CN213705823U - Inertia measurement module, flight control inertia measurement assembly and aircraft - Google Patents

Abstract

The utility model relates to an inertia measurement module, flight control inertia measurement subassembly and aircraft, this inertia measurement module includes: the inertia measurement unit is used for measuring inertia parameters of the moving object; the temperature adjusting device is arranged side by side with the inertia measuring unit at intervals and is used for exchanging heat with the inertia measuring unit; the packaging structure is used for packaging the inertia measurement unit and the temperature regulation device inside; and the heat conducting medium is filled in a gap between the inertial measurement unit and the temperature regulating device and does not cover the top surface of the inertial measurement unit. The working temperature of the inertia measurement unit in the inertia measurement module in the embodiment of the disclosure can be maintained in the optimal state, and the pressure applied is small, so that the measurement accuracy and reliability of the inertia measurement unit are improved.

Description

Inertia measurement module, flight control inertia measurement assembly and aircraft

Technical Field

The utility model relates to an inertia measurement technical field, specifically relates to an inertia measurement module, flight control inertia measurement subassembly and aircraft.

Background

An Inertial Measurement Unit (IMU) is a device that measures three-axis attitude angles (or angular velocities) and accelerations of a moving object during movement. A conventional IMU contains three single axis accelerometers and three single axis gyroscopes: the accelerometer detects acceleration signals of the aircraft on three independent axes of the carrier coordinate system, and the gyroscope detects angular velocity signals of the carrier relative to the navigation coordinate system. The motion attitude of the airplane can be calculated by measuring the angular velocity and the acceleration of an object in a three-dimensional space, and the method plays a core role in flight control. Since the IMU needs to operate at a specific operating temperature to maintain the accuracy and stability of the measurement, a heating device is disposed around the IMU to adjust the temperature of the IMU for this purpose, but the conventional heating device and IMU generate physical contact and pre-pressure, and the pre-pressure on the surface of the IMU increases with the increase of the temperature, which leads to inaccuracy and instability of the control of the moving object, especially the inaccuracy of the IMU in the aircraft leads to the "drop-out" phenomenon of the aircraft, which has a great influence on the performance of the aircraft. Meanwhile, the heat of the heating device can be directly or indirectly quickly dissipated to the outside, so that the moving object starts to work when the initial heating time of the IMU is too long or the standard working temperature of the IMU is not heated, and the control problem of the moving object is easily caused

SUMMERY OF THE UTILITY MODEL

The present disclosure provides an inertial measurement module, a flight control inertial measurement unit, and an aircraft, which have high measurement accuracy and reliability, so as to partially solve the above problems in the related art.

In order to achieve the above object, the present disclosure provides an inertial measurement module, comprising:

the inertia measurement unit is used for measuring inertia parameters of the moving object;

the temperature adjusting device is arranged side by side with the inertia measuring unit at intervals and is used for exchanging heat with the inertia measuring unit;

the packaging structure is used for packaging the inertia measurement unit and the temperature regulation device inside;

and the heat conducting medium is filled in a gap between the inertial measurement unit and the temperature regulating device and does not cover the top surface of the inertial measurement unit.

Optionally, packaging structure includes encapsulation lid and encapsulation seat, the encapsulation seat with the installation is enclosed out jointly to the encapsulation lid inertia measuring unit with temperature regulation apparatus's cavity, just the lateral wall top of encapsulation seat have with the composition surface that the encapsulation lid docked, inertia measuring unit's top surface towards the encapsulation lid and with composition surface coplane sets up, heat-conducting medium fills in the cavity, heat-conducting medium's top surface with inertia measuring unit's top surface parallel and level.

Optionally, the top wall of the package cover and the top surface of the inertia measurement unit are covered on the package base at intervals, the package cover comprises a top wall and a connecting wall protruding out of the periphery of the top wall, a shoulder is formed at the bottom of the connecting wall, the shoulder has an inner step surface with staggered heights, an outer step surface and a transition surface for connecting the inner step surface and the outer step surface, the height of the inner step surface relative to the top wall is smaller than that of the outer step surface relative to the top wall, the inner step surface is used for being attached to the joint surface, and the transition surface is used for being attached to the outer peripheral surface of the side wall of the package base.

Optionally, a bottom surface of the temperature adjustment device is coplanar with a bottom surface of the inertial measurement unit, and a top surface of the temperature adjustment device is lower than a top surface of the inertial measurement unit.

The other direction of the disclosure also provides a flight control inertia measurement assembly, which comprises an integrated circuit board and the inertia measurement module arranged on the integrated circuit board, wherein an inertia measurement unit of the inertia measurement module is connected with the integrated circuit board through signals, and a temperature regulation device is electrically connected with the integrated circuit board.

Optionally, the bottom of the package structure is connected to the integrated circuit board and has an opening that is open toward the integrated circuit board, and the inertial measurement unit and the temperature adjustment device are connected to the integrated circuit board through the opening.

