CN214069082U - Heat dissipation device based on semiconductor cooler and laser light source - Google Patents
Heat dissipation device based on semiconductor cooler and laser light source Download PDFInfo
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- CN214069082U CN214069082U CN202023309169.5U CN202023309169U CN214069082U CN 214069082 U CN214069082 U CN 214069082U CN 202023309169 U CN202023309169 U CN 202023309169U CN 214069082 U CN214069082 U CN 214069082U
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Abstract
The utility model relates to a heat abstractor technical field provides a heat abstractor and laser source based on semiconductor cooler, and this heat abstractor includes: the heat conducting plate is used for being connected with the light source component; the refrigerating end of the semiconductor refrigerator is attached to the surface of the heat conducting plate; the heat dissipation assembly comprises a base, a heat pipe, a first heat conduction block and a second heat conduction block, wherein an evaporation section of the heat pipe is connected with the first heat conduction block, a condensation section of the heat pipe is connected with the second heat conduction block, the second heat conduction block is connected with the base, and a heating end of the semiconductor refrigerator is attached to the surface of the first heat conduction block. The utility model discloses well light source subassembly passes through the heat-conducting plate and contacts with the semiconductor cooler, has shortened the heat-conduction distance between light source subassembly and the semiconductor cooler, ensures that light source subassembly operating temperature is even, and the output wavelength of light source subassembly is stable, and has improved the radiating effect, improves refrigeration efficiency, reduces the refrigeration energy consumption.
Description
Technical Field
The utility model relates to a heat abstractor technical field, more specifically say, relate to a heat abstractor and laser source based on semiconductor cooler.
Background
The semiconductor laser has the advantages of small volume, light weight, high reliability, long service life, low power consumption and the like, and is widely applied to various fields of national economy at present. The optical fiber laser is a laser using rare earth element doped glass optical fiber as a gain medium, and has a very wide application range, including laser optical fiber communication, military and national defense safety, medical equipment, industrial manufacturing and the like. Both semiconductor lasers and fiber lasers are very sensitive to temperature, and especially red laser tubes generally require a standard working temperature of a light source base to be 25 ℃ and at most not to exceed 30 ℃. And the laser pipe all can produce the heat at the working process, in order to ensure that the laser pipe works under suitable temperature, need in time dispel the heat that the laser pipe produced.
When radiating the laser tube in the prior art, the base is usually designed to be in an L shape, one end of the base is used for connecting the laser tube, and the other end of the base is used for being connected with a semiconductor refrigerator, so that the laser tube is radiated through the semiconductor refrigerator. However, the distance from each laser tube to the semiconductor cooler is different, so that the conduction thermal resistance of each laser tube is different, the working temperature of each laser tube is greatly different, the overall heat dissipation effect is poor, and the output wavelength of the laser light source is unstable.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat abstractor and laser light source based on semiconductor cooler to solve the not good technical problem of current heat abstractor radiating effect.
In order to achieve the above object, the utility model adopts the following technical scheme:
in one aspect, the utility model provides a heat abstractor based on semiconductor cooler, include:
the heat conducting plate is used for being connected with the light source component;
the refrigerating end of the semiconductor refrigerator is attached to the surface of the heat conducting plate;
the heat dissipation assembly comprises a base, a heat pipe, a first heat conduction block and a second heat conduction block, wherein an evaporation section of the heat pipe is connected with the first heat conduction block, a condensation section of the heat pipe is connected with the second heat conduction block, the second heat conduction block is connected with the base, and a heating end of the semiconductor refrigerator is attached to the surface of the first heat conduction block.
In one embodiment, the first heat conduction block and the second heat conduction block are respectively arranged on two opposite sides of the base, and the first heat conduction block and the bottom plate form an L-shaped structure.
In one embodiment, the first heat conduction block, the second heat conduction block and the base form an integral structure, and the bottom surface of the second heat conduction block and the bottom surface of the base are coplanar to form a heat sink surface.
In one embodiment, the heat dissipation device further comprises a fan assembly, the fan assembly is arranged on the outer side of the heat sink surface, and the fan surface of the fan assembly faces the heat sink surface.
In one embodiment, the heat dissipation device further comprises a liquid cooling assembly, and the liquid cooling assembly is arranged on the outer side of the surface of the heat sink and attached to the surface of the heat sink.
