CN213752632U

CN213752632U - Wafer detection device

Info

Publication number: CN213752632U
Application number: CN202023152573.6U
Authority: CN
Inventors: 陈鲁; 李少雷; 张朝前; 马砚忠; 王兵; 张嵩
Original assignee: Shenzhen Zhongke Feice Technology Co Ltd
Current assignee: Shenzhen Zhongke Feice Technology Co Ltd
Priority date: 2020-12-24
Filing date: 2020-12-24
Publication date: 2021-07-20
Anticipated expiration: 2030-12-24

Abstract

The utility model provides a wafer detection device, includes the driving piece, is used for bearing the fixed station of wafer transfer box and is used for receiving and dispatching the measuring piece that detects the signal, is equipped with the breach position on the fixed station, and the measuring piece arranges the opening side at wafer transfer box along the fore-and-aft direction, and measuring piece or fixed station are connected to the driving piece to order about measuring piece and fixed station along upper and lower direction and take place relative motion. The detection piece and the fixed table move relatively along a single vertical direction by utilizing the alignment relation between the notch position and the detection piece and under the driving action of the driving piece, after the detection piece enters the wafer transmission box through the notch position, wafers in the wafer transmission box can be scanned and detected one by one, so that the items such as whether the placement position is correct, whether lamination exists, counting statistics and the like can be synchronously completed, the position debugging of the detection piece before each detection operation is carried out is not needed, and the conditions can be created for effectively improving the detection efficiency by simplifying the preparation flow.

Description

Wafer detection device

Technical Field

The utility model relates to a semiconductor manufacturing technology field, concretely relates to wafer detection device.

Background

It is known that device front end modules (i.e., EFEM) and standard load port modules (i.e., Loadport) are important components of an IC fabrication facility; the equipment front end module can realize the functions of taking out the wafer from the wafer transmission box, classifying the wafer, pre-aligning and the like, and the standard loading port module is a window for the wafer transmission box to enter and exit the equipment front end module; before a wafer transmission box in a standard loading port module enters an equipment front end module, the position condition and the like of a wafer in the wafer transmission box are often required to be detected so as to avoid the problems of breakage and the like of the wafer in the subsequent grabbing and transmitting processes. However, the existing wafer inspection scheme has the defects of complex inspection process, low inspection efficiency and the like.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the main technical problem who solves provides a wafer detection device to reach the purpose that improves detection efficiency.

An embodiment provides a wafer inspection apparatus, comprising:

the fixed table is used for bearing the wafer transmission box, and is provided with a notch position which is positioned at the opening side of the wafer transmission box;

the detection piece is used for receiving and transmitting detection signals and is arranged on the opening side of the wafer transmission box along the front-back direction; and

the driving piece is connected with the detection piece or the fixed table so as to drive the detection piece and the fixed table to move relatively along the up-down direction, and the detection piece can enter and exit the wafer transmission box through the gap position.

In one embodiment, the detecting member includes a first supporting portion and a first detecting portion; wherein,

the first supporting part comprises a first supporting arm and a second supporting arm, the first supporting arm and the second supporting arm are arranged in parallel at intervals along the left-right direction, and the first supporting arm and the second supporting arm are used for entering and exiting the wafer conveying box through the gap;

the first detection part comprises a detection light emitting element and a detection light receiving element, wherein the detection light emitting element is used for emitting parallel detection light along the left-right direction, the detection light receiving element is used for receiving the detection light, the detection light emitting element is arranged at one end, close to the wafer transfer box, of the first support arm, the detection light receiving element is arranged at one end, close to the wafer transfer box, of the second support arm, and the detection light emitting element and the detection light receiving element are distributed in a left-right relative mode.

In one embodiment, the first support further comprises:

the first sliding guide piece is used for enabling the detection light emitting piece to move in the left-right direction and/or the front-back direction relative to the first supporting arm, and the detection light emitting piece is connected with the first supporting arm through the first sliding guide piece; and

and a second guide slider for moving the detection light receiving element in a left-right direction and/or a front-back direction with respect to the second support arm, the detection light receiving element being connected to the second support arm through the second guide slider.

