CN213960403U

CN213960403U - Substrate, circuit board assembly and electronic equipment

Info

Publication number: CN213960403U
Application number: CN202022378744.0U
Authority: CN
Inventors: 侯召政; 彭浩
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2020-10-22
Filing date: 2020-10-22
Publication date: 2021-08-13
Anticipated expiration: 2030-10-22

Abstract

The application provides a base plate, circuit board subassembly and electronic equipment, this base plate includes: the substrate comprises a substrate body and at least one pad structure arranged on the substrate body, wherein the pad structure comprises a pad part, a boss is arranged on the pad part, and a projection region of the boss in the vertical direction is positioned in the projection region of the pad part in the vertical direction, so that the problem of welding failure is improved, and the reliability of a welding point can be improved to a certain extent.

Description

Substrate, circuit board assembly and electronic equipment

Technical Field

The present disclosure relates to electronic circuits, and particularly to a substrate, a circuit board assembly and an electronic device.

Background

With the rapid development of the technology level, the high density miniaturization is a great development trend of electronic products. Meanwhile, in order to integrate more components on the same unit area of the substrate to achieve more product application directions, electronic products continuously stack internal devices in a height direction, and thus many small-area ultra-high package forms are currently available.

In the prior art, when a substrate is actually manufactured, a circuit layer is usually first arranged on an insulating plate, for example, at least one patterned conductive layer is attached to the insulating plate, and holes (such as element holes, fastening holes, metalized holes, etc.) are arranged on the insulating plate, so as to replace a chassis of an electronic component of a conventional device and realize the interconnection between the electronic components. After the circuit layer is finished, an oil film layer is laid on the whole surface of the substrate, and the oil film layer can play the roles of insulation and isolation. And then, exposing and developing the oil film layer in the designated area (namely the area needing to be provided with the bonding pad), removing the oil film layer to expose the wires, and finally performing surface treatment on the area where the wires are exposed to form the bonding pad.

However, the substrate is prone to failure of soldering during actual production and application, and is low in reliability.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a base plate, a circuit board assembly and electronic equipment, which are beneficial to improving the problem of welding failure and improving the reliability of welding spots to a certain extent.

A first aspect of an embodiment of the present application provides a substrate, including: the bonding pad structure comprises a substrate body and at least one bonding pad structure arranged on the substrate body; the pad structure comprises a pad part, wherein the pad part is provided with a boss; the projection region of the boss in the vertical direction is located within the projection region of the pad portion in the vertical direction.

The base plate that this application embodiment provided, through setting up this boss, when base plate and circuit board weld through the solder, can increase the bonding area of the pad portion of base plate and solder to can promote the reliability of solder joint, avoid the base plate to take place the problem of welding failure in the application, improve the technological reliability to a great extent.

In a possible implementation manner, at least two bosses are arranged on the pad part, and a first gap is formed between every two adjacent bosses.

Like this, the first clearance that forms between two adjacent bosss can regard as exhaust passage, and exhaust passage can effectual reduction solder and the hole when the pad structure combines, and the voidage reduces can promote welding efficiency at to a great extent, can also ensure the reliability of welding simultaneously.

In a possible implementation manner, a preset distance is provided between a plane where at least one sidewall of the boss close to the edge of the pad portion is located and a plane where a sidewall of the pad portion located on the same side is located; and the preset distance is greater than 0.

Therefore, in the actual production process, the side wall of the boss close to the edge of the pad part can facilitate production personnel to directly observe the cladding condition of the solder from the side wall, the on-line detection of the combination condition between the pad structure of the substrate and the solder is facilitated, namely the combination condition between the pad mechanism of the substrate and the solder can be judged by observing the solder on the side wall of the boss, and the working efficiency can be improved to a great extent.

In one possible implementation, the cross section of the boss in the horizontal direction is rectangular;

alternatively, the boss is circular in cross section in the horizontal direction.

