CN213696596U

CN213696596U - Condenser and steam cooking equipment

Info

Publication number: CN213696596U
Application number: CN202021645084.1U
Authority: CN
Inventors: 钟文杰; 朱良; 萧展锋; 潘叶江
Original assignee: Vatti Co Ltd
Current assignee: Vatti Co Ltd
Priority date: 2020-08-10
Filing date: 2020-08-10
Publication date: 2021-07-16
Anticipated expiration: 2030-08-10

Abstract

The utility model belongs to the technical field of steam cooking equipment, concretely relates to condenser and steam cooking equipment. The condenser comprises a shell assembly with a condensation cavity, a condensation assembly arranged in the condensation cavity, and a semiconductor refrigeration sheet arranged outside the condensation cavity; the condensing assembly is connected with the shell assembly and is used for condensing steam; the cold surface of the semiconductor refrigeration piece is connected with the shell assembly and used for cooling the condensation assembly; the shell component is provided with a steam inlet for steam to flow into the condensation cavity and for liquid generated by condensation to flow out of the condensation cavity; the shell assembly is also provided with a steam outlet for the condensed steam to flow out of the condensation cavity. The steam cooking device comprises a cooking device body and a condenser installed on the cooking device body. The utility model discloses the effectual positive displacement of having solved present steam cooking equipment is big, has the problem of scalding user's risk.

Description

Condenser and steam cooking equipment

Technical Field

The utility model belongs to the technical field of steam cooking equipment, concretely relates to condenser and steam cooking equipment.

Background

Steam cooking equipment, for example steam oven, steam ager etc. are in the use, and the steam that steam generator produced gets into the culinary art chamber and accomplishes the heat exchange with the food material after, can be directly discharged the cavity by cooling system through exhaust wind channel. Steam is generally discharged from the front in the existing product design, and when the steam quantity is large, the temperature of a steam outlet can reach 70 ℃, and even can be higher, so that the risk of scalding a user exists, and the user experience is poor.

SUMMERY OF THE UTILITY MODEL

In order to solve present steam cooking equipment openly the displacement is big, has the problem of scalding user's risk, the utility model provides a condenser.

Another object of the utility model is to provide a steam cooking equipment who adopts above-mentioned condenser.

The utility model provides a condenser for condensing steam, which comprises a shell component with a condensation cavity, a condensation component arranged in the condensation cavity, and a semiconductor refrigeration piece arranged outside the condensation cavity;

the condensing assembly is connected with the shell assembly and is used for condensing steam; the cold surface of the semiconductor refrigeration piece is connected with the shell assembly and used for cooling the condensation assembly;

the shell component is provided with a steam inlet for steam to flow into the condensation cavity and for liquid generated by condensation to flow out of the condensation cavity; and the shell component is also provided with a steam outlet for the condensed steam to flow out of the condensation cavity.

The utility model discloses a further improvement of condenser lies in, with the condensation subassembly is connected install on casing assembly's the lateral wall semiconductor refrigeration piece.

The utility model discloses a further improvement of condenser lies in, the condenser still includes radiator unit, radiator unit with the hot face of semiconductor refrigeration piece is connected.

The condenser of the utility model is further improved in that the shell component comprises a shell and a cover body; the cover body is covered on the shell to form a condensation cavity; one side of the cover body is connected with the condensation assembly, and one side of the cover body, which is far away from the condensation assembly, is connected with the cold surface of the semiconductor refrigeration sheet.

The condenser of the utility model is further improved in that a plurality of radiating fins are arranged on the shell; a plurality of the heat dissipating fins are disposed at intervals on opposite sides of the housing.

The condenser of the utility model is further improved in that the condensing component comprises a plurality of condensing sheets; the plurality of condensation sheets are arranged in the condensation cavity at intervals, and the condensation sheets are connected with the shell assembly.

The utility model discloses a further improvement of condenser lies in, a plurality of the condensation piece is parallel to each other the interval arrangement is in order to form mutually perpendicular's narrow steam passage and wide steam passage in the condensation chamber.

