CN213985510U

CN213985510U - Pressure measuring mechanism of chip sensor

Info

Publication number: CN213985510U
Application number: CN202022819622.0U
Authority: CN
Inventors: 王颖杰
Original assignee: Huzhou Zhihe Technology Co ltd
Current assignee: Huzhou Zhihe Technology Co ltd
Priority date: 2020-11-30
Filing date: 2020-11-30
Publication date: 2021-08-17
Anticipated expiration: 2030-11-30

Abstract

The utility model relates to a pressure measuring mechanism of a chip sensor; the pressure measuring tool is arranged in the clamp assembly, the pressure jacking assembly applies pressure to the clamp assembly, and the pressure measuring tool is clamped and contracted by the clamp assembly so as to detect the pressure value range of the pressure measuring tool; accurately measuring the pressure range; and multiple sets of pressure values can be measured, thereby reducing errors.

Description

Pressure measuring mechanism of chip sensor

Technical Field

The utility model relates to a sensor detects technical field, concretely relates to chip sensor pressure measurement mechanism.

Background

When the sensor is subjected to analog test, the sensor is placed on a test platform of a testing machine, and then the test compression column can downwards press the pressed position of the sensor, so that the conducted signal output of the sensor is carried out. However, such a test requires that the test site of the sensor be placed on the test platform at the bottom of the test compression column. Often requiring multiple adjustments when the sensors are placed on the test platform.

At present, more and more sensors are small in shape and are arranged on a chip, if the pressed numerical range of sensor elements arranged on the chip is to be checked, if the chip is directly placed on a test platform and pressed through clamping, the pressed force cannot be well controlled, and the pressed range cannot be accurately calculated.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a chip sensor pressure measurement mechanism that can accurate detection.

In order to achieve the above object, the main technical solution of the present invention is a pressure measuring mechanism for a chip sensor, comprising a clamp assembly, a top pressing assembly located above the clamp assembly, and a pressure measuring tool for loading a chip, wherein the pressure measuring tool is disposed in the clamp assembly, the top pressing assembly applies pressure to the clamp assembly, and the pressure measuring tool is clamped and contracted by the clamp assembly to detect the pressure value range thereof.

In some examples, the clamp assembly comprises a frame, a workbench is arranged on the frame, two guide rods are fixedly connected to opposite angle ends of the workbench respectively, tops of the two guide rods are fixedly connected to two ends of a cross beam, the jacking assembly is arranged at the center of the cross beam, the clamp assembly further comprises a movable plate, the opposite angle ends of the movable plate are sleeved on the guide rods respectively, the movable plate and the workbench form a clamp, and the pressure measuring tool is arranged between the movable plate and the workbench.

In some examples, the capping assembly includes an output portion and a driving portion that drives the output portion to extend toward a top surface of the movable plate and to be pressed down against the movable plate by the output portion.

In some examples, the output part is a screw rod, a threaded hole is formed in the center of the cross beam, and the external thread of the screw rod is matched with the internal thread of the threaded hole; the driving part is a turntable which is fixedly connected to the top of the screw rod, and the turntable is rotated to drive the screw rod to rotate in the circumferential direction and move upwards and downwards in the axial direction.

In some examples, the turntable is provided with a handle, and the handle is perpendicular to the top surface of the turntable.

In some examples, the pressure measuring tool comprises a pressure measuring seat and a pressure measuring cover, wherein one end of the top surface of the pressure measuring seat is provided with an object placing groove, the chip can be placed in the object placing groove, the pressure measuring cover is matched with the object placing groove, the pressure measuring cover covers the chip and is arranged in the object placing groove, the top of the pressure measuring cover is exposed out of the top surface of the object placing groove, and the top of the pressure measuring cover abuts against the bottom surface of the movable plate.

In some examples, the pressure measuring mechanism further comprises a pressure buffering component, the pressure buffering component is detachably arranged on the top surface of the movable plate, and the pressure buffering component is pressed by the pressure jacking component to act on the movable plate.