In one possible implementation, the boss is formed on the pad part using an etching process; or, the boss is formed on the pad part by adopting an electroplating process; or, the boss is formed on the pad part by adopting a mechanical groove milling process.

In one possible implementation manner, the method further includes: a first insulating layer; a second gap is formed between every two adjacent bonding pad structures, and the first insulating layer is arranged in the second gap. The first insulating layer can function as an insulator and an isolator.

In one possible implementation, the pad part includes: a first pad part and a second pad part connected with the first pad part; the first insulating layer is close to at least part of the second pad part in the pad structure, and the first insulating layer covers at least part of the second pad part.

In this way, the first insulating layer is arranged in the second gap between the two adjacent pad structures, the first insulating layer is close to at least part of the second pad parts in the pad structures, and the first insulating layer covers at least part of the second pad parts, so that other areas except the positions where the bosses are arranged on the substrate body are completely covered by the first insulating layer, solder can be prevented from entering the second gap between the two adjacent pad structures when the pad structures are in contact with the solder, and the isolation effect of the first insulating layer is prevented from being influenced.

In one possible implementation, the thickness of the first insulating layer is greater than the thickness of the pad structure. In this way, the first insulating layer may function to protect the pad structure in the horizontal direction.

A second aspect of the embodiments of the present application provides a circuit board assembly, at least including: a circuit board and any of the above described substrates; the circuit board comprises a circuit board body and at least one circuit board welding disc arranged on the circuit board body; the pad structure of the substrate is connected with the circuit board pad of the circuit board through solder so as to realize the connection of the substrate and the circuit board; the lands of the pad structure are encapsulated within the solder.

The circuit board assembly provided by the embodiment of the application, through setting up foretell base plate in the circuit board assembly, when base plate and circuit board are connected, the pad structure of base plate and the circuit board pad of circuit board pass through the solder and are connected, through set up the boss at the pad portion, the boss can be by the cladding in the solder to can increase the pad portion of base plate and the combined area of solder, and then can promote the reliability of solder joint, avoid the base plate to take place the problem of welding failure in the application, the technological reliability has been improved to a very big extent.

A third aspect of embodiments of the present application provides an electronic device, including at least: the circuit board assembly is described above.

The electronic device provided by the embodiment of the application, by arranging the circuit board assembly in the electronic device, the circuit board assembly at least comprises: when the substrate is connected with the circuit board, the pad structure of the substrate is connected with the circuit board pad of the circuit board through the solder, the boss is arranged on the pad part and can be coated in the solder, so that the bonding area of the pad part of the substrate and the solder can be increased, the reliability of a welding spot can be improved, the problem of welding failure of the substrate in the application process is avoided, and the process reliability is improved to a great extent. By arranging the circuit board assembly in the electronic equipment, the experience effect of the electronic equipment can be optimized. Meanwhile, the stability of signal transmission in the electronic equipment is ensured, and the normal work of the electronic equipment is ensured.

These and other aspects, embodiments and advantages of the exemplary embodiments will become apparent from the embodiments described hereinafter, taken in conjunction with the accompanying drawings. It is to be understood, however, that the description and drawings are only for purposes of illustration and are not intended as a definition of the limits of the embodiments of the application, for which reference should be made to the appended claims. Additional aspects and advantages of embodiments of the present application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of embodiments of the present application. Furthermore, the aspects and advantages of the embodiments of the present application may be realized and attained by means of the instrumentalities and combinations particularly pointed out in the appended claims.

Drawings

Fig. 1 is a schematic view of a first structure of a substrate according to an embodiment of the present disclosure;

fig. 2 is a schematic diagram illustrating a first structure of a pad structure in a substrate according to an embodiment of the present disclosure;

fig. 3 is a schematic diagram illustrating a second structure of a pad structure in a substrate according to an embodiment of the present disclosure;

fig. 4 is a schematic diagram illustrating a third structure of a pad structure in a substrate according to an embodiment of the present disclosure;

fig. 5 is a schematic diagram illustrating a fourth structure of a pad structure in a substrate according to an embodiment of the present disclosure;