The condenser of the utility model is further improved in that each condensing sheet is provided with a condensing gap; the plurality of condensing sheets are arranged in the condensing cavity in parallel at intervals, so that the condensing gaps which are parallel to each other form the narrow steam flow channel, and a wide steam flow channel is formed between every two adjacent condensing sheets.

The utility model discloses a further improvement of condenser lies in, the play vapour direction of steam outlet with narrow steam runner's steam flow direction is parallel.

The utility model discloses a further improvement of condenser lies in, the admission direction of admission port with wide steam runner's steam flow direction is parallel.

The condenser of the utility model is further improved in that the heat radiation component comprises a heat radiation plate and a plurality of heat radiation fins; the radiating fins are arranged on one side of the radiating plate at intervals, and the other side, which is far away from the radiating fins, of the radiating plate is connected with the hot surface of the semiconductor refrigerating sheet.

The condenser of the present invention is further improved in that the heat dissipating plates are arranged in parallel to each other at intervals to form a wide heat dissipating passage and a narrow heat dissipating passage perpendicular to each other on the heat dissipating plate.

The utility model discloses a further improvement of condenser lies in, the semiconductor refrigeration piece with be equipped with heat conduction silicone grease between the casing subassembly.

The condenser of the utility model is further improved in that the semiconductor refrigeration piece is a TEC semiconductor refrigeration piece; the shell assembly is made of aluminum alloy.

The utility model also provides a steam cooking device, which comprises a cooking device body and the condenser; the condenser is mounted on the cooking device body;

the steam inlet is communicated with the cooking cavity of the cooking equipment body, and the steam outlet is communicated with the exhaust air channel of the cooking equipment body.

The utility model discloses a steam cooking equipment's further improved part lies in, steam cooking equipment still includes cooling fan, cooling fan installs be used for on the cooking equipment body for the condenser heat dissipation.

The utility model discloses a steam cooking equipment's further improvement part lies in, radiator fan's wind flow direction with radiator unit wide heat dissipation channel parallels.

Compared with the prior art, adopt above-mentioned scheme the beneficial effects of the utility model are that:

the semiconductor refrigeration piece in the condenser cools the condensation assembly through the shell assembly, and steam enters the condensation cavity from the steam inlet and exchanges heat with the condensation assembly arranged in the condensation cavity; the liquid that the condensation produced flows out the condensation chamber through the steam inlet again, and the steam after being condensed then flows out the condensation chamber from the steam outlet, and for the volume of the steam that gets into the condensation chamber, the volume of the steam that flows out the condensation chamber obviously reduces, and the temperature reduces to some extent, so be arranged in steam cooking equipment with the condenser of this embodiment, can effectually solve present steam cooking equipment front displacement big, there is the problem of scalding user's risk.

The utility model discloses a steam cooking equipment is because adopted foretell condenser, so can the current steam cooking equipment of effectual solution openly displacement big at least, has the problem of scalding user's risk.

Drawings

Fig. 1 is a schematic structural diagram of a condenser provided in embodiment 1 of the present invention in an assembled state;

fig. 2 is a schematic structural diagram of a condenser provided in embodiment 1 of the present invention in an explosion state;

FIG. 3 is a schematic cross-sectional view of section A-A of FIG. 1, with the arrows indicating the direction of steam flow;

FIG. 4 is a schematic cross-sectional view of another section of FIG. 1, with arrows indicating the direction of steam flow;

FIG. 5 is a schematic view of the structure of FIG. 3 in another view;

fig. 6 is a schematic view of an assembly structure of a condensation assembly and a cover of a condenser according to embodiment 1 of the present invention under a visual sense;

fig. 7 is a schematic view of an assembly structure of a condensation assembly and a cover of a condenser according to embodiment 1 of the present invention under another visual condition;

fig. 8 is a schematic view of an assembly structure of a condensation assembly and a cover of a condenser according to embodiment 1 of the present invention under still another visual condition;

fig. 9 is a schematic view of an assembly structure of a condensation assembly and a cover of a condenser according to embodiment 1 of the present invention under another visual condition, in which arrows represent a steam flowing direction;

fig. 10 is a schematic structural diagram of a heat dissipation assembly of a condenser according to embodiment 1 of the present invention in a visual sense;

fig. 11 is a schematic structural view of a steam cooking device provided in embodiment 2 of the present invention;

fig. 12 is an enlarged schematic view at B in fig. 4.

