CN214109259U

CN214109259U - Laser processing device with adsorption structure

Info

Publication number: CN214109259U
Application number: CN202023289817.5U
Authority: CN
Inventors: 代磊磊
Original assignee: Shenzhen Yingqi Photoelectric Technology Co ltd
Current assignee: Shenzhen Yingqi Photoelectric Technology Co ltd
Priority date: 2020-12-31
Filing date: 2020-12-31
Publication date: 2021-09-03
Anticipated expiration: 2030-12-31

Abstract

The utility model belongs to the technical field of laser beam machining equipment, a laser beam machining device with adsorption structure is provided, including the processing platform, the central zone of workstation is equipped with the laser cutting head and is used for driving laser cutting head pivoted first actuating mechanism, first actuating mechanism and processing platform fixed connection, first absorption hole and second absorption hole have been seted up to the bilateral symmetry of processing platform, first cavity has been seted up to the inside of processing platform, and first cavity lateral wall and first absorption hole and second absorption hole correspond the position respectively seal installation have first sucking disc and second sucking disc, first absorption hole and first sucking disc intercommunication, second absorption hole and first sucking disc intercommunication, first sucking disc and second sucking disc are connected first communicating pipe and second communicating pipe respectively, and first communicating pipe and second communicating pipe pass through tee bend solenoid valve and connect the exhaust tube. The utility model discloses a laser beam machining device with adsorption structure improves laser beam machining's work efficiency.

Description

Laser processing device with adsorption structure

Technical Field

The utility model relates to a laser beam machining equipment technical field, concretely relates to laser beam machining device with adsorption structure.

Background

Laser processing is carried out by focusing the energy of light through a lens to achieve high energy density at a focus and relying on the photothermal effect. The laser processing can meet various treatments such as punching, cutting, scribing, welding, heat treatment and the like, so the application range is very wide.

In the laser processing device course of work, need to treat the machined part with fixture and carry out the centre gripping and fix, because fixture is fixed through rigid contact mostly treats the machined part, lead to treating the machined part and produce certain damage, consequently, produced one kind and fixed the laser processing device who treats the machined part through adsorption structure, nevertheless, this kind of laser processing device's work efficiency is lower, awaits urgently and improves.

SUMMERY OF THE UTILITY MODEL

To the defect among the prior art, the utility model provides a pair of laser beam machining device with adsorption structure improves laser beam machining's work efficiency.

In order to solve the technical problem, the utility model provides a following technical scheme:

a laser processing device with an adsorption structure comprises a processing table, wherein a laser cutting head and a first driving mechanism for driving the laser cutting head to rotate are arranged in the central area of the processing table, the first driving mechanism is fixedly connected with the processing table, first absorption hole and second absorption hole have been seted up symmetrically to the both sides of processing platform, first cavity has been seted up to the inside of processing platform, and the position that first cavity lateral wall and first absorption hole and second absorption hole correspond is sealed respectively and is installed first sucking disc and second sucking disc, first absorption hole and first sucking disc intercommunication, second absorption hole and first sucking disc intercommunication, first communicating pipe and second communicating pipe are connected respectively to first sucking disc and second sucking disc, first communicating pipe and second communicating pipe pass through three-way solenoid valve and connect the exhaust tube, exhaust tube and vacuum pump connection, vacuum pump, three-way solenoid valve and first actuating mechanism all are connected with the PLC controller electricity.

Further, first actuating mechanism includes driving motor, driving motor and processing platform fixed connection, and coaxial coupling has the driving gear on driving motor's the output shaft, and laser cutting head's bottom fixed mounting has the pivot, pivot and processing platform fixed connection, coaxial coupling has driven gear in the pivot, and the driving gear meshes with driven gear, and driving motor is connected with the PLC controller electricity.

Further, the processing platform is located the both sides of first cavity and has seted up the second cavity symmetrically, is equipped with the movable plate in the second cavity and is used for driving the second actuating mechanism that the movable plate position removed, the lateral wall fixed connection of second actuating mechanism and second cavity, the one end and the second actuating mechanism drive of movable plate are connected, the other end of movable plate passes through the through-hole on the second cavity lateral wall and extends to the outside of second cavity, fixed mounting has the kickboard on the movable plate, the top of kickboard extends to the top of processing platform, second actuating mechanism is connected with the PLC controller electricity.

Furthermore, the second driving mechanism is a servo electric cylinder, and the servo electric cylinder is electrically connected with the PLC.

Furthermore, a sliding block is fixedly mounted at the top of the moving plate, a sliding groove is formed in the position, corresponding to the sliding block, of the second cavity, and the sliding block is arranged in the sliding groove.