fig. 6 is a schematic view of a second structure of a substrate according to an embodiment of the present disclosure;

fig. 7A is a schematic structural diagram of a pad structure formed on a substrate body in a method (etching process) for manufacturing a substrate according to an embodiment of the present disclosure;

fig. 7B is a schematic structural diagram of a film layer covering a substrate body formed with a pad structure in the method for manufacturing a substrate (etching process) according to the embodiment of the present application;

fig. 7C is a schematic structural diagram illustrating a first exposure region is set on a film layer and the film layer in the first exposure region is removed in the method for manufacturing a substrate (etching process) according to the embodiment of the present disclosure;

fig. 7D is a schematic structural diagram illustrating a pad portion directly under the first exposure region being partially etched in the method (etching process) for manufacturing the substrate according to the embodiment of the present application;

fig. 8A is a schematic structural diagram of a pad structure formed on a substrate body in a method for manufacturing a substrate (electroplating process) according to an embodiment of the present disclosure;

fig. 8B is a schematic structural diagram of a film layer covering a substrate body on which a pad structure is formed in the method for manufacturing a substrate (electroplating process) according to the embodiment of the present application;

fig. 8C is a schematic structural diagram illustrating a second exposure region is set on the film layer in the method for manufacturing a substrate (electroplating process) according to the embodiment of the present application, and the film layer in the second exposure region is removed;

fig. 8D is a schematic structural diagram illustrating electroplating performed on a pad portion under a second exposure region in the method for manufacturing a substrate (electroplating process) according to the embodiment of the present disclosure;

fig. 9A is a schematic structural diagram of a pad structure formed on a substrate body in a method for manufacturing a substrate (mechanical groove milling process) according to an embodiment of the present disclosure;

fig. 9B is a schematic structural diagram illustrating a pad portion material of a third exposure region is removed by a mechanical groove milling process and a hollow-out region is set on the pad portion in the method for manufacturing a substrate (mechanical groove milling process) according to the embodiment of the present disclosure;

fig. 10 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present application.

Description of reference numerals:

100-a circuit board assembly; 1-a substrate; 10-a substrate body; 20-pad structure; 201-pad portion; 2011-first pad portion; 2012-a second pad portion; 2013-a hollowed-out area; 202-a boss; 2021-sidewalls; 203-a first gap; l1-preset distance; 30-a first insulating layer; 40-a second gap; 50-a film layer; 501-a first exposure area; 502-a second exposure area; 2-a circuit board; 21-a circuit board body; 22-circuit board pads; 23-a second insulating layer; 3-solder.

Detailed Description

The terminology used in the description of the embodiments of the present application is for the purpose of describing particular embodiments of the present application only and is not intended to be limiting of the application, as the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

With the continuous improvement of living standard, electronic products have been developed rapidly, and high-density miniaturized electronic products are favored by consumers. At present, in order to realize more product applications, more components are generally integrated on the same unit area of the substrate, so that electronic products are continuously stacked with internal devices in the height direction.

In the prior art, a circuit layer is usually arranged on an insulating board, for example, at least one patterned conductive layer is attached on the insulating board, and holes (such as component holes, fastening holes, metalized holes, etc.) are arranged on the insulating board, so as to replace a chassis of electronic components of a conventional device and realize the interconnection between the electronic components. After the circuit layer (i.e. the conductive layer) is finished, ink is laid on the whole surface of the substrate (i.e. the insulating plate provided with the circuit layer), and the ink can play the roles of insulation and isolation. And then, exposing and developing the oil film layer in the designated area (namely the area needing to be provided with the bonding pad), removing the oil film layer to expose the wires, and finally performing surface treatment on the area where the wires are exposed to form the bonding pad to form the required substrate.

However, the pad area of the substrate is small, and when the substrate is soldered to a circuit board by solder, the bonding area between the pad and the solder is small, so that the problem of soldering failure is easily caused in the actual production and application processes, and the reliability is low.