In the figure: 1. a condenser; 2. a cooking apparatus body; 3. a heat radiation fan; 11. a housing assembly; 12. a condensing assembly; 13. a semiconductor refrigeration sheet; 14. a heat dissipating component; 111. a steam inlet; 112. a steam outlet; 113. a housing; 114. a cover body; 141. a heat dissipation plate; 142. a heat sink; 1131. a heat dissipating fin; 121. a condensation sheet; 1211. a condensing gap.

Detailed Description

In order to make the above objects, features, advantages, etc. of the present invention more clearly understood, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.

In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "axial", "radial", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

Further, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Example 1

The embodiment provides a condenser for condensing steam, as shown in fig. 1-5, comprising a shell assembly 11 having a condensation chamber, a condensation assembly 12 disposed in the condensation chamber, and a semiconductor refrigeration sheet 13 disposed outside the condensation chamber;

the condensing assembly 12 is connected with the shell assembly 11 for condensing steam; the cold surface of the semiconductor refrigeration sheet 13 is connected with the shell assembly 11 and used for cooling the condensation assembly 12;

the shell component 11 is provided with a steam inlet 111 for steam to flow into the condensation cavity and for liquid generated by condensation to flow out of the condensation cavity; the housing assembly 11 is further provided with a steam outlet 112 for the condensed steam to flow out of the condensation chamber.

In this embodiment, high-temperature steam enters the condensation cavity from the steam inlet 111, because the condensation cavity is internally provided with the condensation component 12 connected with the shell component 11, and the outside of the condensation cavity is also provided with the semiconductor refrigeration piece 13 connected with the shell component 11, the low temperature of the cold surface of the semiconductor refrigeration piece 13 is quickly transmitted to the condensation component 12 through the shell component 11, so as to realize the cooling of the condensation component 12, so that the high-temperature steam exchanges heat with the low-temperature condensation component 12 in the condensation cavity, and further condensation is realized; and the liquid that the condensation produced is being followed steam inlet 111 and is flowing out the condensation chamber, and the steam after being condensed is then followed steam outlet 12 and flows out simultaneously, for the volume of the steam that gets into the condensation chamber, the volume of the steam that flows out the condensation chamber obviously reduces, and the temperature reduces to some extent, so be used for steam cooking equipment with the condenser of this embodiment, can effectually solve present steam cooking equipment openly displacement greatly, there is the problem of scalding user's risk.

Further, in order to improve the heat conduction performance between the semiconductor cooling plate 13 and the housing assembly 11, a heat conductive silicone grease is provided between the semiconductor cooling plate 13 and the housing assembly 11.

In a specific embodiment, the semiconductor refrigerating plate 13 is a TEC semiconductor refrigerating plate; the housing member 11 is made of aluminum alloy, which is a good heat conductor.

Further, install semiconductor refrigeration piece 13 on the lateral wall of the casing subassembly 11 that is connected with condensation subassembly 12, the purpose reduces the distance between the cold face of semiconductor refrigeration piece 13 and condensation subassembly 12, ensures that the low temperature of the cold face of semiconductor refrigeration piece 13 can be quick transmits for condensation subassembly 12.

Further, the condenser also comprises a heat dissipation assembly 14, and the heat dissipation assembly 14 is connected with the hot surface of the semiconductor refrigeration sheet 13. Because the temperature difference between the cold surface and the hot surface of the semiconductor chilling plate 13 is too small, the chilling effect is affected, so that the heat dissipation assembly 14 is installed on the hot surface of the semiconductor chilling plate 13 to quickly dissipate the temperature of the hot surface of the semiconductor chilling plate 13, the temperature difference between the cold surface and the hot surface of the semiconductor chilling plate 13 is reduced as much as possible, and the chilling effect of the semiconductor chilling plate 13 is improved.

