CN213860467U

CN213860467U - Injection mold is used in processing of LED lamps and lanterns

Info

Publication number: CN213860467U
Application number: CN202022934229.6U
Authority: CN
Inventors: 付小军; 毕兵兵; 游云超; 秦海瑞
Original assignee: Lankao Ruiye Lighting Co Ltd
Current assignee: Lankao Ruiye Lighting Co Ltd
Priority date: 2020-12-10
Filing date: 2020-12-10
Publication date: 2021-08-03
Anticipated expiration: 2030-12-10

Abstract

The utility model discloses an injection mold is used in processing of LED lamps and lanterns, including die block board and top template, water-cooling pore and steam pore have all been seted up to the inside of die block board and the inside of top template, two import pipes of one end difference fixedly connected with of the one end of the water-cooling pore on the die block board and steam pore, the other end of the water-cooling pore on the die block board, four L type pipes of fixedly connected with respectively of the other end of steam pore, the one end of the water-cooling pore on the top template and the one end of steam pore, the other end of the water-cooling pore on the top template is fixedly connected with outlet pipe and outlet duct respectively, the beneficial effects of the utility model are that: the water body and the gas can circularly flow through the two water-cooling ducts and the two hot gas ducts respectively through the circulating water pump and the circulating air pump, the temperature of the die can be accurately controlled by cooling and heating the die through the temperature control assembly in the flowing process, and the product quality is improved.

Description

Injection mold is used in processing of LED lamps and lanterns

Technical Field

The utility model relates to an injection mold, in particular to injection mold is used in processing of LED lamps and lanterns belongs to mould technical field.

Background

The LED lamp is an electroluminescent semiconductor material chip, silver glue or white glue is solidified on the support, then the chip and the circuit board are connected through silver wires or gold wires, the periphery of the chip and the circuit board is sealed through epoxy resin, the effect of protecting an internal core wire is achieved, and finally the shell is installed, so that the anti-seismic performance of the LED lamp is good. At present, LED lamps and lanterns use extensively, lie in wherein LED lamp plate processing manufacturing, because the LED lamp plate mostly all is the plastics material, therefore the LED lamp plate mostly all is the mould injection moulding formation.

The existing injection mold for the LED lamp is simple in structure, generally only has a cooling structure, is difficult to control the temperature during injection molding of the mold, directly influences the quality of final injection molding, adopts tap water for water cooling, scales easily after long-time use, needs to be cleaned frequently, and wastes time and energy.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an injection mold is used in processing of LED lamps and lanterns to solve the current LED lamps and lanterns injection mold that provides among the above-mentioned background art and be difficult to the temperature when control mould injection moulding and adopt the running water to carry out the water-cooling and need frequently carry out the problem of clearing up.

In order to achieve the above object, the utility model provides a following technical scheme: an injection mold for processing an LED lamp comprises a bottom template and a top template, wherein the top template is arranged at the top of the bottom template, a water-cooling pore passage and a hot gas pore passage are respectively formed in the bottom template and the top template, one end of the water-cooling pore passage and one end of the hot gas pore passage on the bottom template are respectively and fixedly connected with two inlet pipes, the other end of the water-cooling pore passage, the other end of the hot gas pore passage on the bottom template, one end of the water-cooling pore passage and one end of the hot gas pore passage on the top template are respectively and fixedly connected with four L-shaped pipes, the other end of the water-cooling pore passage and the other end of the hot gas pore passage on the top template are respectively and fixedly connected with a water outlet pipe and an air outlet pipe, one side of the bottom template is provided with a temperature control assembly, the temperature control assembly comprises a box body, a circulating water pump and a circulating air pump which are respectively and fixedly arranged at two side sides of the top end of the box body, and the outlet end of the circulating water pump and the outlet end of the circulating air pump are respectively and fixedly communicated with the two inlet pipes through connecting pipes.

As a preferred technical scheme of the utility model, the inside of box is separated for water storage chamber and gas storage chamber through the baffle, the inside in water storage chamber is annotated with the demineralized water, the top of water storage chamber avris and the top of another avris of gas storage chamber fixedly connected with wet return and muffler respectively, the top of wet return, the top of muffler and the top of being in two L type pipes of bottom communicate with the bottom of outlet pipe, the bottom of outlet duct and the bottom of being in two L type pipes at top respectively through four coupling assembling, the inlet end of circulating water pump and the entrance point of circulating air pump communicate with the bottom of water storage intracavity wall and the bottom of gas storage intracavity wall respectively through two suction pipes.

