CN213750905U - Liquid-cooled virtual currency mining machine and liquid-cooled heat dissipation device - Google Patents

Abstract

The utility model relates to a liquid cooling virtual currency digs ore deposit machine and liquid cooling heat abstractor. The liquid cooling heat dissipation device is used for dissipating heat of electronic equipment, and the electronic equipment comprises a first electronic unit and a second electronic unit; the liquid cooling heat abstractor includes: the liquid cooling structure comprises a first liquid cooling plate, a second liquid cooling plate and a third liquid cooling plate, wherein the second liquid cooling plate and the third liquid cooling plate are symmetrically arranged at two sides of the first liquid cooling plate, the first electronic unit is arranged between the first liquid cooling plate and the second liquid cooling plate, and the second electronic unit is arranged between the first liquid cooling plate and the third liquid cooling plate; and the pipeline structure is connected with the first liquid cooling plate, the second liquid cooling plate, the third liquid cooling plate and an external cold source and used for inputting and outputting cooling liquid. In order to guarantee the radiating effect, avoid appearing the difference in temperature, guarantee the performance of the virtual currency of liquid cooling and dig the ore deposit machine.

Description

Liquid-cooled virtual currency mining machine and liquid-cooled heat dissipation device

Technical Field

The utility model relates to a virtual equipment technical field that digs, especially relate to a virtual currency of liquid cooling digs ore deposit machine and liquid cooling heat abstractor.

Background

The mining machine needs to carry out high-density calculation when acquiring the virtual currency, so the calculation components on the mining machine can generate a large amount of heat, if the heat cannot be discharged in time, the mining machine runs under a high-temperature environment, the shutdown protection of the mining machine can be caused, an internal circuit is short-circuited, and even important components are burnt out.

Along with the continuous promotion of virtual currency acquisition degree of difficulty, the computing power that the ore mining machine needs constantly increases, and calorific capacity also constantly increases. Most of the existing virtual currency mining machines adopt the traditional air-cooled heat dissipation system for heat dissipation, however, the air-cooled heat dissipation system has the defects of high noise, low heat dissipation efficiency, high requirement on environment and the like, and the air-cooled heat dissipation system is difficult to solve for the heat dissipation requirement of high-power-density equipment. In recent years, some novel water-cooling heat dissipation technologies are gradually started, and compared with the traditional air cooling technology, the water-cooling technology has the advantages of inherent low noise, low power consumption, low requirement on environment and the like. For electronic equipment with high power density layout, a corresponding water-cooling heat dissipation scheme is suitable.

In the current scheme of the water cooled mining machine, the water cooling plate corresponding to each force calculation plate is designed in a single flow and a single flow direction, so that the flow of cooling liquid flowing through the water cooling plate is short, the temperature difference between the cooling liquid and the chip is large, the cooling liquid cannot effectively dissipate heat of the chip, the heat dissipation efficiency of the chip is low, the temperature difference exists between the chips, the use performance of the force calculation plate is influenced, and the normal use of the virtual currency mining machine is further influenced.

SUMMERY OF THE UTILITY MODEL

Therefore, it is necessary to provide a liquid-cooled virtual currency mining machine and a liquid-cooled heat dissipation device capable of ensuring heat dissipation efficiency and temperature balance, aiming at the problems that the heat dissipation efficiency of the existing chips is low and the temperature difference between the chips influences the service performance of the computation force plate.

A liquid cooling heat dissipation device is used for dissipating heat of electronic equipment, wherein the electronic equipment comprises a first electronic unit and a second electronic unit; the liquid cooling heat abstractor includes:

the liquid cooling structure comprises a first liquid cooling plate, a second liquid cooling plate and a third liquid cooling plate, wherein the second liquid cooling plate and the third liquid cooling plate are symmetrically arranged at two sides of the first liquid cooling plate, the first electronic unit is arranged between the first liquid cooling plate and the second liquid cooling plate, and the second electronic unit is arranged between the first liquid cooling plate and the third liquid cooling plate; and

and the pipeline structure is connected with the first liquid cooling plate, the second liquid cooling plate, the third liquid cooling plate and an external cold source and used for inputting and outputting cooling liquid.

In one embodiment, the first liquid cooling plate has a first accommodating cavity, the second liquid cooling plate has a second accommodating cavity, and the third liquid cooling plate has a third accommodating cavity;

the heat dissipation area of the first accommodating cavity is larger than that of the second accommodating cavity, and the heat dissipation area of the first accommodating cavity is larger than that of the third accommodating cavity.

In one embodiment, the first liquid-cooled plate has a first cooling surface and a second cooling surface, the second liquid-cooled plate has a third cooling surface, and the third liquid-cooled plate has a fourth cooling surface;

the first cooling surface and the third cooling surface are arranged oppositely, and are respectively abutted against the first electronic unit for cooling the first electronic unit;

the second cooling surface and the fourth cooling surface are arranged opposite to each other, and are respectively abutted against the second electronic unit for cooling the second electronic unit.

In one embodiment, the surface of the second liquid cooling plate has a first fixing protrusion protruding therefrom, the first fixing protrusion abuts against the first electronic unit, and the surface of the second liquid cooling plate and the first electronic unit enclose a first heat dissipation channel for dissipating heat of the first electronic unit;

the surface of the third liquid cooling plate is provided with a second fixing protrusion which is convexly arranged, the second fixing protrusion is abutted to the second electronic unit, and the surface of the third liquid cooling plate and the second electronic unit are enclosed to form a second heat dissipation channel for dissipating heat of the second electronic unit.

In one embodiment, the electronic device further includes a power supply, the liquid cooling structure further includes a fourth liquid cooling plate connected to the pipeline structure, the fourth liquid cooling plate has a fifth cooling surface, and the fifth cooling surface is attached to the power supply and used for cooling the power supply.

In one embodiment, the first liquid cooling plate has a first liquid inlet and a second liquid outlet; the second liquid cooling plate is provided with a third liquid inlet and outlet and a fourth liquid inlet and outlet; the third liquid cooling plate is provided with a fifth liquid inlet and outlet and a sixth liquid inlet and outlet, and the fourth liquid cooling plate is provided with a seventh liquid inlet and outlet and an eighth liquid inlet and outlet;

the pipeline structures are connected in series and/or in parallel with each liquid inlet and outlet.

In one embodiment, the fourth liquid-cooled plate is connected in series or in parallel with the first liquid-cooled plate, the second liquid-cooled plate, and the third liquid-cooled plate.

In one embodiment, the first, second, and third liquid-cooled plates are connected in series or in parallel;

or the first liquid cooling plate is respectively connected with the second liquid cooling plate and the third liquid cooling plate in series, and the second liquid cooling plate is connected with the third liquid cooling plate in parallel.

In one embodiment, the flow direction of the cooling liquid in the first liquid cooling plate is the same as the flow direction of the second liquid cooling plate and the third liquid cooling plate;

or the flow direction of the cooling liquid in the first liquid cooling plate is opposite to the flow direction of the second liquid cooling plate and the third liquid cooling plate;

or the flowing direction of the cooling liquid in the first liquid cooling plate is the same as the flowing direction of one of the second liquid cooling plate and the third liquid cooling plate, and the flowing direction of the other of the second liquid cooling plate and the third liquid cooling plate is opposite to the flowing direction of the other of the second liquid cooling plate and the third liquid cooling plate.

In one embodiment, the pipe structure comprises an inlet joint, an outlet joint, a liquid cooling pipe group, a first liquid separation and collection device and a second liquid separation and collection device;

the liquid cooling pipeline group can be connected with the first liquid cooling plate, the second liquid cooling plate, the third liquid cooling plate and the fourth liquid cooling plate through the first liquid distribution and collection device and the second liquid distribution and collection device;

the liquid cooling pipeline set is further connected to the external cold source through the inlet connector and the outlet connector.

In one embodiment, the inlet connector is connected to a seventh liquid inlet and outlet of the fourth liquid cooling plate, the eighth liquid inlet and outlet of the fourth liquid cooling plate is connected to the first liquid inlet and outlet of the first liquid cooling plate, the second liquid inlet and outlet of the first liquid cooling plate is respectively connected to a fourth liquid inlet and outlet of the second liquid cooling plate and a sixth liquid inlet and outlet of the third liquid cooling plate through the first liquid distributor, and the third liquid inlet and outlet of the second liquid cooling plate and a fifth liquid inlet and outlet of the third liquid cooling plate are connected to the outlet connector through the second liquid distributor.

A liquid-cooled virtual currency mining machine comprises electronic equipment and a liquid-cooled heat dissipation device with any one of the technical characteristics;

the electronic equipment comprises a first electronic unit, a second electronic unit and a power supply, and the first electronic unit, the second electronic unit and the power supply are cooled by the liquid cooling device.