In one embodiment, the base is provided with a mounting hole.
On the other hand, the utility model also provides a laser light source, including first light source subassembly and first heat abstractor, first heat abstractor is foretell heat abstractor based on the semiconductor cooler, first light source subassembly is located the surface of heat-conducting plate.
In one embodiment, the first light source assembly is a red light source assembly, the laser light source further comprises a second light source assembly, the second light source assembly is a green light source assembly or a blue light source assembly;
the second light source assembly is arranged on the surface of the heat conducting plate of the first heat radiating device;
or, the laser light source further includes a second heat sink, and the second heat sink includes:
the heat conducting plate is used for being connected with the second light source component;
the heat dissipation assembly comprises a base, a heat pipe, a first heat conduction block and a second heat conduction block, wherein an evaporation section of the heat pipe is connected with the first heat conduction block, a condensation section of the heat pipe is connected with the second heat conduction block, the second heat conduction block is connected with the base, and the heat conduction plate is attached to the surface of the first heat conduction block.
In one embodiment, the laser light source further comprises a third light source assembly, wherein the third light source assembly is a blue light source assembly or a green light source assembly, and the third light source assembly and the second light source assembly are used for generating light beams with different colors;
the third light source assembly is arranged on the surface of the heat conducting plate of the first heat radiating device;
or the third light source assembly is arranged on the surface of the heat conducting plate of the second heat radiating device.
In one embodiment, the first light source assembly, the second light source assembly, and the third light source assembly each include:
a laser tube unit including at least one laser tube;
the laser tube unit is arranged in the light source base;
the light source circuit board is electrically connected with the laser tube unit, and a heat conduction insulating layer is arranged between the light source circuit board and the heat conduction plate.
In one embodiment, the laser light source further comprises:
the light emitting component is connected with the laser tube unit and is provided with a light outlet;
the light emitting component base is connected with the light emitting component;
and the light source circuit board and the semiconductor refrigerator are electrically connected with the electrical interface.
The utility model provides a heat abstractor and laser light source's beneficial effect based on semiconductor cooler lies in at least:
(1) the utility model discloses well light source subassembly passes through the heat-conducting plate and contacts with the semiconductor cooler, has greatly shortened the heat-conduction distance between light source subassembly and the semiconductor cooler, is favorable to the heat of light source subassembly to conduct rapidly to the semiconductor cooler to further conduct the heat to the second heat conduction piece through first heat conduction piece and heat pipe, improve the radiating effect, improve refrigeration efficiency, reduce the refrigeration energy consumption.
(2) Because the distance between each laser tube in the laser tube array of the light source component and the semiconductor refrigerator is the same, the conduction thermal resistance is the same, the working temperature of each laser tube is ensured to be uniform, the output wavelength of the laser tube array of the light source component is stable, and the optical output effect is good.
(3) Because each laser tube in the laser tube array of the light source component is contacted with the semiconductor refrigerator, the distances between different laser tubes in the laser tube array and the semiconductor refrigerator are the same, and the whole heat distribution is uniform, so that the refrigeration load of each part is uniform, the working temperature of the semiconductor refrigerator is uniform, the working state is stable, and the long-term reliable work of the semiconductor refrigerator is facilitated.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic diagram of an exemplary prior art laser light source;
fig. 2 is a schematic structural diagram of a heat dissipation device based on a semiconductor cooler according to an embodiment of the present invention;
fig. 3 is an exploded schematic view of a heat dissipation device based on a semiconductor cooler according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a laser light source provided in an embodiment of the present invention;
fig. 5 is a schematic diagram of an explosion structure of an embodiment of a laser light source provided in the embodiment of the present invention;
fig. 6 is a schematic diagram of an explosion structure of another embodiment of the laser light source provided by the embodiment of the present invention.
Wherein, in the figures, the respective reference numerals:
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are for convenience of description only and not to be construed as limiting the technical solution. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
In order to ensure the normal and stable operation of the laser light source and to ensure the stable output wavelength, a semiconductor cooler (TEC) is currently used to perform high-precision temperature control on the laser light source. Referring to fig. 1, in the prior art, a plurality of laser tubes are commonly used as a laser light source for array arrangement to form a laser tube array 101. Since the laser tube is provided with electrical pins, it is usually necessary to make vias in the thermally conductive base 102 so that the electrical pins of the laser tube array pass through the vias and connect to the circuit board 103 disposed on the other side of the thermally conductive base 102. Since the circuit board 103 occupies most of the contact area of the heat conductive base 102 with the heat sink, an "L" shaped base is formed by extending the heat conductive base 102 at 90 °, wherein the extension of the "L" shaped base contacts the cooling end of the semiconductor cooler 104, and the heating end of the semiconductor cooler 104 is used for heat dissipation.