As a preferred technical scheme of the utility model, four coupling assembling includes four threaded sleeve and four pairs of screw thread portion respectively, and four are right screw thread portion extends respectively to set up on four L type pipes, on the outlet pipe, on the outlet duct, on the wet return and on the muffler, four threaded sleeve's both ends difference threaded sleeve is established in the outside of four pairs of screw thread portions.

As an optimal technical scheme of the utility model, the semiconductor refrigeration piece is installed to the fixed interlude in middle part of baffle, the refrigeration face and the face of heating of semiconductor refrigeration piece set up respectively in the inside in water storage chamber and the inside in gas storage chamber.

As a preferred technical scheme of the utility model, the both sides side of water storage intracavity wall and the both sides side of gas storage intracavity wall are all fixed and are equipped with a plurality of baffle, adjacent two crisscross distribution between the baffle, the inner wall in water storage chamber and the inner wall in gas storage chamber are all fixed and are equipped with the insulating layer.

As an optimal technical scheme of the utility model, the fixed flush mounting plate that is equipped with in one side of box, flush mounting plate's surface is installed circulating water pump control switch, circulating air pump control switch and semiconductor refrigeration piece control switch respectively, circulating water pump, circulating air pump and semiconductor refrigeration piece are respectively through circulating water pump control switch, circulating air pump control switch and semiconductor refrigeration piece control switch and external power supply electric connection.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model relates to an injection mold for processing LED lamps, which can enable water and gas to circularly flow through two water-cooling pore passages and two hot gas pore passages respectively through a circulating water pump and a circulating air pump, and can accurately control the temperature of the mold and improve the product quality by cooling and heating the mold through a temperature control assembly in the flowing process; the threaded sleeve is matched with the threaded part, so that the assembly and disassembly are convenient, and the influence on normal demoulding operation is avoided; the cooling water body adopts demineralized water, so that the generation of scale is greatly reduced, and the structure blockage is avoided to the maximum extent.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic side view of the cross-sectional structure of the present invention;

fig. 3 is a schematic side view of the box of the present invention.

In the figure: 1. a bottom template; 2. a top template; 3. an inlet pipe; 4. an L-shaped pipe; 5. a water outlet pipe; 6. an air outlet pipe; 7. a temperature control assembly; 71. a box body; 72. a water circulating pump; 73. a circulating air pump; 74. a partition plate; 75. a water storage cavity; 76. a gas storage cavity; 77. a semiconductor refrigeration sheet; 78. a suction tube; 79. a connecting pipe; 710. a water return pipe; 711. an air return pipe; 8. a connecting assembly; 81. a threaded sleeve; 82. a threaded portion; 9. a baffle plate; 10. a thermal insulation layer; 11. a switch panel.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the utility model provides an injection mold for processing an LED lamp, which comprises a bottom template 1 and a top template 2, wherein the top template 2 is arranged on the top of the bottom template 1, a water cooling pore passage and a hot gas pore passage are both arranged inside the bottom template 1 and inside the top template 2, one end of the water cooling pore passage and one end of the hot gas pore passage on the bottom template 1 are respectively and fixedly connected with two inlet pipes 3, the other end of the water cooling pore passage, the other end of the hot gas pore passage on the bottom template 1, one end of the water cooling pore passage and one end of the hot gas pore passage on the top template 2 are respectively and fixedly connected with four L-shaped pipes 4, the other end of the water cooling pore passage and the other end of the hot gas pore passage on the top template 2 are respectively and fixedly connected with a water outlet pipe 5 and an air outlet pipe 6, one side of the bottom template 1 is provided with a temperature control assembly 7, the temperature control assembly 7 comprises a box body 71, a circulating water pump 72 and a circulating air pump 73, circulating water pump 72 and circulating air pump 73 are fixed respectively and are set up the both sides side on box 71 top, and the outlet end of circulating water pump 72 and the outlet end of circulating air pump 73 all pass through connecting pipe 79 respectively with two import pipe 3 fixed intercommunications, can make water and gas respectively through two water-cooling pore canals and two hot gas pore canals circulation flow through circulating water pump 72 and circulating air pump 73, and the mould is cooled down and is heated through accuse temperature subassembly 7 to the flow in-process, can accurate control mould temperature, improve product quality.