In one embodiment, the liquid-cooled virtual currency miner further includes a connection assembly that connects the first and second electronic units to the power supply, respectively.

In one embodiment, the connecting assembly includes a copper bar and a connecting cable, and the first electronic unit is connected to the power supply through the copper bar and the connecting cable.

In one embodiment, the connecting assembly comprises a positive copper bar, a negative copper bar, a positive cable and a negative cable; the anode of the first electronic unit is provided with the anode copper bar, and the cathode of the first electronic unit is provided with the cathode copper bar; the positive copper bar is provided with a positive fixing hole connected with the positive cable, and the positive fixing hole is positioned in the inner side of the positive copper bar; the negative electrode copper bar is provided with a negative electrode fixing hole connected with the negative electrode cable, and the negative electrode fixing hole is positioned at a position close to the outside of the negative electrode copper bar;

the length of the positive cable is greater than that of the negative cable.

After the technical scheme is adopted, the utility model discloses following technological effect has at least:

the utility model discloses a virtual currency of liquid cooling digs ore machine and liquid cooling heat abstractor, first liquid cooling board, second liquid cooling board and the third liquid cooling board through pipeline structure connection liquid cooling structure, moreover, the both sides of first liquid cooling board set up first electronic unit and second electronic unit respectively, still arrange second liquid cooling board and third liquid cooling board in the outside of first electronic unit and second electronic unit. The pipeline assembly conveys cooling liquid of an external cold source to the first liquid cooling plate, the second liquid cooling plate and the third liquid cooling plate, the first electronic unit and the second electronic unit are cooled through the first liquid cooling plate, the second liquid cooling plate and the third liquid cooling plate, and the pipeline assembly conveys the cooled cooling liquid to the external cold source. The problem of effectual solution chip radiating efficiency is low and there is the difference in temperature influence calculation board performance between the chip at present, improves the cooling efficiency of first electronic unit and second electronic unit, guarantees the radiating effect for the temperature balance between first electronic unit and the second electronic unit avoids appearing the difference in temperature, guarantees the performance of liquid cooling virtual currency digs the machine of mining.

Drawings

Fig. 1 is a perspective view of a liquid-cooled heat dissipating device according to an embodiment of the present invention, illustrating a cover plate of a chassis;

FIG. 2 is a top view of the liquid-cooled heat sink shown in FIG. 1 with a cover plate of the housing removed;

FIG. 3 is an exploded view of the liquid cooling structure of the liquid cooling heat sink of FIG. 1 clamping the first electronic unit and the second electronic unit;

FIG. 4 is a perspective view of one embodiment of the liquid-cooled heat sink of FIG. 1 with a chassis housing removed;

FIG. 5 is a perspective view of another embodiment of the liquid-cooled heat sink shown in FIG. 4 with a chassis housing removed;

fig. 6 is a perspective view of the liquid-cooled heat sink shown in fig. 4 from another angle with the chassis housing removed.

Wherein:

10. liquid-cooled virtual currency mining machines; 100. a liquid cooling heat sink; 110. a liquid cooling structure; 111. a first liquid cold plate; a1, a first liquid inlet and outlet; a2, a second liquid inlet and outlet; 112. a second liquid cooling plate; a3 and a third liquid inlet and outlet; a4, a fourth liquid inlet and outlet; 113. a third liquid cold plate; a5, a fifth liquid inlet and outlet; a6, a sixth liquid inlet and outlet; 114. a fourth liquid cold plate; a7, a seventh liquid inlet and outlet; a8, an eighth liquid inlet and outlet; 120. a pipe structure; 121. a liquid cooling pipe set; 122. a first liquid separator; 123. a second liquid trap; 124. an inlet fitting; 125. an outlet fitting; 200. an electronic device; 210. a first electronic unit; 211. a positive electrode; 212. a negative electrode; 220. a second electronic unit; 230. a power supply; 231. an input terminal; 240. a connecting assembly; 241. a positive copper bar; 2411. a positive electrode fixing hole; 242. a positive cable; 243. a negative copper bar; 2441. a negative electrode fixing hole; 244. a negative cable; 400. a housing of the chassis; 410. a load bearing housing; 420. a first side plate; 430. a second side plate; 440. case cover plate.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Referring to fig. 1 to 5, the present invention provides a liquid cooling heat dissipation device 100. The liquid-cooled heat dissipation device 100 is applied to the liquid-cooled virtual currency mining machine 10, and is used for cooling the electronic equipment 200 of the liquid-cooled virtual currency mining machine 10 so as to ensure the use performance of the liquid-cooled virtual currency mining machine 10. It will be appreciated that the liquid-cooled virtual currency miner 10 herein may also be other types of data processing equipment or the like. Of course, in other embodiments of the present invention, the liquid-cooled heat dissipating apparatus 100 may also be applied to other electrical devices requiring cooling. The present invention is described by taking the liquid cooling heat dissipating apparatus 100 as an example when it is applied to the liquid cooling virtual currency mining machine 10.

At present, the heat abstractor in the virtual currency of liquid cooling digs ore deposit machine 10 uses water-cooling radiator usually, and the water-cooling board that every power board corresponds all is the design of single flow and single flow direction, and the coolant liquid can't effectively dispel the heat to the chip, and the radiating efficiency of chip is lower and there is the difference in temperature between the chip, influences the performance of power board, and then influences the normal use that virtual currency digs the ore deposit machine. Therefore, the utility model provides a novel liquid cooling heat abstractor 100, this liquid cooling heat abstractor 100 can guarantee electronic equipment 200's radiating efficiency for electronic equipment 200 temperature is balanced, guarantees the performance of the virtual currency of liquid cooling digs ore deposit machine 10. The specific structure of the liquid-cooled heat sink 100 is described in detail below.

Referring to fig. 1 to 5, in an embodiment, the liquid-cooled heat dissipation device 100 is used for dissipating heat of an electronic apparatus 200, where the electronic apparatus 200 includes a first electronic unit 210 and a second electronic unit 220; the liquid-cooled heat sink 100 includes a liquid-cooled structure 110 and a pipe structure 120. The liquid cooling structure 110 includes a first liquid-cooled plate 111, a second liquid-cooled plate 112 and a third liquid-cooled plate 113, the second liquid-cooled plate 112 and the third liquid-cooled plate 113 are symmetrically disposed on two sides of the first liquid-cooled plate 111, the first electronic unit 210 is disposed between the first liquid-cooled plate 111 and the second liquid-cooled plate 112, and the second electronic unit 220 is disposed between the first liquid-cooled plate 111 and the third liquid-cooled plate 113. The pipe structure 120 connects the first liquid-cooled plate 111, the second liquid-cooled plate 112, the third liquid-cooled plate 113 and an external cold source, and is used for inputting and outputting a cooling liquid.

The first liquid-cooled plate 111 is a main cooling structure of the liquid-cooled heat dissipation device 100. The first liquid-cooled plate 111 has a first accommodation chamber that accommodates a cooling liquid, and the cooling liquid flows in the first accommodation chamber. Optionally, the first accommodating cavity of the first liquid-cooling plate 111 may be a multi-channel serial-parallel connection, such as an S-shape, or may be a complete cavity, or may be another structure capable of allowing the cooling liquid to flow. After the cooling liquid enters the first accommodating cavity of the first liquid-cooling plate 111, the cooling liquid exchanges heat with the electronic device 200 through the first liquid-cooling plate 111 to cool the first electronic unit 210 and the second electronic unit 220 of the electronic device 200.

The first liquid-cooling plate 111 has a structure for dissipating heat from both sides, and the first electronic unit 210 and the second electronic unit 220 are respectively attached to both sides of the first liquid-cooling plate 111. The cooling fluid in the first receiving chamber exchanges heat with the first electronic unit 210 through one surface to reduce the temperature of the first electronic unit 210, and exchanges heat with the second electronic unit 220 through the other surface to reduce the temperature of the second electronic unit 220. Optionally, two sides of the first liquid-cooled plate 111 are symmetrically arranged; of course, in other embodiments of the present invention, there may be differences in the structures of the two sides of the first liquid-cooling plate 111 as long as the heat dissipation effect is ensured.

In this embodiment, the first electronic unit 210 and the second electronic unit 220 of the electronic device 200 may be, for example, computing boards of a virtual currency mining machine, or the first electronic unit 210 and the second electronic unit 220 may also be other heat generating devices requiring liquid cooling for heat dissipation according to actual needs.