However, the above heat dissipation structure has at least the following problems:
on one hand, the lengthened L-shaped base can cause different distances from the laser tubes in each row or each column in the laser tube array to the semiconductor cooler, so that the conduction thermal resistance is different, the working temperature difference of the laser tubes in each row or each column is larger, the optical output efficiency of each laser tube is different, the output wavelength of the laser tube array is unstable, and a good optical output effect is difficult to achieve.
On the other hand, the semiconductor refrigerator is formed by arranging the PN junction arrays, and the distances between the heat conducted by different lasers in the laser arrays and the PN junctions are large, the refrigeration load of the part far away is small, and the refrigeration load of the part near is large, so that the working temperature of the PN junction arrays is large, the working state is unstable, and the semiconductor refrigerator is not beneficial to control and long-term reliable work.
In addition, the extended L-shaped base also extends the distance from the laser tube array to the semiconductor refrigerator, so that the conduction thermal resistance between the refrigerating end of the semiconductor refrigerator and the laser tube array is increased, the temperature difference is increased, the actual refrigerating effect and the refrigerating efficiency of the semiconductor refrigerator on the laser tube are reduced, and the electric energy consumption is increased.
In order to improve the heat dissipation effect of the light source assembly, the present embodiment provides a new heat dissipation device based on a semiconductor cooler. Referring to fig. 2 and 3, a heat dissipation device (hereinafter, abbreviated as heat dissipation device) 20 based on a semiconductor cooler provided in this embodiment includes a heat conduction plate 21, a semiconductor cooler 22, and a heat dissipation assembly 23. The heat conducting plate 21 is used to connect with light source assemblies (including a first light source assembly, a second light source assembly, and a third light source assembly). The heat dissipation assembly 23 includes a base 231, a heat pipe 232, a first heat conduction block 233 and a second heat conduction block 234, an evaporation section of the heat pipe 232 is connected to the first heat conduction block 233, a condensation section of the heat pipe 232 is connected to the second heat conduction block 234, and the second heat conduction block 234 is connected to the base 231. The refrigerating end of the semiconductor refrigerator 22 is attached to the surface of the heat conductive plate 21, and the heating end of the semiconductor refrigerator is attached to the surface of the first heat conductive block 233.
The heat-conducting plate 21 may be made of a material having good heat conductivity, for example, a metal material, and when the light source assembly 30 generates heat, the heat is rapidly conducted to the heat-conducting plate 21. Meanwhile, as the heat conducting plate 21 has good heat conductivity as a whole, the heat can be distributed more uniformly, and the phenomenon of local overheating and local supercooling can not occur. The heat of the heat conducting plate 21 can be rapidly conducted to the cooling end of the semiconductor refrigerator 22, and the cooling end of the semiconductor refrigerator 22 absorbs the heat and then conducts the heat to the heating end, and then the heat is transferred to the first heat conducting block 233 through the heating end.
The heat pipe 232 is a heat transfer element with extremely high heat conductivity, transfers heat by evaporation and condensation of liquid in the totally-enclosed vacuum pipe by utilizing the fluid principles such as capillary action and the like, can play a role similar to refrigeration of a refrigerator compressor, and has the advantages of high heat conductivity, excellent isothermal property, heat flow density variability, heat flow direction reversibility, capability of transferring heat in a long distance and the like. The heat pipe comprises a pipe shell, a liquid absorption core and an end cover, wherein a proper amount of working liquid is filled after the pipe is pumped into a preset negative pressure, and the capillary porous material of the liquid absorption core tightly attached to the inner wall of the pipe shell is filled with the liquid and then sealed. One end of the heat pipe is an evaporation section, the other end of the heat pipe is a condensation section, and the heat pipe mainly comprises the following processes in the process of realizing heat transfer: the heat of the first heat conducting block 233 is transferred to the liquid-vapor interface through the tube wall of the heat pipe 232 and the wick filled with the working liquid, the working liquid is evaporated at the liquid-vapor interface in the evaporation section, the vapor in the vapor chamber flows from the evaporation section to the condensation section, the vapor is condensed at the vapor-liquid interface in the condensation section, the heat is transferred from the vapor-liquid interface to the second heat conducting block 234 through the wick, the liquid and the tube wall, and the condensed working liquid flows back to the evaporation section in the wick due to capillary action. Through the above processes, the heat of the first heat conduction block 233 can be transferred to the second heat conduction block 234, and the heat dissipation and cooling of the light source assembly 30 are realized.
