CN213901011U - High-efficient heat dissipation LED lamps and lanterns - Google Patents

Abstract

The utility model belongs to the technical field of the illumination, especially, relate to a high-efficient heat dissipation LED lamps and lanterns, including PCB board and lamp body, be provided with the LED lamp on the PCB board, the PCB board tightly pastes the setting and is in on the internal surface of lamp body, the PCB board with the one side of lamp body contact is equipped with first heat conduction aluminium lamination. The utility model discloses set up first heat conduction aluminium lamination on the PCB board, the PCB board carries out heat-conduction through first heat conduction aluminium lamination and lamp body contact, adopts the aluminium lamination to replace traditional heat conduction silicone grease to carry out heat conduction to make the radiating efficiency of lamps and lanterns obtain very big improvement.

Description

High-efficient heat dissipation LED lamps and lanterns

Technical Field

The utility model belongs to the technical field of the illumination, a high-efficient heat dissipation LED lamps and lanterns is related to.

Background

The LED lamp is favored by more and more users due to the unique advantages of energy conservation and strong luminous capacity, but the LED lamp can generate a large amount of heat energy in the lighting process, and due to the poor heat dissipation capacity of the LED lamp, other structures are required to be arranged to dissipate heat of the LED lamp in the process of preparing the LED lamp.

The existing LED lamp heat dissipation structure is generally formed by coating a layer of heat-conducting silicone grease between a lamp body and a contact surface of a PCB (printed circuit board), so that an LED lamp on the PCB conducts heat to the PCB and then transmits the heat to the lamp body through the heat-conducting silicone grease and then radiates the heat out, and the heat dissipation of the LED lamp is accelerated.

However, because the thermal conductivity coefficient of the silicone grease is low, when the heat productivity of the LED light source on the PCB is large, the heat of the PCB cannot be conducted out in time by the thermal conductive silicone grease, the damage of the LED lamp is easily caused, and the aging of the product is accelerated.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to prior art not enough, provide a high-efficient heat dissipation LED lamps and lanterns, aim at adopting the not good problem of heat conduction effect of heat conduction silicone grease as the heat-conducting layer among the solution prior art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a high-efficient heat dissipation LED lamps and lanterns, includes PCB board and lamp body, be provided with the LED lamp on the PCB board, be equipped with the installation department in the lamp body, the PCB board hugs closely to be fixed on the installation department, the PCB board with the one side of lamp body contact is equipped with first heat conduction aluminium lamination.

Preferably, the lamp body is provided with a second heat conduction aluminum layer, the second heat conduction aluminum layer is arranged on the surface of the mounting portion, and the second heat conduction aluminum layer is tightly attached to and fixedly connected with the first heat conduction aluminum layer.

Further, the first heat-conducting aluminum layer and the second heat-conducting aluminum layer are mirror aluminum layers.

Preferably, the first heat-conducting aluminum layer and the second heat-conducting aluminum layer are fixedly connected in a vacuum adsorption mode.

Preferably, the LED lamps are arranged in a plurality of rectangular arrays on the PCB.

Preferably, the lamp comprises a light-emitting lens, and the light-emitting lens and the lamp body are matched to form a closed cavity.

Furthermore, the light-emitting lens is fixed on the lamp body in a vacuum adsorption mode.

Preferably, the lamp comprises a bracket, and two ends of the bracket are symmetrically connected to the lamp body.

Preferably, the PCB is an aluminum substrate or a copper substrate.

Preferably, the outer surface of the lamp body is provided with a heat sink, and the heat sink is connected with the mounting part.

The utility model has the advantages that: the utility model provides a high-efficient radiating LED lamps and lanterns, this application sets up first heat conduction aluminium lamination on the PCB board, and the PCB board carries out heat-conduction through first heat conduction aluminium lamination and lamp body contact, adopts the aluminium lamination to replace traditional heat conduction silicone grease to carry out heat conduction to the radiating efficiency who makes lamps and lanterns obtains very big improvement.