Optionally, the flight control inertia measurement assembly further comprises a temperature compensation type inertia measurement piece and a barometer, and the barometer and the inertia measurement module are respectively arranged on two sides of the temperature compensation type inertia measurement piece at intervals.

Optionally, a plurality of isolation grooves are further formed on the integrated circuit board, and the isolation grooves respectively surround the periphery of the bottom of the inertia measurement module and the periphery of the bottom of the temperature compensation type inertia measurement piece.

Optionally, the isolation groove is n-shaped as a whole, or two L-shaped grooves are spliced to form the n-shaped.

Optionally, the flight control inertia measurement subassembly still includes the casing, integrated circuit board sets up in the casing, the casing includes casing and lower casing, be provided with a plurality of erection columns in the casing down, integrated circuit board supports on the erection column and be formed with the mounting hole of erection column adaptation, the erection column with the mounting hole passes through fastener detachably and connects, in order to incite somebody to action integrated circuit board is fixed casing down, go up the casing with casing detachably links to each other down.

Optionally, the flight control inertia measurement module further includes a connector, the connector is disposed on the integrated circuit board, the connector has a plug end for being butted with an external structure, and the upper housing is formed with an avoiding opening, so that the plug end is exposed out of the housing from the avoiding opening.

Yet another aspect of the present disclosure also provides an aircraft including a flight control inertial measurement unit as described above.

Through above-mentioned technical scheme, the operating temperature of the inertia measurement unit in the inertia measurement module in the embodiment of this disclosure can maintain at optimum, and the pressure that receives is little to improve the measurement accuracy and the reliability of inertia measurement unit.

Specifically, a temperature adjusting device is disposed near the inertia measurement unit of the inertia measurement module, and the temperature adjusting device can adjust the temperature of the inertia measurement unit according to the current temperature condition of the inertia measurement unit to keep the temperature at the optimal working temperature, for example, if the current temperature of the inertia measurement unit is lower than the optimal working temperature, the temperature adjusting device can generate heat to provide heat for the inertia measurement unit; if the current temperature of the inertial measurement unit is higher than the optimal operating temperature, the thermostat does not generate heat and can also absorb a portion of the heat from the inertial measurement unit to reduce the heat of the inertial measurement unit. The optimal operating temperature refers to a temperature required for the most accurate and reliable measurement value of the inertial measurement unit, and the optimal operating temperature may be a specific temperature value or a temperature value range, which is not limited in the present disclosure.

Moreover, the heat transfer efficiency between the inertia measurement unit and the temperature regulation device can be accelerated by the heat conduction medium arranged between the inertia measurement unit and the temperature regulation device, so that the inertia measurement unit can quickly reach the required optimal working temperature, the preheating time of the inertia measurement unit is shortened, accurate and reliable inertia parameters are provided for moving objects, and the control error of the moving objects is avoided. And the temperature adjusting device and the inertia measuring unit are arranged side by side at intervals, and the heat-conducting medium is arranged to be not covered on the top surface of the inertia measuring unit, so that the top surface of the inertia measuring unit cannot be subjected to pre-pressure from the temperature adjusting device and the heat-conducting medium, and the stress change of the heat-conducting medium caused by the heat effect cannot influence the top surface of the inertia measuring unit, thereby ensuring the measurement accuracy and stability of the inertia measuring unit. In addition, above-mentioned packaging structure can be inside inertia measuring unit, temperature regulation apparatus and heat-conducting medium encapsulation, can play heat preservation and guard action, improves heat utilization and inertia measuring unit's life.

Additional features and advantages of the disclosure will be set forth in the detailed description which follows.

Drawings

The accompanying drawings, which are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure without limiting the disclosure. In the drawings:

FIG. 1 is an external schematic view of an inertial measurement module in one example of the present disclosure;

FIG. 2 is a longitudinal cross-sectional view of an inertial measurement module in one example of the present disclosure;

FIG. 3 is an exploded view of an inertial measurement module in one example of the present disclosure;

FIG. 4 is an exploded view of an inertial measurement module in an example of the present disclosure from another perspective;

FIG. 5 is an exploded view of an inertial measurement module in another example of the present disclosure;

FIG. 6 is a temperature time plot of an inertial measurement unit and an electrical heating in one example of the present disclosure;

fig. 7 to 10 are schematic internal structural diagrams of a flight control inertial measurement unit according to an example of the present disclosure, in which schematic installation steps of an inertial measurement module are sequentially shown;

FIG. 11 is an exploded view of a flight control inertial measurement unit in one example of the present disclosure;

FIG. 12 is an exploded view of a flight control inertial measurement unit from another perspective in one example of the disclosure;

FIG. 13 is an external schematic view of a flight control inertial measurement unit in one example of the present disclosure.

