CN213750203U

CN213750203U - PCB board via hole detection device

Info

Publication number: CN213750203U
Application number: CN202022887860.5U
Authority: CN
Inventors: 易凯
Original assignee: Fujian Yongsheng Electronics Co ltd
Current assignee: Fujian Yongsheng Electronics Co ltd
Priority date: 2020-12-06
Filing date: 2020-12-06
Publication date: 2021-07-20
Anticipated expiration: 2030-12-06

Abstract

The utility model discloses a PCB board via hole detection device, its characterized in that sets up a pair of test point on the PCB board, a test point in a pair of test point link to each other with the first layer of via hole, another test point links to each other with the end layer of via hole, two test points pass through the line formation electric conductance between via hole and the via hole and lead to, two test points are with the same symbol sign. The shape of the test point and the shape of the circular pad. The plurality of vias have different pore sizes. The number of layers of the PCB is more than two. The utility model discloses design a pair of test point on the PCB board, measure the quality that the via hole can be judged to the electric conductance between two test points, easy operation is simple, and it is quick to detect. The two test points are marked by the same symbol, so that a corresponding pair of test points can be found in a PCB with a complex layout at a glance, and the test method brings the advantages of convenience and high efficiency for test work.

Description

PCB board via hole detection device

Technical Field

The utility model belongs to the technical field of PCB board preparation and test, a PCB board via hole detection device is related to.

Background

The volume of the existing electronic information products is smaller and smaller, the number of electronic components is more and more, meanwhile, the integration level of an integrated circuit is higher and higher, pins of the integrated circuit are more and more, and the electronic information products can adapt to the development of the demand only by a plurality of layers of PCB boards.

Copper foil leads between layers of a multilayer PCB are realized through via holes, and the via holes play a role in electrical interconnection of multilayer printed circuits, so that the quality of the via holes is closely related to the quality and reliability of the multilayer boards. However, in the production process of the PCB circuit board, the copper plating layer in the via hole is disconnected, the plating layer in the via hole is thin, and the connection between the wall of the multi-layer board and the inner copper ring is poor. At present, the quality of the copper plating layer in the hole is judged mainly by slicing analysis and observing and analyzing the slices by a metallographic microscope. However, this method will inevitably damage the PCB unit and cause the PCB unit to be discarded, or even the whole PCB board is discarded.

Disclosure of Invention

The to-be-solved technical problem of the utility model is to provide a PCB board via hole detection device, the electric conduction test has swiftly obviously detected the via hole of PCB board.

The utility model discloses a solve the technical scheme that above-mentioned technical problem adopted and be:

a PCB board via hole detection device is characterized in that a pair of test points are arranged on a PCB board, one test point of the pair of test points is connected with the first layer of a via hole, the other test point is connected with the last layer of the via hole, two test points are electrically conducted through a connecting line between the via hole and the via hole, and the two test points are marked by the same symbol.

The shape of the test point and the shape of the circular pad.

The plurality of through holes have different aperture sizes.

The number of layers of the PCB is more than two.

The utility model has the advantages that: compared with the prior art, the utility model discloses only design a pair of test point on the PCB board, measure the quality that the via hole can be judged in the electric conduction between two test points, avoided destroying the PCB board, easy operation is simple, and it is quick to detect. The two test points are marked by the same symbol, so that a corresponding pair of test points can be found in a PCB with a complex layout at a glance, and the test method brings the advantages of convenience and high efficiency for test work.

Drawings

FIG. 1 is a schematic structural diagram of the present invention

In FIG. 1, the solid line-first layer copper foil conductor, the dotted line-intermediate layer and last layer copper foil conductor

FIG. 2 is a schematic diagram of the circuit design of each layer (taking a four-layer board as an example)

FIG. 3 is a schematic diagram of the novel electrical conduction test using the present invention

Wherein, 1-PCB board, 2-via hole, 3-test point,

4-test instrument, 5-test fixture (wire).

Detailed Description

The invention will be further explained with reference to the drawings and the specific embodiments

As shown in fig. 1, a pair of test points is arranged on a PCB 1, one test point of a pair of test points 3 is connected with the first layer of a via hole 2, the other test point is connected with the last layer of the via hole 2, two test points 3 are electrically connected through a connecting line between the via hole 2 and the via hole, and the two test points 3 are marked with the same symbol a. The shape of the test point 3 is different from the shape of the circular pad, and the aperture sizes of the plurality of via holes 3 are different.

The number of layers of the PCB is more than two, the test points can also be arranged between units of the PCB but cannot be designed in the layer units, and the via holes between the head test point and the tail test point contain via holes with various apertures of the PCB.

Taking a four-layer board as an example, as shown in fig. 2, two test points are respectively connected with a first via hole and a last via hole, the first via hole is connected with a second layer of circuit to realize conduction with the second via hole, the second via hole is connected with a third layer of circuit to realize conduction with a fourth via hole, the fourth via hole is connected with a fourth layer of circuit to realize conduction with a fifth hole, and so on, so as to realize interconnection between the two test holes and all via holes and lines in the via hole setting area. After the hole metallization and the circuit pattern are completed on the PCB, the test can be arranged.

As shown in fig. 3, during testing, the testing instrument 4 may be a digital multimeter or a microhm meter, and a dedicated testing fixture 5 is used to measure the electrical conduction or the micro-resistance between two testing points to determine whether the whole PCB has a via hole abnormality.

The quality of the via hole can be simply and qualitatively judged by using a digital multimeter. The digital multimeter is selected to be in a conduction test function gear, two test points with the same identification are respectively contacted with two meter pens, and test data and test sound of the multimeter are observed. If the ohm number of the test is less than 1 and there is a droplet sound, the pair of test points is conductive. Conversely, the pair of test points is said to be non-conductive.

The quality of the through hole can be quantitatively judged by using a microohm meter. Two meter pens of the micro-ohm meter are contacted with a pair of test points, and data obtained by the test are observed. Comparing the measured actual value with the engineering design value, and if the deviation of the actual value is smaller than the design value, testing to show that all the through holes of the PCB are normal; if the actual value is much larger than the designed value, even infinite, the test shows that the via hole has abnormality.

The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A PCB board via hole detection device is characterized in that a pair of test points are arranged on a PCB board, one test point of the pair of test points is connected with the first layer of a via hole, the other test point is connected with the last layer of the via hole, two test points are electrically conducted through a connecting line between the via hole and the via hole, and the two test points are marked by the same symbol.

2. The PCB board via inspection device of claim 1, wherein the shape of the test point is the same as the shape of the circular pad.

3. The PCB board via hole detection device of claim 1, wherein the plurality of via holes have different aperture sizes.

4. The PCB board via hole detection device of claim 1, wherein the number of layers of the PCB board is more than two.