In a particular embodiment, the heat dissipation assembly 14 includes a heat dissipation plate 141 and a plurality of heat dissipation fins 142; the plurality of heat dissipation fins 142 are arranged at intervals on one side of the heat dissipation plate 141, and the other side of the heat dissipation plate 141 away from the heat dissipation fins 142 is connected to the hot surface of the semiconductor cooling fin 13.

The heat dissipation plate 141 and the heat dissipation fins 142 are made of aluminum alloy, and the heat dissipation plate 141 has the function of increasing the contact area between the heat dissipation assembly 14 and the hot surface of the semiconductor cooling plate 13; another aspect is to quickly transfer the high temperature of the hot side of the semiconductor chilling plate 13 to the heat sink 142. The heat sink 142 serves to rapidly dissipate heat.

Preferably, as shown in fig. 10, a plurality of heat dissipation fins 142 are arranged in parallel with each other on the heat dissipation plate 141 at intervals to form wide heat dissipation channels and narrow heat dissipation channels perpendicular to each other, for the purpose of enhancing heat dissipation effect.

Further, the housing assembly 11 includes a housing 113 and a cover 114; the cover 114 covers the shell 113 to form a condensation chamber; one side of the cover body 114 is connected with the condensing assembly 12, and the other side is connected with the cold surface of the semiconductor chilling plate 13.

The low temperature of the cold surface of the semiconductor refrigeration sheet 13 is rapidly transferred to the condensation assembly 12 through the cover body 113 so as to achieve the purpose of cooling the condensation assembly 12.

Preferably, the housing 113 is provided with a plurality of heat dissipating fins 131; the plurality of heat dissipating fins 1131 are disposed on two opposite side surfaces of the casing 113 at intervals, and the heat dissipating fins 1131 are for rapidly reducing the problem of the casing 113, thereby improving the condensation effect.

Further, as shown in fig. 6 to 9, the condensing unit 12 includes a plurality of condensing sheets 121; a plurality of condensation sheets 121 are arranged at intervals in the condensation chamber, and the condensation sheets are connected with the shell assembly 11.

Preferably, a plurality of condensing sheets 121 are arranged in parallel to each other at intervals in the condensing chamber to form narrow and wide steam channels perpendicular to each other. The term "narrow" and "wide" are relative terms, so that a better condensation effect can be achieved.

Preferably, each condensing sheet 121 is provided with a condensing gap 1211; the plurality of condensing sheets 121 are arranged in parallel and spaced apart from each other in the condensing chamber such that the parallel condensing gaps 1211 form a narrow steam flow channel, and a wide steam flow channel is formed between two adjacent condensing sheets 121.

The condensation gap 1211 is provided on the heat sink 121 to rapidly reduce the temperature of the heat sink 121.

Preferably, the steam outlet 112 has a steam outlet direction parallel to the steam flow direction of the narrow steam flow channel, so that the condensing sheet can obstruct the steam flow in the cooking cavity as much as possible, thereby improving the condensing effect.

Preferably, the steam inlet 111 has a steam inlet direction parallel to the steam flow direction of the wide steam flow path.

The steam outlet direction of the steam outlet 112 is parallel to the steam flowing direction of the narrow steam flow channel, and the steam inlet direction of the steam inlet 111 is parallel to the steam flowing direction of the wide steam flow channel, so that the staying time of steam in the condensation cavity can be prolonged, and the condensation effect is further improved.

Preferably, the material of the condensation sheet is preferably an aluminum alloy, and the plurality of condensation sheets are arranged on the cover 113 at intervals.