Description of the reference numerals

10. An inertial measurement module; 110. an inertial measurement unit; 120. a temperature adjustment device; 121. an electric heating element; 130. a packaging structure; 131. a package cover; 1311. a top wall; 1312. a connecting wall; 1313. a shoulder; 1314. an inner side step surface; 1315. an outer side step surface; 1316. a transition surface; 132. a package base; 1321. a bonding surface; 140. a heat-conducting medium; 20. an integrated circuit board; 30. a temperature compensated inertial measurement unit; 40. a barometer; 50. a housing; 510. an upper housing; 520. a lower housing; 521. mounting a column; 522. a lug; 60. a connector assembly; 610. connecting a plug end; h1, a first vent; h2, a second vent; r, avoiding the port; o, opening; t, isolating the groove.

Detailed Description

The following detailed description of specific embodiments of the present disclosure is provided in connection with the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present disclosure, are given by way of illustration and explanation only, not limitation.

In the present disclosure, unless stated to the contrary, use of directional terms such as "top and bottom" refers to the orientation or positional relationship of the product as it is conventionally placed in use, such as the orientation as placed in the drawings; "inner and outer" refers to "inner and outer" relative to the contour of the component or structure itself. It should be noted that the orientations and positional relationships indicated by the terms "top," "bottom," "inner," "outer," and the like are merely for convenience in describing the present disclosure, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present disclosure. In addition, it is to be understood that the terms "first," "second," and the like are used for distinguishing one element from another, and are not necessarily order nor importance. In addition, in the description with reference to the drawings, the same reference numerals in different drawings denote the same elements.

An Inertial Measurement Unit (IMU) is a precision Measurement device for measuring the motion attitude of a moving object, and plays an important role in the control and navigation of the moving object, but the Measurement precision of the IMU is affected by the pressure or ambient temperature of the IMU.

In order to meet the requirement of the inertial measurement unit on the working temperature, the embodiment of the present disclosure provides an inertial measurement module 10 and a flight control inertial measurement unit mounted with the inertial measurement module 10. An exemplary embodiment of an inertial measurement module 10 is first described herein with reference to fig. 1 to 5, where the inertial measurement module 10 includes an inertial measurement unit 110, a temperature adjustment device 120, a package structure 130, and a heat transfer medium 140, where:

the inertial measurement unit 110 is used for measuring inertial parameters of the moving object; the mobile object includes, but is not limited to, an aircraft, a vehicle, a ship, a robot, a cargo sorting system, a measuring cart, etc., that is, the inertial measurement unit 110 may be applied to mobile objects in various fields to measure inertial parameters of the mobile object, such as three-axis attitude angle (or angular velocity) and acceleration, so as to provide a reference index for the controller.

The temperature adjusting device 120 is arranged side by side with the inertial measurement unit 110 at an interval and is used for exchanging heat with the inertial measurement unit 110; the heat exchange may be heat transfer from the temperature adjustment device 120 to the inertial measurement unit 110, or heat transfer from the inertial measurement unit 110 to the temperature adjustment device 120, and the temperature adjustment device 120 may adjust the operating temperature of the inertial measurement unit 110 according to a program instruction so as to maintain the operating temperature of the inertial measurement unit 110 in an optimal state.

The package structure 130 is used for packaging the inertial measurement unit 110 and the temperature adjustment device 120 inside; the packaging structure 130 is used for installing and protecting the inertia measurement unit 110 and enhancing the thermal insulation performance

The heat transfer medium 140 is filled in the gap between the inertial measurement unit 110 and the temperature adjustment device 120, and does not cover the top surface of the inertial measurement unit 110, so that the physical contact area between the heat transfer medium 140 and the inertial measurement unit 110 is reduced, and the pre-pressure of the heat transfer medium 140 on the inertial measurement unit 110 is reduced.

Through the above technical solution, the working temperature of the inertia measurement unit 110 in the inertia measurement module 10 in the embodiment of the present disclosure can be maintained in an optimal state, and the pressure applied is small, so as to improve the measurement accuracy and reliability of the inertia measurement unit 110.

Specifically, a temperature adjusting device 120 is disposed near the inertia measurement unit 110 of the inertia measurement module 10, and the temperature adjusting device 120 can adjust the temperature of the inertia measurement unit 110 according to the current temperature condition of the inertia measurement unit 110 to keep the temperature at the optimal operating temperature, for example, if the current temperature of the inertia measurement unit 110 is lower than the optimal operating temperature, the temperature adjusting device 120 can generate heat to provide heat to the inertia measurement unit 110; if the current temperature of the inertial measurement unit 110 is higher than the optimal operating temperature, the thermostat 120 does not generate heat and can also absorb a portion of the heat from the inertial measurement unit 110 to reduce the heat of the inertial measurement unit 110. The optimal operating temperature refers to a temperature required for the most accurate and reliable measurement of the inertial measurement unit 110, and may be a specific temperature value or a temperature value range, which is not limited in this disclosure.