Based on this, the embodiment of the application provides a substrate, through set up the boss on the pad portion, and the projection region of boss in the vertical direction is located the projection region of pad portion in the vertical direction, has increased the bonding area between pad and the solder to solve or alleviate the problem of welding failure, improved technology reliability to a great extent.

The following describes a specific structure of the substrate, a method for manufacturing the substrate, and the like.

Example one

Referring to fig. 1, an embodiment of the present application provides a substrate 1, where the substrate 1 may include: the substrate comprises a substrate body 10 and at least one pad structure 20 arranged on the substrate body 10, wherein the pad structure 20 may include a pad portion 201, the pad portion 201 has a boss 202 thereon, and a projection region of the boss 202 in a vertical direction is located within a projection region of the pad portion 201 in the vertical direction. Through setting up this boss 202, when base plate 1 and circuit board weld through the solder, can increase the bonding area of pad portion 201 and the solder of base plate 1 to can promote the reliability of solder joint, avoid base plate 1 to take place the problem of welding failure in the application, improve the technological reliability to a great extent.

In addition, in the actual production process, the boss 202 can also facilitate the production personnel to directly observe the cladding condition of the solder from the side wall, and facilitate the online detection of the bonding condition between the pad structure 20 of the substrate 1 and the solder, for example, as shown in fig. 2, the bonding condition between the pad mechanism of the substrate 1 and the solder can be judged by observing the solder on the side wall 2021 of the boss 202, and the working efficiency can be greatly improved.

In some embodiments, referring to fig. 3 and 6, the pad portion 201 may have at least two bosses 202 thereon, and a first gap 203 is formed between two adjacent bosses 202. In this way, the first gap 203 formed between two adjacent bosses 202 can be used as an exhaust channel, the exhaust channel can effectively reduce the void when the solder is combined with the pad structure 20, the void ratio is reduced, the welding efficiency can be improved to a great extent, and meanwhile, the welding reliability can be ensured.

Further, when the pad part 201 has a plurality of bosses 202 thereon, a plane where at least one sidewall of the boss 202 near the edge of the pad part 201 is located and a plane where a sidewall of the pad part 201 located on the same side is located may have a preset distance L1 therebetween, where the preset distance L1 is greater than 0. For example, with continued reference to fig. 3, the pad structure 20 has four bosses 202, and a plane where a sidewall (e.g., the sidewall 2021 in fig. 3) of the boss 202 near the edge of the pad portion 201 is located may have a predetermined distance L1 from a plane where a sidewall of the pad portion 201 located on the same side is located, where the predetermined distance L1 is greater than 0.

Thus, in the actual production process, the sidewall 2021 of the boss 202 near the edge of the pad portion 201 can facilitate the production personnel to directly observe the coating condition of the solder from the sidewall, and facilitate the online detection of the bonding condition between the pad structure 20 of the substrate 1 and the solder, that is, the bonding condition between the pad mechanism of the substrate 1 and the solder can be judged by observing the solder on the sidewall 2021 of the boss 202, so that the working efficiency can be greatly improved.

It should be noted that a preset distance L1 may be provided between a plane where the sidewall of one of the bosses 202 close to the edge of the pad portion 201 is located and a plane where the sidewall of the pad portion 201 located on the same side is located, a preset distance L1 may be provided between a plane where the sidewalls of two of the bosses 202 close to the edge of the pad portion 201 are located and a plane where the sidewalls of the pad portion 201 located on the same side are located, or a preset distance L1 may be provided between a plane where the sidewalls of a plurality of the bosses 202 close to the edge of the pad portion 201 and a plane where the sidewalls of the pad portion 201 located on the same side are located.

Moreover, a preset distance L1 may be provided between a plane where one of the sidewalls of any one of the bosses 202 close to the edge of the pad portion 201 is located and a plane where the sidewalls of the pad portion 201 located on the same side are located, a preset distance L1 may be provided between a plane where two of the sidewalls of any one of the bosses 202 close to the edge of the pad portion 201 are located and a plane where the sidewalls of the pad portion 201 located on the same side are located, or a preset distance L1 may be provided between a plane where a plurality of the sidewalls of any one of the bosses 202 close to the edge of the pad portion 201 are located and a plane where the sidewalls of the pad portion 201 located on the same side are located.