The second heat conduction block 234 may be connected to an external refrigeration device to transfer and dissipate heat, or may be directly exposed to air through the second heat conduction block 234 to perform natural cooling to dissipate heat.
The heat dissipation device based on the semiconductor cooler provided by the embodiment has the beneficial effects that:
(1) in this embodiment, the light source module contacts with the semiconductor refrigerator 22 through the heat conducting plate 21, so that the heat conduction distance between the light source module and the semiconductor refrigerator 22 is greatly shortened, the heat of the light source module is rapidly conducted to the semiconductor refrigerator 22, and further the heat is conducted to the second heat conducting block 234 through the first heat conducting block 233 and the heat pipe 232, so that the heat dissipation effect is improved, the refrigeration efficiency is improved, and the refrigeration energy consumption is reduced.
(2) Because the distance between each laser tube in the laser tube array of the light source component and the semiconductor refrigerator 20 is the same, the conduction thermal resistance is the same, the working temperature of each laser tube is ensured to be uniform, the output wavelength of the laser tube array of the light source component is stable, and the optical output effect is good.
(3) Because each laser tube in the laser tube array of the light source component is contacted with the semiconductor refrigerator 20, the distances between different laser tubes in the laser tube array and the semiconductor refrigerator are the same, and the whole heat distribution is uniform, so that the refrigeration load of each part is uniform, the working temperature of the semiconductor refrigerator is uniform, the working state is stable, and the long-term reliable work of the semiconductor refrigerator is facilitated.
Referring to fig. 3, further, the first heat conduction block 233 and the second heat conduction block 234 are respectively disposed on two opposite sides of the base 231, and the first heat conduction block 233 and the base plate 231 form an "L" shaped structure. In the present embodiment, the first heat conduction block 233 in the "L" shaped structure is used for fixing with the light source assembly 30 and conducting heat to the light source assembly, and the bottom plate 231 in the "L" shaped structure is used for mounting and fixing other components of the laser light source. In order to fix other components, the bottom plate 231 is further provided with mounting holes 2310, and the number, position, size and shape of the mounting holes 2310 can be set as required. In order to better accommodate and fix the heat pipe 232, the evaporation section and the condensation section of the heat pipe 232 are perpendicular to each other, and accommodating holes are formed in the first heat conduction block 233 and the second heat conduction block 234, and the accommodating holes can be through holes or blind holes as long as the heat pipe 232 can be accommodated.
Further, the first and second heat-conducting blocks 233 and 234 and the base plate 231 may be manufactured in a manner selected as needed. For example, the first heat conduction block 233, the second heat conduction block 234, and the base plate 231 are manufactured separately and then mounted and fixed to form an integral body. For another example, referring to fig. 2, the first heat conducting block 233, the second heat conducting block 234 and the bottom plate 231 may be an integrated structure, which is integrally formed, and the evaporation section and the condensation section of the heat pipe 232 are respectively disposed in the accommodating holes of the first heat conducting block 233 and the second heat conducting block 234. When the first heat-conducting block 233, the second heat-conducting block 234 and the bottom plate 231 are of an integrated structure, the bottom surface of the second heat-conducting block 234 and the bottom surface of the base 231 are coplanar to form a heat sink surface, and the heat sink surface is used for heat dissipation of an external heat dissipation assembly, so that the heat dissipation efficiency is improved. The heat dissipation assembly can be arranged as required.
In one embodiment, the heat dissipation assembly may be a fan assembly, and the heat dissipation device 20 further includes a fan assembly disposed outside the heat sink surface, with the fan surface of the fan assembly facing the heat sink surface. Specifically, the fan assembly includes a bracket and a fan, wherein the bracket is fixedly connected to the second heat conduction block 234, the fan is fixedly connected to the bracket, and the fan surface of the fan faces the heat sink surface, so that the heat of the second heat conduction block 234 can be effectively blown away, and rapid heat dissipation is realized.