Moreover, the heat-conducting medium 140 disposed between the inertial measurement unit 110 and the temperature adjustment device 120 can accelerate the heat transfer efficiency therebetween, so that the inertial measurement unit 110 can rapidly reach the required optimal working temperature, the preheating time of the inertial measurement unit 110 is reduced, accurate and reliable inertial parameters are provided for the mobile object, and the control error of the mobile object is avoided. Moreover, the temperature adjusting device 120 and the inertia measuring unit 110 are arranged side by side at an interval, and the heat conducting medium 140 is arranged to be not covered on the top surface of the inertia measuring unit 110, so that the top surface of the inertia measuring unit 110 is not subjected to pre-pressure from the temperature adjusting device 120 and the heat conducting medium 140, and thus the stress change of the heat conducting medium 140 caused by the heat effect does not affect the top surface of the inertia measuring unit 110, and the measurement accuracy and stability of the inertia measuring unit 110 are ensured. In addition, the above-mentioned packaging structure 130 can encapsulate the inertia measurement unit 110, the temperature adjustment device 120 and the heat conducting medium 140 inside, and can play a role in heat preservation and protection, thereby improving the heat utilization rate and the service life of the inertia measurement unit 110.

It should be understood that the inertial measurement unit 110 may further incorporate a temperature sensor (not shown in the drawings) for collecting a temperature signal of the inertial measurement unit 110 to feed back to the controller in time when the inertial measurement unit 110 is in operation, so that the controller can control the temperature adjustment device 120 to adjust and control the temperature of the inertial measurement unit 110.

For example, the temperature sensor may be disposed at a side of the inertial measurement unit 110 to avoid pressure on the top wall 1311 of the inertial measurement unit 110.

In other embodiments of the present disclosure, the temperature signal of the inertia measurement unit 110 may also be measured by thermal image acquisition through infrared radiation, that is, a temperature detection device independent from the inertia measurement module 10 may be provided to acquire the temperature signal, which is not limited by the present disclosure.

Exemplary structural features of the various components of the inertial measurement module 10 in the disclosed embodiment are described in further detail herein with continued reference to fig. 1-5.

In an exemplary embodiment of the present disclosure, as shown in fig. 1 to 3, the package structure 130 includes a package cover 131 and a package base 132, the package base 132 and the package cover 131 together enclose a cavity for mounting the inertial measurement unit 110 and the temperature adjustment device 120, a top portion of a sidewall of the package base 132 has a joint surface 1321 for butting against the package cover 131, a top surface of the inertial measurement unit 110 faces the package cover 131 and is disposed coplanar with the joint surface 1321, the heat conducting medium 140 is filled in the cavity, and a top surface of the heat conducting medium 140 is flush with the top surface of the inertial measurement unit 110. Here, the joint surface 1321 of the sidewall of the package base 132 is disposed coplanar with the top surface of the inertia measurement unit 110, so that the heat-conducting medium 140 can be conveniently processed into the gap between the inertia measurement unit 110 and the temperature adjustment device 120 by filling, that is, the fluid heat-conducting medium 140 is filled into the gap to flow and fill the gap, after the heat-conducting medium 140 is solidified, the top surface of the heat-conducting medium 140 is processed to be flush with the joint surface 1321 of the package base 132 by means of a tool such as a scraper, the processing operation of the heat-conducting medium 140 is convenient, and the heat-conducting medium 140 does not cover the top surface of the inertia measurement unit 110, thereby preventing the top surface of the inertia measurement unit 110 from being subjected to pre-pressure and improving the detection accuracy. It should be understood that the heat conductive medium 140 may be made of silicon gel, thermal gel, phase change heat conductive material, epoxy resin, etc., but is not limited thereto.

However, in other embodiments of the present disclosure, the heat conducting medium 140 may be pre-formed, i.e., pre-processed into a configuration capable of being disposed in the gap between the inertial measurement unit 110 and the temperature adjustment device 120, and then assembled, so that the heat conducting medium 140 needs to be reserved with a through hole allowing the top surface of the inertial measurement unit 110 to be exposed, and thus, contact with the top surface of the inertial measurement unit 110 is avoided. The heat conducting medium 140 that can be pre-formed may be made of a heat conducting metal (aluminum, copper, etc.), graphite, etc., in addition to the above materials, but is not limited thereto. Further, it is understood that the top surface of the heat conducting medium 140, which may be pre-formed, may form a height difference with the top surface of the inertial measurement unit 110, for example, the top surface of the heat conducting medium 140 may be lower or higher than the top surface of the inertial measurement unit 110, which is not limited by the present disclosure.

As shown in fig. 2, the top wall 1311 of the package cover 131 is covered on the package base 132 with a space from the top surface of the inertial measurement unit 110, so as to avoid the package cover 131 contacting the top surface of the inertial measurement unit 110 to generate pressure, which affects the measurement accuracy of the inertial measurement unit 110; on the other hand, the air between the top wall 1311 of the package cover 131 and the top surface of the inertia measurement unit 110 can slow down the heat of the temperature adjustment device 120 and the heat conducting medium 140 from being dissipated to the external environment through the package cover 131 by utilizing the characteristic of low thermal conductivity of the air, thereby improving the thermal insulation of the package structure 130.