In the present embodiment, the shape of the boss 202 may include, but is not limited to, the following several possible implementations:

one possible implementation is: as shown in fig. 3, the boss 202 may have a rectangular cross section in the horizontal direction.

Another possible implementation is: as shown in fig. 4, the boss 202 may be circular in cross section in the horizontal direction.

Of course, in other embodiments, the cross section of the boss 202 in the horizontal direction may also be a diamond shape, a triangle shape, a polygon shape, etc., which is not limited by the embodiments of the present application.

Moreover, it is understood that the embodiment of the present application does not limit the specific number, the specific size and the arrangement of the bumps 202, for example, in order to further increase the bonding area between the pad structure 20 of the substrate 1 and the solder, the size of the bumps 202 may be reduced so that the bumps 202 may be more densely disposed on the pad portion 201. For example, as shown in fig. 5, the density with which the lands 202 are disposed on the pad portion 201 is greater than the density with which the lands 202 are disposed on the pad portion 201 shown in fig. 3.

Referring to fig. 6, in the embodiment of the present application, the substrate 1 may further include: and a first insulating layer 30, wherein a second gap 40 is formed between two adjacent pad structures 20, the first insulating layer 30 may be disposed in the second gap 40, and the first insulating layer 30 can perform insulating and isolating functions.

As an alternative embodiment, the first insulating layer 30 may be an ink layer. For example, the first insulating layer 30 may be a green paint.

In the embodiment of the present application, with continued reference to fig. 6, the pad part 201 may include: the first pad portion 2011 and the second pad portion 2012 connected to the first pad portion 2011, wherein the first insulating layer 30 is close to at least a portion of the second pad portion 2012 in the pad structure 20, and the first insulating layer 30 covers at least a portion of the second pad portion 2012. By arranging the first insulating layer 30 in the second gap 40 between two adjacent pad structures 20, the first insulating layer 30 is close to at least part of the second pad part 2012 in the pad structure 20, and the first insulating layer 30 covers at least part of the second pad part 2012, so that the other region of the substrate body 10 except the position where the boss 202 is arranged is completely covered by the first insulating layer 30, the solder can be prevented from entering the second gap 40 between two adjacent pad structures 20 when the pad structures 20 are in contact with the solder, and the isolation effect of the first insulating layer 30 is prevented from being influenced.

In the embodiment of the present application, the thickness of the first insulating layer 30 may be greater than that of the pad structure 20. In this way, the first insulating layer 30 may function to protect the pad structure 20 in the horizontal direction.

The structure of the substrate 1 is described above, and the method for manufacturing the substrate 1 is described below.

It should be noted that, in the embodiment of the present application, the arrangement manner of the boss 202 includes, but is not limited to, the following three possible implementation manners:

the first possible implementation manner is: the mesa 202 may be formed on the pad part 201 using an etching process. Etching (etching) is a technique for removing materials by using a chemical reaction or a physical impact effect, and is generally called photochemical etching (photochemical etching), which refers to removing a protective film in an area to be etched after exposure plate making and development, and contacting a chemical solution during etching to achieve the effect of dissolving and corroding, so as to form an uneven or hollow-out molding effect.

A second possible implementation is: the boss 202 may be formed on the pad part 201 using an electroplating process. Electroplating (Electroplating) refers to a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis so as to prevent the oxidation (such as corrosion) of the metals, improve the wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate, and the like), and improve the appearance.

A third possible implementation is: the boss 202 may be formed on the pad part 201 using a mechanical milling process. Mechanical grooving means that the desired groove is cut by a specific tool, in other words a tool with a bottom edge, into a groove.

