CN213983205U

CN213983205U - LED flexible lamp strip

Info

Publication number: CN213983205U
Application number: CN202023279106.XU
Authority: CN
Inventors: 郑世鹏; 吴学坚; 程寅山; 徐钊; 郑朝曦
Original assignee: Shenzhen Youming Photoelectric Co ltd
Current assignee: Shenzhen Youming Photoelectric Co ltd
Priority date: 2020-12-29
Filing date: 2020-12-29
Publication date: 2021-08-17
Anticipated expiration: 2030-12-29

Abstract

The utility model belongs to the technical field of the LED illumination, concretely relates to LED flexible lamp area, a serial communication port, including flexible circuit board for bear luminous spare part, be equipped with a plurality of wafer on the flexible circuit board, the wafer includes the wafer of two kind at least colour temperatures, is first colour temperature wafer and second colour temperature wafer respectively, is equipped with the wiring mouth on the flexible circuit board, and wiring mouth and wafer intercommunication, flexible circuit board surface cover have the fluorescent layer, and the fluorescent layer covers the surface of wafer. The utility model discloses an at LED wafer surface coating strip fluorescent layer, the fluorescent layer covers whole luminous LED wafer, links up all LED wafers, because the fluorescent layer itself is continuous, consequently can make the light spot be continuous state, and the light that the LED wafer sent is through the continuous fluorescent layer reflection out, presents the same effect of similar strip luminous body at last, has improved aesthetic measure, has solved the intermittent problem of the lamp area is luminous among the prior art.

Description

LED flexible lamp strip

Technical Field

The utility model belongs to the technical field of the LED illumination, concretely relates to LED flexible lamp area.

Background

At present, in LED general lighting and auxiliary lighting, LED lamp strips are more and more widely applied, but with social development, people have higher and higher requirements on light environment and more give consideration to light atmosphere, so that a light and color adjustable flexible LED lamp strip is developed in the industry. The flexible LED lamp strip is assembled by using the FPC as an assembly circuit board and using the SMD LEDs, so that the thickness of the product is only 0.1CM, the product does not occupy space, and the product can be cut off at will and can be prolonged at will without influencing the luminescence. The FPC is soft, can be bent, folded and wound at will, and can move and stretch freely in a three-dimensional space without being broken. The decorative plate is suitable for being used in irregular places and narrow spaces, and is also suitable for randomly combining various patterns in advertisement decoration because the decorative plate can be randomly bent and wound. However, the LED color temperature adjustable lamp strip in the prior art is still mixed with the SMD chip for spacing, as shown in fig. 1, because the lamp strip uses point light sources at a certain spacing distance, the effect of the lamp strip is still intermittent when the lamp strip is lighted.

SUMMERY OF THE UTILITY MODEL

The utility model provides a flexible lamp area of LED aims at solving and presents the intermittent problem of effect when the lamp area is lighted among the prior art.

The technical scheme of the utility model as follows:

a LED flexible light strip, comprising:

the flexible circuit board is used for bearing the light-emitting parts;

the flexible circuit board is provided with a plurality of chips, wherein the chips comprise chips with at least two color temperatures, namely a first color temperature chip and a second color temperature chip;

the flexible circuit board is provided with a wiring port which is communicated with the wafer;

the surface of the flexible circuit board is covered with a fluorescent layer, and the fluorescent layer covers the surface of the wafer.

Further, the first color temperature chips and the second color temperature chips are alternately arranged in sequence at equal intervals.

Furthermore, the color temperature variation range of the first color temperature wafer is 3000K-6000K, and the color temperature variation range of the second color temperature wafer is 2400K-4000K.

Furthermore, the wiring port comprises a common lead wiring port, a first color temperature lead wiring port and a second color temperature lead wiring port.

Furthermore, the common lead wire port is communicated with the first color temperature chip and the second color temperature chip, the first color temperature lead wire port is communicated with the first color temperature chip, and the second color temperature lead wire port is communicated with the second color temperature chip.

Furthermore, the common lead wiring port is a positive electrode, and the first color temperature lead wiring port and the second color temperature lead wiring port are negative electrodes.

Further, the thickness of the fluorescent layer is 0.3-5 mm.

Further, the fluorescent layer is of a strip arc structure.