It can be understood that the first electronic unit 210 and the second electronic unit 220 each include a substrate and a heat generating element on one side of the substrate, for example, the substrate is an aluminum substrate, and the heat generating element is disposed on one side of the aluminum substrate. In many cases, the heat resistances of the heat generating element in the upper and lower directions are different due to packaging, mounting, and the like. 80% -90% of heat generated by the first electronic unit 210 and the second electronic unit 220 during operation is concentrated on the aluminum substrate. Therefore, the surface of the aluminum substrate of the first electronic unit 210 abuts against one surface of the first liquid-cooled plate 111, and the surface of the aluminum substrate of the second electronic unit 220 abuts against the other surface of the first liquid-cooled plate 111. Thus, the heat of the first electronic unit 210 and the second electronic unit 220 can be transferred to the first liquid-cooling plate 111 through the aluminum substrate, and the cooling effect of the first electronic unit 210 and the second electronic unit 220 is ensured.

The surfaces of the first electronic unit 210 and the second electronic unit 220 facing away from the first liquid-cooled plate 111 also generate heat accordingly. In order to ensure the heat dissipation performance of the electronic device 200, the utility model discloses a liquid cooling heat abstractor 100 still sets up second liquid cooling board 112 and third liquid cooling board 113 in the both sides of first liquid cooling board 111, second liquid cooling board 112 sets up the surface that deviates from first liquid cooling board 111 at first electronic unit 210, second liquid cooling board 112 dispels the heat to the heating element of first electronic unit 210, third liquid cooling board 113 sets up another surface that deviates from first liquid cooling board 111 at second electronic unit 220, third liquid cooling board 113 dispels the heat to the heating element of second electronic unit 220. That is to say, the first liquid-cooled plate 111, the second liquid-cooled plate 112, and the third liquid-cooled plate 113 form a sandwich structure with the first electronic unit 210 and the second electronic unit 220, the first liquid-cooled plate 111 is located at the middle position, the second liquid-cooled plate 112 and the third liquid-cooled plate 113 are symmetrically disposed on two sides of the first liquid-cooled plate 111, the first electronic unit 210 is disposed between the first liquid-cooled plate 111 and the second liquid-cooled plate 112, and the second electronic unit 220 is disposed between the first liquid-cooled plate 111 and the third liquid-cooled plate 113.

Thus, the aluminum substrate of the first electronic unit 210 abuts against one surface of the first liquid-cooling plate 111, the heating element of the first electronic unit 210 abuts against the second liquid-cooling plate 112, and the two surfaces of the first electronic unit 210 can be cooled by the combination of the first liquid-cooling plate 111 and the second liquid-cooling plate 112. The aluminum substrate of the second electronic unit 220 abuts against the other surface of the first liquid-cooled plate 111, the heating element of the second electronic unit 220 abuts against the third liquid-cooled plate 113, and the two surfaces of the second electronic unit 220 are cooled by the combination of the first liquid-cooled plate 111 and the third liquid-cooled plate 113.

Of course, in other embodiments of the present invention, the aluminum substrate of the first electronic unit 210 may abut against the second liquid-cooled plate 112, and the heating element of the first electronic unit 210 may abut against one surface of the first liquid-cooled plate 111; the aluminum substrate of the second electronic unit 220 abuts against the third liquid-cooling plate 113, and the heating element of the second electronic unit 220 abuts against the other surface of the first liquid-cooling plate 111. This also allows for cooling of the first electronics unit 210 and the second electronics unit 220.

The second liquid-cooled plate 112 and the third liquid-cooled plate 113 are auxiliary cooling structures of the liquid-cooled heat dissipation device 100. When the heat dissipation requirement is high, the first liquid-cooled plate 111, the second liquid-cooled plate 112, and the third liquid-cooled plate 113 are used in combination. When the heat dissipation requirement is not high, only the first liquid cooling plate 111 may be reserved, and the second liquid cooling plate 112 and the third liquid cooling plate 113 may be omitted. Therefore, the production cost can be reduced while the heat dissipation requirement is ensured.

The second liquid-cooled plate 112 has a second accommodation chamber in which the cooling liquid flows. Optionally, the second accommodating cavity of the second liquid cooling plate 112 may be a multi-channel serial-parallel connection, such as an S-shape, or may be a complete cavity, or may be another structure capable of allowing the cooling liquid to flow. After the cooling liquid enters the second accommodating cavity of the second liquid cooling plate 112, the cooling liquid exchanges heat with the electronic device 200 through the second liquid cooling plate 112 to cool the first electronic unit 210 of the electronic device 200.

The third liquid cooling plate 113 has a third accommodation chamber in which the cooling liquid flows. Optionally, the third accommodating cavity of the third liquid cooling plate 113 may be a multi-channel serial-parallel connection, such as an S-shape, or may be a complete cavity, or may be another structure capable of allowing the cooling liquid to flow. After the cooling liquid enters the third accommodating cavity of the third liquid-cooling plate 113, the cooling liquid exchanges heat with the electronic device 200 through the third liquid-cooling plate 113 to cool the second electronic unit 220 of the electronic device 200.

In an embodiment of the present invention, when the liquid cooling heat dissipating device 100 is assembled, the aluminum substrates of the first electronic unit 210 and the second electronic unit 220 are attached to two surfaces of the first liquid cooling plate 111. The heat generated by the heating element during operation can be transferred to the first liquid cooling plate 111 through the aluminum substrate, thereby achieving liquid cooling heat dissipation. Moreover, the second liquid cooling plate 112 and the heating element of the first electronic unit 210 can be abutted, and the heat on the side of the heating element can be transferred to the second liquid cooling plate 112, so that the cooling effect on the first electronic unit 210 is ensured, and liquid cooling heat dissipation is realized. The third liquid-cooled plate 113 and the heating element of the second electronic unit 220 can be abutted, and the heat on the side of the heating element can be transferred to the third liquid-cooled plate 113, so that the cooling effect on the second electronic unit 220 is ensured, and liquid-cooled heat dissipation is realized.

The pipe structure 120 connects the first liquid-cooled plate 111, the second liquid-cooled plate 112, the third liquid-cooled plate 113 and an external cold source. The external cold source has a liquid inlet end and a liquid outlet end, and the pipeline structure 120 is connected with the liquid inlet end and the liquid outlet end. The cooling liquid of the external cold source is delivered to the pipe structure 120 through the liquid outlet end, and is delivered to the first liquid-cooling plate 111, the second liquid-cooling plate 112 and the third liquid-cooling plate 113 through the pipe structure 120. The cooling liquid after the first liquid-cooled plate 111, the second liquid-cooled plate 112, and the third liquid-cooled plate 113 cool the first electronic unit 210 and the second electronic unit 220 flows back to the pipeline structure 120, and returns to the external cold source through the liquid inlet end. The external cold source may cool the recovered cooling fluid, and then deliver the cooling fluid to the pipe structure 120. The cooling liquid is recycled in such a reciprocating way, and the cooling cost is reduced. Alternatively, the cooling liquid of the external cold source may be cooling water, or may also be cooling oil or liquid helium.

In the liquid-cooled heat dissipating device 100 of the above embodiment, the pipe assembly transmits the cooling liquid of the external cold source to the first liquid-cooled plate 111, the second liquid-cooled plate 112, and the third liquid-cooled plate 113, cools the first electronic unit 210 and the second electronic unit 220 through the first liquid-cooled plate 111, the second liquid-cooled plate 112, and the third liquid-cooled plate 113, and transmits the cooled cooling liquid to the external cold source. The problem that the service performance of the force calculating plate is affected by the temperature difference between the chips due to the low radiating efficiency of the chips at present is effectively solved, the cooling efficiency of the first electronic unit 210 and the cooling efficiency of the second electronic unit 220 are improved, the radiating effect is guaranteed, the temperature between the first electronic unit 210 and the second electronic unit 220 is balanced, the temperature difference is avoided, and the service performance of the liquid-cooled virtual currency mining machine 10 is guaranteed.

In one embodiment, the first liquid cold plate 111 has a first cooling surface and a second cooling surface, the second liquid cold plate 112 has a third cooling surface, and the third liquid cold plate 113 has a fourth cooling surface. The first cooling surface and the third cooling surface are disposed opposite to each other and abut against the first electronic unit 210, respectively, for cooling the first electronic unit 210. The second cooling surface is disposed opposite to the fourth cooling surface and abuts against the second electronic units 220, respectively, for cooling the second electronic units 220.