Drawings

Fig. 1 is an exploded view of an LED lamp with high heat dissipation efficiency according to an embodiment of the present invention;

fig. 2 is a front view of the structure of the lamp body according to an embodiment of the present invention;

fig. 3 is a rear view of an LED lamp with high heat dissipation efficiency according to an embodiment of the present invention;

fig. 4 is a front view of an LED lamp with high heat dissipation efficiency according to an embodiment of the present invention;

fig. 5 is a cross-sectional view taken at a-a of fig. 4.

The labels in the figure are: 100-a PCB board; 101-a first thermally conductive aluminum layer; 200-LED lamps; 300-a lamp body; 301-a mounting portion; 302-a first lumen wall; 303-a second lumen wall; 304-step surface; 305-a first adsorption tank; 306-a second adsorption tank; 307-bumps; 400-a scaffold; 500-a heat sink; 600-light-emitting lens; 610-waterproof ring; 700-screw; 800-a first one-way intake valve; 900-second one-way intake valve.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly, e.g., as fixed or detachable connections or as an integral part; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Referring to fig. 1 to 5, a specific embodiment of an LED lamp with high heat dissipation efficiency according to the present invention is shown.

As shown in fig. 1 to 5, the LED lamp with high heat dissipation efficiency includes a PCB 100, a lamp body 300, and an LED lamp 200 disposed on the PCB 100, wherein a mounting portion 301 is disposed in the lamp body 300, the PCB 100 is tightly attached to the mounting portion 301, and a first heat conductive aluminum layer 101 is disposed on a surface of the PCB 100 contacting the mounting portion 301.

Specifically, in the present embodiment, the lamp body 300 is recessed inward to form a space for accommodating the PCB board 100, and the mounting portion 301 is disposed in the space. The LED lamp 200 is installed to PCB board 100's front, the back with the surface of installation department 301 is hugged closely, first heat conduction aluminium lamination 101 sets up PCB board 100's back, with the contact is hugged closely to the surface of installation department 301. The LED lamp 200 generates a large amount of heat during operation, the heat is sequentially conducted to the PCB board 100 and the first heat conductive aluminum layer 101, the first heat conductive aluminum layer 101 conducts the heat to the mounting portion 301 of the lamp body 300, and the lamp body 300 radiates the heat to the air, so that the heat dissipation of the LED lamp 200 is realized.

The utility model discloses a traditional heat conduction silicone grease is replaced to the aluminium lamination and heat conduction is carried out, and the coefficient of heat conductivity of aluminium is high, is 100 times of heat conduction silicone grease, consequently is the heat-conducting medium of more ideal. This application sets up first heat conduction aluminium lamination 101 on PCB board 100, and the first heat conduction aluminium lamination 101 of rethread carries out heat-conduction with the contact of lamp body 300, can conduct lamp body 300 with the heat that LED sent more fast, is outwards gived off the heat by lamp body 300 again, has greatly improved the radiating efficiency of LED lamps and lanterns.

Further, as shown in fig. 1 to 2, in the present embodiment, the lamp body 300 is provided with a second heat conductive aluminum layer disposed on the surface of the mounting portion 301. Specifically, the surface of installation department 301 is the contact surface with the laminating of PCB board 100 back, sets up the second heat conduction aluminium lamination on lamp body 300, hugs closely with installation department 301 surface through the first heat conduction aluminium lamination 101 at PCB board 100 back, makes first heat conduction aluminium lamination 101 can hug closely fixedly with the second heat conduction aluminium lamination, has increaseed area of contact, improves heat-conduction effect.