In one embodiment, the first supporting portion further includes a plurality of shift position locking parts, and the plurality of shift position locking parts are arranged and distributed along the extending direction of the first slide guide part and the second slide guide part, and are used for fixing the relative position between the detection light emitting element and the first supporting arm and between the detection light receiving element and the second supporting arm.

In one embodiment, the first support further comprises:

the positioning arms are distributed at one ends, far away from the wafer transmission box, of the first supporting arm and the second supporting arm along the left-right direction; and

and the third guide sliding piece is used for enabling the first supporting arm and the second supporting arm to be close to or far away from each other along the left-right direction, and the first supporting arm and the second supporting arm are connected with the positioning arm through the third guide sliding piece.

In one embodiment, the detecting member includes:

the second supporting part is used for entering and exiting the wafer transmission box through the gap position and is arranged at the opening side of the wafer transmission box; and

the second detection part is used for transmitting detection signals in the form of electromagnetic waves or mechanical waves to the wafer in the wafer transmission box and receiving the detection signals reflected from the wafer, and the second detection part is arranged at one end, close to the wafer transmission box, of the second supporting part.

In one embodiment, the second supporting portion includes a third supporting arm and a fourth supporting arm, the third supporting arm and the fourth supporting arm are spaced apart from each other in a side-by-side manner along a left-right direction, the third supporting arm and the fourth supporting arm are used for passing in and out the wafer transfer box through the notch, and the second detecting portion is disposed on each of the third supporting arm and the fourth supporting arm.

In one embodiment, the second detection portion is a reflective photoelectric sensor or an ultrasonic sensor.

In one embodiment, the drive member comprises:

the connecting part is arranged on the opening side of the wafer conveying box, the connecting part and the fixed table are mutually distributed in parallel along the vertical direction, and one end of the connecting part is connected with the detection piece; and

and the power output end of the driving part is connected with the other end of the connecting part so as to drive the connecting part to drive the detection piece to move up and down relative to the fixed table.

In one embodiment, the wafer transfer apparatus further includes a carrier body, the carrier body has a first space and a second space, the first space is distributed on an upper side or a lower side of the second space along a vertical direction, the fixed stage is installed in the first space, the driving portion is installed in the second space, and the end side of the wafer transfer box, which is far away from the fixed stage, is provided with the notch position.

According to the wafer detection device of the embodiment, the wafer detection device comprises a driving part, a fixed table used for bearing a wafer transmission box and a detection part used for receiving and sending detection signals, wherein the fixed table is provided with a notch position, the detection part is arranged on the opening side of the wafer transmission box along the front-back direction, and the driving part is connected with the detection part or the fixed table so as to drive the detection part and the fixed table to move relatively along the up-down direction. The detection piece and the fixed table move relatively along a single vertical direction by utilizing the alignment relation between the notch position and the detection piece and under the driving action of the driving piece, after the detection piece enters the wafer transmission box through the notch position, wafers in the wafer transmission box can be scanned and detected one by one, so that the items such as whether the placement position is correct, whether lamination exists, counting statistics and the like can be synchronously completed, the position debugging of the detection piece before each detection operation is carried out is not needed, and the conditions can be created for effectively improving the detection efficiency by simplifying the preparation flow.

Drawings

Fig. 1 is a schematic structural assembly diagram (one) of a wafer inspection apparatus according to an embodiment.

Fig. 2 is a schematic structural assembly diagram (two) of the wafer inspection apparatus according to an embodiment.

Fig. 3 is an enlarged schematic view of a structure of a partial region in fig. 2.

Fig. 4 is a reference schematic diagram (a) illustrating a structure of a detecting member of the wafer detecting apparatus according to an embodiment.

Fig. 5 is a reference diagram (two) illustrating a structure of a detecting member of the wafer detecting apparatus according to an embodiment.

Fig. 6 is a reference schematic diagram (three) illustrating a structure of a detecting member of the wafer detecting apparatus according to an embodiment.