The first liquid cooling plate 111 has two cooling surfaces, which are a first cooling surface and a second cooling surface. A surface of the first electronic unit 210 is attached to the first cooling surface and a surface of the second electronic unit 220 is attached to the second cooling surface. Specifically, in an embodiment, a surface of the aluminum substrate of the first electronic unit 210 abuts against the first cooling surface of the first liquid-cooled plate 111, and a surface of the aluminum substrate of the second electronic unit 220 abuts against the second cooling surface of the first liquid-cooled plate 111. The cooling liquid in the first accommodating cavity exchanges heat with the first electronic unit 210 through the first cooling surface, so that the temperature of the first electronic unit 210 is reduced; the temperature of the second electronic unit 220 is reduced by the second cooling surface exchanging heat with the second electronic unit 220. Thus, the heat of the first electronic unit 210 and the second electronic unit 220 can be transferred to the first liquid-cooling plate 111 through the aluminum substrate, and the cooling effect of the first electronic unit 210 and the second electronic unit 220 is ensured.

The second liquid cooling plate 112 has one cooling surface, i.e., a third cooling surface. The third cooling surface faces the surface of the first electronics unit 210 facing away from the first liquid-cooled plate 111. That is, the third cooling surface abuts against the heat generating component of the first electronic unit 210 for cooling the heat generating component of the first electronic unit 210. The cooling liquid in the second accommodating cavity exchanges heat with the first electronic unit 210 through the third cooling surface, and the temperature of the first electronic unit 210 is reduced.

The third liquid cold plate 113 has one cooling surface, i.e., a fourth cooling surface. The fourth cooling surface faces the other surface of the second electronic unit 220 facing away from the first liquid-cooled plate 111. That is, the fourth cooling surface abuts against the heat generating element of the second electronic unit 220 for cooling the heat generating element of the second electronic unit 220. The cooling liquid in the third accommodating cavity exchanges heat with the second electronic unit 220 through the fourth cooling surface, and the temperature of the second electronic unit 220 is reduced.

The first cooling surface is disposed opposite to the third cooling surface, and in an embodiment, the aluminum substrate of the first electronic unit 210 is attached to the first cooling surface, and the third cooling surface abuts against the heat generating element of the first electronic unit 210, so as to cool the first electronic unit 210 and ensure the heat dissipation effect of the first electronic unit 210. The second cooling surface is disposed opposite to the fourth cooling surface, and in an embodiment, the aluminum substrate of the second electronic unit 220 is attached to the second cooling surface, and the fourth cooling surface abuts against the heat generating element of the second electronic unit 220, so as to cool the second electronic unit 220 and ensure the cooling effect of the second electronic unit 220.

In one embodiment, the cooling capacity of the first liquid cold plate 111 is greater than the cooling capacity of the second liquid cold plate 112 and the third liquid cold plate 113. Due to the structural limitations of the first electronic unit 210 and the second electronic unit 220, the heat dissipation amount of the aluminum substrate toward the first liquid-cooled plate 111 is relatively large, and the heat dissipation amount of the heat generating elements toward the second liquid-cooled plate 112 and the third liquid-cooled plate 113 is relatively small. In order to ensure the heat dissipation effect, the cooling capacity of the first liquid-cooling plate 111 is improved to improve the heat dissipation capacity of the first liquid-cooling plate 111 for the aluminum substrate, and correspondingly, the cooling capacities of the second liquid-cooling plate 112 and the third liquid-cooling plate 113 can be properly reduced as long as the heat dissipation of the heating element is ensured. Therefore, the heat dissipation effect of the first electronic unit 210 and the second electronic unit 220 can be ensured, and the complexity of the structure and the cost can be reduced.

In one embodiment, the first liquid cooling plate 111 has a first receiving cavity, the second liquid cooling plate 112 has a second receiving cavity, and the third liquid cooling plate 113 has a third receiving cavity. The heat radiating area of the first accommodating cavity is larger than that of the second accommodating cavity, and the heat radiating area of the first accommodating cavity is larger than that of the third accommodating cavity. It is understood that the heat dissipation area herein refers to an area that enables effective cooling. That is, the flow area inside the first liquid cooling plate 111 is larger than the flow area inside the second liquid cooling plate 112 and the third liquid cooling plate 113. The flow area within the first liquid-cooled plate 111 may be larger, and the flow area within the second liquid-cooled plate 112 and the third liquid-cooled plate 113 may be smaller. This can reduce the manufacturing cost while ensuring the heat dissipation effect.

Further, a heat dissipation protrusion or a heat dissipation fin may be disposed in the first accommodating cavity, so that the heat dissipation capability of the first liquid-cold plate 111 is increased through the heat dissipation protrusion or the heat dissipation fin, and the cooling effect of the first liquid-cold plate 111 is further improved.

In an embodiment, the surface of the second liquid cooling plate 112 has a first fixing protrusion protruding therefrom, the first fixing protrusion abuts against the first electronic unit 210, and the surface of the second liquid cooling plate 112 and the first electronic unit 210 enclose a first heat dissipation channel for dissipating heat of the first electronic unit 210. That is, the third cooling surface has a first fixing protrusion protruding therefrom, and the first fixing protrusion abuts against the heat generating element of the first electronic unit 210, so as to fix and dissipate heat of the first electronic unit 210. The heat generated by the heat generating components of the first electronic unit 210 is transferred to the second liquid cooling plate 112 through the first fixing protrusion for cooling. Furthermore, a first heat dissipation channel is defined between the third cooling surface of the second liquid cooling plate 112 and the substrate of the first electronic unit 210, the heat dissipated by the first electronic unit 210 during operation exists in the first heat dissipation channel, and the second liquid cooling plate 112 can exchange heat with the heat in the first heat dissipation channel through the third cooling surface to cool the first electronic unit 210.

Optionally, the first fixing protrusion is a protruding structure such as a boss or a boss. That is, the third cooling surface of the second liquid cooling plate 112 is a plane, and the first fixing protrusion is disposed to protrude from the third cooling surface. Further, the third cooling surface is recessed with respect to the first fixing projection, so that a higher-level device can be disposed on the substrate of the first electronic unit 210, and a sufficient mounting space can be secured.

In an embodiment, the surface of the third liquid-cold plate 113 has a second fixing protrusion protruding therefrom, the second fixing protrusion abuts against the second electronic unit 220, and the surface of the third liquid-cold plate 113 and the second electronic unit 220 enclose a second heat dissipation channel for dissipating heat of the second electronic unit 220. That is, the fourth cooling surface has a second fixing protrusion protruding therefrom, and the second fixing protrusion abuts against the heat generating element of the second electronic unit 220, so as to fix and dissipate heat of the second electronic unit 220. The heat generated by the heat generating element of the second electronic unit 220 is transferred to the third liquid cooling plate 113 through the second fixing protrusion for cooling. Moreover, a second heat dissipation channel is enclosed between the fourth cooling surface of the third liquid cooling plate 113 and the substrate of the second electronic unit 220, the heat dissipated by the second electronic unit 220 exists in the second heat dissipation channel when the second liquid cooling plate operates, and the third liquid cooling plate 113 can exchange heat with the heat in the second heat dissipation channel through the fourth cooling surface to cool the second electronic unit 220.

Optionally, the second fixing protrusion is a protruding structure such as a boss or a boss. That is, the fourth cooling surface of the third liquid cooling plate 113 is a plane, and the second fixing protrusion is disposed to protrude from the fourth cooling surface. Further, the fourth cooling surface is recessed with respect to the second fixing projection, so that a higher height of the device can be disposed on the substrate of the second electronic unit 220, and a sufficient mounting space can be secured.

In an embodiment, the electronic device 200 further includes a power supply 230, the liquid-cooled structure 110 further includes a fourth liquid-cooled plate 114 connected to the pipe structure 120, the fourth liquid-cooled plate 114 has a fifth cooling surface, and the fifth cooling surface is attached to the power supply 230 for cooling the power supply 230. The power supply 230 supplies power to the first electronic unit 210 and the second electronic unit 220 to ensure that the first electronic device 200 and the second electronic device 200 can work normally, and meanwhile, the power supply 230 has an input terminal 231 for connecting an external power source.

Alternatively, the power supply 230 is disposed side by side with the first electronic unit 210 and the second electronic unit 220 stacked. The fourth liquid cooling plate 114 covers the surface of the power supply 230 and abuts against the power supply 230. The power supply 230 generates heat during operation, and the fourth liquid cooling plate 114 can dissipate heat and cool the power supply 230, so as to ensure the reliability of the operation of the power supply 230.

The fourth liquid cold plate 114 has a fourth receiving cavity in which the cooling liquid flows. Optionally, the fourth accommodating cavity of the fourth liquid-cooled plate 114 may be a multi-channel in series-parallel connection, such as an S-shape, or may be a complete cavity, or may be another structure capable of allowing the cooling liquid to flow. After the cooling fluid enters the fourth accommodating cavity of the fourth liquid-cooling plate 114, the cooling fluid exchanges heat with the electronic device 200 through the fourth liquid-cooling plate 114 to cool the power supply 230 of the electronic device 200. The fourth liquid cold plate 114 has one cooling surface that is a fifth cooling surface. The fifth cooling surface is disposed toward the power supply 230. That is, the fifth cooling surface abuts against the surface of the power supply source 230. The cooling liquid in the fourth accommodating chamber exchanges heat with the power supply 230 through the fifth cooling surface, and the temperature of the power supply 230 is reduced.