Specifically, the length and width of the surface of the mounting portion 301 are greater than the length and width of the PCB 100, so that the back surface of the PCB 100 can completely contact the surface of the mounting portion 301. In this embodiment, in order to further reduce the space occupied by the lamp, the shape of the lamp body 300 is adapted to the shape of the PCB 100, and the surface shape of the mounting portion 301 is also adapted to the shape of the PCB 100. Specifically, when the PCB 100 is circular, the lamp body 300 and the mounting part 301 disposed in the lamp body 300 are also circular; when the PCB board 100 has a rectangular shape, the lamp body 300 and the mounting part 301 provided in the lamp body 300 also have a rectangular shape.

Further, in this embodiment, the first thermal aluminum layer 101 and the second thermal aluminum layer are mirror aluminum layers. Specifically, adopt the mirror surface technology of aluminizing to plate first heat conduction aluminium lamination 101 and plate second heat conduction aluminium lamination on the internal surface of lamp body 300 on PCB board 100 respectively for the first heat conduction aluminium lamination 101 of mirror surface and the second heat conduction aluminium lamination of mirror surface's surface all does not have unevenness, can laminate each other more completely, and heat conduction efficiency obtains the maximize.

Further, in one embodiment, the first and second thermal aluminum layers 101 and 101 are connected by vacuum suction to fixedly connect the PCB board 100 to the surface of the mounting portion 301. The PCB 100 and the lamp body 300 are connected and fixed in a vacuum hole adsorption mode, the first heat conduction aluminum layer 101 and the second heat conduction aluminum layer can be tightly attached, and compared with the traditional mode that the PCB 100 is fixed through screws 700, the vacuum adsorption mode has the advantages that the PCB 100 after vacuum adsorption can be completely attached to the lamp body 300, all positions are evenly stressed, and warping is not easy to generate; and vacuum adsorption does not need to be fixed by means of other structures, so that the space occupied by the internal structure of the lamp is greatly reduced, the total volume of the lamp can be smaller, and the lamp is lighter and thinner.

As shown in fig. 1 to 5, in the present embodiment, the first thermal conductive aluminum layer 101 of the mirror surface and the second thermal conductive aluminum layer of the mirror surface are connected by vacuum adsorption to fixedly connect the PCB board 100 to the inner surface of the lamp body 300. Because first heat conduction aluminium lamination 101 and second heat conduction aluminium lamination are the smooth surface that the surface does not have unevenness, adopt the vacuum adsorption mode to connect between two smooth surfaces and can not cause the destruction to the smooth surface, the area of contact of two smooth surfaces reaches the biggest after the absorption, and the radiating effect is better, and the radiating efficiency adopts the radiating lamps and lanterns of heat conduction silicone grease more than thirty percent with the tradition.

Specifically, lamp body 300 is equipped with first adsorption tank 305 and first one-way admission valve 800, first adsorption tank 305 sets up on the installation department 301, be equipped with a through-hole on the first adsorption tank 305, first one-way admission valve 800 sets up on the through-hole of this first adsorption tank 305, first adsorption tank 305 and first one-way admission valve 800 intercommunication, first one-way admission valve 800 sets up the outside at lamp body 300, and the air inlet of first one-way admission valve 800 sets up towards the inside setting of lamp body 300, and the gas outlet sets up towards the outside of lamp body 300. During evacuation, with air exhaust device with first one-way admission valve 800 is connected, takes out the air between installation department 301 surface and PCB board 100 through the cooperation of first absorption groove 305 and first one-way admission valve 800, makes to form the vacuum state of negative pressure between installation department 301 and the PCB board 100, and PCB board 100 hugs closely fixed absorption on installation department 301 surface.

Preferably, as shown in fig. 1, in the present embodiment, the LED lamps 200 are provided in a plurality and distributed on the PCB board 100 in a rectangular array. It should be noted that the plurality of LED lamps 200 here means that at least three LED lamps 200 are used. The plurality of LED lamps 200 are distributed on the PCB 100 in a rectangular array manner, and heat emitted by each LED lamp 200 can be uniformly conducted to the first heat-conducting aluminum layer 101 of the PCB 100, so that quick heat dissipation can be realized.