Fig. 7 is a reference schematic diagram (iv) illustrating a structure of a detecting member of the wafer detecting apparatus according to an embodiment.

In the figure:

10. a bearing body; 20. a fixed table; 30. a detection member; 31. a first support arm; 32. a second support arm; 33. detecting a light emitting element; 34. a detection light receiving member; 35. a first guide slider; 36. a second guide slide member; 37. a gear locking piece; 38. a positioning arm; 39. a third guide slide piece; 310. a second detection unit; 320. a third support arm; 330. a fourth support arm; 40. a drive member; 41. a drive section; 42. a connecting portion; a. a gap position; A. a wafer transfer box.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings. Wherein like elements in different embodiments are numbered with like associated elements. In the following description, numerous details are set forth in order to provide a better understanding of the present application. However, those skilled in the art will readily recognize that some of the features may be omitted or replaced with other elements, materials, methods in different instances. In some instances, certain operations related to the present application have not been shown or described in detail in order to avoid obscuring the core of the present application from excessive description, and it is not necessary for those skilled in the art to describe these operations in detail, so that they may be fully understood from the description in the specification and the general knowledge in the art.

Furthermore, the features, operations, or characteristics described in the specification may be combined in any suitable manner to form various embodiments. Also, the various steps or actions in the method descriptions may be transposed or transposed in order, as will be apparent to one of ordinary skill in the art. Thus, the various sequences in the specification and drawings are for the purpose of describing certain embodiments only and are not intended to imply a required sequence unless otherwise indicated where such sequence must be followed.

The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings).

The common wafer detection device in the prior art mainly comprises a door-shaped frame, two groups of opposite sensors and a driving part, wherein the two groups of opposite sensors are arranged oppositely; the power output end of the driving part is coupled to the bottom end of the door-shaped frame and is rotationally connected with the door-shaped frame, and the correlation sensor is arranged at the top end of the door-shaped frame; when the wafer is detected, the door-shaped frame is firstly required to be inclined towards one side of the wafer transmission box, so that the edge of the wafer is positioned in the detection range of the correlation sensor, and then the door-shaped frame is driven by the driving part to gradually move downwards, so that the detection operation is completed. In order to match different wafer transmission boxes, the inclination angle of the door-shaped frame needs to be adjusted in advance when detection operation is performed once; therefore, the complexity of the detection process is increased, the detection efficiency is reduced, and even the detection result is affected, and the structure, the volume, the operation mode and the like of the device are easily too complex.

Referring to fig. 1 to 7, an embodiment of a wafer inspection apparatus is mainly used for inspecting a wafer in a wafer transfer box a, such as whether a wafer is placed correctly, whether a lamination exists, whether the wafer is damaged, and counting the number of the wafer; the wafer transport box a is a Front Opening Unified Pod (FOUP), and has an accommodating space and a Front Opening door frame Opening, wherein a plurality of storage slots are arranged in the accommodating space and are distributed in an overlapping manner in the accommodating space through the door frame Opening, and the wafers are placed in the accommodating space through the storage slots in a stacked manner. The wafer inspecting apparatus includes a carrier body 10, a fixing stage 20, an inspecting member 30 and a driving member 40, which are described below.

Referring to fig. 1 and 2, the carrier body 10 is mainly used for providing an assembly space for each component of the entire device, and has a first space and a second space, the first space is distributed above the second space along the up-down direction, the first space is used for providing an assembly space for the fixing table 20, and the second space is used for providing an assembly space for a main body portion (such as a driving portion 41 described later) of the driving member 40. In one embodiment, the carrier body 10 may be an independent individual structural component, so that the whole apparatus can be structurally independent from other related devices, and the wafer inspection operation can be independently completed while the apparatus is provided with the conditions for assembling and disassembling with other related devices; in another embodiment, the carrier body 10 may also be a part of an ic manufacturing apparatus, for example, a rack of a standard load port module is used as the carrier body 10, so that the detection function of the whole device is structurally integrated and functionally combined with the ic manufacturing apparatus, and the ic manufacturing apparatus has a wafer detection function at the same time.