In some examples, the pressure buffering assembly comprises an upper pressing plate and a lower pressing plate, wherein adjusting columns are arranged at two ends of the lower pressing plate, two ends of the upper pressing plate are sleeved on the adjusting columns, and a plurality of elastic pieces are arranged between the upper pressing plate and the lower pressing plate.

In some examples, a cushion block is arranged on the top surface of the pressure buffering component, a groove is arranged in the center of the cushion block, the shape of the groove is matched with that of the bottom end of the screw rod, and the screw rod and the groove can abut against each other.

The utility model discloses owing to adopted above technical scheme to realize following effect:

the utility model is provided with a pressure measuring tool to load the chip, and the pressure range is accurately measured by adjusting different extrusion lengths of the top pressing component; and multiple sets of pressure values can be measured, thereby reducing errors.

Drawings

Figure 1 is a schematic structural view of an embodiment of the present invention,

figure 2 is a schematic diagram of the embodiment of figure 1 without the pressure buffering assembly,

figure 3 is a schematic diagram of the embodiment of figure 1 showing the chip loaded into the pressure-measuring socket,

figure 4 is a structural schematic of a cross section of the embodiment of figure 1,

in the figure: the device comprises a frame 1, a pressure measuring seat 2, a movable plate 3, a pressure measuring cover 4, a guide rod 5, a workbench 6, a lower pressing plate 7, an elastic piece 8, an upper pressing plate 9, a groove 10, a cushion block 11, a screw rod 12, a rotary table 13, a handle 14, a cross beam 15, a chip 16 and an object placing groove 21.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in a generic and descriptive sense only and not for purposes of limitation, as the terms are used in the description to indicate that the referenced device or element must have the specified orientation, be constructed and operated in the specified orientation, and not for the purpose of limitation.

It is to be understood that the terms "a" and "an" are to be interpreted as meaning that a number of one element may be one in one embodiment or multiple in another embodiment, and the terms "a" and "an" are not to be interpreted as limiting the number.

The first embodiment is as follows:

referring to figures 1-4 of the drawings accompanying the present application, a pressure measurement mechanism for a chip 16 sensor according to a preferred embodiment of the present invention is illustrated, comprising a clamp assembly, a capping assembly located above the clamp assembly, and a pressure measurement tool for loading a chip 16, the pressure measuring tool is arranged in the clamp assembly, the top pressing assembly applies pressure to the clamp assembly, the pressure measuring tool is clamped and contracted by the clamp assembly so as to detect the pressure numerical range of the pressure measuring tool, when in use, the pressure measuring tool is placed in a clamping area formed by the clamp assembly, the top pressing component above the clamp component is driven to extend to the top surface of the clamp component and abut against the top surface of the clamp component, so that the clamping area is reduced, and thus the range of values that the sensor element can be pressed, the chip 16 sensor includes the chip 16 with the sensor element or the sensor chip 16.

Specifically, in this embodiment, the pressure measuring tool includes a pressure measuring base 2 and a pressure measuring cover 4, one end of the top surface of the pressure measuring base 2 is provided with an object placing groove 21, the chip 16 can be placed in the object placing groove 21, the pressure measuring cover 4 is adapted to the object placing groove 21, the pressure measuring cover 4 covers the chip 16 and is arranged in the object placing groove 21, the top of the pressure measuring cover 4 is exposed out of the top surface of the object placing groove 21, and the top of the pressure measuring cover 4 abuts against the bottom surface of the movable plate 3; when the device is used, the chip 16 is placed in the storage groove 21, the pressure measuring cover 4 is covered, the pressure measuring tool is placed in the clamping area, and the stress range condition of the sensor element is accurately measured through conversion of multilayer force.