When the mesa 202 is formed on the pad portion 201 by using an etching process, referring to fig. 7A to 7D, the method of manufacturing the substrate 1 is specifically as follows:

s101: as shown in fig. 7A, a pad structure 20 is formed on the substrate body 10.

S102: as shown in fig. 7B, a film layer 50 is covered on the substrate body 10 formed with the pad structure 20, and the height of the film layer 50 is greater than the height of the pad structure 20.

S103: as shown in fig. 7C, exposure development; a first exposure region 501 is set on the film layer 50, and the film layer 50 in the first exposure region 501 is removed.

S104: as shown in fig. 7D, the pad portion 201 directly under the first exposure region 501 is partially etched, for example, the pad portion 201 directly under the first exposure region 501 is half-etched by using a half-etching process (see fig. 7D).

S105: all remaining film layers 50 are removed to form the substrate 1 as shown in fig. 1.

Next, the substrate 1 in fig. 1 may be subjected to a surface treatment, that is, a first insulating layer 30 is provided on the surface of the substrate 1 in fig. 1, so as to form the substrate 1 shown in fig. 6.

When the boss 202 is formed on the pad portion 201 by using the plating process, referring to fig. 8A to 8D, the method of manufacturing the substrate 1 is specifically as follows:

s201: as shown in fig. 8A, a pad structure 20 is formed on the substrate body 10.

S202: as shown in fig. 8B, a film layer 50 is covered on the substrate body 10 formed with the pad structure 20, and the height of the film layer 50 is greater than the height of the pad structure 20.

S203: as shown in fig. 8C, exposure development; a second exposure region 502 is set on the film layer 50, and the film layer 50 in the second exposure region 502 is removed.

S204: as shown in fig. 8D, plating is performed on the pad portions 201 under the second exposure regions 502, for example, plating is performed on the pad portions 201 under the second exposure regions 502 using an additive plating process to form the mesas 202 (see fig. 8D).

S205: all remaining film layers 50 are removed to form the substrate 1 as shown in fig. 1.

When the boss 202 is formed on the pad portion 201 by using the mechanical groove milling process, referring to fig. 9A to 9B, the manufacturing method of the substrate 1 is specifically as follows:

s301: as shown in fig. 9A, a pad structure 20 is formed on the substrate body 10.

S302: as shown in fig. 9B, a hollow area 2013 is set on the pad portion 201, and a mechanical groove milling process is adopted to remove the material of the pad portion 201 in the hollow area 2013, so as to form the substrate 1 shown in fig. 1.

Example two

Referring to fig. 10, an embodiment of the present application provides a circuit board assembly 100, where the circuit board assembly 100 at least includes: the circuit board 2 and the substrate 1 in the first embodiment, wherein the circuit board 2 includes a circuit board body 21 and at least one circuit board pad 22 disposed on the circuit board body 21, the pad structure 20 of the substrate 1 is connected to the circuit board pad 22 of the circuit board 2 by a solder 3, so as to connect the substrate 1 to the circuit board 2, and the bump 202 of the pad structure 20 is covered in the solder 3 (see fig. 10).

In one possible implementation, as shown with continued reference to fig. 10, the circuit board 2 may further include: and a second insulating layer 23, wherein the second insulating layer 23 may be disposed in the gap between two adjacent circuit board pads 22, and the second insulating layer 23 may perform insulating and isolating functions.

As an alternative embodiment, the second insulating layer 23 may be an ink layer. For example, the second insulating layer 23 may be green paint.

Specifically, as shown in fig. 10, when the substrate 1 is connected to the circuit board 2, the pad structure 20 of the substrate 1 is connected to the circuit board pad 22 of the circuit board 2 through the solder 3, and the boss 202 is disposed on the pad portion 201, so that the boss 202 can be wrapped in the solder 3 (see fig. 10), thereby increasing the bonding area between the pad portion 201 of the substrate 1 and the solder 3, further improving the reliability of the solder joint, avoiding the problem of solder failure of the substrate 1 during the application process, and improving the process reliability to a great extent.