Referring to fig. 1 and 2, the fixing table 20 is mainly used for carrying a wafer transfer box a, so that the wafer transfer box a can be fixedly placed, and a notch a located at an opening side of the wafer transfer box a is disposed on the fixing table 20; the two notch positions a can be symmetrically distributed along the left and right directions or can be provided with an opening along the left and right directions; after the wafer transfer box a is placed on the fixing table 20, the gap position a is equivalent to a circumferential edge area of the wafer, and based on the structural characteristics of the wafer transfer box a, the gap position a can be communicated with the internal space of the wafer transfer box a. The fixed table 20 may be an independent individual structural component, and is combined with other components through the function of the bearing machine body 10 to form an independent detection device; or may be part of an integrated manufacturing facility, such as one that utilizes a standard loadport module pod mounting apparatus as the mounting table 20, so that the integrated circuit manufacturing facility is configured to also function as a wafer inspection facility.

Referring to fig. 1, 2, 3 and 4, the detecting element 30 is mainly used for transmitting and receiving a detecting signal to provide information support for finally completing the detection of the wafer in the wafer pod a; the detecting member 30 includes a first supporting portion and a first detecting portion. The first supporting portion is mainly used as a mounting and carrying component of the first detecting portion, and includes a first supporting arm 31 and a second supporting arm 32, where the first supporting arm 31 and the second supporting arm 32 are both plate-shaped structures whose extending directions are in front and back directions (of course, it should be understood by those skilled in the art that the plate-shaped structures are only an example, as long as the function of the present invention can be realized, and the shape and structure thereof are not limited), and at the same time, the first supporting arm 31 and the second supporting arm 32 are mutually distributed at intervals side by side along the left and right direction, so that after the first supporting arm 31 and the second supporting arm 31 enter the wafer transfer box a via the gap position a, the first supporting arm 31 and the second supporting arm are respectively located on two symmetrical sides of the circumferential edge of the wafer. The first detecting part is a correlation photoelectric sensor including a detecting light emitting element 33 for emitting parallel detecting light (e.g., infrared beam) in the left-right direction from one side of the circumferential edge of the wafer and a detecting light receiving element 34 for receiving the detecting light from the other side of the circumferential edge of the wafer; the light emitting detecting element 33 is disposed at an end of the first support arm 31 adjacent to the foup a (i.e., an end adjacent to the wafer, or a front end of the first support arm 31), the light receiving detecting element 34 is disposed at an end of the second support arm 32 adjacent to the foup a (i.e., an end adjacent to the wafer, or a front end of the second support arm 32), and the light emitting detecting element 33 and the light receiving detecting element 34 are disposed in a left-right opposite arrangement (i.e., at the same horizontal height in the up-down direction).

In practical implementation, it is preferable that the height of the inspection light beam in the vertical direction and the height of the emitting port of the inspection light emitting device 33 and the receiving port of the inspection light receiving device 34 in the vertical direction are both greater than the height of a single wafer in the vertical direction (i.e. equivalent to the thickness of the single wafer), so that when the wafer is scanned and inspected by the inspection device 30, if the height of the inspection light beam received by the wafer ice cup inspection light receiving device 34 is not changed (i.e. equivalent to the thickness of the wafer scanned by the inspection device 30 being equal to the actual thickness of the wafer), the wafer is in the correct position for horizontal placement; if the height is increased (i.e., the thickness of the wafer scanned by the inspection unit 30 is greater than the actual thickness of the wafer), the wafer has a tilt problem; therefore, whether the wafer is placed correctly (or whether the wafer is placed horizontally) can be detected.

Referring to fig. 1, 2 and 4, the driving member 40 is mainly used for driving the detecting member 30 to move relative to the fixing table 20 along the up-down direction, so that the detecting member 30 can scan and detect the wafers in the wafer transferring box a one by one; which includes a driving part 41 and a connecting part 42. Wherein, the driving part 41 is installed in the carrying body 10 and located at the lower side of the fixed table 20, the driving part 41 may be a driving device composed of main components such as a stepping motor, a screw transmission mechanism, etc., or a driving device constructed by using a multi-position cylinder, etc. as a main body; the key points are as follows: the detection piece 30 can be driven to move at a constant speed in the vertical direction or intermittently move according to the distance between the wafers, so that the wafers can be scanned one by one in the moving or stopping process of the detection piece 30. The connecting portion 42 is disposed side by side with the fixed base 20 along the vertical direction, the lower end of the connecting portion 42 is connected to the power output end of the driving portion 41, and the upper end of the connecting portion 42 is connected to the first supporting portion.

