CN213873267U - Semiconductor refrigerating and heating module - Google Patents
Semiconductor refrigerating and heating module Download PDFInfo
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- CN213873267U CN213873267U CN202022603879.2U CN202022603879U CN213873267U CN 213873267 U CN213873267 U CN 213873267U CN 202022603879 U CN202022603879 U CN 202022603879U CN 213873267 U CN213873267 U CN 213873267U
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Abstract
A semiconductor refrigeration and heating module comprises a core module, a control module and a working module, wherein the core module is arranged outside a working environment, the working module is arranged inside the working environment, the core module comprises two semiconductor refrigeration sheets and a water collecting head which are arranged side by side from top to bottom, the lower surfaces of the semiconductor refrigeration sheets on the lower row are tightly attached to the water collecting head, the upper surfaces of the semiconductor refrigeration sheets on the upper row are provided with radiating fins, and a plurality of radiating fans are arranged on the radiating fins; the working module comprises a coil pipe fin and a coil pipe, wherein a heat conduction fluid is filled in the coil pipe, the coil pipe is wound in the water collecting head and the coil pipe fin, a driving pump is arranged on the coil pipe, and a plurality of cooling fans are arranged on the coil pipe fin; a circuit system is arranged in the working module, and two ends of the circuit system are respectively and electrically connected with the two semiconductor refrigerating sheets. The utility model discloses utilize the characteristics of circuit and semiconductor refrigeration piece to realize producing the effect of refrigeration heating in the little space, can regard as portable and emergency place's use.
Description
Technical Field
The utility model relates to a semiconductor refrigeration technology field especially relates to a semiconductor refrigeration heating module.
Background
Semiconductor refrigeration technology has gained wider application since its development in the last 50 th century because of its unique advantages. The working principle of the semiconductor refrigeration chip is that when current passes through the semiconductor refrigeration chip, heat transfer can be generated between two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end.
The semiconductor cooler (TEC) is a solid state device without rotating parts, has a small volume, a long service life, no noise and no harmful substances, and can switch the cooling and heating functions by controlling the direction of input current. The semiconductor refrigeration device can be installed and operated at any angle, and accurate temperature control can be realized through voltage regulation. In a precise refrigerating place with small volume and small refrigerating capacity, the semiconductor refrigerating technology has an irreplaceable position.
The refrigeration and heating products produced based on the semiconductor refrigeration piece have smaller application range and smaller refrigeration space, so the development of the semiconductor refrigeration and heating technology is limited.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problem, the utility model provides a semiconductor refrigeration heating module, concrete technical scheme is:
a semiconductor refrigeration and heating module comprises a core module, a control module and a working module, wherein the core module is arranged outside a working environment, the working module is arranged inside the working environment, the core module comprises a water collecting head and two semiconductor refrigeration sheets which are arranged side by side up and down, the lower surfaces of the lower rows of semiconductor refrigeration sheets are tightly attached to the water collecting head, the upper surfaces of the upper rows of semiconductor refrigeration sheets are provided with radiating fins, and a plurality of radiating fans are arranged on the radiating fins; the working module comprises a coil pipe fin and a coil pipe, wherein heat-conducting fluid is filled in the coil pipe, the coil pipe is wound in the water collecting head and the coil pipe fin, a driving pump for driving the heat-conducting fluid to flow in the coil pipe is arranged on the coil pipe, and a plurality of cooling fans are arranged on the coil pipe fin; the control module is internally provided with a circuit system with adjustable current direction and voltage, and two ends of the circuit system are respectively and electrically connected with the two semiconductor refrigerating sheets.
Furthermore, a circuit change-over switch and a voltage regulator are arranged on the control module.
Further, the control module is provided with a temperature detection device close to the core module.
Further, the inner wall of the coil pipe is provided with small grooves protruding outwards.
Furthermore, a flexible heat-conducting medium is coated between the upper surfaces of the semiconductor refrigeration sheets in the upper row and the heat dissipation fins.