In one embodiment, the first liquid-cooled plate 111 has a first liquid inlet/outlet a1 and a second liquid inlet/outlet a 2; the second liquid cooling plate 112 has a third liquid inlet and outlet A3 and a fourth liquid inlet and outlet a 4; the third liquid cooling plate 113 has a fifth liquid inlet and outlet a5 and a sixth liquid inlet and outlet a6, and the fourth liquid cooling plate 114 has a seventh liquid inlet and outlet a7 and an eighth liquid inlet and outlet A8. The conduit structure 120 may be connected in series and/or in parallel with each of the fluid inlets and outlets.

The first liquid cooling plate 111 is provided with a first liquid inlet and outlet A1 and a second liquid inlet and outlet A2 which are communicated with the first accommodating cavity. The first liquid inlet/outlet a1 and the second liquid inlet/outlet a2 are liquid inlet and outlet of the first liquid cooling plate 111. When the first liquid inlet/outlet A1 is a liquid inlet, the second liquid inlet/outlet A2 is a liquid outlet. When the first liquid inlet/outlet port a1 is a liquid outlet port, the second liquid inlet/outlet port a2 is a liquid inlet port. The second liquid cooling plate 112 has a third liquid inlet and outlet A3 and a fourth liquid inlet and outlet a4 which communicate with the second accommodating cavity. The third liquid inlet and outlet A3 and the fourth liquid inlet and outlet a4 are liquid inlets and liquid outlets of the second liquid cooling plate 112. When the third liquid inlet and outlet A3 is a liquid inlet, the fourth liquid inlet and outlet a4 is a liquid outlet. When the third liquid inlet/outlet port A3 is a liquid outlet port, the fourth liquid inlet/outlet port a4 is a liquid inlet port.

The third liquid cooling plate 113 is provided with a fifth liquid inlet and outlet A5 and a sixth liquid inlet and outlet A6 which are communicated with the third accommodating cavity. The fifth liquid inlet/outlet a5 and the sixth liquid inlet/outlet a6 are liquid inlets and liquid outlets of the third liquid cooling plate 113. When the fifth liquid inlet/outlet A5 is a liquid inlet, the sixth liquid inlet/outlet A6 is a liquid outlet. When the fifth liquid inlet/outlet A5 is a liquid outlet, the sixth liquid inlet/outlet A6 is a liquid inlet. The fourth liquid-cold plate 114 has a seventh liquid inlet/outlet a7 and an eighth liquid inlet/outlet A8 that communicate with the fourth receiving chamber. Seventh liquid inlet/outlet a7 and eighth liquid inlet/outlet A8 are liquid inlets and liquid outlets of fourth liquid cold plate 114. When the seventh liquid inlet/outlet port a7 is a liquid inlet, the eighth liquid inlet/outlet port A8 is a liquid outlet. When the seventh liquid inlet/outlet port a7 is a liquid outlet port, the eighth liquid inlet/outlet port A8 is a liquid inlet port.

The liquid inlet and outlet of each liquid cooling plate are connected through the pipeline structure 120 to realize the input and output of the cooling liquid. In principle, the connection manner between the respective liquid cooling plates is not limited in principle as long as cooling of the electronic apparatus 200 can be achieved. Alternatively, the two liquid inlets and the two liquid outlets of each liquid cooling plate may be individually connected with an external cold source, in this case, the first liquid cooling plate 111, the second liquid cooling plate 112, the third liquid cooling plate 113, and the fourth liquid cooling plate 114 are connected in parallel. At this time, the external cold source respectively conveys the cooling liquid to each liquid-cooling plate. Of course, the first liquid-cooled plate 111, the second liquid-cooled plate 112, the third liquid-cooled plate 113, and the fourth liquid-cooled plate 114 may also be connected in series through the pipe structure 120, and the cooling liquid delivered by the external cooling source flows into each liquid-cooled plate in sequence. In other embodiments of the present invention, one or more of the liquid cooling plates may be connected in series and connected in parallel with the remaining liquid cooling plates.

In one embodiment, the first liquid inlet/outlet A1 and the second liquid inlet/outlet A2 can be disposed on the same side or different sides. The third liquid inlet and outlet port A3 and the fourth liquid inlet and outlet port A4 can be arranged on the same side or different sides. The fifth liquid inlet and outlet A5 and the sixth liquid inlet and outlet A6 can be arranged on the same side or different sides. The seventh liquid inlet/outlet A7 and the eighth liquid inlet/outlet A8 may be disposed on the same side or different sides.

It should be noted that the positions of the first liquid inlet/outlet a1 and the second liquid inlet/outlet a2 are not limited in principle, and may be disposed on the same side or different sides. For example, the first liquid inlet/outlet a1 and the second liquid inlet/outlet a2 may be disposed on two sides of the first liquid-cooling plate 111; of course, the first liquid inlet/outlet A1 and the second liquid inlet/outlet A2 may be disposed on the same side of the first liquid-cooled plate 111, as shown in FIG. 3.

The positions of the third liquid inlet and outlet A3 and the fourth liquid inlet and outlet a4 are not limited in principle, and may be arranged on the same side or different sides. For example, the third liquid inlet and outlet A3 and the fourth liquid inlet and outlet a4 may be disposed on two sides of the second liquid cooling plate 112, respectively; of course, the third liquid inlet/outlet port A3 and the fourth liquid inlet/outlet port a4 may be disposed on the same side of the second liquid-cooled plate 112, as shown in fig. 3.

The arrangement positions of the fifth liquid inlet and outlet a5 and the sixth liquid inlet and outlet a6 are not limited in principle, and may be arranged on the same side or different sides. For example, the fifth liquid inlet/outlet a5 and the sixth liquid inlet/outlet a6 may be disposed on two sides of the third liquid cooling plate 113; of course, the fifth liquid inlet/outlet A5 and the sixth liquid inlet/outlet A6 may be disposed on the same side of the third liquid cooling plate 113, as shown in FIG. 3.

The arrangement positions of the seventh liquid inlet/outlet a7 and the eighth liquid inlet/outlet A8 are not limited in principle, and may be arranged on the same side or different sides. Illustratively, the seventh liquid inlet/outlet a7 and the eighth liquid inlet/outlet A8 may be disposed on two sides of the fourth liquid-cooled plate 114, respectively; of course, the seventh liquid inlet/outlet A7 and the eighth liquid inlet/outlet A8 may be disposed on the same side of the fourth liquid-cooled plate 114, as shown in FIG. 4.

Referring to fig. 1-5, in one embodiment, the fourth liquid-cooled plate 114 is connected in series or in parallel with the first liquid-cooled plate 111, the second liquid-cooled plate 112, and the third liquid-cooled plate 113. That is, the first liquid-cooled plate 111, the second liquid-cooled plate 112, and the third liquid-cooled plate 113 are integrated, and may be connected in parallel or in series with the fourth liquid-cooled plate 114.

Optionally, the tubing structure 120 connects the fourth liquid-cooled plate 114 in series with the first liquid-cooled plate 111, the second liquid-cooled plate 112, and the third liquid-cooled plate 113. That is, the cooling fluid may first enter the fourth liquid-cooled plate 114, and then enter the first liquid-cooled plate 111, the second liquid-cooled plate 112, and the third liquid-cooled plate 113. Because the power supply 230 has a small heat value and poor heat resistance, it can be used as an inlet of the cooling liquid to participate in heat exchange, and then connected in series with the first liquid-cooling plate 111, the second liquid-cooling plate 112, and the third liquid-cooling plate 113 to deliver the cooling liquid. Thus, the temperature rise of the cooling liquid after cooling the power supply 230 is not too high, and the heat dissipation requirements of the first electronic unit 210 and the second electronic unit 220 can be still ensured. In other embodiments, the cooling fluid may also eventually enter the fourth fluid-cooled plate 114.

Of course, in other embodiments of the present invention, the piping structure 120 connects the fourth liquid-cooled plate 114 in parallel with the first liquid-cooled plate 111, the second liquid-cooled plate 112, and the third liquid-cooled plate 113. That is, the cooling liquid flows into the first liquid-cooled plate 111, the second liquid-cooled plate 112, and the third liquid-cooled plate 113 and the fourth liquid-cooled plate 114 through the pipe structure 120.