In the initial state, the position adjustment of the first support portion by the driving element 40 allows the detection light emitting element 33 and the detection light receiving element 34 to be accommodated in the notch position a; when the wafer is inspected, the driving part 41 drives the connecting part 42 to drive the inspection piece 30 to move upwards, so that the inspection light emitting piece 33 and the inspection light receiving piece 34 enter the wafer transfer box a and are positioned at two sides of the circumferential edge of the wafer, and thus the wafer is scanned in the moving process; when the detection operation of whether the wafer placement position is correct is realized, the detection of whether the wafer has the lamination or not and the counting and counting of the wafer can be realized by integrating the information of the time sensed by the first detection part, the driving speed of the driving part 40 to the detection piece 30, the moving distance of the detection piece 30 and the like.

Firstly, the detection piece 30 is directly driven to move along a single vertical direction by the driving piece 40 by utilizing the structural matching relationship between the fixed platform 20 provided with the notch position a and the wafer transmission box A, so that the detection piece 30 completes the detection operation on the wafer in the moving process, the position debugging of the detection piece 30 is not required before each detection operation (or execution of one detection period), and therefore, the condition can be created for effectively improving the detection efficiency by simplifying the preparation flow; moreover, the notch position a can be used for realizing the prepositioning of the detection piece 40, and the accuracy of the detection result can be ensured.

Secondly, the detecting member 30 is driven by the driving member 40 to move in the wafer transfer box a in the up-down direction, and there is no need to configure a door-shaped frame, a rotating shaft, and other accessories such as angle positioning and detection, which is beneficial to simplifying the structure of the whole apparatus and reducing the volume.

Third, local materials can be used, and a part of the ic manufacturing apparatus (such as the body and the fixing member of the standard load port module) is used as the carrier body 10 and the fixing stage 20, and the detecting member 30 and the driving member 40 are directly and adaptively assembled, so that the ic manufacturing apparatus can have the function of wafer detection.

In one embodiment, referring to fig. 5, the first supporting portion further includes a first sliding guide piece 35 and a second sliding guide piece 36; the first slide guide piece 35 and the second slide guide piece 36 can adopt the fittings of the prior art such as a linear slide rail, a sliding connector and the like; the first slider guide 35 is connected between the detection light emitting element 33 and the first support arm 31 in the left-right direction, and the second slider guide 36 is connected between the detection light receiving element 34 and the second support arm 32 in the left-right direction, so that the detection light emitting element 33 and the detection light receiving element 34 can be moved closer to or farther away from each other in the left-right direction, and the distance between the detection light emitting element 33 and the detection light receiving element 34 can be adjusted according to the size of the wafer, thereby meeting the detection requirements of wafers of different sizes. In another embodiment, the first slide guide 35 and the second slide guide 36 may also be arranged along the front-back direction, so that the detecting light emitting element 33 and the detecting light receiving element 34 can adjust the depth of the detecting light emitting element 33 and the detecting light receiving element 34 extending into the wafer cassette a according to the size of the wafer or the specific position in the wafer cassette a, so as to achieve fine adjustment in the front-back direction. In other embodiments, the first and second slide guides 35 and 36 may also be configured to slide in multiple directions (e.g., a linear slide in the left-right direction and a linear slide in the front-back direction are stacked) so that the inspection light receiving element 33 and the inspection light receiving element 34 can move toward or away from each other in the left-right direction and move in and out of the wafer carrier a in the front-back direction according to actual inspection requirements.