The sealing cap 131 may be abutted with the sealing seat 132 in any suitable manner, as shown in fig. 2 to 4, the sealing cap 131 includes a top wall 1311 and a connecting wall 1312 protruding from the periphery of the top wall 1311, a shoulder 1313 is formed at the bottom of the connecting wall 1312, the shoulder 1313 has an inner step face 1314 with a height offset, an outer step face 1315 and a transition face 1316 connecting the inner step face 1314 and the outer step face 1315, the height of the inner step face 1314 relative to the top wall 1311 is smaller than that of the outer step face 1315 relative to the top wall 1311, the inner step face 1314 is configured to be abutted with an engagement face 1321 of the sealing seat 132, and the transition face 1316 is configured to be abutted with the outer peripheral face of the side wall of the sealing seat 132. Since the inner stepped surface 1314 has a height difference with the top wall 1311 of the package cover 131, and the inner stepped surface 1314 is attached to the engaging surface 1321 of the package seat 132, a gap is formed between the top wall 1311 of the package cover 131 and the top surface of the inertial measurement unit 110, so as to prevent the inertial measurement unit 110 from contacting the top wall 1311 of the package cover 131.

Alternatively, after the package cover 131 is abutted against the package seat 132, the package cover 131 and the package seat 132 may be fixed by applying an adhesive on the engagement surface 1321 and the transition surface 1316, or may be fixed by snapping, welding, or the like, but is not limited thereto.

In addition, in the embodiment of the present disclosure, the package cover 131 is further provided with a first vent H1, the first vent H1 can communicate the inner space and the outer space of the package structure 130, and release the temperature change inside the package structure 130 to cause the internal pressure change, so that the internal pressure of the package structure 130 is always balanced with the atmospheric pressure, thereby avoiding generating pressure on the surface of the inertia measurement unit 110, and ensuring the measurement accuracy of the inertia measurement unit 110.

As shown in fig. 2, the bottom surface of thermostat 120 is coplanar with the bottom surface of inertial measurement unit 110, which facilitates mounting thermostat 120 and inertial measurement unit 110 to a surface of the same structure, such as to the surface of integrated circuit board 20, referred to hereinafter. In addition, the top surface of the temperature adjustment device 120 is lower than the top surface of the inertial measurement unit 110, so that the heat transfer medium 140 can cover the top surface of the temperature adjustment device 120 after the heat transfer medium 140 is filled, so that heat generated from the top surface can be rapidly guided to the inertial measurement unit 110 by the heat transfer medium 140 to maximally utilize the heat generated from the temperature adjustment device 120.

In other embodiments of the present disclosure, since there is a gap between the top wall 1311 of the package cover 131 and the top surface of the inertial measurement unit 110, the top surface of the temperature adjustment device 120 may also be flush with the top surface of the inertial measurement unit 110, and the heat of the top surface of the temperature adjustment device 120 is almost preserved in the package structure 130 due to the low thermal conductivity of air.

In an exemplary embodiment of the present disclosure, as shown in fig. 3 to 5, the temperature adjustment device 120 includes a plurality of electric heating members 121, the plurality of electric heating members 121 being respectively spaced around the circumference of the inertia measurement unit 110. That is to say, the temperature adjustment device 120 can provide heat from the periphery of the inertia measurement unit 110 at the same time, so that the heated temperature of the inertia measurement unit 110 is more uniform, the situation that the self stress changes due to nonuniform heating of the inertia measurement unit 110 is avoided, and the measurement accuracy is ensured.

Specifically, the electric heating element 121 is a heating resistor, the plurality of heating resistors are divided into two groups, the two groups of heating resistors are respectively located on two sides of the inertia measurement unit 110, and the heating resistors in each group are arranged along the periphery of the inertia measurement unit 110 at intervals, so that the circumferential size of the inertia measurement unit 110 is reduced by the arrangement mode under the condition that the inertia measurement unit 110 is heated more uniformly.

It should be noted that, in the embodiment of the present disclosure, the shapes of the components, such as the inertial measurement unit 110, the temperature adjustment device 120, and the package structure 130, may be flexibly designed according to actual requirements, and for example, the components may be respectively in various shapes, such as a circle, a rectangle, and the like, which is not limited by the present disclosure.

In addition, the inertia measurement module 10 in the embodiment of the present disclosure further has an advantage of fast temperature rise at the initial stage of start, and the embodiment of the present disclosure further provides a temperature-time curve verified through a large number of experiments and simulation analyses as shown in fig. 6, where at present, the working temperature required by most of the inertia measurement units 110 is 50 ℃ to 80 ℃, the optimal working temperature of the inertia measurement unit 110 of a certain model is assumed to be 60 ℃, the internal environment temperature of the moving object is 40 ℃, and the inertia measurement unit 110 in the embodiment of the present disclosure is heated to 60 ℃ by the temperature adjustment device 120 for only 12 seconds, as a result, when the inertia measurement module 10 is started, the optimal working temperature can be reached in only 12 seconds, and the heating time is short. Moreover, as can be seen from the temperature difference between the inertia measurement unit 110 and the electric heating element 121 at the same time point, the temperature difference is small, which means that most of the heat of the electric heating element 121 can be transferred to the inertia measurement unit 110, and thus the heat loss is low.