Further, the flexible heat-conducting medium is a mixture of silicone grease and nano metal powder.
Further, the nano metal powder is nano copper or nano aluminum powder.
Further, the heat transfer fluid is water.
Further, the heat-conducting fluid is organic working medium R245 fa.
Has the advantages that:
the utility model discloses utilize the characteristics of circuit and semiconductor refrigeration piece to realize producing the effect of refrigeration heating in the little space, can regard as portable and emergency place's use.
Drawings
Fig. 1 is an overall schematic view of the present invention.
Fig. 2 is an exploded view of the present invention.
In the figure: the device comprises a core module 1, semiconductor refrigeration sheets 11, a water collecting head 12, radiating fins 13, a control module 2, a working module 3, coil fins 31, a coil pipe 32, a driving pump 33 and a radiating fan 4.
Detailed Description
The invention will be further described with reference to the following drawings and specific embodiments:
as shown in fig. 1-2, a semiconductor refrigeration and heating module comprises a core module 1, a control module 2 and a work module 3, wherein the core module 1 is arranged outside a work environment, the work module 3 is arranged inside the work environment, the core module 1 comprises a water collecting head 12 and two semiconductor refrigeration sheets 11 which are arranged side by side up and down, the lower surfaces of the semiconductor refrigeration sheets 11 on the lower row are tightly attached to the water collecting head 12, the upper surfaces of the semiconductor refrigeration sheets 11 on the upper row are provided with heat dissipation fins 13, and a plurality of heat dissipation fans 4 are arranged on the heat dissipation fins 13; work module 3 includes coil pipe fin 31 and coil pipe 32, be filled with the heat-conducting fluid in the coil pipe 32, coil pipe 32 coils and sets up in header 12 and coil pipe fin 31, be provided with the driving pump 33 that is used for driving the heat-conducting fluid and flows in coil pipe 32 on the coil pipe 32, be provided with a plurality of radiator fan 4 on the coil pipe fin 31, coil pipe 32 inner wall is provided with tiny slot to increase coil pipe 32 and header 12, coil pipe fin 31's area of contact, thereby more be favorable to heat-conduction. The control module 2 is internally provided with a circuit system with adjustable current direction and voltage, and two ends of the circuit system are respectively and electrically connected with the two semiconductor refrigerating sheets 11.
In this embodiment, the control module 2 is provided with a circuit transfer switch and a voltage regulator, and the control module 2 is provided with a temperature detection device near the core module 1. The circuit change-over switch is utilized to control the current direction in the circuit, so that the semiconductor refrigerating sheet 11 can refrigerate or heat; and the voltage regulator is used for changing the voltage applied between the two semiconductor refrigerating sheets 11, so that the refrigerating and heating power is regulated to achieve accurate temperature control.
In this embodiment, a flexible heat-conducting medium is coated between the upper surface of the upper row of semiconductor chilling plates 11 and the heat dissipation fins 13. The flexible heat-conducting medium is a mixture of silicone grease and nano metal powder, and the nano metal powder is nano copper or nano aluminum powder, so that the flexible heat-conducting medium is more favorable for conducting heat.
In this embodiment, the heat transfer fluid is water.
In another embodiment, the heat transfer fluid is organic working fluid R245 fa.
Under the refrigeration working condition, the control circuit change-over switch in the control module 2 is switched to a circuit loop of the refrigeration mode, the lower row of semiconductor refrigeration pieces 11 generates cold, and the upper row of semiconductor refrigeration pieces 11 generates heat; the cold energy is transmitted to the water collecting head 12 and further transmitted to the heat-conducting fluid in the coil 32 in the water collecting head, the heat-conducting fluid enters the coil 32 in the coil fin 31 under the driving of the driving pump 33 and transmits the cold energy to the coil fin 31, and the cold energy is released to the working environment needing refrigeration under the action of the cooling fan 4 on the coil fin 31. The heat accumulation generated by the semiconductor refrigeration sheets 11 arranged on the upper row can affect the refrigeration efficiency, the heat radiating fins 13 on the semiconductor refrigeration sheets are contacted through flexible heat-conducting media, the heat is conducted to the heat radiating fins 13, and the heat is transmitted to the outside of the working environment under the action of the heat radiating fan 4.
