CN213878078U

CN213878078U - Wireless signal enhancement chip pastes

Info

Publication number: CN213878078U
Application number: CN202022872844.9U
Authority: CN
Inventors: 戚泽涛
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-12-02
Filing date: 2020-12-02
Publication date: 2021-08-03
Anticipated expiration: 2030-12-02

Abstract

The utility model discloses a radio signal reinforcing chip pastes, paste the main part including the chip, the front end surface that the main part was pasted to the chip is provided with the chip and pastes openly, the positive front end surface of chip subsides is provided with gilding circuit and chip entirely, and gilding circuit is located the surface of chip entirely, the surface of chip is provided with the AD glued membrane, the rear end that the main part was pasted to the chip is provided with chip and pastes the reverse side, the surface that the reverse side was pasted to the chip is provided with the ultra-thin double faced adhesive tape of TESA. Radio signal reinforcing chip paste, adopt AD glued membrane FPC technology to carry out chip package and consolidate, product thickness 0.2MM, pliable and tough flexible, the naked area of leaking of circuit is only about 10%, temperature resistant more than 200 degrees, signal enhancement is than hardboard height more than 50%, metallic feeling, pleasing to the eye atmosphere, be full of science and technology sense, the transparent form accessible reinforcing signal transmission of product, more be fit for user cooperation product and use, the product specification is wide 3.5CM long 2.5CM thick 0.2MM, bring better use prospect.

Description

Wireless signal enhancement chip pastes

Technical Field

The utility model relates to an reinforcing cell-phone, panel computer, notebook computer radio signal receive, reinforcing signal technical field, in particular to radio signal reinforcing chip subsides.

Background

The existing PCBA hard board circuit product is basically 0.7MM thick and above, the bare leakage area of the hard board circuit is about 90% approximately, the product is thick and heavy, the circuit is easy to drop and oxidize, the signal transmission is provided with an interlayer, the material is not optimal, the signal enhancement effect is not obvious, certain adverse effect is brought to the use process of people, the user experience of people is reduced, therefore, the upgrading circuit is provided, novel materials and an intelligent manufacturing process are adopted, and the PCBA hard board circuit product is used for innovating a wireless signal enhancement chip sticker.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides a radio signal reinforcing chip pastes possesses the simple operation, and convenient to use and practicality advantage such as strong can effectively solve the not enough problem that exists among the prior art.

(II) technical scheme

In order to achieve the above purpose, the utility model adopts the following technical scheme: radio signal reinforcing chip subsides, including chip subsides main part, the front end surface of chip subsides main part is provided with chip and pastes openly, the positive front end surface of chip subsides is provided with gilt circuit and chip entirely, and the gilt circuit that just entirely lies in the surface of chip, the surface of chip is provided with the AD glued membrane, the rear end of chip subsides main part is provided with chip and pastes the reverse side, the surface of chip subsides reverse side is provided with the ultra-thin double faced adhesive tape of TESA, chip subsides main part is the preparation of full transparent material, accessible reinforcing signal.

Preferably, the AD adhesive film is packaged and reinforced with the chip by adopting an FPC (flexible printed circuit) process.

Preferably, the product specification of the chip sticker main body is 2.5cm long, 3.5cm wide and 0.2mm thick, and the chip sticker main body is flexible and bendable.

Preferably, the exposed area of the circuit in the chip paste main body is 10%.

Preferably, the TESA ultra-thin double-sided tape is repeatedly mounted on the back surface of the chip sticker main body, and the thickness of the TESA ultra-thin double-sided tape is 0.05 mm.

(III) advantageous effects

Compared with the prior art, the utility model provides a wireless signal reinforcing chip pastes possesses following beneficial effect:

the wireless signal enhanced chip paste is used for enhancing wireless signal receiving and enhancing signals and improving the use efficiency of people, at present, the wireless signal enhanced chip paste is basically a PCBA hard board circuit product on the market, the product is too thick and basically reaches 0.7MM or more, the exposed area of a hard board circuit is about 90 percent approximately, the product is thick and heavy, the circuit is easy to fall off and oxidize, the signal transmission has an interlayer, the material is not optimal, the signal enhancement effect is not obvious, a die must be arranged on the chip paste production product, a set of large-scale precision equipment and technical personnel are required, the work efficiency of people is reduced, the novel chip paste adopts an AD glue film FPC technology to carry out chip packaging and reinforcement, the line width and the line distance are 0.15MM and 0.06MM, the product thickness is 0.2MM, the flexibility is realized, the exposed area of the circuit is only about 10 percent, the temperature resistance is over 200 ℃, the signal enhancement is over 50 percent higher than that of the hard board, metallic texture, beautiful atmosphere, full of scientific and technological sense, transparent shape of the product without obstacle to enhance signal transmission, more suitable for being used by users in cooperation with products, the product specification is 3.5CM wide by 2.5CM long by 0.2MM thick, the product has the advantages of environmental protection, lightness and thinness, transparency, high temperature resistance, flexibility, bending, water resistance, flame retardance, material saving, more suitable for the user to use the product experience sense, product signal transmission performance improvement, more meeting the new requirements of technological innovation, for the new product invented by the original innovation company, before purchasing production equipment and related detection instruments in fund, a factory with equipment is selected to carry out substitute production, the effective utilization of resources can be improved, the TESA ultrathin double-sided adhesive on the back can be repeatedly installed and torn off without adhesive on the corresponding product shell, the novel black technology for enhancing the micro-electronic wired wireless signal is directly attached to the uppermost or right position on the back of a mobile phone according to the product direction, or paste cell-phone back lower extreme position in middle can, high durability and convenient use, it is safe high-efficient, this product can promote 50% -100% signal enhancement effect on the basis of former cell-phone signal, including communication signal, data signal, the WIFI signal, effective signal reinforcing receives, does not consume the cell-phone consumption, environmental protection safety, can solve the regional weakening of cell-phone signal or the not enough region of signal tower coverage by a wide margin, including the urban area, the town, intensive floor, high-rise office building, underground building, the villa, the mountain area, rural, marine etc., whole wireless signal reinforcing chip pastes simple structure, high durability and convenient operation, the effect of using is better for traditional mode effect.

Drawings

Fig. 1 is the overall structure schematic diagram of the wireless signal enhanced chip sticker of the present invention.

Fig. 2 is a schematic view of a reverse structure of the wireless signal enhanced chip sticker of the present invention.

Fig. 3 is a schematic view of a local structure of the wireless signal enhanced chip sticker of the present invention.

In the figure: 1. a chip sticker main body; 2. sticking the front side of the chip; 3. an AD adhesive film; 4. a full gold plating line; 5. a chip; 6. sticking the chip on the reverse side; 7. TESA ultrathin double faced adhesive tape.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

As shown in fig. 1-3, the wireless signal enhanced chip sticker comprises a chip sticker main body 1, wherein a chip sticker front surface 2 is arranged on the front end outer surface of the chip sticker main body 1, a full gold-plated circuit 4 and a chip 5 are arranged on the front end outer surface of the chip sticker front surface 2, the full gold-plated circuit 4 is located on the outer surface of the chip 5, an AD adhesive film 3 is arranged on the outer surface of the chip 5, a chip sticker reverse surface 6 is arranged at the rear end of the chip sticker main body 1, a TESA ultra-thin double-sided adhesive 7 is arranged on the outer surface of the chip sticker reverse surface 6, and the chip sticker main body 1 is made of a full transparent material and is used for enhancing signals without obstacles.

Furthermore, the AD adhesive film 3 is packaged and reinforced with the chip by adopting an FPC (flexible printed circuit) process, so that the firmness of the chip 5 is improved.

Furthermore, the product specification of the chip sticker main body 1 is 2.5cm long, 3.5cm wide and 0.2mm thick, and the chip sticker is flexible and bendable, so that the use efficiency of the chip sticker is improved.

Furthermore, the exposed area of the circuit in the chip sticker main body 1 is about 10%, so that the use efficiency of people is improved.

Further, the TESA ultrathin double-sided adhesive tape 7 is repeatedly installed on the back face of the chip pasting main body 1, the thickness of the TESA ultrathin double-sided adhesive tape 7 is 0.05mm, the chip pasting is convenient to install, and the work efficiency of people is improved.