Preferably, the inside of the box body 71 is divided into a water storage cavity 75 and a gas storage cavity 76 by a partition plate 74, the inside of the water storage cavity 75 is filled with demineralized water, the top of the side of the water storage cavity 75 and the top of the other side of the gas storage cavity 76 are fixedly connected with a water return pipe 710 and a gas return pipe 711 respectively, the top of the water return pipe 710, the top of the gas return pipe 711 and the top of the two L-shaped pipes 4 at the bottom are communicated with the bottom of the water outlet pipe 5, the bottom of the gas outlet pipe 6 and the bottom of the two L-shaped pipes 4 at the top respectively through four connecting assemblies 8, the inlet end of the circulating water pump 72 and the inlet end of the circulating air pump 73 are communicated with the bottom of the inner wall of the water storage cavity 75 and the bottom of the inner wall of the gas storage cavity 76 respectively through two suction pipes 78, the water body and the gas can circularly flow through two water cooling channels and two hot gas channels respectively through the circulating water pump 72 and the circulating air pump 73, the temperature control assembly 7 cools and heats the mold during the flow, the temperature of the mold is accurately controlled, the product quality is improved, the four connecting assemblies 8 respectively comprise four threaded sleeves 81 and four pairs of threaded parts 82, the four pairs of threaded parts 82 respectively extend to be arranged on the four L-shaped pipes 4, the water outlet pipe 5, the air outlet pipe 6, the water return pipe 710 and the air return pipe 711, two ends of each threaded sleeve 81 are respectively sleeved outside the four pairs of threaded parts 82 in a threaded manner, the threaded sleeves 81 are matched with the threaded parts 82 to facilitate disassembly and assembly, the influence on normal demolding operation is avoided, the middle parts of the partition plates 74 are fixedly and alternately provided with the semiconductor refrigerating sheets 77, the refrigerating surfaces and the heating surfaces of the semiconductor refrigerating sheets 77 are respectively arranged inside the water storage cavity 75 and the air storage cavity 76, water and air can be respectively cooled and heated through the semiconductor refrigerating sheets 77, electric energy is reasonably utilized, a plurality of baffle plates 9 are fixedly arranged on two side sides of the inner wall of the water storage cavity 75 and two side sides of the inner wall of the air storage cavity 76, crisscross distribution between two adjacent baffles 9, the inner wall in water storage chamber 75 and the inner wall in gas storage chamber 76 are all fixed and are equipped with insulating layer 10, can prolong the circulation path through baffle 9, improve space utilization and heat transfer effect, can play heat retaining effect through insulating layer 10, avoid ambient temperature to influence the inside temperature of accuse temperature subassembly 7, the fixed flush mounting plate that is equipped with in one side of box 71, flush mounting plate 11's surface is installed the circulating water pump control switch respectively, circulating air pump control switch and semiconductor refrigeration piece control switch, circulating water pump 72, circulating air pump 73 and semiconductor refrigeration piece 77 are respectively through circulating water pump control switch, circulating air pump control switch and semiconductor refrigeration piece control switch and external power supply electric connection, be convenient for control whole accuse temperature subassembly 7 through flush mounting plate 11, and the operation is simple.

When the injection mold is used specifically, the utility model relates to an LED lamp processing injection mold, firstly, the die assembly is carried out on a bottom template 1 and a top template 2, then four L-shaped pipes 4 corresponding to each other in pairs are connected by adjusting the position of a threaded sleeve 81, simultaneously, a water outlet pipe 5 and a gas outlet pipe 6 are respectively communicated with a water return pipe 710 and a gas return pipe 711, then, the injection molding is carried out, in the injection molding process, a semiconductor refrigerating sheet 77 with the type being TES1-12704 is opened through a switch panel 11, at the moment, the heating surface of the semiconductor refrigerating sheet 77 generates high temperature, meanwhile, a circulating air pump 73 is controlled by the switch panel 11 to work, hot air in a gas storage cavity 76 is heated through the suction pipe 78 and a connecting pipe 79 to the inside of two hot air channels, the influence on the product quality due to too fast natural cooling in the injection molding process is avoided to the utmost, in the shaping and cooling process after the injection molding is finished, the circulating air pump 73 is closed through the switch panel 11, the circulating water pump 72 is simultaneously started, the demineralized water in the water storage cavity 75 is input into the two water-cooling channels through the suction pipe 78 and the connecting pipe 79 through the circulating water pump 72 for water-cooling and temperature reduction, meanwhile, the refrigerating surface of the semiconductor refrigerating sheet 77 can exchange heat and reduce the temperature of the circulating water body, so as to ensure the water cooling effect, the water body and the gas can respectively flow circularly through the two water cooling pore passages and the two hot gas pore passages by the circulating water pump 72 and the circulating air pump 73, the temperature control assembly 7 is used for cooling and heating the die in the flowing process, can accurately control the temperature of the die, improve the product quality, greatly reduce the generation of scale by adopting demineralized water for cooling a water body in the water cooling process, avoid the structure blockage to the maximum extent, and during the demoulding, due to the fact that the threaded sleeve 81 is matched with the threaded portion 82 to facilitate dismounting, normal demoulding operation can be furthest prevented from being influenced.