In one embodiment, the first liquid-cooled plate 111, the second liquid-cooled plate 112, and the third liquid-cooled plate 113 are connected in series or in parallel; or, the first liquid-cooling plate 111 is respectively connected in series with the second liquid-cooling plate 112 and the third liquid-cooling plate 113, and the second liquid-cooling plate 112 and the third liquid-cooling plate 113 are connected in parallel. In this embodiment, the fourth liquid-cooled plate 114 is connected in series with the first liquid-cooled plate 111, the second liquid-cooled plate 112, and the third liquid-cooled plate 113, which are integrally formed.

Optionally, the first liquid-cooled plate 111, the second liquid-cooled plate 112, and the third liquid-cooled plate 113 are connected in parallel. At this time, the cooling liquid output by the fourth liquid-cooled plate 114 is respectively delivered to the first liquid-cooled plate 111, the second liquid-cooled plate 112, and the third liquid-cooled plate 113 to cool the first electronic unit 210 and the second electronic unit 220.

Alternatively, the first liquid-cooled plate 111, the second liquid-cooled plate 112, and the third liquid-cooled plate 113 may be connected in series. At this time, the cooling liquid sequentially enters the first liquid-cooled plate 111, the second liquid-cooled plate 112, and the third liquid-cooled plate 113 to cool the first electronic unit 210 and the second electronic unit 220. Moreover, the order of the first liquid-cooled plate 111, the second liquid-cooled plate 112, and the third liquid-cooled plate 113 connected in series may be adjusted, which is not described herein again.

Alternatively, the first, second, and third liquid-cooled plates 111, 112, 113 may be connected in series and parallel. That is, the first liquid-cooled plate 111 may connect the second liquid-cooled plate 112 and the third liquid-cooled plate 113 in series, respectively, and the second liquid-cooled plate 112 and the third liquid-cooled plate 113 are connected in parallel. The cooling liquid in the first liquid-cooled plate 111 flows into the second liquid-cooled plate 112 and the third liquid-cooled plate 113, respectively, to cool the first electronic unit 210 and the second electronic unit 220. Of course, the cooling fluid in the second liquid cooling plate 112 and the third liquid cooling plate 113 may flow into the first liquid cooling plate 111.

It can be understood that one of the two liquid inlet/outlet ports of the first liquid cooling plate 111, the second liquid cooling plate 112, and the third liquid cooling plate 113 is a liquid inlet port, the other is a liquid outlet port, and each liquid inlet/outlet port can be flexibly switched as long as the input/output of the cooling liquid of each liquid cooling plate can be realized.

The first electronic unit 210 and the second electronic unit 220 are combined in series and in parallel through the first liquid cooling plate 111, the second liquid cooling plate 112 and the third liquid cooling plate 113, so that the cooling liquid flows back and forth between the first electronic unit 210 and the second electronic unit 220, the heat dissipation efficiency of the first electronic unit 210 and the second electronic unit 220 is improved, the temperature difference between the cooling liquid and the highest temperature of the first electronic unit 210 or the second electronic unit 220 is reduced, the temperature of the cooling liquid is improved, and the requirement of waste heat recovery can be met.

In one embodiment, the flow direction of the cooling fluid in the first fluid-cooled plate 111 is the same as the flow direction of the second fluid-cooled plate 112 and the third fluid-cooled plate 113. Optionally, the first liquid inlet and outlet a1, the third liquid inlet and outlet A3, and the fifth liquid inlet and outlet a5 are liquid inlets, and the second liquid inlet and outlet a2, the fourth liquid inlet and outlet a4, and the sixth liquid inlet and outlet a6 are liquid outlets. The cooling fluid flows in the same direction in the first, second, and third liquid-cooled plates 111, 112, 113. Of course, the first liquid inlet/outlet a1, the third liquid inlet/outlet A3, and the fifth liquid inlet/outlet a5 may be liquid outlets, and the second liquid inlet/outlet a2, the fourth liquid inlet/outlet a4, and the sixth liquid inlet/outlet a6 may be liquid inlets.

In one embodiment, the flow direction of the cooling fluid in the first fluid-cooled plate 111 is opposite to the flow direction of the second fluid-cooled plate 112 and the third fluid-cooled plate 113. That is, the coolant in the first liquid-cooled plate 111 flows in one direction, and the coolant in the second liquid-cooled plate 112 and the third liquid-cooled plate 113 flows in the other direction. Optionally, the first liquid inlet/outlet a1, the fourth liquid inlet/outlet a4, and the sixth liquid inlet/outlet a6 are liquid inlets, and the second liquid inlet/outlet a2, the third liquid inlet/outlet A3, and the fifth liquid inlet/outlet a5 are liquid outlets. Of course, the first liquid inlet/outlet a1, the fourth liquid inlet/outlet a4, and the sixth liquid inlet/outlet a6 may be liquid outlets, and the second liquid inlet/outlet a2, the third liquid inlet/outlet A3, and the fifth liquid inlet/outlet a5 may be liquid inlets.

In one embodiment, the flow direction of the cooling fluid in the first liquid cooling plate 111 is the same as the flow direction of one of the second liquid cooling plate 112 and the third liquid cooling plate 113, and the flow direction of the other of the second liquid cooling plate 112 and the third liquid cooling plate 113 is opposite. That is, the coolant in the first liquid-cooled plate 111 flows in one direction, the coolant in one of the second liquid-cooled plate 112 and the third liquid-cooled plate 113 flows in one direction, and the coolant in the other flows in the other direction. Illustratively, the flow direction of the cooling fluid in the first fluid-cooled plate 111 is the same as the flow direction of the cooling fluid in the second fluid-cooled plate 112, but is different from the flow direction of the cooling fluid in the third fluid-cooled plate 113. Of course, the flow direction of the cooling fluid in the first fluid-cooled plate 111 may be different from the flow direction of the cooling fluid in the second fluid-cooled plate 112, but the same as the flow direction of the cooling fluid in the third fluid-cooled plate 113. At this time, the connection mode of the liquid inlet and outlet of each liquid cooling plate is substantially the same as that of the liquid inlet and outlet in the above embodiments, and is not described herein again.

Referring to fig. 1-5, in one embodiment, the piping structure 120 includes an inlet fitting 124, an outlet fitting 125, a set of liquid cooling pipes 121, a first liquid trap 122, and a second liquid trap 123. The liquid cooling pipe set 121 may be connected to the first liquid cooling plate 111, the second liquid cooling plate 112, the third liquid cooling plate 113, and the fourth liquid cooling plate 114 through the first liquid separator 122 and the second liquid separator 123. The liquid cooling tube assembly 121 is also connected to an external heat source through an inlet connector 124 and an outlet connector 125.

The inlet connector 124 and the outlet connector 125 are used to connect the liquid cooling pipe set 121 to an external cold source. The inlet connector 124 is connected to the liquid outlet end of the external cold source, and the outlet connector 125 is connected to the liquid inlet end of the external cold source. The cooling liquid in the external cold source enters the liquid cooling pipeline set 121 through the liquid outlet end and the inlet joint 124, and the cooling liquid in the liquid cooling pipeline set 121 flows back to the external cold source through the outlet joint 125 and the liquid inlet end.

The liquid cooling pipeline group 121 comprises a plurality of cooling pipelines, the cooling pipelines are respectively connected with the liquid inlet and outlet ports of the first liquid cooling plate 111, the second liquid cooling plate 112, the third liquid cooling plate 113 and the fourth liquid cooling plate 114, and the serial-parallel connection of the liquid cooling plates is realized through the first liquid distributing and collecting device 122 and the second liquid distributing and collecting device 123, so that different cooling requirements are met. Optionally, each cooling conduit is a hard pipe or a custom-made profiled pipe or the like.

The first liquid trap 122 has a first joint, a second joint, and a third joint. The first liquid separator 122 realizes the series-parallel connection of the first liquid-cooled plate 111, the second liquid-cooled plate 112 and the third liquid-cooled plate 113 through a first joint, a second joint and a third joint. Illustratively, the first connector is connected to the second liquid inlet/outlet a2 of the first liquid cooling plate 111, the second connector is connected to the fourth liquid inlet/outlet a4 of the second liquid cooling plate 112, and the third connector is connected to the sixth liquid inlet/outlet a6 of the third liquid cooling plate 113. Each liquid inlet and outlet is connected with the joint through a cooling pipeline. Optionally, the first joint, the second joint and the third joint may be disposed on the same side or on different sides.

The second liquid trap 123 has a fourth connection, a fifth connection and a sixth connection. The second liquid distributor 123 realizes the output of the cooling liquid after the serial-parallel connection of the first liquid cooling plate 111, the second liquid cooling plate 112 and the third liquid cooling plate 113 through the fourth joint, the fifth joint and the sixth joint. Illustratively, the fourth joint is connected to the third liquid inlet/outlet port A3 of the second liquid cold plate 112, the fifth joint is connected to the fifth liquid inlet/outlet port a5 of the third liquid cold plate 113, and the sixth joint is connected to the outlet port 125. Each liquid inlet and outlet is connected with the joint through a cooling pipeline. Optionally, the fourth joint, the fifth joint and the sixth joint may be disposed on the same side or on different sides.