Under the heating condition, a control circuit change-over switch in the control module 2 is switched to a circuit loop of a heating mode, the lower row of semiconductor chilling plates 11 generate heat, and the upper row of semiconductor chilling plates 11 generate cold; the hot water quantity is conducted to the water collecting head 12 and further conducted to the heat-conducting fluid in the coil 32 therein, the heat-conducting fluid enters the coil 32 in the coil fins 31 under the driving of the driving pump 33 and transfers the heat to the coil fins 31, and the heat is released to the working environment needing heating under the action of the heat-radiating fan 4 on the coil fins 31. The accumulation of cold energy generated by the upward-arranged semiconductor refrigeration pieces 11 can affect the heating efficiency, the heat radiating fins 13 on the upper row are contacted through flexible heat conducting media, the cold energy is conducted to the heat radiating fins 13, and the cold energy is transmitted out of the working environment under the action of the heat radiating fan 4.
Claims (7)
1. A semiconductor refrigeration heating module is characterized in that: the cooling system comprises a core module, a control module and a working module, wherein the core module is arranged outside a working environment, the working module is arranged inside the working environment, the core module comprises a water collecting head and two semiconductor refrigerating sheets which are arranged side by side up and down, the lower surfaces of the lower rows of semiconductor refrigerating sheets are tightly attached to the water collecting head, the upper surfaces of the upper rows of semiconductor refrigerating sheets are provided with cooling fins, and a plurality of cooling fans are arranged on the cooling fins; the working module comprises a coil pipe fin and a coil pipe, wherein heat-conducting fluid is filled in the coil pipe, the coil pipe is wound in the water collecting head and the coil pipe fin, a driving pump for driving the heat-conducting fluid to flow in the coil pipe is arranged on the coil pipe, and a plurality of cooling fans are arranged on the coil pipe fin; the control module is internally provided with a circuit system with adjustable current direction and voltage, and two ends of the circuit system are respectively and electrically connected with the two semiconductor refrigerating sheets.
2. The semiconductor refrigeration and heating module of claim 1, wherein: and the control module is provided with a circuit change-over switch and a voltage regulator.
3. The semiconductor refrigeration and heating module of claim 2, wherein: the control module is provided with a temperature detection device at a position close to the core module.
4. The semiconductor refrigeration and heating module of claim 1, wherein: the inner wall of the coil pipe is provided with small grooves protruding outwards.
5. The semiconductor refrigeration and heating module of claim 1, wherein: and a flexible heat-conducting medium is coated between the upper surfaces of the semiconductor refrigeration sheets on the upper row and the radiating fins.
6. The semiconductor refrigeration and heating module of claim 1, wherein: the heat transfer fluid is water.
7. The semiconductor refrigeration and heating module of claim 1, wherein: the heat-conducting fluid is an organic working medium R245 fa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022603879.2U CN213873267U (en) | 2020-11-12 | 2020-11-12 | Semiconductor refrigerating and heating module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022603879.2U CN213873267U (en) | 2020-11-12 | 2020-11-12 | Semiconductor refrigerating and heating module |
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| Publication Number | Publication Date |
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| CN213873267U true CN213873267U (en) | 2021-08-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022603879.2U Active CN213873267U (en) | 2020-11-12 | 2020-11-12 | Semiconductor refrigerating and heating module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106895531A (en) * | 2017-04-26 | 2017-06-27 | 重庆大学 | A kind of semiconductor air conditioner support |
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2020
- 2020-11-12 CN CN202022603879.2U patent/CN213873267U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106895531A (en) * | 2017-04-26 | 2017-06-27 | 重庆大学 | A kind of semiconductor air conditioner support |
| CN106895531B (en) * | 2017-04-26 | 2023-07-21 | 重庆大学 | Semiconductor air conditioner support |
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