In the description of the present invention, it should be understood that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.

In the present invention, unless otherwise explicitly specified or limited, for example, it may be fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an injection mold is used in processing of LED lamps and lanterns, includes die block board (1) and top template (2), its characterized in that, top template (2) sets up the top at die block board (1), water-cooling pore and steam pore have all been seted up to the inside of die block board (1) and the inside of top template (2), the one end in water-cooling pore and the one end in steam pore on die block board (1) are fixedly connected with two import pipes (3) respectively, the other end in water-cooling pore, the other end in steam pore on die block board (1), the one end in water-cooling pore and the one end in steam pore on top template (2) are fixedly connected with four L type pipes (4) respectively, the other end in water-cooling pore and the other end in steam pore on top template (2) are fixedly connected with outlet pipe (5) and outlet duct (6) respectively, one side of die block board (1) is equipped with accuse temperature subassembly (7), accuse temperature subassembly (7) include box (71), circulating water pump (72) and circulating air pump (73) are fixed respectively and are set up the both sides side on box (71) top, circulating water pump (72) exit end and circulating air pump (73) exit end all through connecting pipe (79) respectively with two import pipe (3) fixed intercommunication.

2. The injection mold for processing the LED lamp according to claim 1, wherein: the inside of box (71) is separated for water storage chamber (75) and gas storage chamber (76) through baffle (74), the inside notes of water storage chamber (75) have demineralized water, the top of water storage chamber (75) avris and the top of another avris of gas storage chamber (76) are fixedly connected with wet return (710) and muffler (711) respectively, the top of wet return (710), the top of muffler (711) and the top of being in two L type pipes (4) of bottom communicate with the bottom of outlet pipe (5), the bottom of outlet pipe (6) and the bottom of being in two L type pipes (4) at top respectively through four coupling assembling (8), the entrance point of circulating water pump (72) and the bottom intercommunication of the air pump of circulating water pump (73) respectively with the bottom of water storage chamber (75) inner wall and gas storage chamber (76) inner wall through two admission pipes (78).

3. The injection mold for processing the LED lamp according to claim 2, wherein: four coupling assembling (8) are including four screw thread sleeves (81) and four pairs of screw thread portion (82) respectively, four pairs of screw thread portion (82) extend respectively and set up on four L type pipes (4), on outlet pipe (5), on outlet duct (6), on wet return (710) and on muffler (711), four the both ends of screw thread sleeve (81) are threaded the outside of establishing four pairs of screw thread portion (82) respectively.

4. The injection mold for processing the LED lamp according to claim 2, wherein: the middle part of baffle (74) is fixed to be interlude and is installed semiconductor refrigeration piece (77), the refrigeration face and the face of heating of semiconductor refrigeration piece (77) set up respectively in the inside of water storage chamber (75) and the inside of gas storage chamber (76).

5. The injection mold for processing the LED lamp according to claim 2, wherein: both sides of water storage chamber (75) inner wall and both sides of gas storage chamber (76) inner wall all fix and are equipped with a plurality of baffle (9), adjacent two crisscross distribution between baffle (9), the inner wall of water storage chamber (75) and the inner wall of gas storage chamber (76) all fix and are equipped with insulating layer (10).

6. The injection mold for processing the LED lamp according to claim 4, wherein: fixed flush mounting plate of switch panel (11) that is equipped with in one side of box (71), the surface of flush mounting plate of switch (11) installs circulating water pump control switch, circulating air pump control switch and semiconductor refrigeration piece control switch respectively, circulating water pump (72), circulating air pump (73) and semiconductor refrigeration piece (77) are respectively through circulating water pump control switch, circulating air pump control switch and semiconductor refrigeration piece control switch and external power supply electric connection.