Furthermore, a reflective layer is also covered on the flexible circuit board.

Further, the surface of the fluorescent layer is also covered with packaging glue, and the packaging glue is thixotropic glue.

Compared with the prior art, the utility model discloses following beneficial effect has:

the utility model discloses an at LED wafer surface coating strip fluorescent layer, the fluorescent layer covers whole luminous LED wafer, links up all LED wafers, because the fluorescent layer itself is continuous, consequently can make the light spot be continuous state, and the light that the LED wafer sent is through the continuous fluorescent layer reflection out, presents the same effect of similar strip luminous body at last, has improved aesthetic measure, has solved the intermittent problem of the lamp area is luminous among the prior art.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an LED flexible light strip;

fig. 2 is a schematic structural view of an LED flexible light strip provided in an embodiment of the present invention;

fig. 3 is a schematic view of a flexible LED strip structure provided by the embodiment of the present invention.

Reference numerals:

10-a flexible circuit board; 20-a wafer; 21-a first color temperature chip; 22-second color temperature wafer; 30-a wiring port; 31-common wire connection port; 32-a first color temperature wire connection port; 33-a second color temperature wire connection port; 40-fluorescent layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

It will also be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

Fig. 1 is the utility model provides a schematic diagram of the flexible lamp area embodiment of LED.

Referring to fig. 1, the embodiment includes a flexible circuit board 10, a chip 20, a wiring port 30 and a fluorescent layer 40, wherein the chip 20 is disposed on the flexible circuit board 10 and connected to a circuit on the flexible circuit board, the wiring port 30 is disposed on the flexible circuit board 10 and connected to the circuit on the flexible circuit board, and the chip 20 is communicated with the wiring port 30, and the wiring port is externally connected to a control device or a power device, so as to control or power the chip 20. The phosphor layer 40 covers the surface of the wafer 20 and covers the entire wafer 20.

In the present embodiment, the flexible printed circuit board 10 is used for carrying light emitting components and providing circuit connection, and the flexible printed circuit board (FPC) is a highly reliable and flexible printed circuit board made of polyimide or polyester film as a base material. The flexible circuit board has the characteristics of high wiring density, light weight, thin thickness and good bending property.

The number of the chips 20 disposed on the flexible circuit board 10 is plural, the chip 20 is an LED light emitting chip, which is a light source, and the chip 10 in this embodiment includes two color temperature light emitting chips, which are a first color temperature chip 21 and a second color temperature chip 22. The chips of two color temperatures are arranged in a row on the flexible circuit board in a sequential and alternate arrangement manner, i.e. both sides of the first color temperature chip 21 are the second color temperature chips 22, both sides of the second color temperature chips 22 are the first color temperature chips 21, and the arrangement intervals between the chips 20 are equal. The alternate arrangement mode can realize the adjustment and realization of various color temperatures. In other embodiments, the wafers 20 may be arranged in other ways.

Specifically, the color temperature of the first color temperature chip 21 in this embodiment varies from 3000K to 6000K, and the color temperature of the second color temperature chip varies from 2400K to 4000K. Both color temperature ranges can satisfy the adjustment of most color temperature ranges.

In this embodiment, the wiring ports 30 include a common wire port 31, a first color temperature wire port 32, and a second color temperature wire port 33. The common wire connection port 31 is connected to the first color temperature chip 21 and the second color temperature chip 22, the first color temperature wire connection port 32 is connected to the first color temperature chip 21, and the second color temperature wire connection port 33 is connected to the second color temperature chip 22. The common wire connection port 31 is a positive electrode, and the first color temperature wire connection port 32 and the second color temperature wire connection port 33 are negative electrodes.

In this embodiment, the fluorescent layer 40 has a strip-shaped structure, the cross section of which is arc-shaped, and the thickness of the fluorescent layer is 0.3-5 mm. Such a thickness range of the phosphor layer 40 has a good light emitting property. Specifically, the fluorescent layer 40 is formed by mixing phosphor and a resin composition, wherein the resin composition may be a silicone resin, a silicone rubber, or an epoxy resin. There are many ways to realize a white LED, and a layer of yellow fluorescent powder is often coated on a blue LED chip to mix blue light and yellow light into white light, where the fluorescent powder may be yttrium aluminum garnet fluorescent powder, silicate fluorescent powder, or nitride fluorescent powder. The fluorescent layer in this embodiment is continuous, so that the light spots are continuous, and the light emitted from the LED chip is reflected by the continuous fluorescent layer, thereby exhibiting the same effect as a stripe-shaped light emitter.