According to the above technical scheme, the beneficial effects of the utility model are that: in the processing process, a workpiece to be processed is placed at a first adsorption hole and a second adsorption hole, a PLC controller controls a first driving mechanism to drive a laser cutting head to rotate to the first adsorption hole, meanwhile, the PLC controller controls a vacuum pump to start working and controls the side of a first communicating pipe of a three-way electromagnetic valve to be opened, a first suction disc is vacuumized, the workpiece to be processed is fixed on a processing table under the action of the first suction disc and the first adsorption hole, and after the laser cutting head finishes processing the workpiece to be processed at the first adsorption hole, the side of the first suction disc is deflated through an exhaust valve, so that the processed workpiece is taken down and put into the workpiece to be processed again; the first driving mechanism is controlled by the PLC to drive the laser cutting head to rotate to the position of the second adsorption hole, meanwhile, the PLC controls the second communicating pipe side of the three-way electromagnetic valve to be opened, the second sucker is vacuumized, the workpiece to be machined is fixed on the machining table under the action of the second sucker and the second adsorption hole, the laser cutting head finishes machining of the workpiece to be machined at the position of the second adsorption hole, the second sucker side is deflated through the exhaust valve, the machined workpiece is taken down and put into the workpiece to be machined again, in the process, the laser cutting head is alternately switched and machined at the position of the first adsorption hole and the position of the second adsorption hole, the PLC alternately controls the first sucker and the second sucker to be in a vacuum state, the time consumed by placing the workpiece to be machined and taking down the workpiece to be machined is avoided, and the working efficiency of laser machining is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.

Fig. 1 is a sectional view of the present invention.

Reference numerals:

1-a processing table; 2-laser cutting head;

11-a first adsorption hole; 12-a second adsorption well; 13-a drive motor; 14-a rotating shaft; 15-a first cavity; 16-a second cavity;

131-a drive gear; 141-driven gear; 151-first suction cup; 152-a second suction cup; 153-a first communication pipe; 154-second communication tube; 155-an exhaust pipe; 156-vacuum pump; 157-three-way solenoid valve; 161-servo electric cylinder; 162-moving the plate; 163-a push plate; 164-a slider; 165-chute.

Detailed Description

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.

Referring to fig. 1, the laser processing apparatus with an absorption structure provided in this embodiment includes a processing table 1, a laser cutting head 2 and a first driving mechanism for driving the laser cutting head 2 to rotate are disposed in a central region of the processing table 1, the first driving mechanism is fixedly connected to the processing table 1, first absorption holes 11 and second absorption holes 12 are symmetrically disposed on two sides of the processing table 1, a first cavity 15 is disposed inside the processing table 1, positions of a sidewall of the first cavity 15 corresponding to the first absorption holes 11 and the second absorption holes 12 are respectively and hermetically mounted with a first suction cup 151 and a second suction cup 152, the first absorption holes 11 are communicated with the first suction cup 151, the second absorption holes 12 are communicated with the first suction cup 151, the first suction cup 151 and the second suction cup 152 are respectively connected to a first communicating pipe 153 and a second communicating pipe 154, the first communicating pipe 153 and the second communicating pipe 154 are connected to an exhaust pipe 155 through a three-way electromagnetic valve 157, the extraction pipe 155 is connected with the vacuum pump 156, the three-way electromagnetic valve 157 and the first driving mechanism are all electrically connected with the PLC controller, and the laser cutting head 2 is the prior art, so that the description is omitted.

In practical use, in the processing process, a workpiece to be processed is placed at the first adsorption hole 11 and the second adsorption hole 12, the first driving mechanism is controlled by the PLC to drive the laser cutting head 2 to rotate to the first adsorption hole 11, meanwhile, the PLC controls the vacuum pump 156 to start working and controls the first communication pipe 153 side of the three-way electromagnetic valve 157 to be opened, the first suction disc 151 is vacuumized, the workpiece to be processed is fixed on the processing table 1 through the action of the first suction disc 151 and the first adsorption hole 11, and after the workpiece to be processed at the first adsorption hole 11 is processed by the laser cutting head 2, the first suction disc 151 side is deflated through the exhaust valve, so that the processed workpiece is taken down and put into the workpiece to be processed again; the first driving mechanism is controlled by the PLC controller to drive the laser cutting head 2 to rotate to the second adsorption hole 12, meanwhile, the PLC controller controls the second connection pipe 154 side of the three-way solenoid valve 157 to be opened, the second suction cup 152 is vacuumed, the workpiece to be processed is fixed on the processing table 1 through the action of the second suction cup 152 and the second suction hole 12, after the workpiece to be processed at the second suction hole 12 is processed by the laser cutting head 2, the second suction cup 152 side is deflated through the exhaust valve, therefore, the processed workpiece is taken down and put into the workpiece to be processed again, in the process, the laser cutting head 2 is switched and processed alternately at the first adsorption hole 11 and the second adsorption hole 12, the PLC controls the first adsorption disc 151 and the second adsorption disc 152 to be in a vacuum state alternately, time consumed by placing the workpiece to be processed and taking down the workpiece to be processed is avoided, and the working efficiency of laser processing is improved.

In this embodiment, the first driving mechanism includes a driving motor 13, the driving motor 13 is fixedly connected to the processing table 1, an output shaft of the driving motor 13 is coaxially connected to a driving gear 131, a bottom end of the laser cutting head 2 is fixedly mounted with a rotating shaft 14, the rotating shaft 14 is fixedly connected to the processing table 1, the rotating shaft 14 is coaxially connected to a driven gear 141, the driving gear 131 is engaged with the driven gear 141, and the driving motor 13 is electrically connected to the PLC controller.