While the foregoing generally describes an exemplary embodiment of the inertial measurement module 10, embodiments of the present disclosure also provide a flight control inertial measurement unit mounted with the inertial measurement module 10, and the exemplary embodiment of the flight control inertial measurement unit will be described in detail below with reference to fig. 1 to 13.

In the embodiment of the present disclosure, the flight control inertial measurement unit mainly refers to a measurement unit installed on an aircraft, and is mainly used for measuring inertial parameters such as a three-axis attitude angle (or angular rate) and an acceleration of the aircraft, so as to calculate a motion direction and a motion speed of the aircraft in a spatial position, and correct a heading and a speed of the aircraft in combination with a preset motion trajectory in an inertial navigation system to implement a navigation function. The flight control inertia measurement assembly comprises an integrated circuit board 20 and the inertia measurement module 10 arranged on the integrated circuit board 20, wherein the inertia measurement unit 110 of the inertia measurement module 10 is in signal connection with the integrated circuit board 20, and the temperature regulation device 120 is electrically connected with the integrated circuit board 20. The inertia measurement module 10 optimizes the temperature control of the inertia measurement unit 110 through the temperature adjustment device 120, the heat conducting medium 140 and the packaging structure 130, so that the measurement accuracy and the reliability of the inertia measurement unit 110 are improved, and the measurement accuracy and the reliability of the flight control inertia measurement assembly are improved.

The inertial measurement unit 10 may be disposed on the integrated circuit board 20 in any suitable manner, and in an exemplary embodiment of the present disclosure, as shown in fig. 4 and 5, and fig. 7 to 10, the bottom of the package structure 130 is connected to the integrated circuit board 20 and has an opening O opened toward the integrated circuit board 20, through which the inertial measurement unit 110 and the temperature adjustment device 120 are connected to the integrated circuit board 20.

Specifically, as shown in fig. 4, in an example of the present disclosure, the bottom of the package structure 130 may have one opening O, that is, the package base 132 is formed in a ring shape, the ring-shaped package base 132 is fixed to the integrated circuit board 20 by soldering, bonding, or the like, and encloses a cavity for mounting the inertia measurement unit 110, the temperature adjustment device 120, and the heat conducting medium 140 together with the integrated circuit board 20, and the package structure 130 is simple and is advantageous for light weight.

As shown in fig. 5, in another example of the present disclosure, the opening O of the bottom of the package structure 130 may be plural, disposed corresponding to the inertial measurement unit 110 and the temperature adjustment device 120, respectively, and formed in a shape adapted to the bottom surface shapes of the inertial measurement unit 110 and the temperature adjustment device 120. That is, the heat conducting medium 140 in the package structure 130 is separated from the ic board 20 by the bottom wall of the package seat 132, so as to prevent the heat conducting medium 140 from affecting the performance of the ic board 20.

Alternatively, in other embodiments of the present disclosure, the bottom of the package structure 130 may also be a closed plate, so that a through hole may be formed on the sidewall of the package base 132 or the top wall 1311 of the package cover 131, and then the through hole is penetrated through by a structure such as a flexible signal line or an electrical pin, and is connected to the integrated circuit board 20 for signal connection or electrical connection, which is not limited by the present disclosure.

In the disclosed embodiment, fig. 7 to 10 illustrate the assembly process of the inertial measurement module 10 to the integrated circuit board 20. Specifically, first, as shown in fig. 7, the inertia measurement unit 110 is directly soldered to the integrated circuit board 20 by soldering or the like, and the temperature adjustment device 120 is also directly soldered to the integrated circuit board 20 by soldering or the like, and signal connection and electrical connection are established. Next, as shown in fig. 8, the package holder 132 is fixed to the integrated circuit board 20 by means of bonding, pin plugging, or the like, and encloses the inertia measurement unit 110 and the temperature adjustment device 120 inside thereof. Then, as shown in fig. 9, the heat-conducting medium 140 is filled into the gap between the inertial measurement unit 110 and the temperature adjustment device 120 by injection, and after the heat-conducting medium is solidified, the surface of the heat-conducting medium is scraped off, so that the top surface of the inertial measurement unit 110 is exposed to the heat-conducting medium 140. Finally, as shown in fig. 10, a package cover 131 is disposed on the package base 132 to protect the inertial measurement unit 110.

In the embodiment of the present disclosure, the flight control inertia measurement assembly further includes a temperature compensation type inertia measurement unit 30, and the temperature compensation type inertia measurement unit 30 can correct the acquired inertia parameters under the condition of temperature change. That is to say, this fly to control inertia measurement subassembly in not only be provided with as above inertia measurement module 10 and gather inertial parameter, still be provided with temperature compensation formula inertia measurement spare 30 and gather inertial parameter, the data that both gathered can verify and contrast each other to revise through the algorithm, with further obtain more accurate and reliable inertial parameter, thereby carry out more accurate control to the aircraft.