The clamp assembly comprises a rack 1, a workbench 6 is arranged on the rack 1, two guide rods 5 are fixedly connected to diagonal ends of the workbench 6 respectively, tops of the two guide rods 5 are fixedly connected to two ends of a cross beam 15, the jacking assembly is arranged at the center of the cross beam 15, the clamp assembly further comprises a movable plate 3, the diagonal ends of the movable plate 3 are sleeved on the guide rods 5 respectively, the movable plate 3 and the workbench 6 form a clamp, and the pressure measuring tool is arranged between the movable plate 3 and the workbench 6; the top pressing component comprises an output part and a driving part, and the driving part drives the output part to extend to the top surface of the movable plate 3 and prop against the movable plate 3 to press downwards through the output part; under the technical scheme, the jacking effect can be realized by driving the telescopic rod through the air cylinder, but the air cylinder has a certain telescopic range, in other words, the pressure of the air cylinder cannot be well controlled, so in the embodiment, another technical scheme capable of controlling the pushing range is adopted, and the further explanation is that the output part is a screw 12, a threaded hole is formed in the center of the cross beam 15, and the external thread of the screw 12 is matched with the internal thread of the threaded hole; the drive division is carousel 13, carousel 13 fixed connection is in the top of screw rod 12, through rotating carousel 13, drives screw rod 12 circumferential direction and the axial and goes upward and move down, rotates through staff's operation carousel 13 promptly, and then drives screw rod 12 and pushes down to the anchor clamps subassembly, and this mode just can better grasp the degree of pushing down, can stop at any time and push down.

In order to further control the pressing force and measure a plurality of groups of pressure values, in this embodiment, the pressure measuring mechanism of the chip 16 sensor further includes a pressure buffer assembly, the pressure buffer assembly is detachably disposed on the top surface of the movable plate 3, and the pressure buffer assembly is pressed by the pressure pressing assembly to act on the movable plate 3; the pressure buffering assembly comprises an upper pressing plate 9 and a lower pressing plate 7, adjusting columns are arranged at two ends of the lower pressing plate 7, two ends of the upper pressing plate 9 are connected to the adjusting columns in a sleeved mode, a plurality of elastic pieces 8 are arranged between the upper pressing plate 9 and the lower pressing plate 7 and abut against the upper pressing plate 9 through screws 12, the upper pressing plate 9 moves downwards, springs of the elastic pieces 8 are compressed, the lower pressing plate 7 is further forced to extrude the movable plate 3, the range of a clamping area is further reduced, the compression range is finally measured, in the process, through the conversion of force and the displacement of different downward pressing controls, multiple groups of compression values can be measured, and data obtained through the compression values of each group are accurate.

In addition, in order to provide better force for the worker and facilitate the rotation of the rotary plate 13, a handle 14 is provided on the rotary plate 13, and the handle 14 is perpendicular to the top surface of the rotary plate 13.

In this embodiment, a cushion block 11 is disposed on the top surface of the pressure buffering component, a groove 10 is disposed at the center of the cushion block 11, the shape of the groove 10 is adapted to the shape of the bottom end of the screw 12, the screw 12 and the groove 10 can abut against each other, and the cushion block 11 is disposed to protect the top surface of the upper pressure plate 9 from being deformed due to multiple times of pressing down by the bottom end of the screw 12, so as to protect the top surface flatness of the upper pressure plate 9.

The use of the device is as follows:

firstly, the pressure measuring cover 4 is opened from the pressure measuring seat 2, the chip 16 is placed in the placing groove 21 of the pressure measuring seat 2, and the pressure measuring cover 4 is covered; the height of the movable plate 3 is raised to enlarge the clamping area, the pressure measuring seat 2 is arranged on the workbench 6, then the movable plate 3 moves downwards to clamp the pressure measuring seat 2, the pressure buffering assembly is installed on the top surface of the movable plate 3, and a worker extends the screw 12 to extrude the pressure buffering assembly by rotating the rotary disc 13, so that multiple groups of pressed numerical values are measured.