It is worth noting that the joints of the first liquid trap 122 and the second liquid trap 123 may have different functions due to different connected cooling pipes. For example, in the above embodiment, the first liquid distributor and collector 122 and the second liquid distributor and collector 123 are liquid collectors. Of course, in other embodiments of the present invention, the connection mode of the cooling pipes is changed, and the functions of the first liquid separator 122 and the second liquid separator 123 can be changed, as shown in fig. 1, when the cooling liquid enters the second liquid cooling plate 112 and the third liquid cooling plate 113 from A3 and a5 first, the first liquid separator 122 is a liquid collector, and the second liquid separator 123 is a liquid separator. In this embodiment, the second liquid distributor 123 is separated from the first liquid distributor 122, as shown in fig. 4; of course, the second liquid separator 123 and the first liquid separator 122 may be an integral structure, as shown in fig. 5. In other embodiments of the present invention, the first liquid distributor 123 and the second liquid distributor 122 may also be three-way valves, etc.

Referring to fig. 3 to 5, in an embodiment, the inlet connector 124 is connected to the seventh liquid inlet/outlet a7 of the fourth liquid cooling plate 114, the eighth liquid inlet/outlet A8 of the fourth liquid cooling plate 114 is connected to the first liquid inlet/outlet a1 of the first liquid cooling plate 111, the second liquid inlet/outlet a2 of the first liquid cooling plate 111 is respectively connected to the fourth liquid inlet/outlet a4 of the second liquid cooling plate 112 and the sixth liquid inlet/outlet a6 of the third liquid cooling plate 113 through the first liquid distributor 122, and the third liquid inlet/outlet A3 of the second liquid cooling plate 112 and the fifth liquid inlet/outlet a5 of the third liquid cooling plate 113 are connected to the outlet connector 125 through the second liquid distributor 123.

The present invention provides an example of the connection of the liquid inlet and outlet and the flow of the cooling liquid, in which the fourth liquid cooling plate 114 is connected in series with the first liquid cooling plate 111, and then connected in series with the second liquid cooling plate 112 and the third liquid cooling plate 113, and the second liquid cooling plate 112 and the third liquid cooling plate 113 are connected in parallel.

The liquid outlet end of the external cold source is connected with the seventh liquid inlet and outlet a7 of the fourth liquid cold plate 114 through the inlet joint 124, the eighth liquid inlet and outlet A8 of the fourth liquid cold plate 114 is connected with the first liquid inlet and outlet a1 of the first liquid cold plate 111, and the second liquid inlet and outlet a2 of the first liquid cold plate 111 is connected with the fourth liquid inlet and outlet a4 of the second liquid cold plate 112 and the sixth liquid inlet and outlet a6 of the third liquid cold plate 113 through the first liquid distributor 122. The third liquid inlet and outlet A3 of the second liquid cooling plate 112 and the fifth liquid inlet and outlet a5 of the third liquid cooling plate 113 are connected to the liquid inlet of an external cold source through the second liquid distributor 123 via the outlet connector 125.

The cooling liquid output by the external cold source enters the fourth liquid-cooling plate 114 through the inlet connector 124 and the liquid-cooling pipe set 121, and the power supply 230 is cooled by the fourth liquid-cooling plate 114. The cooling liquid after exchanging heat with the power supply 230 flows into the first liquid-cooling plate 111 through the liquid-cooling pipe set 121, and cools a surface of the first electronic unit 210 and a surface of the second electronic unit 220 through the first liquid-cooling plate 111 respectively. Subsequently, the cooling liquid flows out of the first liquid-cooling plate 111, is distributed by the first liquid-collecting device 122, and enters the second liquid-cooling plate 112 and the third liquid-cooling plate 113, respectively, and then cools the other surface of the first electronic unit 210 and the other surface of the second electronic unit 220. The cooled coolant flows out of the second liquid cooling plate 112 and the third liquid cooling plate 113, and is collected to the outlet connector 125 through the second liquid distributor 123, and then flows back to the external cold source.

When the cooling fluid flows among the first liquid cooling plate 111, the second liquid cooling plate 112, and the third liquid cooling plate 113, the flow direction of the cooling fluid in the first liquid cooling plate 111 is opposite to the flow direction of the cooling fluid in the second liquid cooling plate 112 and the third liquid cooling plate 113. Thus, it is possible to ensure that the flow directions of the cooling liquid on both sides of the first electronic unit 210 are different, and opposite flows are formed on both sides of the first electronic unit 210, so that the temperature of the first electronic unit 210 is equalized, and the temperature difference between the cooling liquid and the first electronic unit 210 can be reduced. Optionally, the sum of the flow channel resistances of the second liquid cooling plate 112 and the third liquid cooling plate 113 is substantially consistent with the sum of the flow channel resistances of the first liquid cooling plate 111, so as to ensure that the flow rates in the whole liquid cooling structure 110 are consistent.

Of course, in other embodiments of the present invention, the connection mode of the liquid inlet and outlet of each liquid cooling plate and the flowing direction of the cooling liquid can be properly adjusted, and the connection mode and principle are substantially the same, which is not repeated herein.

The utility model also provides a liquid cooling virtual currency digs machine 10, liquid cooling heat abstractor 100 in electronic equipment 200 and the above-mentioned embodiment. The electronic device 200 includes a first electronic unit 210, a second electronic unit 220, and a power supply 230, and the liquid cooling device cools the first electronic unit 210, the second electronic unit 220, and the power supply 230. The utility model discloses a virtual currency of liquid cooling digs ore deposit machine 10 adopts the liquid cooling heat abstractor 100 back of above-mentioned embodiment, can guarantee electronic equipment 200's radiating effect, and then guarantees the reliability of the virtual currency of liquid cooling digs ore deposit machine 10 work. Of course, the liquid-cooled virtual currency miner 10 may also be other types of processing equipment.

In one embodiment, the liquid-cooled virtual currency miner 10 further includes a chassis housing 400, the electronic device 200 and the liquid-cooled structure 110 and the conduit structure 120 of the liquid-cooled heat sink 100 being disposed in the chassis housing 400. The housing case 400 is a case of the liquid-cooled heat sink 100. The housing case 400 has a mounting space for mounting the electronic unit of the electronic apparatus 200 of the virtual money miner, the liquid cooling structure 110, and the piping structure 120. The housing 400 also has a protection function, so that external sundries are prevented from entering the housing, and meanwhile, external objects can be prevented from touching the electronic device 200, and the electronic device 200 can work normally. In addition, the chassis housing 400 can also make the components of the liquid-cooled heat dissipating device 100 form a whole for convenient use.

In an embodiment, the chassis housing 400 includes a carrying housing 410, and a first side plate 420, a second side plate 430 and a chassis cover 440 disposed on the carrying housing 410, wherein the first side plate 420 and the second side plate 430 are disposed opposite to each other, the chassis cover 440 is disposed on the top of the carrying housing 410, the input terminal 231 of the electronic device 200 is disposed on the first side plate 420, and the inlet connector 124 and the outlet connector 125 of the duct structure 120 are disposed on the second side plate 430. The bearing housing 410 is U-shaped. The first side plate 420 and the second side plate 430 are disposed at two opposite sides of the carrying bottom case, and the chassis cover plate 440 is covered on the carrying shell 410, so that the first side plate 420, the second side plate 430, the carrying shell 410 and the chassis cover plate 440 can form a box body with an installation space.

Also, the inlet and outlet connectors 124 and 125 protrude through the second side plate 430 for connection with an external heat sink. The input terminal of the power supply 230 extends through the first side plate 420, so as to be connected to an external power source. Furthermore, a fixing member is disposed inside the first side plate 420, and the fixing member fixes the first liquid separator 122 and the second liquid separator 123.

Referring to fig. 1-6, in one embodiment, the liquid-cooled virtual currency miner 10 further includes a connection assembly 240, the connection assembly 240 connecting the first and second electronic units 210 and 220, respectively, to the power supply 230. The connecting assembly 240 electrically connects the first electronic unit 210 and the power supply 230, and electrically connects the second electronic unit 220 and the power supply 230. Thus, the power supply 230 supplies power to the first electronic unit 210 and the second electronic unit 220, so that the first electronic unit 210 and the second electronic unit 220 operate normally.