Preferably, as shown in fig. 1, fig. 4 to fig. 5, in this embodiment, the lamp further includes an outgoing lens 600, and the outgoing lens 600 and the lamp body 300 cooperate to form a closed cavity. The PCB 100 is disposed in the cavity, and the light-emitting lens 600 and the lamp body 300 can protect the PCB 100 and the LED lamp 200 from water.

Specifically, lamp body 300 is inside sunken to form the recess, installation department 301 sets up on the interior terminal surface of recess, the lateral wall of recess includes first inner chamber wall 302 and second inner chamber wall 303, the edgewise of first inner chamber wall 302 with the edgewise of the interior terminal surface of recess is connected, form a step face 304 between first inner chamber wall 302 and the second inner chamber wall 303, light-emitting glass with the laminating of step face 304 is fixed.

In this embodiment, as shown in fig. 1 to fig. 2, the height of the second inner cavity wall 303 is greater than the thickness of the light-emitting lens 600, and the light-emitting lens 600 is fixed on the lamp body 300 by vacuum absorption, that is, air between the light-emitting lens 600 and the step surface 304 is pumped out, so that a negative pressure is formed between the light-emitting lens 600 and the step surface 304, and the light-emitting lens 600 is fixed on the lamp under the action of atmospheric pressure. The vacuum adsorption fixing mode reduces the use of screws 700 on the lamp, so that the lamp has stronger integrity and the weight of the lamp body 300 is lighter. Specifically, step face 304 is equipped with second adsorption tank 306, and the lamp body 300 outside is equipped with the one-way admission valve 900 of second, second adsorption tank 306 is provided with a through-hole, and the one-way admission valve 900 of second is installed on the through-hole of second adsorption tank 306, second adsorption tank 306 with the one-way admission valve 900 of second communicates, the one-way admission valve 900 of second air inlet orientation step face 304 sets up, and the gas outlet sets up towards the lamps and lanterns outside, and wherein this vacuum adsorption's process is the same with the process and the principle that PCB board 100 adsorbs fixed installation department 301, no longer gives unnecessary details here.

Further, the light-emitting lens 600 and the second inner cavity wall 303 are arranged with a waterproof ring 610 therebetween, the light-emitting lens 600 is adsorbed on the step surface 304, and the waterproof ring 610 is used for filling the gap between the light-emitting lens 600 and the second inner cavity wall 303 to achieve a waterproof effect.

In other embodiments, the light-exiting lens 600 may be further fixed to the step surface 304 by a sealant or a screw 700.

In this embodiment, as shown in fig. 1 and fig. 3 to fig. 4, the lamp further includes a support 400, two ends of the support 400 are symmetrically connected to the lamp body 300, and a user can install the lamp at any position through the support 400 and hang the lamp on the hook, so that the lamp is convenient to use and carry.

Further, both ends of the bracket 400 are mounted on both sides of the lamp body 300 by screws 700. Specifically, the two symmetrical sides of the exterior of the lamp body 300 extend back to the light outlet direction to form protrusions 307 with an arc-shaped surface, the protrusions 307 are provided with blind holes, the blind holes are provided with internal threads, and screws 700 penetrate through the bracket 400 and then are connected with the blind holes in a threaded fit manner. The user can adjust and position the bracket 400 by turning the nut to control the tightness of the screw 700.

In one embodiment, the PCB board 100 is an aluminum substrate or a copper substrate. By adopting metal substrates such as an aluminum substrate or a copper substrate, the PCB 100 can conduct heat of the LED lamp 200 to the first heat-conducting aluminum layer 101 in time due to the metal having strong heat conductivity. Preferably, in this embodiment, the PCB 100 is an aluminum substrate, and the heat conduction effect of the aluminum substrate is better than that of the copper substrate.