The working principle is as follows: the utility model comprises a chip paste main body 1, a chip paste front face 2, an AD adhesive film 3, a full gilding circuit 4, a chip 5, a chip paste back face 6 and a TESA ultrathin double faced adhesive tape 7, the wireless signal enhancement chip paste is used for enhancing a mobile phone, a tablet personal computer, a notebook computer receives wireless signals, enhances signals, improves the use efficiency of people, is a PCBA hard board circuit product on the market at present, the product is too thick and is basically 0.7MM or more, the hard board is approximately 90% of the circuit bare area, the product is light and thin, the circuit is easy to fall off and oxidize, the signal transmission has an interlayer, the material is not optimal, the signal enhancement effect is not obvious, the chip paste production product must be provided with a mold, a set of large-scale precision equipment and technicians are provided, the work efficiency of people is reduced, the novel chip paste adopts the AD adhesive film technology to carry out chip 5 encapsulation and reinforcement, the FPC product thickness is 0.2MM, the flexible and bendable circuit has the circuit bare leakage area of only about 10 percent, can resist temperature of more than 200 ℃, has signal enhancement higher than that of a hard board by more than 50 percent, has metal texture, attractive appearance, is full of technological sense, has transparent product form without obstacle to enhance signal transmission, is more suitable for being used by users in cooperation with products, has the specification of width of 3.5CM, length of 2.5CM and thickness of 0.2MM, has the advantages of environmental protection, lightness, thinness, transparency, high temperature resistance, flexibility, bending, water resistance, flame resistance, material saving, suitability for the users to use the product experience sense, improvement of the signal transmission efficiency of the product, more conformity with the new requirements of technological innovation, innovation of a primary innovation company, selection of a factory with equipment for substitute production before purchasing production equipment and related detection instruments in the absence of capital, effective utilization of resources can be improved, and the back TESA ultrathin double faced adhesive can be repeatedly installed and torn without being adhered to a corresponding product shell, the novel wireless signal enhancement chip is an innovative black technology enhanced by the existing microelectronic wired wireless signal, and is directly attached to the uppermost middle position or the right position of the back of a mobile phone according to the direction of a product, or is attached to the lower middle position of the back of the mobile phone, so that the novel wireless signal enhancement chip is convenient to use, safe and efficient, the product can improve 50% -100% of signal enhancement effect on the basis of the original mobile phone signal, and comprises a communication signal, a data signal and a WIFI signal, the effective signal enhancement receiving does not consume the power consumption of the mobile phone, the environment is safe, the problem that the mobile phone signal is weakened regionally or the coverage of a signal tower is insufficient can be solved greatly, and the novel wireless signal enhancement chip comprises a city area, a town, a dense floor, a high-rise office building, an underground building, a villa mountainous area, a countryside, a sea and the like, and the whole wireless signal enhancement chip is simple in structure and convenient to operate, and the using effect is better than that of the traditional mode.

It is noted that, herein, relational terms such as first and second (a, b, etc.) and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. Wireless signal reinforcing chip pastes, including chip subsides main part (1), its characterized in that: the front end surface of chip subsides main part (1) is provided with chip subsides openly (2), the front end surface of chip subsides openly (2) is provided with gilt circuit (4) and chip (5) entirely, and gilt circuit (4) entirely lies in the surface of chip (5), the surface of chip (5) is provided with AD glued membrane (3), the rear end of chip subsides main part (1) is provided with chip subsides reverse side (6), the surface of chip subsides reverse side (6) is provided with the ultra-thin double faced adhesive tape of TESA (7), chip subsides main part (1) is the preparation of full transparent material, accessible reinforcing signal.

2. The wireless signal enhancement chip sticker of claim 1, wherein: and the AD adhesive film (3) is packaged and reinforced with the chip by adopting an FPC (flexible printed circuit) process.

3. The wireless signal enhancement chip sticker of claim 1, wherein: the product specification of the chip sticker main body (1) is 2.5cm long, 3.5cm wide and 0.2mm thick, and the chip sticker main body is flexible and bendable.

4. The wireless signal enhancement chip sticker of claim 1, wherein: the exposed area of the circuit in the chip paste main body (1) is 10%.

5. The wireless signal enhancement chip sticker of claim 1, wherein: the TESA ultrathin double-sided adhesive tape (7) is repeatedly installed on the back face of the chip sticker main body (1), and the thickness of the TESA ultrathin double-sided adhesive tape (7) is 0.05 mm.