In one embodiment, referring to fig. 5 and 6, the first supporting portion further includes a plurality of shift position locking parts 37, the shift position locking parts 37 may be formed by holes opened on the supporting arm and hardware parts such as screws mounted on the sliding guides, the plurality of shift position locking parts 37 are arranged along the extending direction of the first sliding guide 35 and the second sliding guide 36, and the relative positions between the light emitting detecting part 33 and the first supporting arm 31 and between the light receiving detecting part 34 and the second supporting arm 32 may be fixed by the shift position locking parts 37. Specifically, according to the size of the wafer (e.g. 4 inches, 5 inches, 6 inches, 8 inches, etc.), corresponding hole sites are respectively disposed on the first supporting arm 31 and the second supporting arm 32, and when the size of the wafer to be detected changes, the detection light emitting device 33 and the detection light receiving device 34 can be adjusted and moved between the corresponding hole sites, and finally, the two are locked and fixed by the gear locking device 37.

In one embodiment, referring to fig. 6, in order to realize that the detecting light emitting element 33 and the detecting light receiving element 34 move closer to or away from each other along the left-right direction to meet the detecting requirements of wafers with different sizes, the distance between the detecting light emitting element 33 and the detecting light receiving element 34 can also be adjusted by adjusting the distance between the first supporting arm 31 and the second supporting arm 32; specifically, the first support part includes a positioning arm 38 and a third slide guide 39, the positioning arm 38 is distributed at one end of the first support arm 31 and the second support arm 32 away from the foup a along the left-right direction and is connected with the connecting part 42, the first support arm 31 and the second support arm 32 are connected with the positioning arm 38 through the third slide guide 39, and the third slide guide 39 is selectively set with reference to the first slide guide 35 and the second slide guide 36; in this way, by using the sliding connection relationship between the support arm and the positioning arm 38, the detection light emitting element 33 and the detection light receiving element 34 can be driven to move synchronously by adjusting the relative position between the support arm and the positioning arm 38, so as to finally realize the distance adjustment between the two elements.

In some embodiments, the wafer transport box a with the top side opened with the notch position a may also be used as a container for storing the wafer; at this time, the driving portion 41 may be installed above or below the fixed stage 20 according to actual conditions, so that the connecting portion 42 can drive the detecting member 30 to move from top to bottom, thereby completing the scanning detection of the wafer. Of course, the notch a may be disposed on the fixing stage 20 and the wafer transport box a at the same time, so that the detecting member 30 can reciprocate along the vertical direction, and when the detecting member 30 moves from the top to the bottom by a predetermined distance or from the bottom to the top by a predetermined distance, it can be used as a detection period, so as to complete the scanning detection of all wafers in the wafer transport box a in one detection period, without resetting, thereby being beneficial to improving the detection efficiency. It should be noted that: in such embodiments, the foup a needs to be placed into the platen 20 from the left or right side of the platen 20 to avoid affecting the inspection piece 30.

In some embodiments, referring to fig. 7, the detecting element 30 can also detect the wafer in a signal reflection manner; the method specifically comprises the following steps: the detection piece 30 includes a second support portion and a second detection portion 310; the second supporting part is arranged at the opening side of the wafer transmission box A, can be distributed at the front side of the circumferential edge of the wafer along the left-right direction, and can also be distributed at the left side and/or the right side of the circumferential edge of the wafer along the front-back direction; the second supporting portion is connected to the driving member 40, so that the driving member 40 drives the second detecting portion 310 to enter and exit the foup a through the notch a. The second detecting portion 310 is a reflective photoelectric sensor, such as a laser sensor, disposed at one end or one side of the second supporting portion adjacent to the pod a, and mainly sends a laser beam to the wafer in the pod a, and receives the laser beam reflected from the edge of the wafer, so that the scanning detection of the wafer can also be completed by using the principle such as laser ranging, etc. to determine the number of the wafers in the pod a and whether there is a tilt of the wafer, for example, when there is no tilt of the wafer, the distance information obtained by the laser ranging distance measurement will change within a certain preset parameter range (for example, one preset parameter range when the wafer is detected is 1-2mm, and the other preset parameter range when the wafer is not detected is 20-30 mm), when the wafer is tilted, the measured distance information may have other distance information within a preset parameter range (for example, when the wafer is detected to be obliquely placed, the distance information of any point on the surface of the wafer is 8 mm), so that the wafer can be determined to be obliquely placed. In other embodiments, the second detecting portion 310 may also employ an electromagnetic wave sensor such as a microwave sensor, an infrared sensor, or a mechanical wave sensor such as an ultrasonic sensor, so as to implement one or more detecting functions such as wafer position, lamination, counting, and flaw detection according to actual detecting requirements.