As shown in fig. 1, 3 and 5, in the present embodiment, a heat sink 500 is provided outside the lamp body 300, and the heat sink 500 is connected to the mounting portion 301. The LED lamp 200 on the PCB 100 generates heat when operating, the heat is sequentially transferred to the metal substrate, the first heat conductive aluminum layer 101, the second heat conductive aluminum layer, and the mounting portion 301, and finally the heat is transferred to the heat sink 500 by the mounting portion 301, and the heat sink 500 contacts with air to dissipate the heat to the air. The present embodiment can increase the contact area with air by providing the heat sink 500, thereby improving the heat dissipation efficiency.

Further, the heat sink 500 is disposed on a side of the lamp body 300 away from the PCB board 100, the heat sink 500 is plural, the heat sink 500 is convexly disposed outside the lamp body 300, and the heat sink 500 and the lamp body 300 are integrally formed.

Preferably, the lamp body 300 may also be made of a metal material, so that the heat conduction efficiency can be improved.

In summary, the embodiment provides a high-efficiency heat-dissipation LED lamp, the lamp adopts the aluminum layer to replace the traditional heat-conducting silicone grease for heat conduction, the first heat-conducting aluminum layer is disposed on the PCB board 100, the first heat-conducting aluminum layer is in contact with the lamp body for heat conduction, the heat emitted by the LED can be conducted to the lamp body more quickly, and then the heat is dissipated outwards by the lamp body, so that the heat dissipation efficiency of the LED lamp is greatly improved. The first heat conduction aluminium lamination on the PCB back adopts the vacuum adsorption mode with the second heat conduction aluminium lamination on installation department surface to hug closely fixedly, has further increaseed area of contact, improves heat-conduction effect, and vacuum adsorption has reduced the shared space of lamps and lanterns inner structure, makes the whole volume of lamps and lanterns can be done littleer, and lamps and lanterns are more frivolous.

The above-mentioned embodiments are only one of the preferred embodiments of the present invention, and the ordinary changes and substitutions performed by those skilled in the art within the technical scope of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. The utility model provides a high-efficient heat dissipation LED lamps and lanterns, its characterized in that includes PCB board and lamp body, be provided with the LED lamp on the PCB board, be equipped with the installation department in the lamp body, the PCB board hugs closely to be fixed on the installation department, the PCB board with the one side of installation department contact is equipped with first heat conduction aluminium lamination.

2. The LED lamp with high heat dissipation efficiency as recited in claim 1, wherein the lamp body is provided with a second heat-conducting aluminum layer, the second heat-conducting aluminum layer is disposed on the surface of the mounting portion, and the second heat-conducting aluminum layer is tightly and fixedly connected with the first heat-conducting aluminum layer.

3. The efficient heat dissipation LED lamp of claim 2, wherein the first and second layers of thermally conductive aluminum are both mirror aluminum layers.

4. The efficient heat dissipation LED lamp of claim 2 or 3, wherein the first heat conductive aluminum layer and the second heat conductive aluminum layer are fixedly connected in a vacuum adsorption manner.

5. The LED lamp with high heat dissipation efficiency as recited in claim 1, wherein the plurality of LED lamps are distributed on the PCB in a rectangular array.

6. The LED lamp with high heat dissipation efficiency as recited in claim 1, further comprising a light exit lens, wherein the light exit lens cooperates with the lamp body to form a sealed cavity.

7. The LED lamp with high heat dissipation efficiency as recited in claim 6, wherein the light exit lens is fixed on the lamp body by vacuum absorption.

8. The LED lamp with high heat dissipation efficiency as recited in claim 1, comprising a support, wherein two ends of the support are symmetrically connected to the lamp body.

9. The LED lamp with high heat dissipation efficiency as recited in claim 1, wherein the PCB is an aluminum substrate or a copper substrate.

10. The LED lamp with high heat dissipation efficiency as recited in claim 1, wherein the lamp body has heat dissipation fins on an outer surface thereof, and the heat dissipation fins are connected to the mounting portion.

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