In one embodiment, the heat dissipation assembly may be a liquid cooling assembly, and in this case, the heat dissipation device 20 further includes a liquid cooling assembly disposed outside the heat sink surface and attached to the heat sink surface, so as to ensure that the heat of the second heat conduction block 234 can be quickly conducted to the liquid cooling assembly, thereby realizing quick heat dissipation. The specific structure of the liquid cooling assembly can be set as required. For example, the liquid cooling assembly comprises a heating panel, the heating panel is attached to the surface of the heat sink, a liquid cooling runner is arranged on the surface of the heating panel or inside the heating panel, a liquid cooling pipe can be arranged in the liquid cooling runner, two ends of the liquid cooling pipe are connected with a cooling device, and liquid flows in the liquid cooling pipe to absorb heat.
Of course, in other embodiments, the liquid cooling assembly may be disposed in other manners, for example, the liquid cooling flow channel may be opened inside the second heat conducting block 234, wherein a liquid cooling pipe is disposed, two ends of the liquid cooling pipe are connected to the cooling device, and the liquid flows in the liquid cooling pipe to absorb heat.
Referring to fig. 2, the present embodiment is further directed to a laser light source, which includes a first light source assembly 30 and a first heat sink, the first heat sink is the heat sink 20 based on the semiconductor cooler, and the first light source assembly 30 is disposed on the surface of the heat conducting plate 21 of the heat sink 20.
The specific type of the first light source assembly 30 can be set as required, and can be a red light source assembly, a green light source assembly or a blue light source assembly. The number of the first light source assemblies 30 and the first heat dissipation devices may be set as needed. For example, the number of the first light source assemblies 30 may be one, and the number of the first heat dissipation devices on which the first light source assemblies 30 are disposed corresponds to one. For another example, the number of the first light source assemblies 30 may be multiple, the number of the first heat dissipation devices is one, and the multiple first light source assemblies 30 are disposed on the first heat dissipation devices. For another example, the number of the first light source assemblies 30 may be multiple, the number of the first heat dissipation devices corresponds to the number of the first light source assemblies, and each first light source assembly 30 is disposed on one first heat dissipation device. When the number of the first light source assemblies 30 is plural, the types of the first light source assemblies 30 may be the same (for example, all the first light source assemblies are red light source assemblies, green light source assemblies or blue light source assemblies, and at this time, the types are monochromatic laser light sources), or may be different (for example, two or three of the red light source assemblies, the green light source assemblies and the blue light source assemblies, and at this time, the types are multicolor laser light sources), and the present disclosure is not limited thereto.
Because the laser subassembly, especially ruddiness light source subassembly is very sensitive to the temperature, therefore when first light source subassembly 30 is ruddiness light source subassembly, adopt heat abstractor 20 based on the semiconductor refrigerator to dispel the heat to it, first light source subassembly 30 passes through heat-conducting plate 21 and contacts with semiconductor refrigerator 22, greatly shortened the heat-conduction distance between light source subassembly 30 and the semiconductor refrigerator 22, the heat that is favorable to light source subassembly 30 conducts to semiconductor refrigerator 22 rapidly, and further conduct the heat to second heat-conducting block 234 through first heat-conducting block 233 and heat pipe 232, improve the radiating effect, improve refrigeration efficiency, reduce the refrigeration energy consumption.
For the green light source assembly and the blue light source assembly, the heat dissipation device 20 based on the semiconductor cooler can be used for heat dissipation, and other heat dissipation devices can be used for heat dissipation.