It will be understood by those skilled in the art that the embodiments of the present invention as described above and shown in the drawings are given by way of example only and are not limiting of the present invention.

The objects of the present invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the embodiments without departing from the principles, embodiments of the present invention may have any deformation or modification.

Claims

1. The utility model provides a chip sensor pressure measurement mechanism, its characterized in that includes the pressure measurement frock of anchor clamps subassembly, the top pressing subassembly that is located anchor clamps subassembly top and loading chip (16), the pressure measurement frock sets up in the anchor clamps subassembly, the top pressing subassembly exerts pressure to the anchor clamps subassembly, and the pressure measurement frock is by the centre gripping shrink of anchor clamps subassembly and then detect its pressure numerical range.

2. The pressure measuring mechanism of the chip sensor according to claim 1, wherein the clamp assembly comprises a frame (1), a worktable (6) is arranged on the frame (1), the diagonal ends of the worktable (6) are respectively and fixedly connected with a guide rod (5), the tops of the two guide rods (5) are fixedly connected to the two ends of a cross beam (15), the jacking assembly is arranged at the center of the cross beam (15), the clamp assembly further comprises a movable plate (3), the diagonal ends of the movable plate (3) are respectively sleeved on the guide rods (5), the movable plate (3) and the worktable (6) form a clamp, and the pressure measuring tool is arranged between the movable plate (3) and the worktable (6).

3. The chip sensor load cell according to claim 2, wherein the capping assembly includes an output portion and a driving portion, the driving portion driving the output portion to extend toward the top surface of the movable plate (3) and to be pressed down against the movable plate (3) through the output portion.

4. The chip sensor pressure measuring mechanism according to claim 3, wherein the output part is a screw (12), a threaded hole is formed in the center of the cross beam (15), and the external thread of the screw (12) is matched with the internal thread of the threaded hole; the driving part is a rotary table (13), the rotary table (13) is fixedly connected to the top of the screw rod (12), and the screw rod (12) is driven to rotate in the circumferential direction and move upwards and downwards in the axial direction by rotating the rotary table (13).

5. The chip sensor load cell according to claim 4, wherein a handle (14) is provided on the rotary plate (13), and the handle (14) is perpendicular to the top surface of the rotary plate (13).

6. The chip sensor pressure measuring mechanism according to claim 2, wherein the pressure measuring tool comprises a pressure measuring base (2) and a pressure measuring cover (4), an object placing groove (21) is formed in one end of the top surface of the pressure measuring base (2), the chip (16) can be placed in the object placing groove (21), the pressure measuring cover (4) is matched with the object placing groove (21), the pressure measuring cover (4) covers the chip (16) and is arranged in the object placing groove (21), the top of the pressure measuring cover (4) is exposed out of the top surface of the object placing groove (21), and the top of the pressure measuring cover (4) is abutted to the bottom surface of the movable plate (3).

7. The pressure measuring mechanism according to claim 3, further comprising a pressure buffering assembly, wherein the pressure buffering assembly is detachably disposed on the top surface of the movable plate (3), and the pressure buffering assembly is pressed by the pressure pressing assembly to act on the movable plate (3).

8. The pressure measuring mechanism of the chip sensor according to claim 7, wherein the pressure buffering assembly comprises an upper pressure plate (9) and a lower pressure plate (7), adjusting columns are arranged at two ends of the lower pressure plate (7), two ends of the upper pressure plate (9) are sleeved on the adjusting columns, and a plurality of elastic members (8) are arranged between the upper pressure plate (9) and the lower pressure plate (7).

9. The chip sensor pressure measuring mechanism according to claim 7, wherein a cushion block (11) is disposed on the top surface of the pressure buffering assembly, a groove (10) is disposed at the center of the cushion block (11), the shape of the groove (10) is adapted to the shape of the bottom end of the screw (12), and the screw (12) and the groove (10) can abut against each other.