In addition, the inertia measurement module further includes a barometer 40, and since the thermal field generated by the inertia measurement module 10 may cause a change in the air pressure inside the inertia measurement module, a deviation may occur in the collected air pressure signal of the barometer 40, and in order to reduce the influence of the thermal field generated by the inertia measurement module 10 on the barometer 40, the barometer 40 is disposed as far away from the inertia measurement module 10 as possible. Illustratively, the barometer 40 and the inertial measurement unit 10 are respectively disposed at two sides of the temperature compensation type inertial measurement unit 30 at an interval to block the thermal field generated by the inertial measurement unit 10 and the barometer 40 through the temperature compensation type inertial measurement unit 30, so as to ensure the accuracy and reliability of the collected barometric pressure signal of the barometer 40.

In the embodiment of the present disclosure, as shown in fig. 7 to 12, a plurality of isolation grooves T are further formed on the integrated circuit board 20, and the isolation grooves T respectively surround the outer peripheries of the bottoms of the inertia measurement module 10 and the temperature compensation type inertia measurement unit 30. The isolation slot T is mainly used to reduce the heat loss of the inertial measurement unit 10 and the temperature-compensated inertial measurement unit 30. For the scheme that does not set up isolation tank T, set up isolation tank T on integrated circuit board 20, utilize the low heat conductivity nature of air, the air in this isolation tank T's the cell body can slow down that the heat of inertia measurement module 10 and temperature compensation formula inertia measurement piece 30 distributes away from the bottom, improves the heating efficiency of inertia measurement module 10, strengthens inertia measurement module 10 and temperature compensation formula inertia measurement piece 30's heat insulating ability simultaneously.

The isolation groove T may be formed in any suitable shape as long as it can fit the bottom outer edge of the inertial measurement unit 10 and the temperature compensated inertial measurement unit 30. For example, as shown in fig. 11 and 12, the isolation groove T is n-shaped as a whole, or is formed by splicing two L-shaped grooves into an n-shaped groove, but is not limited thereto. For example, in other embodiments of the present disclosure, the isolation groove T may also be formed by combining three linear grooves into an n-shape, or formed into a semicircular shape or other shapes.

The flight control inertia measurement assembly further comprises a shell 50, wherein the integrated circuit board 20 is arranged in the shell 50 so as to protect the integrated circuit board 20 and components such as the inertia measurement module 10 arranged on the integrated circuit board 20. As shown in fig. 7 to 12, the housing 50 includes an upper housing 510 and a lower housing 520, a plurality of mounting posts 521 are provided in the lower housing 520, the integrated circuit board 20 is supported on the mounting posts 521 and mounting holes adapted to the mounting posts 521 are formed, the mounting posts 521 and the mounting holes are detachably connected by fasteners to fix the integrated circuit board 20 to the lower housing 520, and the upper housing 510 and the lower housing 520 are detachably connected. By disposing a plurality of mounting posts 521 in the housing 50, the integrated circuit board 20 and the lower housing 520 are mounted at an interval, so that electronic components are disposed on both the top surface and the bottom surface of the integrated circuit board 20, the integration level and the function of the integrated circuit board 20 are enhanced, or the size of the integrated circuit board 20 can be reduced, and the mounting space required by the flight control inertia measurement assembly is saved.

Further, as shown in fig. 7 to 13, the flight control inertia measurement assembly further includes a connector 60, the connector 60 is disposed on the integrated circuit board 20, the connector 60 has a connector end 610 to be butted against an external structure, and the upper housing 510 is formed with a relief opening R so that the connector end 610 is exposed from the relief opening R to the housing 50 to be connected to an external controller, a memory, or the like.

In addition, in order to mount the flight control inertia assembly on an aircraft, a lug 522 is further provided on the upper case 510 or the lower case 520 of the flight control inertia assembly, and a fastening hole is formed in the lug 522 to detachably fix the flight control inertia assembly to the aircraft by a fastening member.

Optionally, the flight control inertia assembly may be mounted on the aircraft through a damping structure, so as to prevent the aircraft vibration from affecting the measurement accuracy of the inertia measurement module 10 and the temperature compensation type inertia measurement unit 30. The shock absorbing structure may be an elastic pad, a shock absorbing ball, etc., which the present disclosure does not limit.

Yet another embodiment of the present disclosure also provides an aircraft including a flight control inertial measurement unit as described above. Wherein, this aircraft can be various types of aircraft such as aircraft, unmanned aerial vehicle, glider, dirigible, this disclosure does not put any restrictions to this. The flight control inertia measurement assembly on the aircraft has the advantages of high measurement precision and high reliability, so that the aircraft has the advantages of high controllable precision, accurate navigation and the like, and can fly along a preset air route track.

The preferred embodiments of the present disclosure are described in detail with reference to the accompanying drawings, however, the present disclosure is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present disclosure within the technical idea of the present disclosure, and these simple modifications all belong to the protection scope of the present disclosure.