In an embodiment, referring to fig. 7, to ensure the accuracy of the detection result, the second detecting portion 310 may also be arranged with reference to the first detecting portion, specifically: the second support portion comprises a third support arm 320 and a fourth support arm 330, and the third support arm 320 and the fourth support arm 330 are mutually arranged in parallel at intervals along the left-right direction; meanwhile, the third support arm 320 and the fourth support arm 330 are both provided with the second detecting portions 310, so that after the third support arm 320 and the fourth support arm 330 enter the wafer transport box a through the notch a, the second detecting portions 310 are respectively located at two symmetrical positions of the circumferential edge of the wafer. Thus, the second detecting portions 310 may be disposed on both the left and right sides of the circumferential edge of the wafer, and the two second detecting portions 310 disposed opposite to each other may be used to detect one wafer synchronously, and the detection result (e.g., whether the wafer is inclined, whether the lamination exists, etc.) may be finally obtained by determining the detection information (e.g., consistency, etc.) obtained by the two second detecting portions 310

In some embodiments, the driving element 40 may also be connected to the fixing stage 20, and the detecting element 30 is preset at a fixed position, so that the fixing stage 20 is driven by the driving element 40 to move in an up-and-down direction to achieve a relative movement effect between the fixing stage 20 and the detecting element 30, and during the movement of the fixing stage 20, the wafers in the wafer cassette a carried by the fixing stage may pass between the detecting light emitting element 33 and the detecting light receiving element 34 one by one or enter the detection range of the second detecting part 310; therefore, the wafers can be scanned and detected one by one.

It is right to have used specific individual example above the utility model discloses expound, only be used for helping to understand the utility model discloses, not be used for the restriction the utility model discloses. To the technical field of the utility model technical personnel, the foundation the utility model discloses an idea can also be made a plurality of simple deductions, warp or replacement.

Claims

1. A wafer inspection apparatus, comprising:

2. The wafer inspection apparatus as claimed in claim 1, wherein the inspection member includes a first support portion and a first inspection portion; wherein,

3. The wafer inspection device of claim 2, wherein the first support further comprises:

4. The wafer inspection apparatus according to claim 3, wherein the first supporting portion further comprises a plurality of shift locks, and the shift locks are arranged along the extending direction of the first slide guide and the second slide guide for fixing the relative positions between the inspection light emitting device and the first supporting arm and between the inspection light receiving device and the second supporting arm.

5. The wafer inspection device of claim 2, wherein the first support further comprises:

6. The wafer inspection apparatus of claim 1, wherein the inspection piece comprises:

7. The wafer inspection apparatus as claimed in claim 6, wherein the second supporting portion includes a third supporting arm and a fourth supporting arm, the third supporting arm and the fourth supporting arm are spaced apart from each other in a side-by-side manner along a left-right direction, the third supporting arm and the fourth supporting arm are used for entering and exiting the wafer transport box through the gap, and the second inspection portion is disposed on each of the third supporting arm and the fourth supporting arm.

8. The wafer inspection apparatus according to claim 6, wherein the second inspection portion is a reflection-type photoelectric sensor or an ultrasonic sensor.

9. The wafer inspection apparatus of claim 1, wherein the driving member comprises:

10. The wafer detection apparatus as claimed in claim 9, further comprising a carrier body, wherein the carrier body has a first space and a second space, the first space is distributed above or below the second space along a vertical direction, the fixed stage is installed in the first space, the driving portion is installed in the second space, and the notch is disposed on an end side of the foup away from the fixed stage.