Example 2

The present embodiment provides a steam cooking apparatus, as shown in fig. 11 and 12, including a cooking apparatus body 2, and a condenser 1 in embodiment 1; the condenser 1 is mounted on the cooking apparatus body 2;

the steam inlet 111 is communicated with the cooking cavity of the cooking device body 2, and the steam outlet 112 is communicated with the exhaust air duct of the cooking device body 2.

High-temperature steam in the culinary art chamber of steam cooking equipment 2 enters into the condensation intracavity from steam inlet 111, because the condensation intracavity is equipped with the condensation subassembly 12 of being connected with casing subassembly 11, and the outside in condensation chamber still is equipped with the semiconductor refrigeration piece 13 of being connected with casing subassembly 11, the low temperature of the cold side of semiconductor refrigeration piece 13 passes through casing subassembly 11 and gives condensation subassembly 12 fast, in order to realize the cooling to condensation subassembly 12, so high-temperature steam carries out the heat exchange with microthermal condensation subassembly 12 in the condensation intracavity, and then has realized the condensation.

The liquid generated by condensation flows out of the condensation cavity from the steam inlet 111 and returns to the cooking cavity of the steam cooking device 2, and the water returning to the cooking cavity is re-vaporized at high temperature, so that the water consumption of the water tank is reduced, and the steam amount of the cooking cavity is increased. Meanwhile, the condensed steam flows out from the steam outlet 12, enters the exhaust air duct of the cooking device body 2 and finally flows out of the steam cooking device body 2. Compare in the volume of the steam that gets into the condensation chamber, the volume of the steam that flows out the condensation chamber obviously reduces, and the temperature reduces to some extent, so the steam cooking equipment of this embodiment can effectually solve present steam cooking equipment openly displacement big, has the problem of scalding user's risk.

Further, the steam cooking equipment also comprises a heat radiation fan 3, and the heat radiation fan 3 is arranged on the cooking equipment body 2 and used for radiating heat for the condenser 1; on one hand, the effect is to reduce the temperature difference between the cold surface and the hot surface of the semiconductor refrigerating sheet 13 and to realize the differential refrigerating effect; on the other hand, the shell assembly 11 is cooled, so that the temperature difference between the inside and the outside of the condensation cavity is ensured, and the condensation effect is ensured.

Further, the air flowing direction of the heat dissipation fan 3 is parallel to the wide heat dissipation channel of the heat dissipation assembly 14, so as to rapidly reduce the temperature of the heat dissipation assembly 14 and improve the heat dissipation effect.

Preferably, the steam cooking apparatus may be a steam box, a steam oven, a combined steaming and baking machine, or the like, which cooks food using steam.

With reference to embodiment 1, the operation of the steam cooking apparatus of the present embodiment is specifically described:

when the food is cooked by the steam cooking device, the steam cooking device is started, the steam generator is started, and steam enters the cooking cavity of the cooking device body 2 to exchange heat with the food; after the heat-exchanged steam flows out of the cooking cavity, the steam enters the condenser cavity of the condenser through the steam inlet 111 and exchanges heat with a plurality of condensing sheets which are arranged in the condenser cavity at intervals and are parallel to each other again; the water generated by condensation returns to the cooking cavity through the steam inlet 111, and the condensed steam flows out from the steam outlet 112, directly enters the exhaust air channel of the cooking device body 2, and finally is exhausted from the exhaust port on the front side of the cooking device body 2.

In the condensation process, the semiconductor cooling plate 13 continuously works to cool the cover 114, so as to cool the condensation assembly 12 (a plurality of condensation plates); and meanwhile, the heat radiation fan 3 continuously works to cool the whole condenser 1.

In the description of the present specification, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the described parent features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A condenser is used for condensing steam and is characterized by comprising a shell component (11) with a condensation cavity, a condensation component (12) arranged in the condensation cavity and a semiconductor refrigeration piece (13) arranged outside the condensation cavity;

the condensation assembly (12) is connected with the shell assembly (11) and is used for condensing steam; the cold surface of the semiconductor refrigeration sheet (13) is connected with the shell assembly (11) and used for cooling the condensation assembly (12);

the shell assembly (11) is provided with a steam inlet (111) for steam to flow into the condensation cavity and for liquid generated by condensation to flow out of the condensation cavity; and a steam outlet (112) is also arranged on the shell component (11) and is used for allowing condensed steam to flow out of the condensation cavity.