It should be noted that the various features described in the above embodiments may be combined in any suitable manner without departing from the scope of the invention. In order to avoid unnecessary repetition, various possible combinations will not be separately described in this disclosure.

In addition, any combination of various embodiments of the present disclosure may be made, and the same should be considered as the disclosure of the present disclosure, as long as it does not depart from the spirit of the present disclosure.

Claims (12)

1. An inertial measurement module, comprising:

an inertial measurement unit (110) for measuring inertial parameters of the moving object;

a temperature regulating device (120) arranged side by side and spaced apart from the inertial measurement unit (110) for exchanging heat with the inertial measurement unit (110);

an encapsulation structure (130) for encapsulating the inertial measurement unit (110) and the temperature regulation device (120) inside thereof;

a heat transfer medium (140) filled in a gap between the inertial measurement unit (110) and the temperature adjustment device (120), and not covering a top surface of the inertial measurement unit (110).

2. The inertial measurement module according to claim 1, wherein the package structure (130) comprises a package cover (131) and a package base (132), the package base (132) and the package cover (131) together enclose a cavity for mounting the inertial measurement unit (110) and the temperature adjustment device (120), and a top portion of a sidewall of the package base (132) has an engagement surface (1321) for abutting against the package cover (131), a top surface of the inertial measurement unit (110) faces the package cover (131) and is disposed coplanar with the engagement surface (1321), the heat conducting medium (140) is filled in the cavity, and a top surface of the heat conducting medium (140) is flush with the top surface of the inertial measurement unit (110).

3. The inertia measurement module set according to claim 2, wherein a top wall (1311) of the package cover (131) is disposed on the package base (132) at a distance from a top surface of the inertia measurement unit (110), the package cover (131) includes a top wall (1311) and a connecting wall (1312) protruding from a periphery of the top wall (1311), a shoulder (1313) is formed at a bottom of the connecting wall (1312), the shoulder (1313) has an inner stepped surface (1314) having a height offset with respect to the top wall (1311), an outer stepped surface (1315), and a transition surface (1316) connecting the inner stepped surface (1314) and the outer stepped surface (1315), a height of the inner stepped surface (1314) with respect to the top wall (1311) is smaller than a height of the outer stepped surface (1315) with respect to the top wall (1311), and the inner stepped surface (131) is configured to be attached to the attachment surface (1321), the transition surface (1316) is used for being attached to the outer peripheral surface of the side wall of the packaging seat (132).

4. The inertial measurement module according to any one of claims 1-3, characterized in that the bottom surface of the temperature regulation device (120) is coplanar with the bottom surface of the inertial measurement unit (110), and the top surface of the temperature regulation device (120) is lower than the top surface of the inertial measurement unit (110).

5. Flight control inertial measurement unit, characterized in that it comprises an integrated circuit board (20) and an inertial measurement module (10) according to any one of claims 1 to 4 arranged thereon, wherein the inertial measurement unit (110) of the inertial measurement module (10) is in signal connection with the integrated circuit board (20) and a temperature regulation device (120) is electrically connected with the integrated circuit board (20).

6. The flight control inertial measurement unit according to claim 5, wherein the bottom of the package structure (130) is connected to the integrated circuit board (20) and has an opening (O) open to the integrated circuit board (20), through which the inertial measurement unit (110) and the temperature regulation device (120) are connected to the integrated circuit board (20).

7. The flight control inertia measurement assembly of claim 5 or 6, further comprising a temperature compensated inertia measurement member (30) and a barometer (40), the barometer (40) and the inertia measurement module (10) being spaced apart on either side of the temperature compensated inertia measurement member (30).

8. The flight control inertial measurement unit according to claim 7, wherein the integrated circuit board (20) further has a plurality of isolation slots (T) formed therein, the isolation slots (T) surrounding the bottom outer peripheries of the inertial measurement module (10) and the temperature compensated inertial measurement unit (30), respectively.

9. The flight control inertial measurement unit according to claim 8, characterized in that the isolation slot (T) is n-shaped overall or is n-shaped by two L-shaped slots.

10. The flight control inertia measurement assembly according to claim 5, further comprising a housing (50), wherein the integrated circuit board (20) is disposed in the housing (50), the housing (50) comprises an upper housing (510) and a lower housing (520), a plurality of mounting posts (521) are disposed in the lower housing (520), the integrated circuit board (20) is supported on the mounting posts (521) and is formed with mounting holes adapted to the mounting posts (521), the mounting posts (521) and the mounting holes are detachably connected by fasteners to fix the integrated circuit board (20) to the lower housing (520), and the upper housing (510) and the lower housing (520) are detachably connected.

11. The flight control inertia measurement assembly of claim 10, further comprising a connector (60), the connector (60) being disposed on the integrated circuit board (20), the connector (60) having a socket end (610) that interfaces with an external structure, the upper housing (510) being formed with an escape opening (R) such that the socket end (610) exposes the housing from the escape opening (R).

12. An aircraft, characterized in that it comprises a flight control inertial measurement unit according to any one of claims 5 to 11.

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