connecting shaft through being arranged on the connecting shaft, the front clamping block and the back clamping block are arranged oppositely, and the shape and the angle of a clamping surface are matched with the outer edge of the wafer.
2. A wafer clamping apparatus as recited in claim 1, wherein said front clamping block is bolted to said spindle.
3. A wafer clamping apparatus as recited in claim 1, wherein said clamp mount further includes four cleaning nozzles for cleaning a polished wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023305098.1U CN214123857U (en) | 2020-12-31 | 2020-12-31 | Clamping device for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023305098.1U CN214123857U (en) | 2020-12-31 | 2020-12-31 | Clamping device for wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214123857U true CN214123857U (en) | 2021-09-03 |
Family
ID=77486511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023305098.1U Active CN214123857U (en) | 2020-12-31 | 2020-12-31 | Clamping device for wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214123857U (en) |
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2020
- 2020-12-31 CN CN202023305098.1U patent/CN214123857U/en active Active
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