In actual use, the PLC controller controls the driving motor 13 to work, so as to drive the driving gear 131 to rotate, and the driving gear 131 drives the driven gear 141 to rotate, thereby controlling the rotation angle of the laser cutting head 2.

In this embodiment, the processing table 1 is disposed at two sides of the first cavity 15 and symmetrically provided with second cavities 16, a moving plate 162 and a second driving mechanism for driving the moving plate 162 to move are disposed in the second cavities 16, the second driving mechanism is fixedly connected to a sidewall of the second cavity 16, one end of the moving plate 162 is drivingly connected to the second driving mechanism, the other end of the moving plate 162 passes through a through hole in the sidewall of the second cavity 16 and extends to the outside of the second cavity 16, a pushing plate 163 is fixedly mounted on the moving plate 162, a top end of the pushing plate 163 extends to the upper side of the processing table 1, and the second driving mechanism is electrically connected to the PLC controller.

In practical use, when the workpiece to be processed is placed on the processing table 1, the PLC controller controls the second driving mechanism to shorten, so as to drive the moving plate 162 and the pushing plate 163 to approach the processing table 1, and push the workpiece to be processed to move to the first absorption hole 11 until the workpiece to be processed is pushed to a specified position, so that the position of the workpiece to be processed is adjusted.

In this embodiment, the second driving mechanism is the servo electric cylinder 161, the telescopic distance of the servo electric cylinder 161 is adjustable, the applicability is strong, and the servo electric cylinder 161 is electrically connected with the PLC controller.

In this embodiment, a sliding block 164 is fixedly installed on the top of the moving plate 162, a sliding groove 165 is formed in the second cavity 16 corresponding to the sliding block 164, and the sliding block 164 is disposed in the sliding groove 165.

In practical use, when the second driving mechanism drives the moving plate 162 to move, the slider 164 moves along the sliding groove 165, so as to maintain the stability of the moving plate 162 during moving.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be covered by the claims and the specification.

Claims

1. A laser processing device with an adsorption structure comprises a processing table (1), and is characterized in that: the central area of the processing table is provided with a laser cutting head (2) and a first driving mechanism for driving the laser cutting head (2) to rotate, the first driving mechanism is fixedly connected with the processing table (1), the two sides of the processing table (1) are symmetrically provided with a first adsorption hole (11) and a second adsorption hole (12), the processing table (1) is internally provided with a first cavity (15), the side wall of the first cavity (15) is respectively provided with a first sucker (151) and a second sucker (152) in a sealing way at the positions corresponding to the first adsorption hole (11) and the second adsorption hole (12), the first adsorption hole (11) is communicated with the first sucker (151), the second adsorption hole (12) is communicated with the first sucker (151), the first sucker (151) and the second sucker (152) are respectively connected with a first communicating pipe (153) and a second communicating pipe (154), the first communicating pipe (153) and the second communicating pipe (154) are connected with an exhaust pipe (155) through a three-way electromagnetic valve (157), the air extraction pipe (155) is connected with a vacuum pump (156), and the vacuum pump (156), the three-way electromagnetic valve (157) and the first driving mechanism are all electrically connected with the PLC.

2. The laser processing apparatus having an adsorption structure according to claim 1, wherein: the first driving mechanism comprises a driving motor (13), the driving motor (13) is fixedly connected with the machining table (1), a driving gear (131) is coaxially connected to an output shaft of the driving motor (13), a rotating shaft (14) is fixedly installed at the bottom end of the laser cutting head (2), the rotating shaft (14) is fixedly connected with the machining table (1), a driven gear (141) is coaxially connected to the rotating shaft (14), the driving gear (131) is meshed with the driven gear (141), and the driving motor (13) is electrically connected with the PLC.

3. The laser processing apparatus having an adsorption structure according to claim 2, wherein: processing platform (1) is located the both sides symmetry of first cavity (15) and has seted up second cavity (16), be equipped with movable plate (162) in second cavity (16) and be used for driving the second actuating mechanism that movable plate (162) position moved, the lateral wall fixed connection of second actuating mechanism and second cavity (16), the one end and the second actuating mechanism drive of movable plate (162) are connected, the other end of movable plate (162) passes the through-hole on second cavity (16) lateral wall and extends to the outside of second cavity (16), fixed mounting has catch plate (163) on movable plate (162), the top of catch plate (163) extends to the top of processing platform (1), second actuating mechanism is connected with the PLC controller electricity.

4. A laser processing apparatus having an adsorption structure according to claim 3, wherein: the second driving mechanism is a servo electric cylinder (161), and the servo electric cylinder (161) is electrically connected with the PLC.

5. A laser processing apparatus having an adsorption structure according to claim 3, wherein: the top of the moving plate (162) is fixedly provided with a sliding block (164), the second cavity (16) is provided with a sliding groove (165) corresponding to the sliding block (164), and the sliding block (164) is arranged in the sliding groove (165).