In this embodiment, flexible circuit board 10 still coats the reflector layer, and the setting of reflector layer can strengthen the luminous effect in flexible lamp area.

In this embodiment, the surface of the fluorescent layer 40 is further covered with an encapsulation adhesive, and the encapsulation adhesive is a thixotropic adhesive. The cross section of encapsulation glue has different height and shape, can change luminous angle, makes the lamp area have different luminous angle, can also increase the pliability in lamp area.

In this embodiment, adopt the luminous wafer of two kinds of colour temperature scopes, therefore LED flexible light area can be through adjusting one of them way when lighting, or adjust the LED electric current size of two ways simultaneously to reach the colour temperature scope that needs. Because the strip-shaped fluorescent glue is coated on the surface of the wafer, when the LED lamp strip emits light, light spots are continuous, the effect similar to that of a strip-shaped luminous body is achieved, the condition of discontinuity does not exist, and the attractiveness is improved.

In the embodiment, the flexible circuit board with the size of the bonding pad suitable for fixing the flip LED chip is produced by the processes of etching, resistance welding and the like on the flexible circuit board to produce the flexible circuit board, and the flexible circuit board contains two circuits. And then fixing the LED wafer on the flexible circuit board by using a solder such as silver paste or tin paste through an LED die bonder. Then, coating fluorescent glue on one path of LED wafer so as to enable the path of LED wafer to reach a certain color temperature, such as 2600K, when the path of LED wafer is lightened; of course, the street chip may be fabricated in advance to have a CSP structure of a certain color temperature when lit, and then the fabricated CSP may be mounted on the flexible wiring board in one way. And finally, coating the surfaces of all the wafers stuck on the flexible circuit board by using fluorescent glue, and drawing the wafers into a strip shape, wherein the fluorescent glue formula can ensure that the other path of LED wafer can reach another color temperature when emitting light, and the color temperature is higher than that of the other path of LED wafer.

To sum up, the embodiment of the utility model provides a through at LED wafer surface coating strip fluorescent layer, the fluorescent layer covers whole luminous LED wafer, links up all LED wafers, because the fluorescent layer itself is continuous, consequently can make the light spot be continuous state, the light that the LED wafer sent is through continuous fluorescent layer reflection out, presents the same effect of similar strip luminous body at last, has improved aesthetic measure, has solved the intermittent problem of the light area is luminous.

The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. A LED flexible light strip, comprising:

the flexible circuit board is used for bearing the light-emitting parts;

2. The LED flexible light strip according to claim 1, wherein the first color temperature chips and the second color temperature chips are alternately arranged in sequence and at equal intervals.

3. The LED flexible light strip according to claim 1, wherein the first color temperature wafer has a color temperature ranging from 3000K to 6000K, and the second color temperature wafer has a color temperature ranging from 2400K to 4000K.

4. The LED flexible light strip according to claim 1, wherein the wiring ports comprise a common wire wiring port, a first color temperature wire wiring port and a second color temperature wire wiring port.

5. The LED flexible light strip according to claim 4, wherein the common wire connection port is in communication with the first color temperature die and the second color temperature die, the first color temperature wire connection port is in communication with the first color temperature die, and the second color temperature wire connection port is in communication with the second color temperature die.

6. The LED flexible light strip according to claim 4, wherein the common wire connection port is an anode, and the first color temperature wire connection port and the second color temperature wire connection port are cathodes.

7. The LED flexible light strip according to claim 1, wherein the thickness of the fluorescent layer is 0.3-5 mm.

8. The LED flexible light strip according to claim 1, wherein the fluorescent layer has a strip-shaped arc structure.

9. The LED flexible light strip according to claim 1, wherein the flexible circuit board is further coated with a reflective layer.

10. The LED flexible light strip according to claim 1, wherein the surface of the fluorescent layer is further coated with a packaging adhesive, and the packaging adhesive is a thixotropic adhesive.