In an embodiment, the connection assembly 240 includes a copper bar and a connection cable, and the first electronic unit 210 is connected to the power supply 230 through the copper bar and the connection cable. One end of the copper bar is electrically connected to the first electronic unit 210, and the other end of the copper bar is electrically connected to the power supply 230 through a connection cable. Of course, one end of the copper bar is electrically connected to the second electronic unit 220, and the other end of the copper bar is electrically connected to the power supply 230 through a connection cable.

Referring to fig. 6, in one embodiment, the connection assembly 240 includes a positive copper bar 241, a negative copper bar 243, a positive cable 242, and a negative cable 244; the anode 211 of the first electronic unit 210 is provided with an anode copper bar 241, and the cathode 212 of the first electronic unit 210 is provided with a cathode copper bar 243; the positive copper bar 241 is provided with a positive fixing hole 2411 connected with the positive cable 242, and the positive fixing hole 2411 is positioned at the inner position of the positive copper bar 241; the negative copper bar 243 has a negative fixing hole 2441 connected to the negative cable 244, and the negative fixing hole 2441 is located outside the negative copper bar 243. It can be understood that the inner position here refers to a position between a connection point of the positive electrode copper bar 241 and the first electronic unit 210 and a connection point of the negative electrode copper bar 243 and the second electronic unit 220; the outer position herein refers to a position other than the connection position of the positive copper bar 241 and the first electronic unit 210 and the connection position of the negative copper bar 243 and the second electronic unit 220.

In one embodiment, the length of the positive cable 242 is greater than the length of the negative cable 244. Therefore, the connection between the positive electrode and the negative electrode can be prevented from being reversed, the first electronic unit 210 and the second electronic unit 220 can be prevented from being burnt out, and the use safety can be ensured. Of course, in other embodiments of the present invention, the connection structure between the positive electrode and the negative electrode may be different, so as to prevent the positive electrode and the negative electrode from being connected reversely.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (15)

1. A liquid cooling heat dissipation device is used for dissipating heat of electronic equipment, wherein the electronic equipment comprises a first electronic unit and a second electronic unit; the liquid cooling heat abstractor includes:

the liquid cooling structure comprises a first liquid cooling plate, a second liquid cooling plate and a third liquid cooling plate, wherein the second liquid cooling plate and the third liquid cooling plate are symmetrically arranged at two sides of the first liquid cooling plate, the first electronic unit is arranged between the first liquid cooling plate and the second liquid cooling plate, and the second electronic unit is arranged between the first liquid cooling plate and the third liquid cooling plate; and

and the pipeline structure is connected with the first liquid cooling plate, the second liquid cooling plate, the third liquid cooling plate and an external cold source and used for inputting and outputting cooling liquid.

2. The liquid-cooled heat sink of claim 1, wherein the first liquid-cooled plate has a cooling capacity greater than the second and third liquid-cooled plates;

the first liquid cooling plate is provided with a first accommodating cavity, the second liquid cooling plate is provided with a second accommodating cavity, and the third liquid cooling plate is provided with a third accommodating cavity; the heat dissipation area of the first accommodating cavity is larger than that of the second accommodating cavity, and the heat dissipation area of the first accommodating cavity is larger than that of the third accommodating cavity.

3. The liquid-cooled heat sink of claim 1, wherein the first liquid-cooled plate has a first cooling surface and a second cooling surface, the second liquid-cooled plate has a third cooling surface, and the third liquid-cooled plate has a fourth cooling surface;

the first cooling surface and the third cooling surface are arranged oppositely, and are respectively abutted against the first electronic unit for cooling the first electronic unit;

the second cooling surface and the fourth cooling surface are arranged opposite to each other, and are respectively abutted against the second electronic unit for cooling the second electronic unit.

4. The liquid-cooled heat dissipating device of claim 1, wherein the surface of the second liquid-cooled plate has a first protrusion, the first protrusion abuts against the first electronic unit, and the surface of the second liquid-cooled plate and the first electronic unit enclose a first heat dissipating channel for dissipating heat of the first electronic unit;

the surface of the third liquid cooling plate is provided with a second fixing protrusion which is convexly arranged, the second fixing protrusion is abutted to the second electronic unit, and the surface of the third liquid cooling plate and the second electronic unit are enclosed to form a second heat dissipation channel for dissipating heat of the second electronic unit.

5. The liquid-cooled heat dissipation device of claim 1, wherein the electronic device further comprises a power supply, the liquid-cooled structure further comprises a fourth liquid-cooled plate connected to the conduit structure, the fourth liquid-cooled plate having a fifth cooling surface, the fifth cooling surface being attached to the power supply for cooling the power supply.

6. The liquid-cooled heat sink of claim 5, wherein the first liquid-cooled plate has a first fluid inlet and a second fluid outlet; the second liquid cooling plate is provided with a third liquid inlet and outlet and a fourth liquid inlet and outlet; the third liquid cooling plate is provided with a fifth liquid inlet and outlet and a sixth liquid inlet and outlet, and the fourth liquid cooling plate is provided with a seventh liquid inlet and outlet and an eighth liquid inlet and outlet;

the pipeline structures are connected in series and/or in parallel with each liquid inlet and outlet.

7. The liquid-cooled heat sink of claim 6, wherein the fourth liquid-cooled plate is connected in series or in parallel with the first, second, and third liquid-cooled plates.

8. The liquid-cooled heat sink of claim 6, wherein the first, second, and third liquid-cooled plates are connected in series or in parallel;

or the first liquid cooling plate is respectively connected with the second liquid cooling plate and the third liquid cooling plate in series, and the second liquid cooling plate is connected with the third liquid cooling plate in parallel.

9. The liquid-cooled heat sink of claim 7 or 8, wherein the flow direction of the cooling liquid in the first liquid-cooled plate is the same as the flow direction of the second liquid-cooled plate and the third liquid-cooled plate;

or the flow direction of the cooling liquid in the first liquid cooling plate is opposite to the flow direction of the second liquid cooling plate and the third liquid cooling plate;

or the flowing direction of the cooling liquid in the first liquid cooling plate is the same as the flowing direction of one of the second liquid cooling plate and the third liquid cooling plate, and the flowing direction of the other of the second liquid cooling plate and the third liquid cooling plate is opposite to the flowing direction of the other of the second liquid cooling plate and the third liquid cooling plate.

10. The liquid cooled heat sink of any of claims 6 to 8, wherein the piping structure comprises an inlet connection, an outlet connection, a set of liquid cooled pipes, a first liquid trap and a second liquid trap;

the liquid cooling pipeline group can be connected with the first liquid cooling plate, the second liquid cooling plate, the third liquid cooling plate and the fourth liquid cooling plate through the first liquid distribution and collection device and the second liquid distribution and collection device;

the liquid cooling pipeline set is further connected to the external cold source through the inlet connector and the outlet connector.

11. The liquid-cooled heat dissipation device of claim 10, wherein the inlet connector is connected to a seventh liquid inlet and outlet of the fourth liquid-cooled plate, the eighth liquid inlet and outlet of the fourth liquid-cooled plate is connected to the first liquid inlet and outlet of the first liquid-cooled plate, the second liquid inlet and outlet of the first liquid-cooled plate are respectively connected to a fourth liquid inlet and outlet of the second liquid-cooled plate and a sixth liquid inlet and outlet of the third liquid-cooled plate through the first liquid distributor, and the third liquid inlet and outlet of the second liquid-cooled plate and the fifth liquid inlet and outlet of the third liquid-cooled plate are connected to the outlet connector through the second liquid distributor.

12. A liquid cooled virtual currency miner comprising electronics and a liquid cooled heat sink as claimed in any one of claims 1 to 11;

the electronic equipment comprises a first electronic unit, a second electronic unit and a power supply, and the first electronic unit, the second electronic unit and the power supply are cooled by the liquid cooling device.

13. The liquid-cooled virtual currency miner as recited in claim 12, further comprising a connection assembly connecting the first and second electronic units to the power supply, respectively.

14. The liquid-cooled virtual currency miner as recited in claim 13, wherein said connection assembly includes copper bars and a connection cable, said first electronic unit being connected to said power supply through said copper bars and said connection cable.

15. The liquid-cooled virtual currency miner as recited in claim 14, wherein said connection assembly includes a positive copper bar, a negative copper bar, a positive cable and a negative cable; the anode of the first electronic unit is provided with the anode copper bar, and the cathode of the first electronic unit is provided with the cathode copper bar; the positive copper bar is provided with a positive fixing hole connected with the positive cable, and the positive fixing hole is positioned in the inner side of the positive copper bar; the negative electrode copper bar is provided with a negative electrode fixing hole connected with the negative electrode cable, and the negative electrode fixing hole is positioned at a position close to the outside of the negative electrode copper bar;

the length of the positive cable is greater than that of the negative cable.

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