EXAMPLE III

The embodiment of the present application provides an electronic device, which may include the circuit board assembly 100 in the second embodiment.

The circuit board assembly 100 includes at least: when the circuit board 2 and the substrate 1 in the first embodiment are connected to the circuit board 2, the pad structure 20 of the substrate 1 is connected to the circuit board pad 22 of the circuit board 2 through the solder 3, and the boss 202 is disposed on the pad portion 201 and can be wrapped in the solder 3, so that the bonding area between the pad portion 201 of the substrate 1 and the solder 3 can be increased, the reliability of a solder joint can be improved, the problem of welding failure of the substrate 1 in the application process can be avoided, and the process reliability can be greatly improved.

It will be appreciated that the circuit board assembly 100 may be used to optimize not only the bonding pads in power devices (e.g., high thickness inductive devices), but also the bonding pads of other electronic products (e.g., surface mount high mass core/copper stud/heat spreader devices).

By providing the circuit board assembly 100 in the electronic device, the experience effect of the electronic device can be optimized. Meanwhile, the stability of signal transmission in the electronic equipment is ensured, and the normal work of the electronic equipment is ensured.

It should be noted that the electronic device provided in the embodiment of the present application may include, but is not limited to, a mobile or fixed terminal having the circuit board 2, such as a mobile phone, a tablet computer, a notebook computer, an ultra-mobile personal computer (UMPC), a handheld computer, an intercom, a netbook, a PO step S machine, a Personal Digital Assistant (PDA), a wearable device, a virtual reality device, and the like.

In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, an indirect connection via an intermediary, a connection between two elements, or an interaction between two elements. The specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.

Reference throughout this specification to apparatus or components, in embodiments or applications, means or components must be constructed and operated in a particular orientation and therefore should not be construed as limiting the present embodiments. In the description of the embodiments of the present application, "a plurality" means two or more unless specifically stated otherwise.

The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the embodiments of the application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the embodiments of the present application, and are not limited thereto; although the embodiments of the present application have been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A substrate, comprising:

the bonding pad structure comprises a substrate body and at least one bonding pad structure arranged on the substrate body;

the pad structure comprises a pad part, wherein the pad part is provided with a boss;

the projection region of the boss in the vertical direction is located within the projection region of the pad portion in the vertical direction.

2. The substrate according to claim 1, wherein the pad portion has at least two bosses thereon, and a first gap is formed between two adjacent bosses.

3. The substrate according to claim 2, wherein a plane of at least one sidewall of the boss near the edge of the pad portion has a predetermined distance from a plane of a sidewall of the pad portion located on the same side;

and the preset distance is greater than 0.

4. The baseplate of any one of claims 1 to 3, wherein the boss is rectangular in cross-section in the horizontal direction;

5. The substrate according to any one of claims 1 to 3, wherein the mesa is formed on the pad portion using an etching process;

or, the boss is formed on the pad part by adopting an electroplating process;

or, the boss is formed on the pad part by adopting a mechanical groove milling process.

6. The substrate according to any one of claims 1 to 3, further comprising: a first insulating layer;

a second gap is formed between every two adjacent bonding pad structures, and the first insulating layer is arranged in the second gap.

7. The substrate according to claim 6, wherein the pad portion comprises: a first pad part and a second pad part connected with the first pad part;

the first insulating layer is close to at least part of the second pad part in the pad structure, and the first insulating layer covers at least part of the second pad part.

8. The substrate of claim 6, wherein a thickness of the first insulating layer is greater than a thickness of the pad structure.

9. A circuit board assembly, comprising at least: a circuit board and the substrate of any of the above claims 1-8;

the circuit board comprises a circuit board body and at least one circuit board welding disc arranged on the circuit board body;

the pad structure of the substrate is connected with the circuit board pad of the circuit board through solder so as to realize the connection of the substrate and the circuit board;

the lands of the pad structure are encapsulated within the solder.

10. An electronic device, characterized in that it comprises at least: a circuit board assembly as recited in claim 9.