Referring to fig. 5, in one embodiment, when the first light source assembly 30 is a red light source assembly, the laser light source further includes a second light source assembly 40, and the second light source assembly 40 is a green light source assembly or a blue light source assembly, in which case the laser light source is a dual-color laser light source. The laser light source further includes a second heat sink 50, and the second heat sink 50 includes a heat conductive plate 21 and a heat dissipation member 23. Wherein the heat conductive plate 21 is connected with the second light source assembly 40. The heat dissipation assembly 23 includes a base 231, a heat pipe 232, a first heat conduction block 233 and a second heat conduction block 234, an evaporation section of the heat pipe 232 is connected with the first heat conduction block 233, a condensation section of the heat pipe 232 is connected with the second heat conduction block 234, the second heat conduction block 234 is connected with the base 231, and the heat conduction plate 21 is attached to the surface of the first heat conduction block 233. That is, second heat sink 50 eliminates semiconductor cooler 22 as compared to first heat sink 30. By adopting the second heat dissipation device 50, a good heat dissipation effect can be achieved for the green light source component or the blue light source component, and the refrigeration energy consumption is reduced. Of course, in other embodiments, the second heat dissipation device 50 may have other structures, and is not limited to the above-mentioned cases.
Referring to fig. 6, in one embodiment, the first light source assembly 30 is a red light source assembly, the second light source assembly 40 is one of a green light source assembly and a blue light source assembly, the laser light source further includes a third light source assembly 60, the third light source assembly 60 is one of a blue light source assembly and a green light source assembly, the third light source assembly 60 and the second light source assembly 40 are used for generating light beams with different colors, and the laser light source is a three-color laser light source. The third light source assembly 60 is disposed on the surface of the second heat sink 50. It is understood that there may be one or more second heat sinks 50, and the second light source assembly 40 and the third light source assembly 60 may be disposed on the same second heat sink 50 or on different second heat sinks 50, which is not limited herein.
Referring to fig. 3, 5 and 6, in the present embodiment, the first light source assembly 30, the second light source assembly 40 and the third light source assembly 60 each include a laser tube unit 71, a light source base 72 and a light source circuit board 73. Wherein the laser tube unit 71 includes at least one laser tube, and when a plurality of laser tubes are included, the plurality of laser tubes are arranged in an array to form a laser tube array. The laser tube unit 71 is disposed in the light source base 72 and fixed by the light source base 72. The light source base 72 has a receiving portion on a side opposite to the laser tube unit 71, and the light source circuit board 73 is disposed in the receiving portion and electrically connected to the laser tube unit 71. Considering that the electrical performance is stable and safe, when the light source assembly 30 is arranged on the surface of the heat conducting plate 21, an electrical safety gap is arranged between the light source circuit board 73 and the heat conducting plate 21, and the heat conducting insulating layer is filled in the electrical safety gap, so that the insulating effect can be achieved, the electrical safety is ensured, and the heat conducting performance is good, and the heat of the light source assembly is rapidly conducted to the heat conducting plate 21.
Referring to fig. 4, in order to seal the light source assembly and the heat sink assembly 20 and improve the integrity of the laser light source, the laser light source further includes a housing 81, the housing 81 is disposed on the surface of the heat sink assembly 20, and the heat dissipation surfaces of the first heat conduction block 233 and the second heat conduction block 234 are used as outer surfaces for dissipating heat. The laser light source also includes an exit assembly 82, an exit assembly mount 83, and an electrical interface 84. The light-emitting assembly 82 is fixedly disposed on the surface of the light-emitting assembly base 83, and is provided with a light-emitting port 821, and the light-emitting assembly 82 is connected to the laser tube unit 71, so as to ensure that the light beam generated by the laser tube unit 71 can be emitted through the light-emitting port 51 of the light-emitting assembly 82. The housing 81 is opened with an opening, the electrical interface 84 is disposed in the housing 81 and extends to the outside of the housing 81 through the opening, and both the light source circuit board 73 and the semiconductor refrigerator 22 are connected to the electrical interface 84 so as to be electrically connected to other external components through the electrical interface 84, for example, a power source or a controller can be connected, and the disclosure is not limited herein. It is understood that, in order to ensure the sealing performance, the sealing treatment is performed at the joints of the housing 81 and each component, and the sealing mode can be set as required.
The laser light source provided by the embodiment has the beneficial effects that:
(1) the light source subassembly of laser light source passes through heat-conducting plate 21 and semiconductor cooler 22 contact in this embodiment, has greatly shortened the heat-conduction distance between light source subassembly and the semiconductor cooler 22, is favorable to the heat of light source subassembly to conduct to semiconductor cooler 22 rapidly to further conduct the heat to second heat-conducting block 234 through first heat-conducting block 233 and heat pipe 232, improve the radiating effect, improve refrigeration efficiency, reduce the refrigeration energy consumption.