2. The condenser according to claim 1, characterized in that the semiconductor chilling plates (13) are mounted on the side wall of the housing assembly (11) connected with the condensing assembly (12).

3. The condenser according to claim 1, characterized in that it further comprises a heat dissipating assembly (14), said heat dissipating assembly (14) being connected to the hot face of said semiconductor chilling plates (13).

4. A condenser according to any one of claims 1-3, characterised in that the housing assembly (11) comprises a housing (113) and a cover (114); the cover body (114) is covered on the shell (113) to form a condensation cavity; one side of the cover body (114) is connected with the condensation assembly (12), and the other side of the cover body (114) far away from the condensation assembly (12) is connected with the cold surface of the semiconductor refrigeration sheet (13).

5. The condenser of claim 4, wherein the shell (113) is provided with a plurality of heat dissipating fins (1131); the plurality of heat dissipation fins (1131) are provided at opposite sides of the housing (113) at intervals.

6. A condenser according to any one of claims 1-3, wherein the condensing assembly (12) comprises a plurality of condensing fins (121); a plurality of the condensation sheets (121) are arranged in the condensation cavity at intervals, and the condensation sheets (121) are connected with the shell assembly (11).

7. The condenser of claim 6, wherein a plurality of said condensing fins (121) are arranged in parallel and spaced apart from each other in said condensing chamber to form a narrow steam flow passage and a wide steam flow passage perpendicular to each other.

8. The condenser of claim 7, wherein each condensing sheet (121) is provided with a condensing gap (1211); the plurality of condensation sheets (121) are arranged in the condensation cavity at intervals in parallel, so that the condensation gaps (1211) in parallel form the narrow steam flow channel, and a wide steam flow channel is formed between two adjacent condensation sheets (121).

9. The condenser of claim 7, wherein the steam outlet (112) has a steam outlet direction parallel to the steam flow direction of the narrow steam flow channel.

10. The condenser of claim 7, wherein the steam inlet (111) has a steam inlet direction parallel to the steam flow direction of the wide steam flow channel.

11. A condenser according to claim 3, wherein the heat dissipating assembly (14) comprises a heat dissipating plate (141) and a plurality of heat dissipating fins (142); the plurality of radiating fins (142) are arranged on one side of the radiating plate (141) at intervals, and the other side, which is far away from the radiating fins (142), of the radiating plate (141) is connected with the hot surface of the semiconductor refrigerating sheet (13).

12. The condenser as claimed in claim 11, wherein a plurality of the heat radiating fins (142) are arranged on the heat radiating plate (141) in parallel with each other at intervals to form wide heat radiating passages and narrow heat radiating passages perpendicular to each other.

13. The condenser according to claim 1, characterized in that a heat-conducting silicone grease is provided between the semiconductor cooling fins (13) and the housing assembly (11).

14. The condenser according to claim 1, characterized in that said semiconductor chilling plate (13) is a TEC semiconductor chilling plate; the shell assembly (11) is made of aluminum alloy.

15. A steam cooking device, characterized by comprising a cooking device body (2), and a condenser (1) according to any one of claims 1-14; the condenser (1) is mounted on the cooking device body (2);

the steam inlet (111) is communicated with a cooking cavity of the cooking equipment body (2), and the steam outlet (112) is communicated with an exhaust air channel of the cooking equipment body (2).

16. Steam cooking device according to claim 15, characterised in that it further comprises a heat dissipating fan (3), said heat dissipating fan (3) being mounted on said cooking device body (2) for dissipating heat from said condenser (1).

17. Steam cooking device according to claim 16, characterised in that the direction of the wind flow of the heat dissipating fan (3) is parallel to the wide heat dissipating channel of the heat dissipating assembly (14).