(2) Because the distance between each laser tube in the laser tube array of the light source component and the semiconductor refrigerator 20 is the same, the conduction thermal resistance is the same, the working temperature of each laser tube is ensured to be uniform, the output wavelength of the laser tube array of the light source component is stable, and the optical output effect is good.
(3) When first light source subassembly 30 is as ruddiness light source subassembly, each laser pipe and the contact of semiconductor cooler 20 in its laser pipe array, different laser pipes are the same with semiconductor cooler's distance in the laser pipe array, and setting up of heat-conducting plate 21 makes whole heat distribution even to make the refrigeration load of each part even, semiconductor cooler's operating temperature is even, and operating condition is stable, is favorable to semiconductor cooler's stable control, accurate accuse temperature, and then is favorable to laser light source's reliable work for a long time.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A heat dissipation device based on a semiconductor cooler is characterized by comprising:
the heat conducting plate is used for being connected with the light source component;
the refrigerating end of the semiconductor refrigerator is attached to the surface of the heat conducting plate;
the heat dissipation assembly comprises a base, a heat pipe, a first heat conduction block and a second heat conduction block, wherein an evaporation section of the heat pipe is connected with the first heat conduction block, a condensation section of the heat pipe is connected with the second heat conduction block, the second heat conduction block is connected with the base, and a heating end of the semiconductor refrigerator is attached to the surface of the first heat conduction block.
2. The semiconductor cooler-based heat dissipation device according to claim 1, wherein the first heat conduction block and the second heat conduction block are respectively disposed at two opposite sides of the base, and the first heat conduction block and the base form an "L" shaped structure.
3. The semiconductor cooler-based heat dissipation device according to claim 2, wherein the first heat conduction block, the second heat conduction block and the base form an integrated structure, and a bottom surface of the second heat conduction block and a bottom surface of the base are coplanar to form a heat sink surface.
4. The semiconductor cooler-based heat dissipation device according to claim 3, further comprising a fan assembly disposed outside the heat sink surface with a fan face of the fan assembly facing the heat sink surface;
or, the heat dissipation device further comprises a liquid cooling assembly, wherein the liquid cooling assembly is arranged on the outer side of the surface of the heat sink and attached to the surface of the heat sink.
5. The heat dissipating device according to claim 1, wherein the base has a mounting hole.
6. A laser light source, comprising a first light source component and a first heat sink, wherein the first heat sink is the heat sink based on a semiconductor cooler of any one of claims 1 to 5, and the first light source component is disposed on the surface of the heat conducting plate.
7. The laser light source of claim 6, wherein the first light source assembly is a red light source assembly, the laser light source further comprising a second light source assembly that is a green light source assembly or a blue light source assembly;
the second light source assembly is arranged on the surface of the heat conducting plate of the first heat radiating device;
or, the laser light source further includes a second heat sink, and the second heat sink includes:
the heat conducting plate is used for being connected with the second light source component;
the heat dissipation assembly comprises a base, a heat pipe, a first heat conduction block and a second heat conduction block, wherein an evaporation section of the heat pipe is connected with the first heat conduction block, a condensation section of the heat pipe is connected with the second heat conduction block, the second heat conduction block is connected with the base, and the heat conduction plate is attached to the surface of the first heat conduction block.
8. The laser light source of claim 7, further comprising a third light source module, wherein the third light source module is a blue light source module or a green light source module, and the third light source module and the second light source module are configured to generate light beams of different colors;
the third light source assembly is arranged on the surface of the heat conducting plate of the first heat radiating device;
or the third light source assembly is arranged on the surface of the heat conducting plate of the second heat radiating device.
9. The laser light source of claim 8, wherein the first, second, and third light source modules each comprise:
a laser tube unit including at least one laser tube;
the laser tube unit is arranged in the light source base;
the light source circuit board is electrically connected with the laser tube unit, and a heat conduction insulating layer is arranged between the light source circuit board and the heat conduction plate.
10. The laser light source of claim 9, further comprising:
the light emitting component is connected with the laser tube unit and is provided with a light outlet;
the light emitting component base is connected with the light emitting component;
and the light source circuit board and the semiconductor refrigerator are electrically connected with the electrical interface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023309169.5U CN214069082U (en) | 2020-12-31 | 2020-12-31 | Heat dissipation device based on semiconductor cooler and laser light source |
Applications Claiming Priority (1)
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